Multi-layer piezoelectric wafer combined six-dimensional acceleration sensor

Abstract

The utility model discloses a multilayer piezoelectric wafer combined type six-dimensional acceleration sensor, which comprises a base (1), a shell (2), a dynamometer and a plurality of inertial mass blocks (4), the shell (2) covers the base (1), so that the dynamometer and the inertial mass block (4) which are positioned on the base (1) are packaged; the center of the inertial mass block (4) is collinear with the Z axis of the working three-dimensional rectangular coordinate system of the six-dimensional acceleration sensor; the dynamometer comprises an X0-degree cut type quartz wafer group (7), a first Y0-degree cut type quartz wafer group (8) and a second Y0-degree cut type quartz wafer group (9); the X0-degree cut quartz wafer group (7) is used for collecting Z-direction linear acceleration, X-direction angular acceleration and Y-direction angular acceleration; the first Y0-degree cut quartz wafer group (8) is used for collecting Y-direction linear acceleration; and the second Y0-degree cut quartz wafer group (9) is used for collecting the X-direction linear acceleration and the Z-direction angular acceleration. According to the utility model, the mass block is better attached to the corresponding electrode, and the output of the quartz wafer is more sensitive. By adjusting the sensitivity, the linearity of the acquisition range is higher. According to the utility model, the structure of the piezoelectric six-dimensional acceleration sensor is optimized, and the manufacturing difficulty and the manufacturing cost are lower.

Description

Technical Field

[0001] The utility model relates to the field of sensor technology, in particular to a multi-layer piezoelectric chip combined six-dimensional acceleration sensor. Background Art

[0002] The six-dimensional acceleration sensor is a sensor that can simultaneously collect three-axis linear acceleration and three-axis angular velocity. With the continuous development of intelligent and automated technology, the demand for obtaining multi-dimensional motion information has gradually increased. The six-dimensional acceleration sensor has attracted much attention due to its comprehensive motion parameter acquisition capabilities. At present, researchers have designed different types of six-dimensional acceleration sensors based on the different structures, sensitive and conversion elements used by the sensors. However, these six-dimensional acceleration sensors have some common problems, such as complex decoupling operations, poor dynamic characteristics, and difficulties in miniaturization and micro-miniaturization, which seriously hinder the practical application and commercialization of six-dimensional acceleration sensors. In order to overcome these shortcomings, the patent with announcement number CN102520210A proposes a "piezoelectric six-dimensional acceleration sensor" with an integrated structure of a single mass block and eight piezoelectric wafers in a planar layout. It has the advantages of small inter-dimensional coupling, no need for decoupling operations, good dynamic characteristics, easy miniaturization, and low manufacturing cost. However, since the prior art uses up to eight quartz wafers, and each wafer needs to be installed at a specific angle, it has shortcomings in terms of manufacturing difficulty and installation accuracy. Utility Model Content

[0003] The utility model aims to provide a multi-layer piezoelectric chip combined six-dimensional acceleration sensor, comprising a base, a shell, a dynamometer, and a plurality of inertial mass blocks.

[0004] The housing cover is mounted on the base, thereby encapsulating the dynamometer and the inertial mass block located on the base.

[0005] The center of the inertial mass block is collinear with the Z axis of the working three-dimensional rectangular coordinate system of the six-dimensional acceleration sensor.

[0006] The dynamometer comprises an X0°-cut quartz wafer group, a first Y0°-cut quartz wafer group, and a second Y0°-cut quartz wafer group.

[0007] The X0°-cut quartz wafer group, the first Y0°-cut quartz wafer group, and the second Y0°-cut quartz wafer group are all arranged on a base.

[0008] Furthermore, the base is provided with a mounting plate.

[0009] The dynamometer is fixed on the mounting plate by bolts.

[0010] Furthermore, the mounting disk is a circular disk.

[0011] The mounting plate is mounted on the base through mounting columns.

