Miniature plane diaphragm loudspeaker

Abstract

The utility model discloses a miniature planar diaphragm loudspeaker, which comprises a support and a bonding pad convenient for current to flow in and out. The bracket and the bonding pad are integrally formed by injection molding; an outer ring magnetic circuit, an inner ring magnetic circuit, a vibrating diaphragm, a voice coil and a protective cover are arranged in the bracket; the outer ring magnetic circuit and the support are integrally formed in an injection molding mode, the outer ring magnetic circuit is provided with an outer ring hole, the inner ring magnetic circuit is contained in the outer ring hole, and an annular gap is formed between the outer wall of the inner ring magnetic circuit and the inner wall of the outer ring magnetic circuit; the voice coil is connected to the vibrating diaphragm, and the vibrating diaphragm and the outer ring magnetic circuit as well as the vibrating diaphragm and the inner ring magnetic circuit are arranged at intervals; one end face, far away from the vibrating diaphragm, of the voice coil is at least partially located above the annular gap; the protective cover is arranged above the vibrating diaphragm in a covering manner; and when the voice coil is electrically connected with the voice coil, a PCB lead is replaced by pad welding, so that a PCB pasting process is omitted, and the situation that the whole PCB falls off or falls off due to high temperature of the PCB is avoided.

Description

Technical Field

[0001] The utility model relates to the technology of the loudspeaker field, in particular to a miniature flat diaphragm loudspeaker. Background Art

[0002] Compared with electrostatic speakers and dynamic speakers, planar diaphragm speakers are superior, with larger vibration area and better sound quality; planar diaphragm speakers combine the advantages of both dynamic and electrostatic transducer methods, and have better performance in low frequencies than electrostatic ones, and are also stronger than dynamic ones in high frequencies.

[0003] The existing flat diaphragm speakers with shells have many production processes, and some workstations are difficult and time-consuming to operate. There are also risks of adverse reactions. For example, the PCB board is adhered to the surface of the shell by glue because the adhesive area is too small. The subsequent soldering and electronic wires are not resistant to high temperatures, or the glue adhesion is small and the glue is brittle during the drop process, so there is a risk of the PCB board falling off; the process is cumbersome and time-consuming, the degree of automation is low, and the production cost is high. For example, it is inconvenient to paste the PCB board, combine the inner and outer magnets, spot weld the voice coil leads, and connect the capacitor in series between the two speaker combinations (because the solder joints are small, it is necessary to switch the tooling to stand the speaker upright for spot welding).

[0004] Secondly, the speaker bracket and the external magnetic circuit are set separately. In actual use, the external magnetic circuit is prone to fall off under conditions of long-term severe vibration or strong impact. The external magnetic circuit needs to be processed by a processing jig. Because the jig has its own processing concentricity accuracy, the external magnetic circuit assembled by the jig has a concentricity tolerance. The more tolerances there are, the more difficult it is to control the cumulative tolerance. The larger the cumulative concentricity tolerance, the easier it is for the magnetic circuit and the voice coil to collide when moving up and down, thus affecting the speaker performance.

[0005] Therefore, it is necessary to study a new technical solution to solve the above problems. Utility Model Content

[0006] In view of this, the utility model aims to solve the deficiencies in the prior art, and its main purpose is to provide a miniature planar diaphragm speaker, which effectively solves the problem of the PCB board pasting process in the traditional technology, which makes the entire PCB board prone to falling or falling off and the risk of the external magnetic circuit falling off, through the form of integral injection molding of the bracket and the solder pad and the integral injection molding of the outer ring magnetic circuit and the bracket.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A miniature flat diaphragm speaker comprises a bracket and a pad for facilitating the flow of current in and out; the bracket and the pad are integrally injection molded;

[0009] The bracket is provided with an outer ring magnetic circuit, an inner ring magnetic circuit, a diaphragm, a voice coil and a protective cover; the outer ring magnetic circuit and the bracket are integrally injection molded, the outer ring magnetic circuit has an outer ring hole, the inner ring magnetic circuit is accommodated in the outer ring hole, and the outer wall of the inner ring magnetic circuit and the inner wall of the outer ring magnetic circuit form an annular gap;

[0010] The voice coil is connected to the diaphragm, and the diaphragm is spaced apart from the outer ring magnetic circuit and the inner ring magnetic circuit respectively; an end surface of the voice coil away from the diaphragm is at least partially located above the annular gap; and the protective cover is arranged above the diaphragm.

