Electroplating device for copper material for shielding

Abstract

The utility model relates to the field of copper material processing, and discloses an electroplating device for shielding copper materials, which comprises a working plate, the top of the working plate is fixedly connected with a lifting sleeve plate, the top of the lifting sleeve plate is fixedly connected with a transverse plate, and the top of the transverse plate is fixedly connected with an electrifying box. And one side of the electrifying box is fixedly connected with a positive electrode transmission pipe. According to the electroplating device for the copper material for shielding, through the arrangement of the working plate, the lifting sleeve plate, the transverse plate, the electrifying box, a positive electrode transmission pipe, a positive electrode side plate, a pressing frame, a telescopic column, a pressing plate, a negative electrode transmission pipe, a negative electrode transverse pipe and a negative electrode side plate, the electroplating device is more convenient to use, and materials of the electroplating device can be conveniently replaced; and therefore, the working content of workers is reduced, the working complexity of the workers is reduced, the working time of the workers is shortened, the working efficiency of the workers is improved, and long-term use of the electroplating device is not facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of copper material processing, in particular to an electroplating device for shielding copper material. Background Art

[0002] Copper materials are made of pure copper or copper alloy in various shapes, including rods, wires, plates, strips, bars, tubes, foils, etc. Copper materials are processed by rolling, extrusion and drawing. Copper plates and bars are hot-rolled and cold-rolled, while strips and foils are cold-rolled. Tubes and rods are divided into extruded products and drawn products, and wires are all drawn. In the process of copper material processing, in order to make the copper material look better and more durable, it is necessary to electroplate the copper material, and then an electroplating device is needed.

[0003] However, the electroplating equipment currently available on the market is not very convenient to use, and it is not possible to conveniently change materials in the electroplating equipment. This increases the work content of the staff, increases the complexity of the staff's work, increases the staff's working hours, reduces the staff's work efficiency, and is not conducive to the long-term use of the electroplating equipment. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the utility model provides an electroplating device for shielding copper material, which has the function of convenient material replacement and solves the problems in the above-mentioned background technology.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an electroplating device for shielding copper materials, comprising a working plate, the top of the working plate is fixedly connected to a lifting sleeve plate, the top of the lifting sleeve plate is fixedly connected to a horizontal plate, the top of the horizontal plate is fixedly connected to a power-on box, one side of the power-on box is fixedly connected to a positive transmission tube, and one end of the positive transmission tube is fixedly connected to a positive side plate.

[0008] A pressure frame is fixedly connected to the bottom of the positive side plate, a telescopic column is fixedly connected to the inner side of the pressure frame, one end of the telescopic column is fixedly connected to a pressure plate, a negative transmission tube is fixedly connected to one side of the power box, one end of the negative transmission tube is fixedly connected to a negative cross tube, and one end of the negative cross tube is fixedly connected to the negative side plate, which makes the electroplating device more convenient to use and allows for convenient material replacement, which reduces the work content of the staff, reduces the complexity of the staff's work, reduces the working time of the staff, improves the work efficiency of the staff, and is not conducive to the long-term use of the electroplating device.

[0009] Furthermore, a hanging column is fixedly connected to one side of the negative electrode side plate, and the length of the hanging column is greater than the length of the negative electrode cross tube, so as to facilitate the hooking of other components.

[0010] Furthermore, a hook ring is movably connected to the outer wall of the hanging column, and a hanging plate is fixedly connected to the bottom end of the hook ring to ensure the normal progress of the electroplating process.

[0011] Furthermore, a placement frame is fixedly connected to one side of the hanging plate, and the number of the placement frames is two, so that the copper material can be electroplated.

[0012] Furthermore, a plating frame is fixedly connected to the top of the working plate, and the plating frame is located at the top center point of the working plate, providing a working environment for the electroplating of the copper material.

[0013] Furthermore, a liquid outlet pipe is fixedly connected to one side of the electroplating frame, and a pipe cover is movably connected to one side of the liquid outlet pipe, so that the electroplating solution in the electroplating frame can be quickly discharged after the device is used.