[0012] Furthermore, the mass blocks are four identical cylindrical mass blocks.

[0013] Furthermore, the X0° cut quartz wafer group includes an X0° cut quartz wafer, an X0° cut quartz wafer electrode sheet group, a No. 1 insulating electrode plate and an X0° cut quartz wafer group grounding electrode.

[0014] The X0° cut quartz wafer electrode sheet group includes output electrode Q1, output electrode Q2, output electrode Q3, and output electrode Q4, one end of which is connected to insulating electrode plate No. 1 to prevent charge cross interference, and the other end is connected to the X0° cut quartz wafer to output charge.

[0015] The X0°-cut quartz wafer group grounding electrode is used to isolate each quartz wafer group to prevent cross interference.

[0016] Furthermore, the first Y0°-cut quartz wafer group includes a first Y0°-cut quartz wafer, a first Y0°-cut quartz wafer electrode sheet group, a No. 2 insulating electrode plate, and a first Y0°-cut quartz wafer grounding electrode.

[0017] The first Y0° cut quartz wafer electrode sheet group includes output electrode Q5 and output electrode Q6, one end of these output electrodes is connected to the No. 2 insulating electrode plate to prevent charge cross interference, and the other end is connected to the first Y0° cut quartz wafer to output charge.

[0018] The first Y0°-cut quartz wafer grounding electrode is used to isolate each quartz wafer group to prevent cross interference.

[0019] Furthermore, the second Y0°-cut quartz wafer group includes a second Y0°-cut quartz wafer, a second Y0°-cut quartz wafer electrode sheet group and a No. 3 insulating electrode plate.

[0020] The second Y0° cut quartz wafer electrode sheet group includes output electrode Q7 and output electrode Q8, one end of these output electrodes is connected to the insulating electrode plate No. 3 to prevent charge cross interference, and the other end is connected to the second Y0° cut quartz wafer to output charge.

[0021] Furthermore, the electrode positions of the electrode sheet group of the first Y0°-cut quartz wafer group and the electrode sheet group of the second Y0°-cut quartz wafer group are complementary.

[0022] Furthermore, the housing has a plurality of sockets.

[0023] The output electrode Q1, output electrode Q2, output electrode Q3, output electrode Q4, output electrode Q5, output electrode Q6, output electrode Q7, and output electrode Q8 in the dynamometer constitute eight signal output terminals, and are respectively connected to corresponding sockets through signal leads.

[0024] The technical effect of the utility model is unquestionable. The utility model provides a piezoelectric six-dimensional acceleration sensor that is also free of inter-dimensional coupling, has low manufacturing cost, good dynamic characteristics, is conducive to miniaturization, has a simple structure, and has higher sensitivity and acquisition range. The mass block of the utility model fits the corresponding electrode more closely, and the output of the quartz chip will be more sensitive. By adjusting the sensitivity, the acquisition range of the utility model has higher linearity. The utility model optimizes the structure of the piezoelectric six-dimensional acceleration sensor, and the manufacturing difficulty and manufacturing cost are lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the utility model;

[0026] Figure 2 for Figure 1 A top view of

[0027] Figure 3 This is the electrode arrangement diagram of the No. 1 insulating electrode plate of the utility model;

[0028] Figure 4 This is the electrode arrangement diagram of the No. 2 insulating electrode plate of the utility model;

[0029] Figure 5 This is the electrode arrangement diagram of the No. 3 insulating electrode plate of the utility model;

[0030] In the figure, there are base 1, mounting plate 11, mounting column 12, shell 2, socket 3, inertial mass block 4, nut 51, stud bolt 52, insulating filling material 6, X0° cut quartz chip group 7, first Y0° cut quartz chip group 8, second Y0° cut quartz chip group 9, X0° cut quartz chip 71, X0° cut quartz chip electrode piece group 72, No. 1 insulating electrode plate 73, X0° cut quartz chip group grounding electrode 74, first Y0° cut quartz chip 81, first Y0° cut quartz chip electrode piece group 82, No. 2 insulating electrode plate 83, first Y0° cut quartz chip grounding electrode 84, second Y0° cut quartz chip 91, second Y0° cut quartz chip electrode piece group 92 and No. 3 insulating electrode plate 93. DETAILED DESCRIPTION

