Package structure

Abstract

The utility model discloses a packaging structure, which comprises a mold sealing body, and a conductor, a chip and a lead frame which are coated in the mold sealing body and are sequentially laminated, wherein the lead frame comprises a first frame and a second frame which are arranged at an interval and are distributed in parallel along the direction parallel to the chip; the electric conductor comprises an electric conduction main body and a protruding part, the electric conduction main body is arranged to be of a sheet-shaped structure parallel to the chip, the electric conduction main body comprises a first surface facing the chip and a second surface deviating from the chip, and the protruding part is arranged on the first surface in a protruding mode and is in electric conduction connection with the second frame; the chip is provided with a first side and a second side which are oppositely arranged, the first side is conductively connected to the first frame, and the second side is conductively connected to the first surface of the conductive main body; the second surface of the conductive main body is completely exposed out of the mold sealing body, so that the exposed heat dissipation area of the conductive body is increased, the heat dissipation capability of the packaging structure is further enhanced, and the packaging structure can adapt to a packaging structure with a relatively high heat dissipation requirement.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, in particular to a packaging structure. Background Art

[0002] For packaging structures such as the Quad Flat No-leads Package (QFN), the drain of the chip is connected to the lead frame through a conductive sheet. In some solutions, the surface of the conductive sheet is exposed from the mold package to increase the heat dissipation capacity of the chip. In related technologies, in order to ensure that the conductive sheet can contact the lead frame below, the end of the conductive sheet is usually bent. However, this practice will reduce the area of ​​the conductive sheet exposed from the mold package, thereby affecting the heat dissipation capacity. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a packaging structure that can increase the heat dissipation capacity.

[0004] The packaging structure according to the first embodiment of the utility model includes a molded body, and a conductor, a chip and a lead frame which are encapsulated in the molded body and stacked in sequence:

[0005] The lead frame includes a first frame and a second frame which are spaced apart and are arranged side by side in a direction parallel to the chip;

[0006] The conductor includes a conductive body and a protruding portion, wherein the conductive body is arranged as a sheet structure parallel to the chip, and the conductive body includes a first surface facing the chip and a second surface facing away from the chip, and the protruding portion is arranged protrudingly on the first surface and is conductively connected to the second frame;

[0007] The chip has a first side and a second side that are arranged opposite to each other, the first side is conductively connected to the first frame, and the second side is conductively connected to the first surface of the conductive body;

[0008] Wherein, the second surface of the conductive body is completely exposed from the mold package.

[0009] The packaging structure according to the first embodiment of the utility model has at least the following beneficial effects:

[0010] The conductive body in this embodiment is configured as a sheet structure parallel to the chip, and its second surface can be completely exposed from the mold package, thereby increasing the heat dissipation area exposed by the conductor, thereby enhancing the heat dissipation capacity of the packaging structure, and can adapt to packaging structures with higher heat dissipation requirements.

[0011] In other embodiments of the present invention, the second surface of the conductive body has a limiting groove, the limiting groove is arranged corresponding to the protruding portion, and the molded body includes a limiting portion, and the limiting portion is located in the limiting groove.

[0012] In other embodiments of the present invention, the limiting groove and the corresponding protrusion are configured as a stamping structure.

[0013] In other embodiments of the present invention, a positioning hole is provided on a surface of the second frame facing the protruding portion, and at least one of the protruding portions is inserted into the positioning hole.

[0014] In other embodiments of the utility model, the protrusion is arranged in plurality, at least one of the plurality of protrusions is a first protrusion, and the others are second protrusions, wherein a protrusion height of the first protrusion relative to the first surface is greater than a protrusion height of the second protrusion relative to the first surface, the first protrusion is inserted into the positioning hole, and the second protrusion is conductively connected to the surface of the second frame facing the protrusion.

