Semiconductor wafer outer diameter detection device

Abstract

The utility model discloses a semiconductor wafer outer diameter detection device, which comprises a base and a support frame, the top end of the base is provided with the support frame, the top end of the base on one side of the support frame is provided with a first belt conveyor, and the top end of the base on one side of the first belt conveyor is provided with a second belt conveyor. A movable frame is arranged on the outer wall of the supporting frame, a second motor is installed on the outer wall of the movable frame, a connecting shaft is movably installed in the portion, on one side of the second motor, of the movable frame, the output end of the second motor is connected with the connecting shaft, and arc-shaped gears are symmetrically arranged in the portion, on one side of the connecting shaft, of the movable frame. According to the utility model, the convenient angle adjustment type detection of the semiconductor wafer by the detection device is realized, the vertical height adjustment detection is facilitated, the accurate detection of the outer diameter of the semiconductor wafer is facilitated, the detection of the semiconductor wafers conveyed in batches is facilitated, and the batch detection efficiency of the semiconductor wafers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of detection devices, in particular to a semiconductor wafer outer diameter detection device. Background Art

[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential semiconductor material in various applications. Wafer refers to the silicon wafer used to make silicon semiconductor circuits. The original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, which is a wafer.

[0003] For example, a semiconductor wafer outer diameter detection device disclosed in the authorization announcement number CN221037217U includes a detection box and a size detection mechanism arranged on the upper side of the detection box, wherein the size detection mechanism includes a first limiting groove opened at the top of the detection box, and the semiconductor wafer is clamped by an external clamp. When one end of the external clamp enters the clamping groove at the corresponding position of the first limiting groove, the second limiting groove and the third limiting groove, the semiconductor wafer will be placed, and then the transparent plate is illuminated by the irradiation component, and the size of the semiconductor wafer is observed;

[0004] Although it realizes the visual judgment of the measurement results, if the card slot cannot be placed, it is judged as unqualified, and if it is placed on the opposite side according to the direction, it is qualified. It not only greatly improves its detection efficiency, but also can cooperate with the feeding inspection process to detect and determine the size of semiconductor wafers. However, it does not solve the problem that the existing detection device is not conducive to convenient angle adjustment detection of semiconductor wafers when used, is not convenient for up and down height adjustment detection, and is not convenient for batch delivery of semiconductor wafers. This affects the accuracy of semiconductor wafer outer diameter detection and greatly affects the efficiency of semiconductor wafer batch detection. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor wafer outer diameter detection device to solve the problem that the detection device proposed in the above background technology is not convenient for convenient angle adjustment detection of semiconductor wafers, is not convenient for up and down height adjustment detection, which affects the accuracy of semiconductor wafer outer diameter detection, is not convenient for detecting batch-transported semiconductor wafers, and affects the efficiency of batch detection of semiconductor wafers.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor wafer outer diameter detection device, comprising a base and a support frame, a support frame is installed on the top of the base, a first belt conveyor is installed on the top of the base on one side of the support frame, a second belt conveyor is installed on the top of the base on one side of the first belt conveyor, a movable frame is arranged on the outer wall of the support frame, a second motor is installed on the outer wall of the movable frame, a connecting shaft is movably installed inside the movable frame on one side of the second motor, and the output end of the second motor is connected to the connecting shaft, arc gears are symmetrically arranged inside the movable frame on one side of the connecting shaft, a support shaft is installed on the side of the arc gear close to the movable frame, and the arc gears are movably connected to the movable frame through the support shaft, a driving gear is mounted on the surface of the connecting shaft on one side of the arc gear, and the driving gears are meshed with the arc gears, and a detection camera is installed between the two sets of arc gears.

[0007] Preferably, a sliding frame is installed on the outer wall of the movable frame above the support frame, and a first motor is symmetrically installed on the outer wall of the sliding frame. A movable shaft is arranged inside the sliding frame on one side of the first motor, and the output end of the first motor is connected to the movable shaft.

[0008] Preferably, two sets of racks are symmetrically installed on the outer wall of the support frame on one side of the movable shaft, and the surface of the movable shaft on one side of the rack is equipped with a first gear, and the first gear is meshed with the rack.

[0009] Preferably, a transverse screw moving mechanism is installed on the side of the top of the base away from the first belt conveyor, a front and rear screw moving mechanism is slidably installed on the top of the transverse screw moving mechanism, and an adjustment frame is slidably installed on the outer wall of the front and rear screw moving mechanism.