[0031] The present invention is further described below in conjunction with the embodiments, but it should not be understood that the above subject matter of the present invention is limited to the following embodiments. Without departing from the above technical ideas of the present invention, various substitutions and changes are made according to the common technical knowledge and conventional means in the field, which should be included in the protection scope of the present invention.

[0032] Embodiment 1:

[0033] See also Figures 1 to 5 A multi-layer piezoelectric chip combined six-dimensional acceleration sensor includes a base 1, a shell 2, a dynamometer, and multiple inertial mass blocks 4.

[0034] The housing 2 is mounted on the base 1 , thereby encapsulating the dynamometer and the inertial mass 4 located on the base 1 .

[0035] The center of the inertial mass block 4 is collinear with the Z axis of the working three-dimensional rectangular coordinate system of the six-dimensional acceleration sensor.

[0036] The dynamometer comprises an X0°-cut quartz wafer group 7 , a first Y0°-cut quartz wafer group 8 , and a second Y0°-cut quartz wafer group 9 .

[0037] The X0°-cut quartz wafer group 7 , the first Y0°-cut quartz wafer group 8 , and the second Y0°-cut quartz wafer group 9 are all arranged on the base 1 .

[0038] The X0°-cut quartz wafer group 7 is used to collect Z-direction linear acceleration, X-direction angular acceleration, and Y-direction angular acceleration.

[0039] The first Y0°-cut quartz wafer group 8 is used to collect Y-axis linear acceleration.

[0040] The second Y0°-cut quartz wafer group 9 is used to collect the X-direction linear acceleration and the Z-direction angular acceleration.

[0041] The base 1 is provided with a mounting plate 11 .

[0042] The dynamometer is fixedly mounted on the mounting plate 11 by means of bolts.

[0043] The mounting plate 11 is a circular plate.

[0044] The mounting plate 11 is mounted on the base 1 via mounting posts 12 .

[0045] The mass blocks are four identical cylindrical mass blocks.

[0046] The X0° cut quartz wafer group includes an X0° cut quartz wafer 71, an X0° cut quartz wafer electrode sheet group 72, a No. 1 insulating electrode plate 73 and an X0° cut quartz wafer group grounding electrode 74.

[0047] The X0° cut quartz wafer electrode plate group 72 includes output electrode Q1, output electrode Q2, output electrode Q3, and output electrode Q4. One end of these output electrodes is connected to the insulating electrode plate No. 1 73 to prevent cross-charge interference, and the other end is connected to the X0° cut quartz wafer 71 to output charges.

[0048] The X0°-cut quartz wafer group grounding electrode 74 is used to isolate each quartz wafer group to prevent cross interference.

[0049] The first Y0° cut quartz wafer group 8 includes a first Y0° cut quartz wafer 81, a first Y0° cut quartz wafer electrode plate group 82, a No. 2 insulating electrode plate 83 and a first Y0° cut quartz wafer grounding electrode 84.

[0050] The first Y0° cut quartz wafer electrode plate group 82 includes output electrode Q5 and output electrode Q6, one end of which is connected to the No. 2 insulating electrode plate 83 to prevent charge cross interference, and the other end is connected to the first Y0° cut quartz wafer 81 to output charge.

[0051] The first Y0°-cut quartz wafer grounding electrode 84 is used to isolate each quartz wafer group to prevent cross interference.

[0052] The second Y0°-cut quartz wafer group 9 includes a second Y0°-cut quartz wafer 91 , a second Y0°-cut quartz wafer electrode sheet group 92 and a No. 3 insulating electrode plate 93 .