[0015] In other embodiments of the present invention, the first frame and the second frame are distributed along a first direction, and the first frame is arranged adjacent to a first side surface of the molded body relative to the second frame, and the second frame is arranged adjacent to a second side surface of the molded body relative to the first frame;

[0016] The plurality of protrusions are distributed along a second direction, and along the first direction, the distance between the first protrusion and the second side surface is smaller than the distance between the second protrusion and the second side surface, and one of the first direction and the second direction is the length direction of the packaging structure, and the other is the width direction of the packaging structure.

[0017] In other embodiments of the present invention, the third side surface of the conductive body facing the second side surface includes a straight section and a protruding section protruding relative to the straight section, the protruding section is arranged corresponding to the first protruding portion, and the straight section is arranged corresponding to the second protruding portion.

[0018] In other embodiments of the present invention, the molded body includes a molded body covering the conductor;

[0019] The surface of the first frame facing away from the chip is provided with a first groove, the first groove extends to the side of the first frame, and the depth of the first groove is less than the maximum thickness of the first frame, the mold encapsulation body further includes a first connecting portion connected to the mold encapsulation body, and the first connecting portion is located in the first groove;

[0020] And / or, a second groove is provided on the surface of the second frame facing away from the chip, the second groove extends to the side of the second frame, and the depth of the second groove is less than the maximum thickness of the second frame, and the mold encapsulation body also includes a second connecting portion connected to the mold encapsulation body, and the second connecting portion is located in the second groove.

[0021] In other embodiments of the utility model, a third groove is provided on the surface of the first frame facing the chip, the third groove extends to the side of the first frame, and the depth of the third groove is less than the maximum thickness of the first frame, the mold encapsulation body further includes a third connecting portion connected to the mold encapsulation body, the third connecting portion is located in the third groove, and along the thickness direction of the first frame, the projection of the first groove does not overlap with the projection of the third groove;

[0022] And / or, a fourth groove is provided on the surface of the second frame facing the chip, the fourth groove extends to the side of the second frame, and the depth of the fourth groove is less than the maximum thickness of the second frame, the mold body also includes a fourth connecting portion connected to the mold body, the fourth connecting portion is located in the fourth groove, and along the thickness direction of the second frame, the projection of the second groove does not overlap with the projection of the fourth groove.

[0023] In other embodiments of the present invention, the area of ​​the second surface accounts for 80% to 85% of the area of ​​the corresponding side surface of the molding body.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0026] Figure 1 A cross-sectional view of a packaging structure in the related art;

[0027] Figure 2 It is a three-dimensional schematic diagram of the packaging structure in the first embodiment of the utility model;

[0028] Figure 3 for Figure 2 Schematic diagram of the package structure;

[0029] Figure 4 for Figure 2 A schematic cross-sectional view of the packaging structure, wherein the cross-sectional view is a vertical plane passing through the first protrusion and parallel to the width direction of the packaging structure;

[0030] Figure 5 for Figure 2 A schematic cross-sectional view of the packaging structure, wherein the cross-sectional plane is a vertical plane passing through the second protruding portion and parallel to the width direction of the packaging structure;

[0031] Figure 6 for Figure 2 Schematic diagram of the conductor in the figure;

[0032] Figure 7 for Figure 6 A three-dimensional schematic diagram of the conductor in another direction;

[0033] Figure 8 for Figure 2 A three-dimensional schematic diagram of the first frame;

[0034] Fig. 9 for Figure 8 A three-dimensional schematic diagram of the first frame in another direction;

[0035] Fig.10 for Figure 2 A three-dimensional schematic diagram of the second frame;

[0036] Fig.11 for Fig.10 A three-dimensional schematic diagram of the second frame in another direction.

