Immersed liquid cooling system

Abstract

The utility model relates to an immersed liquid cooling system which comprises a box-type cabinet body, a partition plate is longitudinally arranged in the box-type cabinet body, at least one mainboard clamping groove, a weak wire groove, a strong wire groove, a network cable groove, a temperature sensor and a flow making pump are arranged in a liquid cooling cavity, and a liquid return pipe and a liquid inlet pipe are arranged on the upper portion and the lower portion of the liquid cooling cavity respectively. A filter, a booster pump, a liquid heat exchanger, a liquid supplementing constant pressure box and a flow velocity valve which are sequentially connected with the liquid return pipe and the liquid inlet pipe through pipes are arranged in the transmission and distribution cavity, a liquid drainage valve is arranged at the bottom of the liquid cooling cavity, an industrial controller, a display screen and a PDU power supply are arranged on the side wall of the liquid cooling cavity, and a power supply interface and an aviation plug are arranged on the side wall of the transmission and distribution cavity. According to the utility model, the electronic cooling liquid can be circulated and mixed in the upper, lower, left and right directions of the cabinet body, so that the heat exchange in the cabinet body is more uniform, and the system energy efficiency is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling, in particular to an immersion liquid cooling system. Background Art

[0002] Large amounts of data throughput and computing have caused data centers, which serve as the "brains" of emerging technologies such as artificial intelligence and big data, to face unprecedented energy consumption and heat dissipation challenges: on the one hand, the computing and storage power consumption of IT equipment such as servers is very large; on the other hand, the power consumption used to cool IT equipment in data centers is also growing rapidly.

[0003] In this context, liquid cooling data centers that use liquid cooling technology and liquid cooling servers and other equipment have emerged, providing a new solution for the heat dissipation and cooling of data centers. Liquid cooling refers to the technology of using liquid instead of air as a refrigerant to exchange heat for heat-generating components and remove heat.

[0004] For immersion cooling systems, the most common method is to install a porous mesh plate at the bottom of the immersion liquid cooling cabinet for flow distribution. However, since the heat source on the server motherboard is usually unevenly and irregularly distributed, although it can improve the heat transfer uniformity of the cabinet to a certain extent, it cannot further improve the cooling performance of a single server motherboard, and it will also increase the flow resistance loss of the coolant.

[0005] Therefore, in the liquid cooling system, uniform heat exchange is the key and difficult problem that the immersion liquid cooling system needs to solve. Utility Model Content

[0006] The utility model aims to provide an immersion liquid cooling system, which can reduce the heat exchange thermal resistance between the main heat source and the cooling liquid, thereby increasing the energy consumption of the system, making the heat exchange more uniform and the system energy efficiency higher.

[0007] To achieve the above-mentioned purpose, the utility model provides an immersion liquid cooling system, including a box-type cabinet, wherein a partition plate is longitudinally arranged in the box-type cabinet to divide the internal space into a liquid cooling chamber and a distribution chamber, wherein the liquid cooling chamber is provided with at least one mainboard slot, a weak wire slot and a strong wire slot arranged on both sides of the liquid cooling chamber, a network cable slot, a temperature sensor, a lighting lamp, and a flow pump, wherein a return pipe and a liquid inlet pipe are respectively arranged at the upper and lower parts of the liquid cooling chamber, wherein the distribution chamber is provided with a filter, a booster pump, a liquid heat exchanger, a liquid replenishment constant pressure tank, and a flow rate valve which are sequentially connected with the return pipe and the liquid inlet pipe, wherein the liquid inlet pipe generates an upward jet near the mainboard slot, wherein a drain valve is arranged at the bottom of the liquid cooling chamber, wherein an industrial controller, a display screen, a liquid leakage alarm lamp, a self-checking operation prompt lamp, an operation prompt power lamp, and a PDU power supply are arranged on the side walls of the liquid cooling chamber, and wherein a power supply interface and an aviation plug are arranged on the side walls of the distribution chamber;

[0008] The industrial controller controls the operating parameters of the flow pump and the booster pump according to the temperature signal of the temperature sensor.

[0009] Preferably, the liquid heat exchanger is connected to an external cooling tower for heat exchange.

[0010] Preferably, the liquid heat exchanger is connected to an external water tank and a cooling tower in sequence for heat exchange, and a valve is provided on the pipeline between the water tank and the cooling tower.

[0011] Preferably, a branch pipeline is provided on the mainboard slot, the liquid inlet pipe is connected to the branch pipeline, and microholes are opened on the branch pipeline.

