Wafer moving device for vacuum vertical furnace tube

Abstract

The utility model discloses a wafer moving device for a vacuum vertical furnace tube, which comprises a wafer moving device, a vertical furnace, a wafer boat and a vacuum cavity, the bottom surface of the vertical furnace is abutted against and matched with the upper surface of the vacuum cavity, a lifting mechanism is arranged above the side of the vacuum cavity, a sliding assembly is arranged on the lifting mechanism, and the wafer moving device is arranged on the vertical furnace. The lifting shaft assembly is fixed to a sliding assembly of the lifting mechanism, a rotating mechanism is fixed to the lower end of the lifting shaft assembly, the whole rotating mechanism is located in the vacuum cavity, the lifting shaft assembly comprises a lifting shaft, the lifting shaft is sleeved with a ball bearing, and the ball bearing is matched with the vacuum cavity in an abutting mode. The technical problems of how to realize accurate motion control in the vacuum environment and how to prevent particles generated by moving parts from polluting wafers in the vacuum environment are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer moving device for a vacuum vertical furnace tube. Background Art

[0002] In the field of semiconductor manufacturing technology, low-pressure chemical vapor deposition (LP-CVD) is a widely used process technology for depositing various thin films on substrates such as silicon wafers. In this process, processing equipment based on vacuum technology is needed to control the uniformity and quality of the film. In these vacuum equipment, a large number of precision mechanical parts are needed, among which the wafer motion device is an important device, which is used to accurately move and position the wafer between various processing stations.

[0003] Solutions of existing technologies: In existing technologies, wafer motion devices usually use motors or cylinders as power sources, and transmit power to actuators through transmission mechanisms such as gears and lead screws to achieve the lifting and rotating motion of the wafer. Therefore, how to achieve precise motion control of the wafer in a vacuum environment and how to prevent particles generated by moving parts from contaminating the wafer in the vacuum environment are important issues that need to be solved in existing technologies.

[0004] Problems with the existing technology: Although the existing wafer motion devices meet the needs of semiconductor manufacturing to a certain extent, they still have some problems in practical applications. First, the wafer motion device needs to work in a vacuum environment, which makes the lubrication and cooling of the moving parts difficult and easily leads to a decrease in movement accuracy. Secondly, the moving parts will generate particles during the movement process, and compared with the atmospheric pressure environment, these particles are easier to diffuse in a vacuum environment, which is more likely to affect the quality of the wafer. A solution is proposed below to address the above problems. Utility Model Content

[0005] The utility model aims to provide a wafer moving device for a vacuum vertical furnace tube, which solves the technical problem of how to achieve precise motion control in a vacuum environment and prevent particles generated by moving parts from contaminating wafers in the vacuum environment, as proposed in the above-mentioned background technology.

[0006] The above technical objectives of the utility model are achieved through the following technical solutions:

[0007] A wafer movement device for a vacuum vertical furnace tube comprises a wafer movement device, a vertical furnace, a wafer boat, a vacuum chamber and a lifting shaft assembly, wherein the bottom surface of the vertical furnace abuts and cooperates with the upper surface of the vacuum chamber, a lifting mechanism is installed on the upper side of the vacuum chamber, a sliding assembly is provided on the lifting mechanism, the lifting shaft assembly is fixed on the sliding assembly of the lifting mechanism, a rotating mechanism is fixed to the lower end of the lifting shaft assembly, and the rotating mechanism is located inside the vacuum chamber as a whole, the lifting shaft assembly comprises a lifting shaft, a ball bearing is sleeved on the lifting shaft, and the ball bearing abuts and cooperates with the vacuum chamber.

[0008] Preferably, the lifting mechanism includes a ball screw and a support frame, the ball screw is installed at the center position of the support frame, two slide rails are also installed on the support frame, the slide rails are respectively located on both sides of the ball screw, the sliding assembly is sleeved on the ball screw and the two slide rails, a coupling support frame is also fixed on the support frame, the lower end of the ball screw is connected to a coupling, the coupling is fixed in the coupling support frame, a first reducer is fixed below the coupling support frame, the first reducer is connected to the lower end of the coupling, a first motor is installed below the first reducer, and the first motor is connected to the first reducer.

[0009] Preferably, one end of the support frame is connected to a drag chain, and the other end of the drag chain is connected to the sliding assembly.

[0010] Preferably, the rotating mechanism includes a support seat and a sealing disk, the support seat is fixed at the lower end of the lifting shaft, the sealing disk is fixed at the top of the support seat, a support seat cavity is opened on the support seat, a second reducer is installed below the sealing disk, the second reducer is arranged in the support seat cavity, a second motor is also installed in the support seat cavity, the second motor is transversely fixed on the second reducer, and a rotating disk is also rotatably arranged above the sealing disk, the central axis of the rotating disk passes through the sealing disk and is connected to the second reducer.

[0011] Preferably, the lifting shaft is a hollow shaft, the interior of the lifting shaft is a lifting and pumping cavity, and the lifting shaft cavity is connected to the support seat cavity.