[0037] Reference numerals:

[0038] Conductive member 1, bending portion 12;

[0039] Packaging structure 10;

[0040] The molded body 100, the molded body 110, the first side surface 111, the second side surface 112, the limiting portion 120, the first connecting portion 130, the second connecting portion 140, the third connecting portion 150, and the fourth connecting portion 160;

[0041] Lead frame 200, first frame 210, first groove 211, third groove 212, second frame 220, second groove 221, fourth groove 222, positioning hole 223, third frame 230;

[0042] Chip 300;

[0043] Conductor 400, conductive body 410, first surface 411, second surface 412, third side surface 413, straight section 413a, protruding section 413b, protruding portion 420, limiting groove 430, first protruding portion 421, second protruding portion 422;

[0044] Electroplating layer 500;

[0045] Solder layer 600. DETAILED DESCRIPTION

[0046] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0048] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0049] In the description of the present utility model, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present utility model based on the specific content of the technical solution.

[0050] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0051] Reference Figure 2 , Figure 3The packaging structure 10 of the first embodiment of the utility model includes a mold body 100, a conductor 400, a chip 300 and a lead frame 200, wherein the mold body 100 is used to achieve insulation and protection functions, and the aforementioned lead frame 200, chip 300 and conductor 400 are encapsulated in the mold body 100. It should be noted that the encapsulation referred to herein includes complete encapsulation and partial encapsulation. For example, a portion of the lead frame 200 and the conductor 400 are encapsulated in the mold body 100, and the other portion is exposed from the mold body 100, and the chip 300 is completely encapsulated in the mold body 100.

[0052] The molded body 100 is usually formed by curing epoxy resin, which can be Figure 1 , Figure 2 The lead frame 200 is made of a conductive metal material, and specifically includes a first frame 210 and a second frame 220 that are spaced apart and arranged side by side in a direction parallel to the chip 300. For example, the first frame 210 and the second frame 220 are spaced apart and arranged side by side in a direction parallel to the chip 300. Figure 2 In addition, the lead frame 200 further includes a third frame 230, and the first frame 210, the second frame 220 and the third frame 230 are arranged in parallel along a direction parallel to the chip 300. After the package is completed, part of the surface of the first frame 210, the second frame 220 and the third frame 230 is exposed from the mold body 100 to form a source pin, a drain pin and a gate pin, respectively, for the electrical connection between the package structure 10 and an external device. Exemplarily, the lower surfaces of the first frame 210, the second frame 220 and the third frame 230 are exposed from the mold body 100 to form a source pin, a drain pin and a gate pin, respectively.

[0053] The conductor 400, the chip 300 and the lead frame 200 are stacked in sequence. Figure 4 , Figure 5 , both are cross-sectional schematic diagrams of the packaging structure, Figure 4 The cross-sectional plane in FIG. 4 is a vertical plane passing through the first protruding portion 421 and parallel to the width direction of the package structure (eg, the left-right direction in the figure). Figure 5The cross-section plane in is a vertical plane passing through the second protrusion 422 and parallel to the width direction of the package structure. As shown in the figure, the first frame 210, the second frame 220 and the third frame 230 are arranged side by side and located at the bottom layer, the first frame 210 is located on the left side of the figure, the second frame 220 is located on the right side of the figure, and the third frame 230 is surrounded by the first frame 210. The first frame 210, the second frame 220 and the third frame 230 are separated by the mold body 100. The chip 300 is located in the middle layer, and has a first side and a second side arranged opposite to each other. Exemplarily, the first side is the lower side of the chip 300, and the second side is the upper side of the chip 300. The conductor 400 is located in the upper layer, and includes a conductive body 410. The conductive body 410 has a first surface 411 and a second surface 412 that are arranged opposite to each other. The first surface 411 is arranged toward the chip 300, and the second surface 412 is arranged away from the chip 300. Exemplarily, the first surface 411 is the lower surface of the conductive body 410, and the second surface 412 is the upper surface of the conductive body 410.