[0012] Preferably, a range extender pump is also provided on the rear pipeline of the liquid heat exchanger.

[0013] Preferably, the temperature sensor is arranged outside the chip of the mainboard slot and obtains the chip external temperature T1:

[0014] When T1 is lower than 35°C, the booster pump is turned off;

[0015] When T1 is between 36°C and 50°C, the booster pump operates at 35% power;

[0016] When T1 is between 51°C and 65°C, the booster pump operates at 50% power;

[0017] When T1 is between 66°C and 75°C, the booster pump operates at 80% power;

[0018] When T1 is above 75°C, the booster pump operates at 100% power.

[0019] Preferably, the chip on the mainboard in the mainboard slot has the function of monitoring the temperature T2 inside the chip, and when |T2-T1|≥15°C, the industrial controller sends out an alarm signal.

[0020] Based on the above technical solution, the advantages of the utility model are:

[0021] The immersion liquid cooling system of the utility model can realize the circulation and mixing of electronic cooling liquid in four directions of up, down, left and right of the cabinet, which can make the heat exchange in the cabinet more uniform and the system energy efficiency higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0023] Figure 1 Schematic diagram of the immersion liquid cooling system. DETAILED DESCRIPTION

[0024] The technical solution of the utility model is further described in detail below through the accompanying drawings and embodiments.

[0025] The utility model provides an immersion liquid cooling system, such as Figure 1 As shown, a preferred embodiment of the utility model is shown.

[0026] Specifically, the immersion liquid cooling system includes a box-type cabinet 24, in which a partition plate is longitudinally arranged to divide the internal space into a liquid cooling chamber and a distribution chamber, and the liquid cooling chamber is provided with at least one mainboard slot 1, a weak wire slot 8 and a strong wire slot 21 arranged on both sides of the liquid cooling chamber, a network cable slot 12, a temperature sensor 9, a lighting lamp 20, and a flow pump 11. The upper and lower parts of the liquid cooling chamber are respectively provided with a return pipe 19 and a liquid inlet pipe 10, and the distribution chamber is provided with a filter connected to the return pipe 19 and the liquid inlet pipe 10 in sequence. 18, a booster pump 17, a liquid heat exchanger 15, and a flow rate valve 13. The liquid inlet pipe 10 generates an upward jet near the mainboard slot 1. A drain valve 6 is provided at the bottom of the liquid cooling chamber. An industrial controller, a display screen 2, a leakage alarm light 3, a self-test operation prompt light 4, an operation prompt power light 5, and a PDU power supply 7 are provided on the side wall of the liquid cooling chamber. A power supply interface 22 and an aviation plug 23 are provided on the side wall of the distribution chamber. The industrial controller controls the operating parameters of the flow pump 11 and the booster pump 17 according to the temperature signal of the temperature sensor 9.

[0027] like Figure 1 As shown, the immersion liquid cooling system adopts a cabinet design, mainly including a box-type cabinet 24, that is, a sheet metal shell of the cabinet. A partition plate is longitudinally arranged in the box-type cabinet 24 to divide the internal space into a liquid cooling chamber and a distribution chamber, wherein the liquid cooling chamber contains the area where the electronic coolant is located, and the distribution chamber mainly includes the distribution pipeline of the electronic coolant and the heat dissipation system components.

[0028] A layer of cavity can be independently set in the liquid cooling cavity to form a multi-layer cavity structure, which is convenient for taking out as a whole, such as taking out directly or pulling out in the form of a drawer. Or it can be directly made into a cavity as a whole, and internal operations can be performed after the electronic coolant is directly released. There is at least one motherboard slot 1, and the motherboard is set in the motherboard slot 1, and the motherboard slot 1 can be set in multiple numbers, such as 8 or 16, to meet the computing power requirements of the liquid cooling server.

[0029] The weak-line cable trough 8 and the strong-line cable trough 21 are arranged on both sides of the liquid cooling chamber, and the network cable trough 12 is also arranged on the upper side. The overall wiring is above the liquid level of the electronic coolant, which is safer. The temperature sensor 9 is arranged below the liquid level of the electronic coolant to obtain problems with the electronic coolant and perform parameter control according to the temperature control logic. The lighting lamp 20 is arranged inside to view the internal operation. The flow pump 11 is arranged in the liquid cooling chamber for disturbing the electronic coolant. It can be in the form of a centrifugal pump, a diaphragm pump or a sinusoidal pump, so that the electronic coolant maintains good fluidity, prevents local overtemperature, and keeps the temperature more uniform.