[0014] Furthermore, the bottom of the working plate is fixedly connected with a bottom block, and the number of the bottom blocks is four, which ensures the stability of the overall operation of the device.

[0015] Beneficial Effects

[0016] Compared with the prior art, the utility model provides an electroplating device for shielding copper material, which has the following beneficial effects:

[0017] 1. The electroplating device for shielding copper material makes the electroplating device more convenient to use by arranging a working plate, a lifting sleeve plate, a horizontal plate, a power box, a positive transmission tube, a positive side plate, a pressure frame, a telescopic column, a pressure plate, a negative transmission tube, a negative horizontal tube and a negative side plate. The material of the electroplating device can be replaced conveniently, which reduces the work content of the staff, reduces the work complexity of the staff, reduces the working time of the staff, improves the work efficiency of the staff, and is not conducive to the long-term use of the electroplating device.

[0018] 2. The electroplating device for shielding copper materials facilitates the electroplating of multiple copper materials by means of the arranged hanging posts, hooks, hanging plates, placement frames and electroplating frames, thereby improving the processing speed of the copper materials, accelerating the overall work progress, improving the work efficiency of the staff, and facilitating the long-term use of the electroplating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional diagram of the structure of the utility model;

[0020] Figure 2 This is a three-dimensional diagram of the connection structure between the bottom block and the working plate of the utility model;

[0021] Figure 3 This is a diagram showing the interior structure of the utility model;

[0022] Figure 4 This is a top view of the structure of the utility model;

[0023] Figure 5 The utility model structure Figure 1 Enlarged view of point A in the middle.

[0024] In the figure: 1. working plate; 2. lifting plate; 3. horizontal plate; 4. power box; 5. positive transmission tube; 6. positive side plate; 7. pressing frame; 8. telescopic column; 9. pressing plate; 10. negative transmission tube; 11. negative horizontal tube; 12. negative side plate; 13. hanging column; 14. hook ring; 15. hanging plate; 16. placement frame; 17. electroplating frame; 18. liquid outlet pipe; 19. pipe cover; 20. bottom block. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Example 1

[0027] The preferred embodiment of the electroplating device for shielding copper material provided by the utility model is as follows: Figures 1 to 4 As shown: an electroplating device for shielding copper material, including a working plate 1, a lifting sleeve plate 2 is fixedly connected to the top of the working plate 1, a horizontal plate 3 is fixedly connected to the top of the lifting sleeve 2, a power-on box 4 is fixedly connected to the top of the horizontal plate 3, a positive electrode transmission tube 5 is fixedly connected to one side of the power-on box 4, and a positive electrode side plate 6 is fixedly connected to one end of the positive electrode transmission tube 5.

[0028] A pressure frame 7 is fixedly connected to the bottom of the positive side plate 6, a telescopic column 8 is fixedly connected to the inner side of the pressure frame 7, one end of the telescopic column 8 is fixedly connected to a pressure plate 9, a negative transmission tube 10 is fixedly connected to one side of the power box 4, one end of the negative transmission tube 10 is fixedly connected to a negative cross tube 11, and one end of the negative cross tube 11 is fixedly connected to a negative side plate 12, which makes the electroplating device more convenient to use and can conveniently replace materials in the electroplating device, which also reduces the work content of the staff, reduces the complexity of the staff's work, reduces the working time of the staff, improves the work efficiency of the staff, and is not conducive to the long-term use of the electroplating device.

[0029] Furthermore, a hanging column 13 is fixedly connected to one side of the negative electrode side plate 12, and the length of the hanging column 13 is greater than the length of the negative electrode cross tube 11, so as to facilitate the hooking of other components.

[0030] Furthermore, the outer wall of the hanging column 13 is movably connected with a hook ring 14, and the bottom end of the hook ring 14 is fixedly connected with a hanging plate 15 to ensure the normal progress of the electroplating process.

[0031] Furthermore, a placement frame 16 is fixedly connected to one side of the hanging plate 15, and the number of the placement frames 16 is two, so that the copper material can be electroplated.