[0054] The first side of the chip 300 is conductively connected to the first frame 210, and the second side is conductively connected to the first surface 411 of the conductive body 410. Exemplarily, the first side of the chip 300 has a source and a gate, and the second side has a drain, wherein the source is conductively connected to the upper surface of the first frame 210 through the solder layer 600, and the gate is conductively connected to the upper surface of the third frame 230 through the solder layer 600. The conductive body 410 is also used for conductive connection with the second frame 220. Usually, the lead frame 200 is etched from a sheet of the same thickness. Therefore, the maximum thickness of the first frame 210, the second frame 220 and the third frame 230 is the same, and the upper surface and the lower surface of the three are kept flush after packaging. As mentioned above, the upper surface of the first frame 210 is connected to the chip 300 through the solder layer 600. Therefore, when the conductive body 400 is conductively connected to the upper surface of the chip 300, a certain distance will be spaced between the conductive body 400 and the upper surface of the second frame 220. In order to enable the conductive body 400 to contact the second frame 220, the related art adopts Figure 1 The solution shown is to bend one side of the conductive member 1 downward to form a bent portion 12 so that it can contact the second frame 220. It should be noted that bending a metal sheet is a mature technology in the semiconductor field and is often used for bending structural parts such as lead frames. Therefore, bending the conductive member 1 to connect to the second frame 220 is also a common practice in the semiconductor field. However, the solution in the related art will cause the upper surface of the bent portion 12 to be covered in the molded body 100, reducing the exposed heat dissipation area of ​​the conductive member 1. When the heat dissipation demand of the packaging structure is high, the solution in the related art will be difficult to meet the demand.

[0055] Based on the above problems, the conductive body 410 in this embodiment is set as a sheet structure parallel to the chip 300. In other words, the conductive body 410 in this embodiment is not bent. Therefore, the second surface 412 of the conductive body 410 can be completely exposed from the mold package 100, thereby increasing the exposed heat dissipation area of ​​the conductive body 400, thereby enhancing the heat dissipation capacity of the package structure 10, and can adapt to the package structure 10 with higher heat dissipation requirements. In addition, when the conductive body 410 is set as a sheet structure parallel to the chip 300, in order to achieve a conductive connection between the conductive body 400 and the second frame 220, the conductive body 410 also includes a protrusion 420, referring to Figure 4 , Figure 5 and Figure 7 The protrusion 420 is protruding from the first surface 411 and is electrically connected to the second frame 220. Thus, by providing the protrusion 420, the electrical connection between the conductor 400 and the second frame 220 can be achieved without bending the conductive body 410. It should be noted that the present invention does not limit the shape of the protrusion 420. For example, it can be a truncated cone or a long strip.

[0056] Based on the first embodiment, in some embodiments of the present invention, referring to Figures 4 to 7 The second surface 412 of the conductive body 410 has a limiting groove 430, and the limiting groove 430 is correspondingly arranged with the protrusion 420, wherein the corresponding arrangement of the two refers to the corresponding arrangement of their positions and shapes. Exemplarily, the limiting groove 430 and the protrusion 420 are both circular, and the central axes of the two remain coaxial.

[0057] In this embodiment, the molded body 100 further includes a limiting portion 120, which is located in the limiting groove 430, and can achieve the limiting between the molded body 100 and the conductor 400 during the preparation process. Specifically, during the preparation process of the package structure 10 of this embodiment, the packaging material will completely cover the conductor 400. In other words, the upper surface of the conductor 400 will be covered by a layer of packaging material (for ease of description, it is named as a material layer to be removed), and the material layer to be removed needs to be removed by grinding or the like to expose the upper surface of the conductive body 410. During the grinding process, the molded body 100 and the conductor 400 may be misaligned. Based on the above problems, the conductor body 410 of this embodiment has a limiting groove 430. A limiting portion 120 will be formed in the limiting groove 430 during the molding step, and the limiting portion 120, the molding body 110 and the material layer to be removed are connected as an integrated structure before the material layer to be removed is completely removed. Therefore, the molding body 110 and the conductor 400 can be prevented from being displaced during the grinding process. It should be noted that when the grinding is completed, the molding body 110 and the limiting portion 120 will be separated. At this time, the limiting portion 120 plays the role of filling the limiting groove 430.