[0053] The second Y0° cut quartz wafer electrode sheet group 92 includes output electrodes Q7 and Q8, one end of which is connected to the insulating electrode plate No. 3 93 to prevent charge cross interference, and the other end is connected to the second Y0° cut quartz wafer 91 to output charges.

[0054] The electrode positions of the electrode sheet group 82 of the first Y0°-cut quartz wafer group 8 and the electrode sheet group 92 of the second Y0°-cut quartz wafer group 9 are complementary.

[0055] The housing 2 is provided with a plurality of sockets 3 .

[0056] The output electrode Q1 , output electrode Q2 , output electrode Q3 , output electrode Q4 , output electrode Q5 , output electrode Q6 , output electrode Q7 , and output electrode Q8 in the dynamometer constitute eight signal output terminals, and are respectively connected to corresponding sockets 3 through signal leads.

[0057] Embodiment 2:

[0058] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor comprises a base 1, a shell 2, a dynamometer, and a plurality of inertial mass blocks 4.

[0059] The housing 2 is mounted on the base 1 , thereby encapsulating the dynamometer and the inertial mass 4 located on the base 1 .

[0060] The center of the inertial mass block 4 is collinear with the Z axis of the working three-dimensional rectangular coordinate system of the six-dimensional acceleration sensor.

[0061] The dynamometer comprises an X0°-cut quartz wafer group 7 , a first Y0°-cut quartz wafer group 8 , and a second Y0°-cut quartz wafer group 9 .

[0062] The X0°-cut quartz wafer group 7 is used to collect Z-direction linear acceleration, X-direction angular acceleration, and Y-direction angular acceleration.

[0063] The first Y0°-cut quartz wafer group 8 is used to collect Y-axis linear acceleration.

[0064] The second Y0°-cut quartz wafer group 9 is used to collect the X-direction linear acceleration and the Z-direction angular acceleration.

[0065] Embodiment 3:

[0066] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor, the technical content of which is the same as that of Example 2, and further, the base 1 has a mounting plate 11.

[0067] The dynamometer is fixedly mounted on the mounting plate 11 by means of bolts.

[0068] Embodiment 4:

[0069] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor, the technical content of which is the same as any one of Embodiments 2-3, and further, the mounting disk 11 is a circular disk.

[0070] The mounting plate 11 is mounted on the base 1 via mounting posts 12 .

[0071] Embodiment 5:

[0072] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor, the technical content of which is the same as any one of Examples 2-4, and further, the mass blocks are four identical cylindrical mass blocks.

[0073] Embodiment 6:

[0074] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor, the technical content of which is the same as any one of Examples 2-5, and further, the X0° cut quartz chip group includes an X0° cut quartz chip 71, an X0° cut quartz chip electrode sheet group 72, a No. 1 insulating electrode plate 73 and an X0° cut quartz chip group grounding electrode 74.

[0075] The X0° cut quartz wafer electrode plate group 72 includes output electrode Q1, output electrode Q2, output electrode Q3, and output electrode Q4. One end of these output electrodes is connected to the insulating electrode plate No. 1 73 to prevent cross-charge interference, and the other end is connected to the X0° cut quartz wafer 71 to output charges.

[0076] The X0°-cut quartz wafer group grounding electrode 74 is used to isolate each quartz wafer group to prevent cross interference.

[0077] Embodiment 7:

[0078] A multilayer piezoelectric chip combined six-dimensional acceleration sensor, the technical content of which is the same as any one of Examples 2-6, and further, the first Y0° cut quartz chip group 8 includes a first Y0° cut quartz chip 81, a first Y0° cut quartz chip electrode plate group 82, a No. 2 insulating electrode plate 83 and a first Y0° cut quartz chip grounding electrode 84.

[0079] The first Y0° cut quartz wafer electrode plate group 82 includes output electrode Q5 and output electrode Q6, one end of which is connected to the No. 2 insulating electrode plate 83 to prevent charge cross interference, and the other end is connected to the first Y0° cut quartz wafer 81 to output charge.