[0012] Preferably, each circuit in the rotating mechanism leads to the outside of the vacuum chamber through the support seat cavity and the lifting shaft cavity.

[0013] Beneficial effects: 1. The present invention mounts the lifting mechanism on the upper side of the vacuum chamber, and the rotating mechanism driving component is arranged inside the mounting seat. The lifting mechanism and the rotating mechanism are connected by a hollow shaft, thereby isolating the driving component from the internal space of the vacuum chamber, effectively preventing particle contamination generated by the driving component, ensuring the cleanliness of the vacuum environment, and thus improving the quality of the wafer. 2. The present invention realizes the connection between each line and the outside through the hollow structure, which is convenient for the wiring and maintenance of the equipment. 3. Through the optimized design, the structure of the equipment is more compact and occupies less space, thereby reducing the manufacturing cost of the equipment and facilitating the installation and maintenance of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall assembly of a wafer moving device for a vacuum vertical furnace tube according to an embodiment of the present application;

[0015] Figure 2 It is a schematic diagram of the structure of an embodiment of the present application;

[0016] Figure 3 yes Figure 2 Schematic diagram of the middle lifting assembly;

[0017] Figure 4 yes Figure 2 An enlarged cross-sectional view of the rotating assembly;

[0018] Figure 5 It is a cross-sectional view of an embodiment of the present application.

[0019] : 1. lifting mechanism; 101. first motor; 102. first reducer; 103. coupling; 104. ball screw; 105. initial position; 106. drag chain; 107. slide rail; 108. support frame; 109. sliding assembly; 110. coupling support frame; 111. working position; 2. lifting shaft assembly; 201. lifting shaft; 202. ball bearing; 203. lifting shaft cavity; 3. rotating mechanism; 301. second motor; 302. second reducer; 303. rotating disk; 304. sealing disk; 305. support seat; 306. support seat cavity; 001. wafer moving device; 002. vertical furnace; 003. wafer boat; 004. vacuum chamber. DETAILED DESCRIPTION

[0020] See Figure 1 As shown, a wafer moving device for a vacuum vertical furnace tube includes a lifting mechanism 1, a lifting shaft assembly 2, and a rotating mechanism 3.

[0021] See Figure 2 As shown, a wafer moving device for a vacuum vertical furnace tube also includes a wafer moving device 001, a vertical furnace 002, a wafer boat 003, and a vacuum chamber 004.

[0022] The bottom surface of the vertical furnace 002 abuts against the upper surface of the vacuum chamber 004 to achieve sealing;

[0023] The lifting mechanism 1 is mounted on the upper side of the vacuum chamber 004, and is used to support the wafer movement device 001 of the entire vacuum vertical furnace tube, and provide vertical lifting movement for the wafer boat 003;

[0024] The lifting shaft assembly 2 is fixed on the sliding assembly 109 of the lifting mechanism 1;

[0025] The rotating mechanism 3 is fixed to the lower end of the lifting shaft assembly 2 to provide rotational motion for the wafer boat 003;

[0026] The rotating mechanism 3 is entirely located inside the vacuum chamber 004;

[0027] The ball bearing 202 is sleeved on the lifting shaft 201 and abuts against the vacuum chamber 004 to achieve sealing.

[0028] See Figure 3 The lifting mechanism includes a ball screw and a support frame. The ball screw is installed at the center of the support frame. Two slide rails are also installed on the support frame. The slide rails are respectively located on both sides of the ball screw. The sliding assembly is sleeved on the ball screw and the two slide rails. The sliding assembly can slide up and down.

[0029] A coupling support frame is also fixed on the support frame, and a coupling is connected to the lower end of the ball screw, and the coupling is fixed in the coupling support frame;

[0030] A first reducer is fixed below the coupling support frame, and the first reducer is connected to the lower end of the coupling;

[0031] A first motor is installed below the first reducer, and the first motor is connected to the first reducer;

[0032] One end of the support frame is connected to a drag chain, and the other end of the drag chain is connected to a sliding component.

[0033] See Figure 4 , the rotating mechanism includes a support seat and a sealing disk, the support seat is fixed to the lower end of the lifting shaft, and the sealing disk is fixed above the support seat;

[0034] The support seat is provided with a support seat cavity, a second reducer is installed below the sealing disk, and the second reducer is arranged in the support seat cavity;

[0035] A second motor is also installed in the support seat cavity, and the second motor is transversely fixed on the second reducer;

[0036] A rotating disk is also rotatably arranged above the sealing disk, and the central axis of the rotating disk passes through the sealing disk and is connected to the second reducer.

[0037] See Figure 5 The lifting shaft 201 is a hollow shaft, the interior of the lifting shaft 201 is a lifting chamber 203, and the lifting shaft chamber 203 is connected to the support seat chamber 306;

[0038] All lines in the rotating mechanism 3 lead from the support seat cavity 306 and the lifting shaft cavity 203 to the outside of the vacuum chamber 004 and are arranged in the drag chain 106.