[0058] When the second surface 412 of the conductive body 410 has a limiting groove 430, in some embodiments of the present invention, the limiting groove 430 and the corresponding protrusion 420 are set as a stamping structure. Specifically, by punching from the second surface 412 of the conductive body 410 toward the first surface 411 through tools such as a punch, the protrusion 420 and the limiting groove 430 can be punched out simultaneously for easy processing.

[0059] Based on the first embodiment, in some embodiments of the present invention, referring to Figures 3 to 7 , the second frame 220 is provided with a positioning hole 223 on the surface facing the protrusion 420, and at least one protrusion 420 is inserted into the positioning hole 223, so as to realize the positioning between the conductor 400 and the second frame 220, and avoid displacement of the two during the packaging process and cause defective products. It should be noted that in some specific embodiments, all the protrusions 420 are used as positioning structures to cooperate with the positioning holes 223 for positioning, and in other specific embodiments, only part of the protrusions 420 are used as positioning structures to cooperate with the positioning holes 223 for positioning. For example, when the conductor 400 has more than two protrusions 420, two of them are selected as positioning structures to cooperate with the positioning holes 223 for positioning, which can not only ensure the positioning effect, but also reduce the number of openings. Further, when multiple protrusions 420 are arranged along a straight line or approximately along a straight line, two protrusions 420 at the head and tail are selected as positioning structures to cooperate with the positioning holes 223 for positioning.

[0060] When at least one protrusion 420 is used as a positioning structure to cooperate with the positioning hole 223 for positioning, in some embodiments of the present invention, Figure 4 , Figure 5 and Figure 7 , the protrusions 420 are provided in a plurality, and illustratively, the protrusions 420 are provided in 3, 4, 5, 6, 7, etc. At least one of the plurality of protrusions 420 is a first protrusion 421, and the others are second protrusions 422, and the protrusion height of the first protrusion 421 relative to the first surface 411 is greater than the protrusion height of the second protrusion 422 relative to the first surface 411, illustratively, Figure 7 The protrusions 420 at both ends of the plurality of protrusions 420 are first protrusions 421 , and their height is higher than that of the second protrusion 422 in the middle.

[0061] Based on the aforementioned structure, the first protrusion 421 is relatively high, so it can extend into the positioning hole 223, which can achieve electrical connection with the second frame 220 on the one hand, and also achieve the positioning function on the other hand; the second protrusion 422 is relatively short, so it will be conductively connected to the surface of the second frame 220 facing the protrusion 420. For example, the second protrusion 422 and the upper surface of the second frame 220 are conductively connected through the solder layer 600.

[0062] When at least one protrusion 420 is used as a positioning structure to cooperate with the positioning hole 223 for positioning, in some embodiments of the utility model, the first frame 210 and the second frame 220 are distributed along the first direction. For example, the first frame 210 and the second frame 220 are distributed along the width direction of the packaging structure 10. The first frame 210 is arranged adjacent to the first side surface 111 of the molded body 100 relative to the second frame 220, and the second frame 220 is arranged adjacent to the second side surface 112 of the molded body 100 relative to the first frame 210. For example, the first frame 210 is arranged adjacent to the right side surface of the molded body 100 relative to the second frame 220, and the second frame 220 is arranged adjacent to the left side surface of the molded body 100 relative to the first frame 210.