[0080] The first Y0°-cut quartz wafer grounding electrode 84 is used to isolate each quartz wafer group to prevent cross interference.

[0081] Embodiment 8:

[0082] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor, the technical content of which is the same as any one of Examples 2-7, and further, the second Y0° cut quartz chip group 9 includes a second Y0° cut quartz chip 91, a second Y0° cut quartz chip electrode sheet group 92 and a No. 3 insulating electrode plate 93.

[0083] The second Y0° cut quartz wafer electrode sheet group 92 includes output electrodes Q7 and Q8, one end of which is connected to the insulating electrode plate No. 3 93 to prevent charge cross interference, and the other end is connected to the second Y0° cut quartz wafer 91 to output charges.

[0084] Embodiment 9:

[0085] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor, the technical content of which is the same as any one of Examples 2-8, further, the electrode positions of the electrode sheet group 82 of the first Y0° cut quartz chip group 8 and the electrode sheet group 92 of the second Y0° cut quartz chip group 9 are complementary.

[0086] Embodiment 10:

[0087] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor, the technical content of which is the same as any one of embodiments 2-9, and further, the shell 2 has a plurality of sockets 3.

[0088] The output electrode Q1 , output electrode Q2 , output electrode Q3 , output electrode Q4 , output electrode Q5 , output electrode Q6 , output electrode Q7 , and output electrode Q8 in the dynamometer constitute eight signal output terminals, and are respectively connected to corresponding sockets 3 through signal leads.

[0089] Embodiment 11:

[0090] A multilayer piezoelectric chip combined six-dimensional acceleration sensor, the technical content is the same as any one of embodiments 2-10, further, the insulating electrode plates 73, 83 and 93 are circular plates made of polytetrafluoroethylene, and the electrode pairs (72, 82, 92) are plated on the circular plates by electroplating;

[0091] The outer diameter of the polytetrafluoroethylene annular plate is not greater than the outer diameter of the mounting plate 11, and it has through holes for the pre-tightening bolts (ie, the stud bolts 52 in this specific embodiment) to pass through.

[0092] Embodiment 12:

[0093] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor, the technical content of which is the same as any one of embodiments 2-11, and further, an insulating filling material 6 is filled between each signal lead to fix the insulating electrode plates respectively and insulate them from each other.

[0094] The distance between the insulating filling material 6 and the mounting plate 11 is controlled to be between 0.3 mm and 1 mm, and the height is lower than the position of the insulating electrode plate 93 .

[0095] The insulating filler 6 is various insulating fillers including polytetrafluoroethylene filler.

[0096] Embodiment 13:

[0097] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor comprises a base with a mounting plate, and a shell cover with a socket is installed on the base.

[0098] In the housing, a pre-tightening bolt is fixedly mounted on the base mounting plate to fix the dynamometer and the inertial mass block located on the uppermost position;

[0099] Among them, the mounting disk is a circular disk, which is installed on the base through a mounting column. A mounting hole for collection is installed at the bottom of the base. The four are connected as a whole in a coaxial state, and this common axis is colinear with the Z axis of the working three-dimensional rectangular coordinate system of the sensor.

[0100] The mass block is divided into four identical cylindrical mass blocks, and the centers of the four mass blocks are collinear with the Z axis of the working three-dimensional rectangular coordinate system of the sensor;

[0101] The dynamometer is constructed by stacking three groups of quartz wafers, including an X0°-cut quartz wafer group, a first Y0°-cut quartz wafer group, and a second Y0°-cut quartz wafer group.

[0102] The X0° cut quartz wafer set includes an X0° cut quartz wafer, an electrode sheet set, a No. 1 insulating electrode plate, and a grounding electrode;

[0103] The first Y0°-cut quartz wafer set includes the first Y0°-cut quartz wafer, an electrode sheet set, a No. 2 insulating electrode plate, and a grounding electrode;

[0104] The second Y0°-cut quartz wafer set includes a second Y0°-cut quartz wafer, an electrode sheet set, and a No. 3 insulating electrode plate.

