Gas circuit board cooling system

Abstract

The utility model relates to the technical field of gas circuit boards, in particular to a gas circuit board cooling system which comprises a gas circuit board, a pipeline is arranged in the gas circuit board, four threaded holes are evenly formed in the surface of the gas circuit board, every two of the four threaded holes form a group, and the threaded holes are communicated with the pipeline. Connecting pipes are inserted into the inner sides of the two threaded holes, the upper ends of the two connecting pipes communicate with a heat dissipation plate, the heat dissipation plate is of a hollow structure, the inner sides of the two threaded holes are in threaded connection with bolts, a square tube is fixedly connected to the side wall of the heat dissipation plate, and a sliding plate is slidably connected to the inner side of the square tube; the lower end of the sliding plate is slidably connected with two sliding strips, and the lower ends of the two sliding strips are fixedly connected with a supporting plate. Through the arrangement of the structure, the mutual communication between the heat dissipation plate and the gas circuit board is increased, the heat dissipation effect of the gas circuit board in the using process is improved, and the heat dissipation requirement of a user in the using process of the gas circuit board is met to a certain extent.

Description

Technical Field

[0001] The utility model relates to the technical field of air circuit boards, in particular to an air circuit board cooling system. Background Art

[0002] The manifold is an important component in the plastic injection mold. It is used to transport the plastic melt from the injection molding machine to multiple cavities in the mold. The manifold is usually made of metal material and has multiple channels for distributing the plastic melt to different cavities.

[0003] The existing related technologies often have the following defects: by setting a pipeline on the inner side of the gas circuit board and passing cold water, the problem of defective products caused by mold overheating can be improved. However, cooling only by water circuits cannot meet the cooling needs of users.

[0004] Therefore, the utility model provides an air circuit board cooling system. Utility Model Content

[0005] The utility model aims to solve the shortcoming in the prior art that cooling by water circuit alone cannot meet the cooling demand of users, and proposes an air circuit board cooling system.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an air circuit plate cooling system, comprising an air circuit plate, a pipeline is arranged inside the air circuit plate, four threaded holes are evenly opened on the surface of the air circuit plate, the four threaded holes are grouped in pairs, the threaded holes and the pipelines are connected, connecting pipes are inserted into the inner sides of two of the threaded holes, and the upper ends of the two connecting pipes are connected to a heat sink.

[0007] The effect achieved by the above components is that the heat sink itself also has a good heat dissipation effect, which can meet the user's heat dissipation needs during the use of the gas path plate.

[0008] Preferably, the heat dissipation plate is a hollow structure.

[0009] The effect achieved by the above components is that the water inside the pipeline can flow inside the heat sink of the hollow structure, further improving the cooling effect of the gas circuit board during use.

[0010] Preferably, the inner sides of the two threaded holes are threadedly connected with bolts.

[0011] The effect achieved by the above components is that by setting the bolts, the threaded hole position can be flexibly sealed, thereby improving the flexibility of using the heat sink.

[0012] Preferably, a square tube is fixedly connected to the side wall of the heat dissipation plate, a slide plate is slidably connected to the inner side of the square tube, two slide bars are slidably connected to the lower end of the slide bar, and a support plate is fixedly connected to the lower ends of the two slide bars.

[0013] The effect achieved by the above components is that the sliding bar slides inside the sliding plate to limit the moving direction of the supporting plate.

[0014] Preferably, an anti-slip pad is glued to the upper surface of the support plate.

[0015] The effect achieved by the above components is that the stability of installing the heat sink is improved by arranging the anti-slip pad.

[0016] Preferably, the inner thread of the slide plate is connected with a driving rod, and the driving rod is rotatably connected to the inner part of the support plate.

[0017] The effect achieved by the above components is: when the driving rod is rotated, the driving rod will drive the supporting plate to move upward.

[0018] Preferably, the connecting pipe is made of rubber.

[0019] The effect achieved by the above components is: the connection pipe made of rubber is provided to improve the tightness of the connection between the heat sink and the pipeline on the gas circuit board.

[0020] In summary:

[0021] In the utility model, the water inside the pipeline can flow inside the heat sink of the hollow structure, further improving the cooling effect of the gas circuit plate during use. By setting the above structure, the interconnection between the heat sink and the gas circuit plate is increased, the heat dissipation effect of the gas circuit plate during use is improved, and to a certain extent, the user's heat dissipation needs during the use of the gas circuit plate are met. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0023] Figure 2 It is a structural schematic diagram of the heat dissipation plate in the utility model;

[0024] Figure 3 For the utility model Figure 2 A schematic cross-sectional structure diagram of ;

[0025] Figure 4 It is a structural schematic diagram of the slide plate in the utility model.

[0026] Legend: 1. Air circuit board; 2. Pipeline; 3. Threaded hole; 4. Bolt; 5. Heat sink; 6. Square tube; 7. Slide plate; 8. Support plate; 9. Connecting pipe; 10. Slide bar; 11. Anti-slip pad; 12. Drive rod. DETAILED DESCRIPTION

[0027] Reference Figure 1-4 As shown, the utility model provides a technical solution: an air circuit board cooling system, comprising an air circuit board 1, wherein a pipeline 2 is arranged inside the air circuit board 1.

[0028] The following is a detailed description of its overall specific settings and functions.