[0063] In this embodiment, the plurality of protrusions 420 are distributed along the second direction, and the second direction intersects with the first direction. For example, the second direction is the length direction of the package structure 10. Along the aforementioned first direction, the distance between the first protrusion 421 and the second side surface 112 is smaller than the distance between the second protrusion 422 and the second side surface 112. In other words, the first protrusion 421 is closer to the second side surface 112 than the second protrusion 422. The reason for such a setting is that the second frame 220 needs to be provided with a positioning hole 223 matching with the first protrusion 421 at a position corresponding to the first protrusion 421, so as to Figure 4 As shown in the example, the second frame 220 is located at the leftmost side of the molded body 110, and the conductive body 410 needs to be separated from the left side of the molded body 110 by a certain distance, and the first protrusion 421 needs to be separated from the left side of the conductive body 410 by a certain distance. Therefore, the positioning hole 223 is usually closer to the right side of the second frame 220. If other recessed areas are opened on the right side of the second frame 220, such as the subsequent second groove 221, etc., the thickness between the positioning hole 223 and the recessed area will be too small, and even the positioning hole 223 will be connected to the recessed area. Based on this, in this embodiment, the first protrusion 421 is set closer to the second side 112 relative to the second protrusion 422, and the position of the positioning hole 223 can also be moved accordingly in the direction of the second side 112, so as to increase the thickness between the positioning hole 223 and the recessed area.

[0064] It should be noted that the first direction may also be the length direction of the packaging structure 10 , and the second direction may also be the width direction of the packaging structure 10 .

[0065] When the first protrusion 421 is closer to the second side surface 112, in some embodiments of the present invention, Figure 6 , Figure 7 The conductive body 410 has a third side surface 413, and the third side surface 413 is arranged toward the second side surface 112 of the package structure. Exemplarily, the third side surface 413 is the left side surface of the conductive body 410. The third side surface 413 includes a straight section 413a and a protruding section 413b. The protruding section 413b is arranged corresponding to the first protruding portion 421, and the straight section 413a is arranged corresponding to the second protruding portion 422. In other words, the minimum distance between the protruding section 413b and the second side surface 112 is smaller than the minimum distance between the straight section 413a and the second side surface 112. The reason for such arrangement is that in order to increase the welding performance of the exposed pins of the lead frame 200, the package structure 10 also needs to form an electroplating layer 500 through an electroplating process. In the pre-treatment process of electroplating, it is necessary to To flush the package structure 10 with high-speed water flow, if the thickness of the molded body 100 covering the conductor 400 is too small, there is a risk of separation of the molded body 100 and the conductor 400 during the flushing process. In this embodiment, the portion corresponding to the first protrusion 421 on the third side 413 is set as a protruding section 413b, and the portion corresponding to the second protrusion 422 is set as a straight section 413a, which can ensure that the molded body 100 between the straight section 413a and the second side 112 has sufficient thickness, reducing the risk of the molded body 100 and the conductor 400. Furthermore, the protruding section 413b is set to an arc shape, and the position with the smallest thickness only appears between the vertex of the arc and the second side 112, and the thickness of other positions will gradually increase, thereby further reducing the scope of the weak area.

[0066] On the basis of the first embodiment, in some embodiments of the present invention, the first frame 210 and the second frame 220 further have grooves, and part of the molded body 100 can be embedded in the grooves to increase the connection strength between the molded body 100 and the frame. Specifically, the molded body 100 includes a molded body 110 covering a conductor, and the molded body 110 can be understood with reference to the above embodiments.

[0067] Reference Figure 4 , Figure 8 , Fig. 9, the surface of the first frame 210 facing away from the chip 300 is provided with a first groove 211. For example, the first groove 211 is provided on the lower surface of the first frame 210. The depth of the first groove 211 is less than the maximum thickness of the first frame 210, that is, the first groove 211 does not completely penetrate the first frame 210 upward. It should be noted that the area of ​​the first groove 211 is not limited in this embodiment. Figure 8 As shown, most of the lower surface of the first frame 210 is thinned by processes such as etching, so that a first groove 211 is formed in the thinned area, and the unthinned portion is exposed from the mold body 100 to form the aforementioned source pin.