[0011] As a preferred embodiment, the bracket has an annular step surface; the diaphragm includes a middle part and an outer ring part, the outer ring part is arranged around the outer circumference of the middle part, and a membrane ring is arranged on one side of the outer ring part; a middle sticker is arranged on one side of the middle part, and the voice coil is adhered to the middle sticker; one side of the membrane ring is located on the annular step surface; the diaphragm divides the space in the bracket into a front cavity and a rear cavity, and the outer ring magnetic circuit and the inner ring magnetic circuit are arranged in the rear cavity.

[0012] As a preferred solution, the protective cover includes a main body and an outer ring, the outer ring is arranged around the outer circumference of the main body, the outer edge of the outer ring is successively recessed with clearance openings, and the outer ring abuts against the membrane ring.

[0013] As a preferred solution, a middle hole is provided through the main body, and the middle hole is communicated with the front cavity.

[0014] As a preferred solution, a relief notch for the lead wire of the voice coil to extend out is provided on one side of the bracket corresponding to the soldering pad.

[0015] As a preferred embodiment, a first avoidance position lower than the plane of the annular step surface is provided on the annular step surface; correspondingly, a second avoidance position is provided on the outside of the bracket corresponding to the first avoidance position, and the first avoidance position is connected with the second avoidance position to form the avoidance slot.

[0016] As a preferred solution, the bottom surface of the avoidance notch is flush with the upper plane of the pad.

[0017] As a preferred solution, an assembly position is further provided in the bracket, and the assembly position is located below the annular step surface, and the outer ring magnet is integrally formed at the assembly position.

[0018] As a preferred solution, the pad includes a soldering piece portion for connecting to the lead of the voice coil and a conductive portion for electrically connecting to an external element, and the conductive portion extends out of the bracket.

[0019] As a preferred solution, the conductive part is connected to the lower end surface of the welding piece part and one end of the conductive part is exposed outside the welding piece part; wherein the welding surface of the welding piece part is larger than the welding surface of the conductive part.

[0020] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical scheme that the bracket and the pad are integrally injection molded, which can simplify the process, and the pad is used to replace the PCB board when electrically connected to the voice coil, thereby eliminating the PCB board pasting process, so as to prevent the entire PCB board from falling or falling off due to high temperature of the PCB board (soldering or adding external electronic wires), and can save material costs;

[0021] Secondly, the outer ring magnetic circuit and the bracket are integrally injection molded to make the connection between the outer ring magnetic circuit and the bracket more stable, and in the subsequent assembly process, the assembly concentricity tolerance is reduced, which effectively solves the problem of multiple sets of concentricity tolerances in the design when the speaker bracket and the external magnetic circuit are separated in the prior art, thereby affecting the performance of the speaker.

[0022] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional diagram of an embodiment of the utility model (the soldering pad is not shown);

[0024] Figure 2 It is a cross-sectional view of an embodiment of the utility model;

[0025] Figure 3 It is an exploded view of an embodiment of the utility model;

[0026] Figure 4 It is a cross-sectional view of the bracket and the pad of the embodiment of the utility model;

[0027] Figure 5 It is a structural diagram of the protective cover of the embodiment of the utility model;

[0028] Figure 6 It is a structural diagram of the diaphragm of the embodiment of the utility model;

[0029] Figure 7 It is a structural diagram of a solder pad according to an embodiment of the utility model;

[0030] Figure 8 It is a top view of the bracket of the embodiment of the utility model.

[0031] Description of the accompanying drawings:

[0032] 10. Bracket 11. Outer ring magnetic circuit

[0033] 12. Inner magnetic circuit 13. Diaphragm

[0034] 14. Voice coil 15. Protective cover

[0035] 111, outer ring hole 16, annular gap

[0036] 17. Avoidance notch 18. Assembly position

[0037] 19. Annular step surface 191. First avoidance position

[0038] 101, front cavity 102, back cavity

[0039] 103. Second avoidance position

[0040] 131, middle part 132, outer ring part

[0041] 133, membrane ring 134, middle sticker

[0042] 151, main body 152, outer ring

[0043] 153, make way 154, middle hole

[0044] 20. Solder pad 21. Solder piece

[0045] 22. Conductive part. DETAILED DESCRIPTION

[0046] Please refer to Figures 1 to 8 As shown, it shows the specific structure of an embodiment of the utility model.