[0010] Preferably, a third motor is installed at the top of the adjusting frame, a threaded rod is arranged inside the adjusting frame below the third motor, and an output end of the third motor is connected to the threaded rod.

[0011] Preferably, a threaded sleeve is mounted on the surface of the threaded rod, and the threaded sleeve is threadedly connected to the threaded rod, an electric suction cup is installed at the bottom end of the threaded sleeve, and a placement groove is installed at the top of the base below the electric suction cup.

[0012] Preferably, a sliding block is installed on the outer wall of the threaded sleeve, a sliding rail is installed inside the adjusting frame on one side of the sliding block, and the sliding rail is slidably connected to the sliding block.

[0013] Preferably, a control panel is installed on the top of the base on one side of the second belt conveyor, and the output end of the control panel is electrically connected to the input ends of the first belt conveyor, the second belt conveyor, the first motor, the second motor, the detection camera, the transverse screw moving mechanism, the front and rear screw moving mechanism, the third motor, and the electric suction cup.

[0014] Compared with the prior art, the utility model has the following beneficial effects: the detection device not only realizes the convenient angle adjustment detection of semiconductor wafers, facilitates the up and down height adjustment detection, facilitates the accurate detection of the outer diameter of semiconductor wafers, but also facilitates the detection of semiconductor wafers transported in batches, thereby improving the efficiency of semiconductor wafer batch detection;

[0015] (1) The semiconductor wafer to be inspected is conveyed by the first belt conveyor. When the semiconductor wafer is conveyed to one side of the transverse screw moving mechanism, the front and rear screw moving mechanisms are driven by the transverse screw moving mechanism to move transversely at the top of the transverse screw moving mechanism. The adjustment frame is driven by the front and rear screw moving mechanisms to move forward and backward on the outer wall of the front and rear screw moving mechanisms. When the adjustment frame drives the electric suction cup to move to the top of the semiconductor wafer, the threaded rod is driven to rotate by the third motor, and the threaded sleeve moves on the surface of the threaded rod. The threaded sleeve drives the electric suction cup to adjust the height, and the electric suction cup adsorbs the semiconductor wafer. By operating the transverse screw moving mechanism, the front and rear screw moving mechanism, and the third motor to reset, the electric suction cup drives the semiconductor wafer to move to the inside of the placement groove, and the electric suction cup is operated to close to place the semiconductor wafer in the placement groove, so that the detection device can conveniently transport and discharge semiconductor wafers, facilitate the detection of semiconductor wafers transported in batches, and improve the efficiency of semiconductor wafer batch detection;

[0016] (2) The semiconductor wafer in the placement slot is inspected by the inspection camera. The second motor drives the connecting shaft to rotate, and the connecting shaft drives the driving gear to rotate, and the driving gear drives the arc gear to rotate, and the arc gear drives the inspection camera to rotate, so as to facilitate the inspection camera to perform angle adjustment rotation inspection. The first motor drives the movable shaft to rotate, and the movable shaft drives the first gear to rotate. The first gear drives the sliding frame to adjust the height on the surface of the support frame through the movable shaft, and the sliding frame drives the movable frame to adjust the height, and the movable frame drives the inspection camera to perform height adjustment inspection, so that the inspection camera can achieve high precision movement up and down to measure the film thickness, key dimensions, outer diameter accuracy, etc. of the semiconductor wafer to ensure that it meets the parameter design requirements. When the inspection is completed, the horizontal screw moving mechanism, the front and rear screw moving mechanism, and the third motor are operated again to drive the semiconductor wafer to the top of the second belt conveyor through the electric suction cup, and the semiconductor wafer is transported by the second belt conveyor, so as to realize the convenient angle adjustment inspection of the semiconductor wafer by the inspection device, facilitate the up and down height adjustment inspection, facilitate the accurate inspection of the outer diameter of the semiconductor wafer, and improve the inspection accuracy of the inspection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1It is a schematic diagram of the three-dimensional structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the three-dimensional structure of the adjustment frame of the utility model;

[0019] Figure 3 This is a front view structural schematic diagram of the utility model;

[0020] Figure 4 It is a side view structural schematic diagram of the utility model;

[0021] Figure 5 It is a schematic diagram of the top structure of the utility model.