[0068] In this embodiment, refer to Figure 4 , Figure 5 The molded body 100 also includes a first connecting portion 130 located in the first groove 211. Since the first groove 211 extends to the side of the first frame 210, the first connecting portion 130 can be connected to the molded body 110 as an integrated structure. In other words, a partial area of ​​the first frame 210 can be regarded as being clamped between the molded body 110 and the first connecting portion 130. In this way, the risk of separation of the molded body 110 and the second frame 220 can be reduced.

[0069] Similarly, in some other embodiments, referring to Fig.10 , Fig.11 The second frame 220 is provided with a second groove 221 on the surface facing away from the chip 300. For example, the second groove 221 is provided on the lower surface of the second frame 220. The second groove 221 extends to the side of the first frame 210, and the depth of the second groove 221 is less than the maximum thickness of the second frame 220. Figure 4 , Figure 5 The molded body 100 also includes a second connecting portion 140 connected to the molded body 110, and the second connecting portion 140 is located in the second groove 221. In this way, a partial area of ​​the second frame 220 can be regarded as being clamped between the molded body 110 and the second connecting portion 140. In this way, the risk of separation between the molded body 110 and the second frame 220 can be reduced.

[0070] When the first frame 210 is provided with the first groove 211, in some embodiments of the present invention, the surface of the first frame 210 facing the chip 300 is provided with the third groove 212, and illustratively, the lower surface of the first frame 210 is provided with the third groove 212. The depth of the third groove 212 is less than the maximum thickness of the first frame 210, that is, the third groove 212 does not completely penetrate the first frame 210 downward.

[0071] In this embodiment, refer to Figure 5The molded body 100 also includes a third connecting portion 150 located in the third groove 212. Since the third groove 212 extends to the side of the first frame 210, the third connecting portion 150 can be connected to the molded body 110 as an integrated structure, so that the molded body 100 and the first frame 210 can be prevented from being misaligned due to relative translation through the limiting effect of the third connecting portion 150 and the third groove 212.

[0072] In this embodiment, along the thickness direction of the first frame 210 , the projection of the first groove 211 does not overlap with the projection of the third groove 212 , so that the problem of insufficient strength caused by the local thickness of the first frame 210 being too small can be avoided.

[0073] Similarly, in some other embodiments, referring to Fig.10 , Fig.11 The surface of the second frame 220 facing the chip 300 is provided with a fourth groove 222, the fourth groove 222 extends to the side of the second frame 220, and the depth of the fourth groove 222 is less than the maximum thickness of the second frame 220, referring to Figure 5 The molded body 100 also includes a fourth connecting portion 160 connected to the molded body 110, and the fourth connecting portion 160 is located in the fourth groove 222. In this way, the molded body 100 and the second frame 220 can be prevented from being dislocated due to relative translation through the limiting effect of the fourth connecting portion 160 and the fourth groove 222.

[0074] In this embodiment, along the thickness direction of the second frame 220 , the projection of the second groove 221 does not overlap with the projection of the fourth groove 222 , so that the problem of insufficient strength caused by the local thickness of the second frame 220 being too small can be avoided.

[0075] It should be noted that the first connection part 130 , the second connection part 140 , the third connection part 150 , the fourth connection part 160 and the molded body 110 are integrally formed in the molding step.

[0076] Based on the first embodiment, in some embodiments of the present invention, the area of ​​the second surface 412 accounts for 80% to 85% of the area of ​​the corresponding side surface of the molded body 100, including two endpoint values ​​of 80% and 85%. In this way, the conductor 400 can have sufficient heat dissipation area, which helps to improve the heat dissipation capacity of the packaging structure 10.