[0032] Furthermore, a plating frame 17 is fixedly connected to the top of the working plate 1 , and the plating frame 17 is located at the top center point of the working plate 1 , providing a working environment for the electroplating of the copper material.

[0033] Furthermore, a liquid outlet pipe 18 is fixedly connected to one side of the electroplating frame 17, and a pipe cover 19 is movably connected to one side of the liquid outlet pipe 18, so that the electroplating solution in the electroplating frame 17 can be quickly discharged after the device is used.

[0034] Furthermore, a bottom block 20 is fixedly connected to the bottom of the working plate 1, and the number of the bottom blocks 20 is four, which ensures the stability of the overall operation of the device.

[0035] During use, when it is necessary to feed the electroplating device, the lifting sleeve 2 is raised, and the material to be electrolyzed is placed inside the pressing frame 7. At this time, the telescopic column 8 begins to extend so that the pressing plate 9 can fix the electrolyzed material, and then the hanging plate 15 is taken out, and the copper material to be electroplated is placed in the placement frame 16, and then the hook ring 14 is placed on the hanging column 13, and the electroplating solution is added to the electroplating frame 17. At this time, the lifting sleeve 2 is lowered so that the electrolytic material and the electroplated copper material fall into the electroplating solution, and the power box 4 starts to work so that the current flows in the electroplating solution, thereby completing the electroplating of the copper material.

[0036] To sum up, the electroplating device for shielding copper materials makes the electroplating device more convenient to use, and the material of the electroplating device can be easily replaced, which also reduces the work content of the staff, reduces the complexity of the staff's work, reduces the working time of the staff, improves the work efficiency of the staff, and is not conducive to the long-term use of the electroplating device; it also facilitates the electroplating device to electroplate multiple copper materials, improves the processing speed of copper materials, speeds up the overall work progress, improves the work efficiency of the staff, and is conducive to the long-term use of the electroplating device.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0038] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the utility model.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electroplating device for shielding copper material, comprising a working plate (1), characterized in that: The top of the working plate (1) is fixedly connected to a lifting sleeve plate (2), the top of the lifting sleeve plate (2) is fixedly connected to a horizontal plate (3), the top of the horizontal plate (3) is fixedly connected to a power supply box (4), one side of the power supply box (4) is fixedly connected to a positive electrode transmission tube (5), and one end of the positive electrode transmission tube (5) is fixedly connected to a positive electrode side plate (6); The bottom of the positive side plate (6) is fixedly connected to a pressure frame (7), the inner side of the pressure frame (7) is fixedly connected to a telescopic column (8), one end of the telescopic column (8) is fixedly connected to a pressure plate (9), one side of the power box (4) is fixedly connected to a negative transmission tube (10), one end of the negative transmission tube (10) is fixedly connected to a negative cross tube (11), and one end of the negative cross tube (11) is fixedly connected to a negative side plate (12).

2. The electroplating device for shielding copper material according to claim 1, characterized in that: A hanging column (13) is fixedly connected to one side of the negative electrode side plate (12), and the length of the hanging column (13) is greater than the length of the negative electrode cross tube (11).

3. The electroplating device for shielding copper material according to claim 2, characterized in that: The outer wall of the hanging column (13) is movably connected with a hook ring (14), and the bottom end of the hook ring (14) is fixedly connected with a hanging plate (15).

4. The electroplating device for shielding copper material according to claim 3, characterized in that: A placement frame (16) is fixedly connected to one side of the hanging plate (15), and the number of the placement frames (16) is two.

5. The electroplating device for shielding copper material according to claim 1, characterized in that: The top of the working plate (1) is fixedly connected with an electroplating frame (17), and the electroplating frame (17) is located at the top center point of the working plate (1).

6. The electroplating device for shielding copper material according to claim 5, characterized in that: A liquid outlet pipe (18) is fixedly connected to one side of the electroplating frame (17), and a pipe cover (19) is movably connected to one side of the liquid outlet pipe (18).

7. The electroplating device for shielding copper material according to claim 1, characterized in that: The bottom of the working plate (1) is fixedly connected with a bottom block (20), and the number of the bottom blocks (20) is four.

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