[0022] In the figure: 1. base; 2. support frame; 3. first belt conveyor; 4. second belt conveyor; 5. movable frame; 6. sliding frame; 7. first motor; 8. movable shaft; 9. first gear; 10. rack; 11. second motor; 12. connecting shaft; 13. driving gear; 14. arc gear; 15. support shaft; 16. detection camera; 17. horizontal screw rod moving mechanism; 18. front and rear screw rod moving mechanism; 19. adjustment frame; 20. third motor; 21. threaded rod; 22. threaded sleeve; 23. electric suction cup; 24. placement slot; 25. slide rail; 26. slider; 27. control panel. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-5The utility model provides an embodiment: a semiconductor wafer outer diameter detection device, including a base 1 and a support frame 2, the support frame 2 is installed on the top of the base 1, a first belt conveyor 3 is installed on the top of the base 1 on one side of the support frame 2, a second belt conveyor 4 is installed on the top of the base 1 on one side of the first belt conveyor 3, a movable frame 5 is arranged on the outer wall of the support frame 2, a second motor 11 is installed on the outer wall of the movable frame 5, a connecting shaft 12 is movably installed inside the movable frame 5 on one side of the second motor 11, and the output end of the second motor 11 is connected to the connecting shaft 12, an arc gear 14 is symmetrically arranged inside the movable frame 5 on one side of the connecting shaft 12, and a support shaft 15 is installed on the side of the arc gear 14 close to the movable frame 5, and the arc gear The wheels 14 are all movably connected to the movable frame 5 through the support shaft 15, the surface of the connecting shaft 12 on one side of the arc gear 14 is equipped with a driving gear 13, and the driving gear 13 is meshed with the arc gear 14, and a detection camera 16 is installed between the two sets of arc gears 14, a sliding frame 6 is installed on the outer wall of the movable frame 5 above the support frame 2, and a first motor 7 is symmetrically installed on the outer wall of the sliding frame 6, and a movable shaft 8 is arranged inside the sliding frame 6 on one side of the first motor 7, and the output end of the first motor 7 is connected to the movable shaft 8, and two sets of racks 10 are symmetrically installed on the outer wall of the support frame 2 on one side of the movable shaft 8, and the surface of the movable shaft 8 on one side of the rack 10 is equipped with a first gear 9, and the first gear 9 is meshed with the rack 10;

[0025] When in use, the detection camera 16 is turned on by operating the control panel 27, and the detection camera 16 detects the semiconductor wafer inside the placement slot 24. The model of the detection camera 16 is a product similar to Dhyana 9KTDI produced by Fuzhou Indigo Imaging Technology Co., Ltd. The second motor 11 is turned on by operating the control panel 27, and the second motor 11 drives the connecting shaft 12 to rotate, and the connecting shaft 12 drives the driving gear 13 to rotate. Under the meshing action of the driving gear 13 and the arc gear 14, the driving gear 13 drives the arc gear 14 to rotate, and under the movable support of the support shaft 15, the arc gear 14 drives the detection camera 16 to rotate, so as to facilitate the detection camera 16 to perform angle-adjustable rotation detection. The first motor 7 is turned on by operating the control panel 27, and under the support of the sliding frame 6, the movable shaft 8 is driven by the first motor 7 to rotate, and the movable shaft 8 drives the first gear 9 to rotate. Under the meshing action of the first gear 9 and the rack 10, the first gear 9 drives the sliding frame 6 to adjust its height on the surface of the support frame 2 through the movable shaft 8, and the sliding frame 6 drives the movable shaft 8 to rotate. The movable frame 5 is height-adjusted, and the movable frame 5 drives the detection camera 16 to perform height-adjustment detection, so that the detection camera 16 can achieve high-precision movement up and down to measure the film thickness, key dimensions, outer diameter accuracy, etc. of the semiconductor wafer to ensure that it meets the parameter design requirements. When the detection is completed, the transverse screw moving mechanism 17, the front and rear screw moving mechanism 18, and the third motor 20 are operated again to drive the semiconductor wafer to the top of the second belt conveyor 4 through the electric suction cup 23, and the second belt conveyor 4 is opened by operating the control panel 27. The semiconductor wafer is transported by the second belt conveyor 4, realizing the convenient angle-adjustment detection of the semiconductor wafer by the detection device, facilitating the up and down height adjustment detection, facilitating the accurate detection of the outer diameter of the semiconductor wafer, and improving the detection accuracy of the detection device;