[0077] The embodiments of the utility model are described in detail above in conjunction with the accompanying drawings, but the utility model is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the utility model. In addition, the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

Claims

1. A packaging structure, characterized in that: It includes a mold package, and a conductor, a chip and a lead frame which are encapsulated in the mold package and stacked in sequence: The lead frame includes a first frame and a second frame which are spaced apart and are arranged side by side in a direction parallel to the chip; The conductor includes a conductive body and a protruding portion, wherein the conductive body is arranged as a sheet structure parallel to the chip, and the conductive body includes a first surface facing the chip and a second surface facing away from the chip, and the protruding portion is arranged protrudingly on the first surface and is conductively connected to the second frame; The chip has a first side and a second side that are arranged opposite to each other, the first side is conductively connected to the first frame, and the second side is conductively connected to the first surface of the conductive body; Wherein, the second surface of the conductive body is completely exposed from the mold package.

2. The packaging structure according to claim 1, characterized in that: The second surface of the conductive body has a limiting groove, the limiting groove is arranged corresponding to the protruding portion, and the molded body includes a limiting portion, and the limiting portion is located in the limiting groove.

3. The packaging structure according to claim 2, characterized in that: The limiting groove and the corresponding protruding portion are configured as a stamping structure.

4. The packaging structure according to claim 1, characterized in that: A positioning hole is provided on a surface of the second frame facing the protruding portion, and at least one of the protruding portions is inserted into the positioning hole.

5. The packaging structure according to claim 4, characterized in that: The protrusions are arranged in plurality, at least one of the plurality of protrusions is a first protrusion, and the others are second protrusions, wherein a protrusion height of the first protrusion relative to the first surface is greater than a protrusion height of the second protrusion relative to the first surface, the first protrusion is inserted into the positioning hole, and the second protrusion is conductively connected to a surface of the second frame facing the protrusion.

6. The packaging structure according to claim 5, characterized in that: The first frame and the second frame are distributed along a first direction, and the first frame is arranged adjacent to a first side surface of the molded body relative to the second frame, and the second frame is arranged adjacent to a second side surface of the molded body relative to the first frame; The plurality of protrusions are distributed along a second direction, and along the first direction, the distance between the first protrusion and the second side surface is smaller than the distance between the second protrusion and the second side surface, and one of the first direction and the second direction is the length direction of the packaging structure, and the other is the width direction of the packaging structure.

7. The packaging structure according to claim 6, characterized in that: The third side surface of the conductive body facing the second side surface includes a straight section and a protruding section protruding relative to the straight section, the protruding section is arranged corresponding to the first protruding portion, and the straight section is arranged corresponding to the second protruding portion.

8. The packaging structure according to claim 1, characterized in that: The molded body comprises a molded body covering the conductor; The surface of the first frame facing away from the chip is provided with a first groove, the first groove extends to the side of the first frame, and the depth of the first groove is less than the maximum thickness of the first frame, the mold encapsulation body further includes a first connecting portion connected to the mold encapsulation body, and the first connecting portion is located in the first groove; And / or, a second groove is provided on the surface of the second frame facing away from the chip, the second groove extends to the side of the second frame, and the depth of the second groove is less than the maximum thickness of the second frame, and the mold encapsulation body also includes a second connecting portion connected to the mold encapsulation body, and the second connecting portion is located in the second groove.

9. The packaging structure according to claim 8, characterized in that: A third groove is provided on the surface of the first frame facing the chip, the third groove extends to the side of the first frame, and the depth of the third groove is less than the maximum thickness of the first frame, the mold encapsulation body further includes a third connecting portion connected to the mold encapsulation body, the third connecting portion is located in the third groove, and along the thickness direction of the first frame, the projection of the first groove does not overlap with the projection of the third groove; And / or, a fourth groove is provided on the surface of the second frame facing the chip, the fourth groove extends to the side of the second frame, and the depth of the fourth groove is less than the maximum thickness of the second frame, the mold body also includes a fourth connecting portion connected to the mold body, the fourth connecting portion is located in the fourth groove, and along the thickness direction of the second frame, the projection of the second groove does not overlap with the projection of the fourth groove.

10. The packaging structure according to claim 1, characterized in that: The area of ​​the second surface accounts for 80% to 85% of the area of ​​the corresponding side surface of the molding body.

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