[0105] The X0° cut quartz wafer electrode sheet group includes 4 output electrodes, which are connected to the insulating electrode plate at the bottom to prevent charge cross interference, and are connected to the X0° cut quartz wafer at the top to output charge; the first Y0° cut quartz wafer electrode sheet group includes 2 output electrodes, which are connected to the insulating electrode plate at the top and are connected to the first Y0° cut quartz wafer at the bottom to output charge;

[0106] The second Y0°-cut quartz wafer electrode sheet group includes two output electrodes, which are connected to the insulating electrode plate at the top and connected to the second Y0°-cut quartz wafer at the bottom to output electric charge.

[0107] The electrode position of the first Y0° cut quartz wafer is complementary to the electrode position of the second Y0° cut quartz wafer, because the first Y0° cut quartz wafer collects the shear force in the Y-axis direction, while the second Y0° cut quartz wafer collects the shear force in the X-axis direction, and their directions are perpendicular to each other. The eight pairs of electrodes constitute eight signal output terminals, and are respectively connected to a corresponding socket through signal leads.

[0108] The normal linear acceleration and two tangential angular accelerations are collected by using an X0° cut quartz wafer. Specifically, due to the action of the mass force or torque, coupled induced charges are generated on the surface of the wafer. The acceleration is measured by superimposing the outputs collected by multiple electrodes. Similarly, the two tangential linear accelerations and the normal angular acceleration are collected by using two Y0° cut quartz wafers.

[0109] Embodiment 14:

[0110] A multi-layer piezoelectric chip combined six-dimensional acceleration sensor (reference Figure 1 , 2 , 3, 4, 5), the sensor comprises a base 1 with a mounting plate 11, a housing 2 with a socket 3 is mounted on the base 1, in the housing 2, a pre-tightening bolt (including a nut 51, a stud bolt 52) ​​is fixedly mounted on the dynamometer on the base mounting plate 11 (reference Figure 1 The mounting plate 11 is a circular plate, which is mounted on the base 1 through the mounting column 12. The base 1 is provided with a mounting hole 13 for collection. The four are connected as a whole in a coaxial state, and the common axis is collinear with the Z axis of the working three-dimensional rectangular coordinate system of the sensor. The mass block 4 is divided into four identical cylindrical mass blocks, and the centers of the four mass blocks are collinear with the Z axis of the working three-dimensional rectangular coordinate system of the sensor. The dynamometer is constructed in a mode of stacking three groups of quartz wafers, including an X0° cut quartz wafer group 7, a first Y0° cut quartz wafer group 8, and a second Y0° cut quartz wafer group 9. Among them, the X0° cut quartz chip group 7 includes an X0° cut quartz chip 71, an electrode sheet group 72, an insulating electrode plate No. 1 73 and a grounding electrode 74; the first Y0° cut quartz chip group 8 includes a first Y0° cut quartz chip 81, an electrode sheet group 82, an insulating electrode plate No. 2 83 and a grounding electrode 84; the second Y0° cut quartz chip group 9 includes a second Y0° cut quartz chip 91, an electrode sheet group 92 and an insulating electrode plate No. 3 93.