[0026] A transverse screw moving mechanism 17 is installed on the side of the top of the base 1 away from the first belt conveyor 3, a front and rear screw moving mechanism 18 is slidably installed on the top of the transverse screw moving mechanism 17, an adjustment frame 19 is slidably installed on the outer wall of the front and rear screw moving mechanism 18, a third motor 20 is installed on the top of the adjustment frame 19, a threaded rod 21 is arranged inside the adjustment frame 19 below the third motor 20, and the output end of the third motor 20 is connected to the threaded rod 21, a threaded sleeve 22 is sleeved on the surface of the threaded rod 21, and the threaded sleeve 22 is threadedly connected to the threaded rod 21, and an electric suction cup is installed at the bottom of the threaded sleeve 22 23, a placement groove 24 is installed at the top of the base 1 below the electric suction cup 23, a slider 26 is installed on the outer wall of the threaded sleeve 22, a slide rail 25 is installed inside the adjustment frame 19 on one side of the slider 26, and the slide rail 25 is slidably connected with the slider 26, and a control panel 27 is installed at the top of the base 1 on one side of the second belt conveyor 4, and the output end of the control panel 27 is electrically connected to the first belt conveyor 3, the second belt conveyor 4, the first motor 7, the second motor 11, the detection camera 16, the transverse screw rod moving mechanism 17, the front and rear screw rod moving mechanism 18, the third motor 20, and the input end of the electric suction cup 23;

[0027] When in use, an external power supply is connected, and the first belt conveyor 3 is first turned on through the operation control panel 27, and the semiconductor wafer to be tested is conveyed by the first belt conveyor 3. When the semiconductor wafer is conveyed to one side of the transverse screw moving mechanism 17, the transverse screw moving mechanism 17 is turned on through the operation control panel 27. Under the drive of the transverse screw moving mechanism 17, the front and rear screw moving mechanism 18 moves laterally at the top of the transverse screw moving mechanism 17. The front and rear screw moving mechanism 18 is turned on through the operation control panel 27. Under the drive of the front and rear screw moving mechanism 18, the adjustment frame 19 moves back and forth on the outer wall of the front and rear screw moving mechanism 18. When the adjustment frame 19 drives the electric suction cup 23 to move to the top of the semiconductor wafer, the third motor 20 is turned on through the operation control panel 27. Under the support of the adjustment frame 19, the threaded rod 21 is driven by the third motor 20 to rotate. Under the threaded support of the threaded rod 21 and the threaded sleeve 22, the threaded sleeve 22 The electric suction cup 23 moves on the surface of the threaded rod 21 and is supported by the sliding rail 25 and the slider 26. The threaded sleeve 22 drives the electric suction cup 23 to adjust its height. The electric suction cup 23 is opened by operating the control panel 27, and the electric suction cup 23 adsorbs the semiconductor wafer. The electric suction cup 23 drives the semiconductor wafer to move to the inside of the placement groove 24 by operating the transverse screw rod moving mechanism 17, the front and rear screw rod moving mechanism 18, and the third motor 20 to reset. The electric suction cup 23 is closed to place the semiconductor wafer in the placement groove 24. After the semiconductor wafer inspection is completed, the transverse screw rod moving mechanism 17, the front and rear screw rod moving mechanism 18, and the third motor 20 are reversely driven to place the semiconductor wafer at the top of the second belt conveyor 4 to facilitate the discharge of the semiconductor wafer, thereby realizing the convenient transportation and discharge of the semiconductor wafer by the detection device, facilitating the detection of batch-transported semiconductor wafers, and improving the efficiency of batch detection of semiconductor wafers.

[0028] Working principle: When in use, an external power supply is connected, and the first belt conveyor 3 is used to transport the semiconductor wafers to be inspected. Under the drive of the transverse screw moving mechanism 17, the front and rear screw moving mechanism 18 moves horizontally at the top of the transverse screw moving mechanism 17. Under the drive of the front and rear screw moving mechanism 18, the adjustment frame 19 moves back and forth on the outer wall of the front and rear screw moving mechanism 18. The threaded rod 21 is driven by the third motor 20 to rotate, and the threaded sleeve 22 moves on the surface of the threaded rod 21. The threaded sleeve 22 drives the electric suction cup 23 to adjust the height, and the electric suction cup 23 adsorbs the semiconductor wafer. By operating the transverse screw moving mechanism 17, the front and rear screw moving mechanism 18, and the third motor 20 to reset, the electric suction cup 23 drives the semiconductor wafer to move to the inside of the placement groove 24, and the electric suction cup 23 is closed to place the semiconductor wafer in the placement groove 24. The detection camera 16 detects the semiconductor wafer in the placement groove 24, and the second motor 11 drives the connecting shaft 12 to rotate. 2 drives the active gear 13 to rotate, the active gear 13 drives the arc gear 14 to rotate, and the arc gear 14 drives the detection camera 16 to rotate, so as to facilitate the detection camera 16 to perform angle adjustment rotation detection, the first motor 7 drives the movable shaft 8 to rotate, the movable shaft 8 drives the first gear 9 to rotate, the first gear 9 drives the sliding frame 6 to adjust the height on the surface of the support frame 2 through the movable shaft 8, the sliding frame 6 drives the movable frame 5 to adjust the height, and the movable frame 5 drives the detection camera 16 to perform height adjustment detection, so that the detection camera 16 can achieve high precision movement up and down, so as to measure the film thickness, key size, outer diameter accuracy, etc. of the semiconductor wafer, so as to ensure that it meets the parameter design requirements. When the detection is completed, the horizontal screw moving mechanism 17, the front and rear screw moving mechanism 18, and the third motor 20 are operated again to drive the semiconductor wafer to move to the top of the second belt conveyor 4 through the electric suction cup 23, and the semiconductor wafer is transported by the second belt conveyor 4 to complete the use of the detection device.