[0029] In this embodiment: four threaded holes 3 are evenly opened on the surface of the gas circuit board 1, and the four threaded holes 3 are arranged in groups of two, and the threaded holes 3 are connected to the pipeline 2. The inner sides of the two threaded holes 3 are plugged with connecting pipes 9, and the upper ends of the two connecting pipes 9 are connected to the heat sink 5. The heat sink 5 itself also has a good heat dissipation effect, which can meet the heat dissipation needs of the user during the use of the gas circuit board 1.

[0030] The heat sink 5 is a hollow structure. The water inside the pipeline 2 can flow inside the heat sink 5 of the hollow structure, further improving the cooling effect of the gas path plate 1 during use. The inner sides of the two threaded holes 3 are both threadedly connected with bolts 4. By providing the bolts 4, the position of the threaded holes 3 can be flexibly blocked, which improves the flexibility of using the heat sink 5.

[0031] Specifically, the side wall of the heat sink 5 is fixedly connected with a square tube 6, the inner side of the square tube 6 is slidably connected with a slide plate 7, the lower end of the slide plate 7 is slidably connected with two slide bars 10, and the lower ends of the two slide bars 10 are fixedly connected with a support plate 8. The slide bars 10 slide inside the slide plate 7 to limit the moving direction of the support plate 8.

[0032] The upper surface of the support plate 8 is glued with an anti-skid pad 11. By providing the anti-skid pad 11, the stability of the installation of the heat sink 5 is improved. The internal thread of the slide plate 7 is connected with a driving rod 12, and the driving rod 12 is rotatably connected to the inside of the support plate 8. When the driving rod 12 is rotated, the driving rod 12 will drive the support plate 8 to move upward. The connecting pipe 9 is made of rubber. The connecting pipe 9 made of rubber improves the tightness of the connection between the heat sink 5 and the pipeline 2 on the gas circuit board 1.

[0033] Working principle: adding pipeline 2 to the gas circuit board 1 can change the machine damage caused by product defects and excessive temperature of the injection molding machine. Adding a cooling system to the gas circuit board 1 improves the problem of product defects caused by mold overheating. The water channel inside the pipeline 2 circulates continuously to reduce the mold temperature. After adding a cooling system to the gas circuit board 1, the heat transfer of the mold is reduced, and the temperature is effectively reduced to make the product reach a good quality, saving raw materials and energy consumption. Inserting the connecting pipe 9 on the heat sink 5 into the inner side of the threaded hole 3 on the gas circuit board 1 can realize the connection between the heat sink 5 and the pipeline 2 on the gas circuit board 1. Slide the slide plate 7 on the inner side of the square tube 6, and put the square tube 6, the slide plate 7 and the support plate 8 on the outer side of the gas circuit board 1. At this time, rotate the drive rod 12, and the drive rod 12 will drive the support plate 8 to move upward, wherein the slide bar 10 slides inside the slide plate 7 to limit the moving direction of the support plate 8, and the support plate 8 can be clamped on the gas circuit board 1 The outer side of the heat sink 5 can be installed at this time. By arranging the anti-slip pad 11, the stability of the installation of the heat sink 5 is improved. By arranging the connecting pipe 9 made of rubber material, the tightness of the connection between the heat sink 5 and the pipeline 2 on the gas circuit plate 1 is improved. The water inside the pipeline 2 can flow inside the heat sink 5 with a hollow structure, further improving the cooling effect of the gas circuit plate 1 during use. The heat sink 5 itself also has a good heat dissipation effect, which can meet the user's heat dissipation needs during the use of the gas circuit plate 1. By arranging the bolts 4, the flexible sealing work of the position of the threaded hole 3 can be achieved, which improves the flexibility of using the heat sink 5. By arranging the above structure, the mutual connection between the heat sink 5 and the gas circuit plate 1 is increased, the heat dissipation effect during the use of the gas circuit plate 1 is improved, and the heat dissipation needs of the user during the use of the gas circuit plate 1 are met to a certain extent.

[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

Claims

1. A cooling system for a gas circuit board (1), comprising a gas circuit board (1), characterized in that: The gas circuit plate (1) is provided with a pipeline (2) inside, and four threaded holes (3) are evenly opened on the surface of the gas circuit plate (1). The four threaded holes (3) are arranged in groups of two, and the threaded holes (3) are connected to the pipeline (2). The inner sides of two threaded holes (3) are plugged with connecting pipes (9), and the upper ends of the two connecting pipes (9) are connected to the heat sink (5).

2. A cooling system for a gas circuit board (1) according to claim 1, characterized in that: The heat dissipation plate (5) is a hollow structure.

3. A cooling system for a gas circuit board (1) according to claim 1, characterized in that: Bolts (4) are threadedly connected to the inner sides of the two threaded holes (3).

4. A cooling system for a gas circuit board (1) according to claim 1, characterized in that: The side wall of the heat dissipation plate (5) is fixedly connected to a square tube (6), the inner side of the square tube (6) is slidably connected to a slide plate (7), the lower end of the slide plate (7) is slidably connected to two slide bars (10), and the lower ends of the two slide bars (10) are fixedly connected to a support plate (8).

5. A cooling system for a gas circuit board (1) according to claim 4, characterized in that: An anti-slip pad (11) is glued to the upper surface of the support plate (8).

6. A cooling system for a gas circuit board (1) according to claim 4, characterized in that: The slide plate (7) is internally threadedly connected with a driving rod (12), and the driving rod (12) is internally rotationally connected to the support plate (8).

7. A cooling system for a gas circuit board (1) according to claim 1, characterized in that: The connecting pipe (9) is made of rubber.

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