[0111] The electrode sheet group 72 includes four output electrodes Q1, Q2, Q3, and Q4, which are connected to the insulating electrode plate 73 at the bottom to prevent charge cross interference (refer to Figure 3 , 4 electrode sheets are fixed to 4 slots of the insulating electrode plate respectively), connected to the X0° cut quartz wafer 71 on top to output charge; the electrode sheet group 82 includes 2 output electrodes Q5 and Q6, connected to the insulating electrode plate 83 on top (reference Figure 4 , two electrode sheets are fixed to two slots of the insulating electrode plate, and the remaining slots are left empty), and the lower part is connected to the first Y0° cut quartz wafer 81 to output charge; the electrode sheet group 92 includes two output electrodes Q7 and Q8, and the upper part is connected to the insulating electrode plate 93 (reference Figure 5 , the two electrode sheets are fixed to two of the slots of the insulating electrode plate, and the remaining slots are left empty), and the second Y0° cut quartz wafer 91 is connected to output the charge. Among them, the functions of the grounding electrodes 74 and 84 are to isolate each quartz wafer group to prevent cross interference. It should be noted that Figure 4 The corresponding first Y0° cut quartz wafer electrode position and Figure 5 The corresponding relationship is complementary, because the first Y0° cut quartz wafer collects the shear force in the Y axis direction, and the second Y0° cut quartz wafer collects the shear force in the X axis direction, and their directions are perpendicular to each other. The eight pairs of electrodes Q1-Q8 constitute eight signal output terminals, and are respectively connected to a corresponding socket through signal leads.

[0112] In this specific embodiment, the pre-tightening bolt may be provided with a flat washer and / or an elastic washer between the nut 51 and the inertial mass block 4 when necessary.

[0113] The insulating electrode plates 73, 83 and 93 are circular plates made of polytetrafluoroethylene, and the electrode pairs (72, 82, 92) are plated on the circular plates by electroplating; the outer diameter of the polytetrafluoroethylene circular plate is not larger than the outer diameter of the mounting plate 11, and it has a through hole for the pre-tightening bolt (i.e., the stud bolt 52 in this specific embodiment) to pass through. Insulating filling material 6 is filled between each signal lead to fix them and insulate them from each other. The spacing between the insulating filling material 6 and the mounting plate 11 is controlled to be between 0.3 mm and 1 mm, and the height is lower than the position of the insulating electrode plate 93. The insulating filling material 6 is a variety of insulating filling materials including polytetrafluoroethylene filling material.

[0114] Embodiment 15:

[0115] A multilayer piezoelectric chip combined six-dimensional acceleration sensor, the technical content is the same as that of embodiments 1-14, when the multilayer piezoelectric chip combined six-dimensional acceleration sensor is used, the linear acceleration a in the X direction Fx , obtained by adding the output values ​​(Q7, Q8) of the two output ends of the electrode group 92 of the second Y0° cut quartz wafer group 9; the linear acceleration a in the Y direction Fy , obtained by adding the output values ​​(Q5, Q6) of the two output ends of the electrode group 82 of the first Y0° cut quartz wafer group 8; the linear acceleration a in the Z direction Fz , obtained by adding the output values ​​(Q1, Q2, Q3, Q4) of the four output terminals of the electrode group 72 of the X0° cut quartz wafer group 7; the angular acceleration a in the X direction Mx , the output values ​​(Q1, Q2, Q3, Q4) of the four output terminals of the electrode group 72 of the X0° cut quartz wafer group 7 are used to obtain ((Q1+Q2)-(Q3+Q4)); the angular acceleration a in the Y directionMy , from the output values ​​(Q1, Q2, Q3, Q4) of the four output terminals of the electrode group 72 of the X0° cut quartz wafer group 7, (Q1+Q4)-(Q3+Q2) is obtained; the angular acceleration a in the Z direction Mz , which is obtained by subtracting the output values ​​(Q5, Q6) of the two output ends of the electrode group 82 of the second Y0°-cut quartz wafer group 8.

Claims

1. A multilayer piezoelectric chip combined six-dimensional acceleration sensor, characterized in that: It comprises a base (1), a shell (2), a dynamometer, and a plurality of inertial mass blocks (4); The housing (2) is mounted on the base (1) to encapsulate the dynamometer and the inertial mass block (4) located on the base (1); The center of the inertial mass block (4) is collinear with the Z axis of the working three-dimensional rectangular coordinate system of the six-dimensional acceleration sensor; The dynamometer comprises an X0°-cut quartz wafer group (7), a Y0°-cut quartz wafer group I (8), and a Y0°-cut quartz wafer group II (9); The X0°-cut quartz wafer group (7), the Y0°-cut quartz wafer group I (8), and the Y0°-cut quartz wafer group II (9) are all arranged on the base (1).

