Printed circuit board with heat dissipation structure

Abstract

The utility model relates to the technical field of heat radiation of printed circuit boards, in particular to a printed circuit board with a heat radiation structure, which comprises a printed circuit board, a heat radiator, a conduit and heat radiation fins, a chip is welded and mounted above the printed circuit board, the heat radiator is fixedly mounted above the chip, and the heat radiation fins are fixedly mounted above the heat radiator. According to the utility model, the temperature of the chip can be monitored in real time through the arranged temperature sensor, and the liquid metal, the conduit and the heat dissipation fins have good thermal conductivity, so that the heat dissipation efficiency can be greatly improved; the heat dissipation structure does not generate vibration in the operation process, can be applied to sensitive equipment or high-precision instruments, is small in size, and can be applied to a relatively compact layout.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of printed circuit boards, in particular to a printed circuit board with a heat dissipation structure. Background Art

[0002] Printed circuit boards are an indispensable part of modern electronic equipment. The conductive lines on them can realize electrical connections between electronic components. Since printed circuit boards often generate a lot of heat when working, which affects the safety of the printed circuit boards and the entire device, a heat sink is needed to dissipate the heat from the printed circuit boards.

[0003] Existing printed circuit boards often use heat sinks and fans to dissipate heat from the printed circuit boards. This method requires additional space, which may lead to insufficient space and difficulty in installation in miniaturized or portable devices. In some closed or semi-closed environments, the fan may not be able to effectively move enough air, and long-term use of the fan and heat sink will cause dust accumulation, thereby limiting the cooling effect. Vibrations may be generated when the fan is running, and it cannot be used in sensitive equipment or instruments requiring high precision. Therefore, a printed circuit board with a heat dissipation structure is proposed to address the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a printed circuit board with a heat dissipation structure to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A printed circuit board with a heat dissipation structure comprises a printed circuit board, a radiator, a conduit and heat dissipation fins. A chip is welded and mounted above the printed circuit board, a radiator is fixedly mounted above the chip, a conduit is fixedly connected between the radiator and an electromagnetic pump, and the heat dissipation fins are fixedly mounted on the thin conduit.

[0007] Preferably, the interior of the radiator is a cavity with an inlet and an outlet respectively provided at its two ends, the conduit connects the outlet of the radiator with the inlet of the thin conduit, the outlet of the thin conduit is connected to the inlet of the electromagnetic pump, and the outlet of the electromagnetic pump is connected to the inlet of the radiator.

[0008] Preferably, the heat sink is consistent with the chip in size and shape, and thermal grease is filled between the heat sink and the chip. Mounting feet are provided on the upper and lower sides of the heat sink, and circular holes are opened on the mounting feet. Screws are spirally fixed in the circular holes of the mounting feet, and a spring is provided between the screws and the mounting feet.

[0009] Preferably, a temperature sensor capable of monitoring the chip temperature in real time is provided inside the chip, and the heat sink and the conduit are filled with liquid metal.

[0010] Preferably, threaded sleeves that cannot be removed from the catheter are rotatably mounted on both ends of the catheter, and sealing rings are arranged at the cross sections of both ends of the catheter to prevent the internal liquid metal from leaking from the interface.

[0011] Preferably, the end of the thin conduit below the heat dissipation fin is connected to the conduit through a three-way joint and a four-way joint.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] In the utility model, since liquid metal is filled in the radiator and the conduit, the liquid metal has good thermal conductivity and can quickly take away the heat generated by the printed circuit board. The temperature of the chip can be monitored in real time by the set temperature sensor. When the chip temperature does not reach the set temperature, the electromagnetic pump will not start, thereby achieving energy saving. The liquid metal has good thermal conductivity, and the conduit and the heat dissipation fins are made of materials with good thermal conductivity, which can greatly improve the heat dissipation efficiency. The heat dissipation structure will not generate vibration during operation and can be used on sensitive equipment or high-precision instruments. The heat dissipation structure is small in size and can be used in a relatively compact layout. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the radiator of the utility model;

[0016] Figure 3 This is a schematic diagram of the heat dissipation fins and thin conduits of the utility model;

[0017] Figure 4 For this utility model Figure 2 A schematic diagram of the structure at A;

[0018] Figure 5 This is a schematic diagram of the radiator foot installation structure of the utility model.

[0019] In the figure: 1. printed circuit board; 101. chip; 2. radiator; 3. catheter; 4. cooling fins; 5. electromagnetic pump; 6. threaded sleeve; 7. sealing ring; 8. four-way connector; 9. three-way connector; 10. thin catheter; 11. screw; 12. thermal grease; 13. mounting feet; 14. spring; 15. liquid metal. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0022] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0023] See also Figure 1-5 , the utility model provides a technical solution:

[0024] A printed circuit board with a heat dissipation structure comprises a printed circuit board 1, a radiator 2, a conduit 3 and heat dissipation fins 4. A chip 101 is welded and mounted above the printed circuit board 1, the radiator 2 is fixedly mounted above the chip 101, the conduit 3 is fixedly connected between the radiator 2 and an electromagnetic pump 5, and the heat dissipation fins 4 are fixedly mounted on a thin conduit 10.