[0030] Furthermore, a liquid return pipe 19 and a liquid inlet pipe 10 are respectively provided at the upper part and the lower part of the liquid cooling chamber, for leading out the electronic coolant in the liquid cooling chamber for heat dissipation, and then circulating back to the liquid cooling chamber.

[0031] The liquid inlet pipe 10 generates an upward jet near the motherboard slot 1. Preferably, a branch pipe is provided on the motherboard slot 1, and the liquid inlet pipe 10 is connected to the branch pipe, and micropores are provided on the branch pipe. Preferably, the liquid inlet pipe 10 can adopt a telescopic sleeve structure, and the telescopic sleeves are sealed with multiple layers of sealing rings, which can meet the requirements of mobility and sealing, so as to match the structure in which the liquid cooling chamber is drawn out in the form of a drawer.

[0032] like Figure 1 As shown, preferably, a filter 18, a booster pump 17, a liquid heat exchanger 15, a liquid replenishment constant pressure tank, a range extender pump 14, and a flow rate valve 13, which are sequentially connected to the return pipe 19 and the liquid inlet pipe 10, are provided in the delivery and distribution cavity, and a drain valve 6 is provided at the bottom of the liquid cooling cavity.

[0033] During operation, the electronic coolant is sucked from the upper part of the liquid cooling chamber, sucked through the return pipe 19, and passes through the filter 18, the booster pump 17, the liquid heat exchanger 15, the liquid replenishment constant pressure tank, the range-extending pump 14, and the flow rate valve 13 in sequence. The filter 18 filters impurities, the booster pump 17 overcomes the filtering resistance, and the liquid heat exchanger 15 is used to dissipate heat and cool down. The range-extending pump 14 provides power, and the flow rate valve 13 controls the flow rate. Finally, it returns to the bottom of the liquid cooling chamber through the liquid inlet pipe 10, and is ejected from the upward micropores opened on the branch line to form an upward jet. At this time, the temperature of the electronic coolant is reduced and the density is relatively large. It can be automatically mixed during the rising process of the jet, and as the temperature rises, the density decreases, so that the liquid with a higher temperature is more concentrated in the upper part. Under the disturbance of the flow pump 11, the upper liquid accelerates the mixing in the left and right directions, which can take away the heat emitted by the motherboard more quickly. Due to long-term operation, the electronic coolant will produce a small amount of loss. The liquid replenishment constant pressure tank can be used for liquid replenishment. At the same time, the liquid replenishment constant pressure tank is also provided with a vent valve, which can also discharge air.

[0034] The liquid heat exchanger 15 can be cooled by air to dissipate heat. In this case, a cooling fan can be arranged behind the liquid heat exchanger 15, which is suitable for the case where the total number of units is small.

[0035] When the total number of liquid-cooled servers is large, such as a large data center, in order to enhance heat dissipation, the liquid heat exchanger 15 is connected to an external cooling tower 16 for heat exchange. At this time, multiple liquid heat exchangers 15 can be connected to one cooling tower 16 to promote heat dissipation.

[0036] More preferably, the liquid heat exchanger 15 is connected to an external water tank and a cooling tower 16 in sequence for heat exchange, and a valve is provided on the pipeline between the water tank and the cooling tower 16. When the heat dissipation is small, the valve between the water tank and the cooling tower 16 can be disconnected, and the water tank is used for heat dissipation, which is beneficial to energy saving. When the heat dissipation is large, the valve between the water tank and the cooling tower 16 is opened, and the cooling tower 16 is used for heat dissipation to enhance the heat dissipation.

[0037] The bottom of the liquid cooling chamber is provided with a drain valve 6, which can drain the electronic coolant from the bottom for maintenance. The side wall of the liquid cooling chamber is provided with an industrial controller, a display screen 2, a leakage alarm light 3, a self-check operation prompt light 4, an operation prompt power light 5, and a PDU power supply 7. The side wall of the transmission and distribution chamber is provided with a power supply interface 22 and an aviation plug 23 to provide power and control.

[0038] The industrial controller controls the operating parameters of the flow pump 11 and the booster pump 17 according to the temperature signal of the temperature sensor 9. Preferably, the temperature sensor 9 is arranged outside the chip of the mainboard slot 1 and obtains the chip external temperature T1:

[0039] When T1 is lower than 35°C, the booster pump 17 is turned off;

[0040] When T1 is between 36°C and 50°C, the booster pump 17 operates at 35% power;

[0041] When T1 is between 51°C and 65°C, the booster pump 17 operates at 50% power;

[0042] When T1 is between 66°C and 75°C, the booster pump 17 operates at 80% power;

[0043] When T1 is higher than 75° C., the boost pump 17 operates at 100% power.