2. The multilayer piezoelectric chip combined six-dimensional acceleration sensor according to claim 1, characterized in that: The base (1) is provided with a mounting plate (11); The dynamometer is fixedly mounted on the mounting plate (11) by means of bolts.

3. The multilayer piezoelectric chip combined six-dimensional acceleration sensor according to claim 2, characterized in that: The mounting plate (11) is a circular plate; The mounting plate (11) is mounted on the base (1) via a mounting column (12).

4. The multilayer piezoelectric chip combined six-dimensional acceleration sensor according to claim 1, characterized in that: The mass blocks are four identical cylindrical mass blocks.

5. The multilayer piezoelectric chip combined six-dimensional acceleration sensor according to claim 1, characterized in that: The X0°-cut quartz wafer group comprises an X0°-cut quartz wafer (71), an X0°-cut quartz wafer electrode sheet group (72), a No. 1 insulating electrode plate (73), and an X0°-cut quartz wafer group grounding electrode (74); The X0°-cut quartz wafer electrode sheet group (72) comprises output electrodes Q1, Q2, Q3 and Q4, one end of each of the output electrodes is connected to the No. 1 insulating electrode plate (73) to prevent cross-interference of charges, and the other end is connected to the X0°-cut quartz wafer (71) to output charges; The X0°-cut quartz wafer group grounding electrode (74) is used to isolate each quartz wafer group to prevent cross interference.

6. The multilayer piezoelectric chip combined six-dimensional acceleration sensor according to claim 1, characterized in that: The Y0°-cut quartz wafer group I (8) comprises a Y0°-cut quartz wafer I (81), a Y0°-cut quartz wafer electrode plate group I (82), a No. 2 insulating electrode plate (83) and a Y0°-cut quartz wafer grounding electrode I (84); The Y0°-cut quartz wafer electrode sheet group I (82) includes an output electrode Q5 and an output electrode Q6, one end of which is connected to the No. 2 insulating electrode plate (83) to prevent cross-charge interference, and the other end is connected to the Y0°-cut quartz wafer I (81) to output charges; The Y0°-cut quartz wafer grounding electrode I (84) is used to isolate each quartz wafer group to prevent cross interference.

7. The multilayer piezoelectric chip combined six-dimensional acceleration sensor according to claim 1, characterized in that: The Y0°-cut quartz wafer group II (9) comprises a Y0°-cut quartz wafer II (91), a Y0°-cut quartz wafer electrode sheet group II (92) and a No. 3 insulating electrode plate (93); The Y0°-cut quartz wafer electrode sheet group II (92) comprises an output electrode Q7 and an output electrode Q8, one end of which is connected to the No. 3 insulating electrode plate (93) to prevent cross-interference of charges, and the other end is connected to the Y0°-cut quartz wafer II (91) to output charges.

8. The multilayer piezoelectric chip combined six-dimensional acceleration sensor according to claim 1, characterized in that: The electrode positions of the Y0°-cut quartz wafer electrode piece group I (82) of the Y0°-cut quartz wafer group I (8) and the Y0°-cut quartz wafer electrode piece group II (92) of the Y0°-cut quartz wafer group II (9) are complementary.

9. The multilayer piezoelectric chip combined six-dimensional acceleration sensor according to claim 1, characterized in that: The housing (2) is provided with a plurality of sockets (3); The output electrode Q1, output electrode Q2, output electrode Q3, output electrode Q4, output electrode Q5, output electrode Q6, output electrode Q7 and output electrode Q8 in the dynamometer constitute eight signal output terminals, and are respectively connected to corresponding sockets (3) through signal leads.

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