[0025] The radiator 2 is hollow inside, with an inlet and an outlet at both ends. The duct 3 connects the outlet of the radiator 2 with the inlet of the thin duct 10, the outlet of the thin duct 10 is connected to the inlet of the electromagnetic pump 5, and the outlet of the electromagnetic pump 5 is connected to the inlet of the radiator 2 to form a loop for heat dissipation of the circuit board. The size and shape of the radiator 2 and the chip 101 are consistent. The heat dissipation silicone grease 12 is filled between the radiator 2 and the chip 101. The upper and lower sides of the radiator 2 are provided with mounting feet 13, and the mounting feet 13 are provided with round holes. The mounting feet 13 are spirally fixed with screws 11 in the round holes. The screws 11 and the mounting feet 13 are connected. A spring 14 is provided between the two ends of the conduit 3 to facilitate the installation of the radiator 2; a temperature sensor is provided inside the chip 101 to monitor the temperature of the chip 101 in real time, and the inside of the radiator 2 and the conduit 3 are filled with liquid metal 15, which reduces the volume of the radiator 2 and saves energy; threaded sleeves 6 that cannot be removed from the conduit 3 are rotatably installed at both ends of the conduit 3, and sealing rings 7 are arranged at the cross sections of both ends of the conduit 3 to prevent the internal liquid metal 15 from leaking from the interface, thereby increasing the sealing effect and preventing the liquid metal 15 from leaking; the end of the thin conduit 10 below the heat dissipation fin 4 is connected to the conduit 3 through a three-way joint 9 and a four-way joint 8, thereby improving the heat dissipation performance.

[0026] Workflow: The electrical appliances required in the utility model are powered by an external power supply. The threaded sleeve 6 on the conduit 3 is rotated and locked on the threads of the inlet and outlet of the radiator 2 and the inlet and outlet of the electromagnetic pump 5 by means of a sealing ring 7. The conduit 3 and the thin conduit 10 are connected to each other through a three-way joint 9 and a four-way joint 8. In this way, the radiator 2, the conduit 3, the thin conduit 10, and the electromagnetic pump 5 are combined to form a loop, and the loop is filled with liquid metal 15. The heat dissipation silicone grease 12 is evenly applied to the top of the chip 101 of the printed circuit board 1, and the radiator 2 is installed above the chip 101 of the printed circuit board 1. The spring 14 is put on the screw 11, and then the radiator 2 is fixedly installed on the printed circuit board 1 through the circular hole of the mounting foot 13. The heat dissipation fins 4 are fixed on the thin conduit 10 for auxiliary heat dissipation. When When the temperature sensor arranged inside the chip 101 of the printed circuit board 1 detects that the temperature of the chip 101 of the printed circuit board 1 exceeds the set value, a signal will be sent. When the control chip receives the signal, the electromagnetic pump 5 will be started. Under the action of the electromagnetic pump 5, the liquid metal 15 inside the radiator 2 will flow from the inside of the radiator 2 through the outlet of the radiator 2 into the conduit 3, and then flow from the inlet of the thin conduit 10 to the outlet, enter the electromagnetic pump 5 through the conduit 3 from the inlet of the electromagnetic pump 5, and then pass through the outlet of the electromagnetic pump 5 and enter the cavity of the radiator 2 again through the inlet of the radiator 2 to take away the heat of the chip 101 of the printed circuit board 1. The liquid metal 15 inside the conduit 3 and the radiator 2 mainly dissipates its internal heat through the heat dissipation fins 4 and the conduit 3, thereby achieving the purpose of heat dissipation.

[0027] The contents not described in detail in this specification belong to the prior art known to the professional and technical personnel in this field. The standard parts used in this utility model can be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt the conventional means such as bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A printed circuit board with a heat dissipation structure, comprising a printed circuit board (1), a heat sink (2), a conduit (3) and heat dissipation fins (4), characterized in that: A chip (101) is welded and mounted above the printed circuit board (1), a heat sink (2) is fixedly mounted above the chip (101), a conduit (3) is fixedly connected between the heat sink (2) and the electromagnetic pump (5), the heat dissipation fins (4) are fixedly mounted on a thin conduit (10), and a conduit (3) is fixedly mounted at the end of the thin conduit (10).

2. A printed circuit board with a heat dissipation structure according to claim 1, characterized in that: The interior of the radiator (2) is a hollow cavity, and an inlet and an outlet are respectively provided at two ends thereof; the conduit (3) connects the outlet of the radiator (2) with the inlet of the thin conduit (10); the outlet of the thin conduit (10) is connected to the inlet of the electromagnetic pump (5); and the outlet of the electromagnetic pump (5) is connected to the inlet of the radiator (2).

3. A printed circuit board with a heat dissipation structure according to claim 1, characterized in that: The heat sink (2) and the chip (101) are consistent in size and shape, and heat dissipation silicone grease (12) is filled between the heat sink (2) and the chip (101). The heat sink (2) is provided with mounting feet (13) on the upper and lower sides, and the mounting feet (13) are provided with round holes. Screws (11) are screwed and fixed in the round holes of the mounting feet (13), and springs (14) are provided between the screws (11) and the mounting feet (13).

4. A printed circuit board with a heat dissipation structure according to claim 1, characterized in that: A temperature sensor capable of monitoring the temperature of the chip (101) in real time is provided inside the chip (101), and liquid metal (15) is filled inside the heat sink (2) and the conduit (3).

5. A printed circuit board with a heat dissipation structure according to claim 1, characterized in that: Both ends of the conduit (3) are rotatably mounted with threaded sleeves (6) that cannot be removed from the conduit (3), and sealing rings (7) are arranged at the cross sections of both ends of the conduit (3).

6. A printed circuit board with a heat dissipation structure according to claim 1, characterized in that: The end of the thin conduit (10) below the heat dissipation fin (4) is connected to the conduit (3) via a three-way joint (9) and a four-way joint (8).

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