[0047] In the description of the present invention, it should be noted that directional words such as the terms "up", "down", "front", "back", "left", "right", etc., which indicate directions and positional relationships, are based on the directions or positional relationships shown in the drawings or during normal wearing and use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific protection scope of the present invention.

[0048] A miniature planar diaphragm speaker comprises a bracket 10 and a soldering pad 20.

[0049] The pad 20 facilitates the flow of current in and out; the bracket 10 and the pad 20 are integrally injection-molded.

[0050] The pad material is generally tin-plated stainless steel, the magnet used in the speaker can be a neodymium iron boron magnet, and the bracket is made of plastic. When the bracket is injection molded, the pad and the outer ring magnetic circuit that need to be integrally formed are first placed in a specific position. After injection molding, the plastic material of the bracket can fix the pad and the outer ring magnetic circuit together. This method is integral injection molding.

[0051] An outer ring magnetic circuit 11, an inner ring magnetic circuit 12, a diaphragm 13, a voice coil 14 and a protective cover 15 are arranged in the bracket 10; the outer ring magnetic circuit 11 and the bracket 10 are integrally injection molded, the outer ring magnetic circuit 11 has an outer ring hole 111, the inner ring magnetic circuit 12 is accommodated in the outer ring hole 111, and the outer wall of the inner ring magnetic circuit 12 and the inner wall of the outer ring magnetic circuit 11 form an annular gap 16; the voice coil 14 is connected to the diaphragm 13, and the diaphragm 13 is spaced apart from the outer ring magnetic circuit 11 and the inner ring magnetic circuit 12 respectively; an end face of the voice coil 14 away from the diaphragm 13 is at least partially located above the annular gap 16; the protective cover 15 is covered above the diaphragm 13.

[0052] Preferably, a relief notch 17 for the lead wire of the voice coil 14 to extend out is provided on one side of the bracket 10 corresponding to the solder pad 20, so that the lead wire of the voice coil 14 can be extended out and connected to the soldering piece, so that no gasket is required under the voice coil. Preferably, the bottom surface of the relief notch 17 is flush with the upper plane of the solder pad.

[0053] Preferably, an assembly position 18 is further provided in the bracket 10 , and the assembly position 18 is located below the annular step surface 19 , and the outer ring magnet is integrally injection-molded at the assembly position 18 .

[0054] Preferably, the bracket 10 has an annular step surface 19 inside; the annular step surface 19 is provided with a first avoidance position 191 which is lower than the plane of the annular step surface; correspondingly, the outside of the bracket 10 is provided with a second avoidance position 103 corresponding to the first avoidance position 191, and the first avoidance position 191 is connected with the second avoidance position 103 to form an avoidance slot 17.

[0055] The diaphragm 13 includes a middle portion 131 and an outer ring portion 132, the outer ring portion 132 is arranged around the outer circumference of the middle portion 131, and a membrane ring 133 is arranged on one side of the outer ring portion 132; a center sticker 134 is arranged on one side of the middle portion 131, and the voice coil 14 is glued to the center sticker 134; one side of the membrane ring 133 is located on the annular step surface 19; the diaphragm 13 divides the space in the bracket 10 into a front cavity 101 and a rear cavity 102, and the outer ring magnetic circuit 11 and the inner ring magnetic circuit 12 are arranged in the rear cavity 102; through the design of the center sticker 134, the rigidity and symmetry of the central part of the diaphragm 13 are increased, laying a good foundation for pasting the voice coil 14 below.

[0056] Preferably, the protective cover 15 includes a main body 151 and an outer ring 152, the outer ring 152 is arranged around the outer circumference of the main body 151, and the outer edge of the outer ring 152 is sequentially recessed with clearance openings 153, the outer ring 152 abuts against the membrane ring 133, and the design of the clearance openings 153 facilitates the inflow of glue during subsequent glue dispensing. Preferably, a middle hole 154 is provided through the main body 151, and the middle hole 154 is connected to the front cavity 101.

[0057] The pad 20 includes a soldering piece 21 for connecting to the lead of the voice coil 14 and a conductive part 22 for electrically connecting to an external element, and the conductive part 22 extends out of the bracket 10. Compared with the traditional welding method between the PCB and the lead of the voice coil 14, the difficulty of welding the lead of the bass coil 14 can be effectively reduced, the work efficiency can be improved, and the defects such as welding without sound and short circuit can be reduced. In addition, the existence of the pad 20 can save the welding of external electronic wires, which can facilitate the connection welding of FPC.