[0044] At the same time, the temperature signal of the temperature sensor 9 controls the flow pump 11. When the temperature T1 outside the chip gradually increases, the operating power of the flow pump 11 can also be set to gradually increase, and can be linearly corresponding to the increase to achieve stepless regulation, that is, within the range of 35 to 75°C, it corresponds to 0 to 100% power of the flow pump 11, or it can also be like the operating strategy of the booster pump 17 and take a specific value within a certain range.

[0045] Furthermore, the chip on the mainboard in the mainboard slot 1 has the function of monitoring the temperature T2 inside the chip. When |T2-T1|≥15°C, the temperature difference between the inside and outside of the chip is too large and a fault may occur. The industrial controller sends an alarm signal to remind that manual intervention is required.

[0046] The immersion liquid cooling system of the utility model can realize the circulation and mixing of electronic cooling liquid in four directions of up, down, left and right of the cabinet, which can make the heat exchange in the cabinet more uniform and the system energy efficiency higher.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the utility model can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the utility model, which should be included in the scope of the technical solution for protection of the utility model.

Claims

1. An immersion liquid cooling system, characterized in that: The invention comprises a box-type cabinet (24), wherein a partition plate is longitudinally arranged in the box-type cabinet (24) to divide the internal space into a liquid cooling chamber and a distribution chamber, wherein the liquid cooling chamber is provided with at least one mainboard slot (1), a weak wire slot (8) and a strong wire slot (21) arranged on both sides of the liquid cooling chamber, a network cable slot (12), a temperature sensor (9), and a flow pump (11), wherein the upper and lower parts of the liquid cooling chamber are respectively provided with a liquid return pipe (19) and a liquid inlet pipe (10), and the distribution chamber is provided with a liquid return pipe and a liquid inlet pipe (10) connected to the liquid return pipe. A filter (18), a booster pump (17), a liquid heat exchanger (15), and a flow rate valve (13) are connected in sequence between (19) and the liquid inlet pipe (10), the liquid inlet pipe (10) generates an upward jet near the motherboard slot (1), a drain valve (6) is provided at the bottom of the liquid cooling chamber, an industrial controller, a display screen (2), and a PDU power supply (7) are provided on the side wall of the liquid cooling chamber, and a power supply interface (22) and an aviation plug (23) are provided on the side wall of the distribution chamber; The industrial controller controls the operating parameters of the flow generating pump (11) and the booster pump (17) according to the temperature signal of the temperature sensor (9).

2. The immersion liquid cooling system according to claim 1, characterized in that: The liquid heat exchanger (15) is connected to an external cooling tower (16) for heat exchange.

3. The immersion liquid cooling system according to claim 1, characterized in that: The liquid heat exchanger (15) is connected to an external water tank and a cooling tower (16) in sequence for heat exchange, and a valve is provided on the pipeline between the water tank and the cooling tower (16).

4. The immersion liquid cooling system according to claim 1, characterized in that: The mainboard slot (1) is provided with a branch pipeline, the liquid inlet pipe (10) is connected to the branch pipeline, and microholes are provided on the branch pipeline.

5. The immersion liquid cooling system according to claim 1, characterized in that: A liquid replenishment constant pressure tank and a range-increasing pump (14) are also provided on the rear side pipeline of the liquid heat exchanger (15).

6. The immersion liquid cooling system according to claim 1, characterized in that: The temperature sensor (9) is arranged on the outside of the chip of the mainboard slot (1) and obtains the chip outside temperature T1: When T1 is lower than 35°C, the booster pump (17) is turned off; When T1 is between 36°C and 50°C, the booster pump (17) operates at 35% power; When T1 is between 51°C and 65°C, the booster pump (17) operates at 50% power; When T1 is between 66°C and 75°C, the booster pump (17) operates at 80% power; When T1 is higher than 75°C, the booster pump (17) operates at 100% power.

7. The immersion liquid cooling system according to claim 6, characterized in that: The chip on the mainboard in the mainboard slot (1) has the function of monitoring the temperature T2 inside the chip. When |T2-T1|≥15°C, the industrial controller sends out an alarm signal.

8. The immersion liquid cooling system according to claim 1, characterized in that: An illumination lamp (20) is also provided in the liquid cooling cavity.

9. The immersion liquid cooling system according to claim 1, characterized in that: A liquid leakage alarm light (3), a self-checking operation prompt light (4), and an operation prompt power light (5) are provided on the side wall of the liquid cooling chamber.

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