Claims

1. A semiconductor wafer outer diameter detection device, comprising a base (1) and a support frame (2), characterized in that: A support frame (2) is installed at the top of the base (1), a first belt conveyor (3) is installed at the top of the base (1) on one side of the support frame (2), a second belt conveyor (4) is installed at the top of the base (1) on one side of the first belt conveyor (3), a movable frame (5) is arranged on the outer wall of the support frame (2), a second motor (11) is installed on the outer wall of the movable frame (5), a connecting shaft (12) is movably installed inside the movable frame (5) on one side of the second motor (11), and an output end of the second motor (11) is connected to the connecting shaft (12) ), the movable frame (5) on one side of the connecting shaft (12) is symmetrically provided with arc gears (14), the arc gears (14) are installed with support shafts (15) on the sides close to the movable frame (5), and the arc gears (14) are movably connected to the movable frame (5) through the support shafts (15), the surfaces of the connecting shafts (12) on one side of the arc gears (14) are all covered with driving gears (13), and the driving gears (13) are all meshed with the arc gears (14), and a detection camera (16) is installed between the two sets of arc gears (14).

2. A semiconductor wafer outer diameter detection device according to claim 1, characterized in that: A sliding frame (6) is installed on the outer wall of the movable frame (5) above the support frame (2), and a first motor (7) is symmetrically installed on the outer wall of the sliding frame (6). A movable shaft (8) is arranged inside the sliding frame (6) on one side of the first motor (7), and the output end of the first motor (7) is connected to the movable shaft (8).

3. A semiconductor wafer outer diameter detection device according to claim 2, characterized in that: Two sets of racks (10) are symmetrically mounted on the outer wall of the support frame (2) on one side of the movable shaft (8), and a first gear (9) is mounted on the surface of the movable shaft (8) on one side of the rack (10), and the first gear (9) is meshed with the rack (10).

4. The semiconductor wafer outer diameter detection device according to claim 1, characterized in that: A transverse screw moving mechanism (17) is installed on the side of the top of the base (1) away from the first belt conveyor (3), a front and rear screw moving mechanism (18) is slidably installed on the top of the transverse screw moving mechanism (17), and an adjustment frame (19) is slidably installed on the outer wall of the front and rear screw moving mechanism (18).

5. A semiconductor wafer outer diameter detection device according to claim 4, characterized in that: A third motor (20) is installed at the top of the adjustment frame (19), a threaded rod (21) is arranged inside the adjustment frame (19) below the third motor (20), and an output end of the third motor (20) is connected to the threaded rod (21).

6. A semiconductor wafer outer diameter detection device according to claim 5, characterized in that: A threaded sleeve (22) is sleeved on the surface of the threaded rod (21), and the threaded sleeve (22) is threadedly connected to the threaded rod (21); an electric suction cup (23) is installed at the bottom end of the threaded sleeve (22), and a placement groove (24) is installed at the top end of the base (1) below the electric suction cup (23).

7. A semiconductor wafer outer diameter detection device according to claim 6, characterized in that: A sliding block (26) is installed on the outer wall of the threaded sleeve (22), a sliding rail (25) is installed inside the adjusting frame (19) on one side of the sliding block (26), and the sliding rail (25) is slidably connected to the sliding block (26).

8. The semiconductor wafer outer diameter detection device according to claim 6, characterized in that: A control panel (27) is installed at the top of the base (1) on one side of the second belt conveyor (4), and the output end of the control panel (27) is electrically connected to the input ends of the first belt conveyor (3), the second belt conveyor (4), the first motor (7), the second motor (11), the detection camera (16), the transverse screw moving mechanism (17), the front and rear screw moving mechanism (18), the third motor (20), and the electric suction cup (23).

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