[0058] The conductive part 22 is connected to the lower end surface of the soldering piece 21 and one end of the conductive part 22 is exposed outside the soldering piece 21; wherein, the soldering surface of the soldering piece 21 is larger than the soldering surface of the conductive part 22, and the structural design of the soldering piece facilitates the subsequent lead welding of the voice coil.

[0059] The design focus of the utility model is that the support and the pad are integrally injection molded, which can simplify the process, and the pad is used to replace the PCB board when electrically connected to the voice coil, eliminating the PCB board pasting process, so as to prevent the entire PCB board from falling or falling off due to high temperature of the PCB board (soldering or adding external electronic wires), and can save material costs;

[0060] Secondly, the outer ring magnetic circuit and the bracket are integrally injection molded to make the connection between the outer ring magnetic circuit and the bracket more stable, and in the subsequent assembly process, the assembly concentricity tolerance is reduced, which effectively solves the problem of multiple sets of concentricity tolerances in the design when the speaker bracket and the external magnetic circuit are separated in the prior art, thereby affecting the performance of the speaker.

[0061] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A miniature planar diaphragm speaker, characterized in that: It includes a bracket and a pad that facilitates the flow of current in and out; the bracket and the pad are integrally injection-molded; The bracket is provided with an outer ring magnetic circuit, an inner ring magnetic circuit, a diaphragm, a voice coil and a protective cover; the outer ring magnetic circuit and the bracket are integrally injection molded, the outer ring magnetic circuit has an outer ring hole, the inner ring magnetic circuit is accommodated in the outer ring hole, and the outer wall of the inner ring magnetic circuit and the inner wall of the outer ring magnetic circuit form an annular gap; The voice coil is connected to the diaphragm, and the diaphragm is spaced apart from the outer ring magnetic circuit and the inner ring magnetic circuit respectively; an end surface of the voice coil away from the diaphragm is at least partially located above the annular gap; and the protective cover is arranged above the diaphragm.

2. The micro flat diaphragm speaker according to claim 1, characterized in that: The bracket has an annular step surface; the diaphragm includes a middle part and an outer ring part, the outer ring part is arranged around the outer circumference of the middle part, and a membrane ring is arranged on one side of the outer ring part; a middle sticker is arranged on one side of the middle part, and the voice coil is glued to the middle sticker; one side of the membrane ring is located on the annular step surface; the diaphragm divides the space in the bracket into a front cavity and a rear cavity, and the outer ring magnetic circuit and the inner ring magnetic circuit are arranged in the rear cavity.

3. The micro flat diaphragm speaker according to claim 2, characterized in that: The protective cover includes a main body and an outer ring. The outer ring is arranged around the outer circumference of the main body. The outer edge of the outer ring is sequentially recessed with clearance openings inward, and the outer ring abuts against the membrane ring.

4. The micro flat diaphragm speaker according to claim 3, characterized in that: The main body is provided with a central hole which is communicated with the front cavity.

5. The micro flat diaphragm speaker according to claim 2, characterized in that: A evacuation slot for the lead wire of the voice coil to extend out is provided on one side of the bracket corresponding to the soldering pad.

6. The micro flat diaphragm speaker according to claim 5, characterized in that: The annular step surface is provided with a first avoidance position which is lower than the plane of the annular step surface; correspondingly, the outside of the bracket is provided with a second avoidance position corresponding to the first avoidance position, and the first avoidance position is connected with the second avoidance position to form the avoidance slot.

7. The micro flat diaphragm speaker according to claim 6, characterized in that: The bottom surface of the avoidance notch is flush with the upper plane of the pad.

8. The micro flat diaphragm speaker according to claim 2, characterized in that: An assembly position is also provided in the bracket, and the assembly position is located below the annular step surface, and the outer ring magnetic circuit is integrally formed at the assembly position.

9. The miniature flat diaphragm speaker according to claim 1, characterized in that: The pad includes a soldering piece portion for connecting to the lead wire of the voice coil and a conductive portion for electrically connecting to an external element, and the conductive portion extends out of the bracket.

10. The micro flat diaphragm speaker according to claim 9, characterized in that: The conductive part is connected to the lower end surface of the soldering piece and one end of the conductive part is exposed outside the soldering piece; wherein the soldering surface of the soldering piece is larger than the soldering surface of the conductive part.

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