[0039] Working principle:

[0040] Initial state: the vertical furnace 002 is not working, the wafer moving device 001 for the vacuum vertical furnace tube is fixed on the vacuum chamber 004, the sliding assembly 109 is located at the initial position 105, the rotating mechanism 3 and the wafer boat 003 are located in the vacuum chamber 004 as a whole, and the wafer boat 003 is located directly below the vertical furnace 002.

[0041] Before the process starts, the wafers are loaded on the wafer boat 003. After loading, the first motor 101 drives the sliding mechanism 109 to lift vertically upward on the support frame 108, driving the lifting shaft 202 to slide upward in the ball bearing 201, thereby driving the rotating mechanism 3 and the wafer boat 003 placed thereon to lift upward. When the sliding mechanism 109 is lifted to the working position 111, the upper surface of the sealing disk 304 of the rotating mechanism 3 is lifted to abut against the inner surface of the vacuum chamber 004, and the wafer boat 003 is located as a whole inside the vertical furnace 002, and the vertical furnace 002 is sealed.

[0042] After the process starts, the vertical furnace 002 starts working, and at the same time the second motor 301 starts working, the second reducer 302 performs motion conversion, driving the rotating disk 303 to rotate horizontally, thereby driving the wafer boat 003 to rotate in the vertical furnace 002. During the process, the sealing disk 304 does not rotate to ensure sealing.

[0043] After the process is completed, the second motor 301 stops working, the rotating disk 303 drives the wafer boat 003 to stop rotating, and the first motor 101 drives the sliding mechanism 109 to slide downward until it is reset. The wafer boat 003 moves downward into the vacuum chamber 004 to unload the wafers.

[0044] In the above process, the cooperation of various components realizes the automatic loading and unloading of wafers. No manual operation is required during the wafer loading, unloading and processing, avoiding the dangers of manual operation and possible contamination of wafers. The hollow structure is used to isolate the driving components from the internal space of the vacuum chamber, which also facilitates the wiring and maintenance of the equipment.

[0045] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer moving device for a vacuum vertical furnace tube, comprising a wafer moving device (001), a vertical furnace (002), a wafer boat (003), a vacuum chamber (004) and a lifting shaft assembly (2), characterized in that: The bottom surface of the vertical furnace (002) is in abutment with the upper surface of the vacuum chamber (004); a lifting mechanism (1) is installed on the upper side of the vacuum chamber (004); a sliding component (109) is provided on the lifting mechanism (1); the lifting shaft component (2) is fixed on the sliding component (109) of the lifting mechanism (1); a rotating mechanism (3) is fixed at the lower end of the lifting shaft component (2); the rotating mechanism (3) is located inside the vacuum chamber (004) as a whole; the lifting shaft component (2) includes a lifting shaft (201); a ball bearing (202) is sleeved on the lifting shaft (201); the ball bearing (202) is in abutment with the vacuum chamber (004).

2. A wafer moving device for a vacuum vertical furnace tube according to claim 1, characterized in that: The lifting mechanism (1) comprises a ball screw (104) and a support frame (108), wherein the ball screw (104) is mounted at the center of the support frame (108), and two slide rails (107) are also mounted on the support frame (108), and the slide rails (107) are respectively located on both sides of the ball screw (104), and the sliding assembly (109) is sleeved on the ball screw (104) and the two slide rails (107), and the support frame (108) is also fixed with a coupling support frame (109). 10), the lower end of the ball screw (104) is connected to a coupling (103), the coupling (103) is fixed in a coupling support frame (110), a first reducer (102) is fixed below the coupling support frame (110), the first reducer (102) is connected to the lower end of the coupling (103), a first motor (101) is installed below the first reducer (102), and the first motor (101) is connected to the first reducer (102).

3. The wafer moving device for a vacuum vertical furnace tube according to claim 2, characterized in that: One end of the support frame (108) is connected to a drag chain (106), and the other end of the drag chain (106) is connected to the sliding component (109).

4. The wafer moving device for a vacuum vertical furnace tube according to claim 1, characterized in that: The rotating mechanism (3) comprises a support seat (305) and a sealing disk (304), wherein the support seat (305) is fixed at the lower end of the lifting shaft (201), and the sealing disk (304) is fixed at the top of the support seat (305), and a support seat cavity (306) is provided on the support seat (305), and a second reducer (302) is installed below the sealing disk (304), and the second reducer (302) is arranged in the support seat cavity (306), and a second motor (301) is also installed in the support seat cavity (306), and the second motor (301) is transversely fixed on the second reducer (302), and a rotating disk (303) is also rotatably arranged above the sealing disk (304), and the central axis of the rotating disk (303) passes through the sealing disk (304) and is connected to the second reducer (302).

5. The wafer moving device for a vacuum vertical furnace tube according to claim 4, characterized in that: The lifting shaft (201) is a hollow shaft, the interior of the lifting shaft (201) is a lifting shaft cavity (203), and the lifting shaft cavity (203) is connected to the support seat cavity (306).

6. The wafer moving device for a vacuum vertical furnace tube according to claim 5, characterized in that: Each circuit in the rotating mechanism (3) leads to the outside of the vacuum chamber (004) through the support seat cavity (306) and the lifting shaft cavity (203).

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