Aluminum substrate with good heat-resistant effect

Abstract

The utility model discloses an aluminum substrate with a good heat-resistant effect, which relates to the technical field of aluminum substrates and comprises an aluminum substrate main body, a mounting mechanism, a heat dissipation mechanism and a waterproof mechanism, and the mounting mechanism is mounted at one end of the aluminum substrate main body. According to the heat dissipation device, the aluminum substrate body and the heat dissipation mechanism are arranged, the aluminum substrate body works to generate high temperature, the high temperature is evenly diffused to the heat dissipation fins along with the heat conduction rods in the guide rod grooves, the heat dissipation effect of the heat dissipation device is enhanced while the material of the heat dissipation device is resistant to high temperature, and the heat resistance of the heat dissipation device is improved; according to the aluminum substrate main body, the bearing plate rod is operated to rotate in the rotating groove, so that the threaded head at the lower end of the bearing plate rod is embedded into the installed position, and the bearing plate rod limits the aluminum substrate main body at the same horizontal position all the time during installation, so that damage to the aluminum substrate main body caused by excessive screwing of a common screw during installation is effectively prevented; and the protection effect of device installation is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of aluminum substrates, in particular to an aluminum substrate with good heat resistance effect. Background Art

[0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided board is composed of a three-layer structure, namely a circuit layer, an insulating layer and a metal base layer. There are also double-sided boards designed for high-end use, with a structure of a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. Very few applications are multi-layer boards, which can be made by bonding an ordinary multi-layer board with an insulating layer and an aluminum base. However, there are some defects in the use of aluminum substrates on the market. For example, the modules on the existing aluminum substrates will generate high temperatures and release a lot of heat when working. Although the aluminum substrate itself has strong high temperature resistance, the actual heat dissipation effect is poor. The high temperature heat generated for a long time can easily reduce the service life of the device. In addition, since the aluminum substrate is light and thin, it is easy to bend and deform the aluminum substrate when tightening the installation screws and the pressure of the surrounding components. Therefore, an aluminum substrate with good heat resistance is needed.

[0003] The existing aluminum substrate cannot play a good heat-resistant effect when the aluminum substrate is working, and cannot effectively prevent the aluminum substrate from deforming during installation, and cannot improve the waterproofness of the device. Therefore, an aluminum substrate with good heat-resistant effect is urgently needed. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide an aluminum substrate with good heat resistance to solve the problem that the existing aluminum substrate cannot have a good heat resistance when the aluminum substrate is working, cannot effectively prevent the aluminum substrate from deforming during installation, and cannot improve the waterproofness of the device.

[0005] To achieve the above purpose, the utility model provides the following technical solution: an aluminum substrate with good heat resistance, comprising an aluminum substrate body, a mounting mechanism, a heat dissipation mechanism and a waterproof mechanism, wherein the mounting mechanism is installed at one end of the aluminum substrate body.

[0006] A heat dissipation mechanism is installed at one end of the aluminum substrate body.

[0007] A waterproof mechanism is installed at one end of the heat dissipation mechanism.

[0008] Preferably, the mounting mechanism comprises a side frame, a rotation groove, a support plate rod and a threaded head. A side frame is mounted on one end of the aluminum substrate body. A rotation groove is opened at one end of the side frame. A support plate rod is mounted at one end of the rotation groove. A threaded head is mounted at the lower end of the support plate rod.

[0009] Preferably, the support plate rod forms a rotating structure with the side frame through a rotating groove, and the aluminum base plate body is snap-connected with the side frame.

[0010] Preferably, the heat dissipation mechanism includes a guide rod groove, a heat-conducting rod, heat-dissipating fins and a card slot, a guide rod groove is opened at one end of the aluminum substrate body, a heat-conducting rod is installed at one end of the guide rod groove, heat-dissipating fins are installed at the lower end of the heat-conducting rod, and a card slot is opened at the lower end of the side frame.

[0011] Preferably, the heat dissipation fins are connected to the side frame by snapping together through snapping grooves, and the upper end surface of the heat dissipation fins is tightly fitted to the lower end surface of the heat conducting rod.

[0012] Preferably, the waterproof mechanism comprises an isolation membrane, a rod-penetrating hole and an insulating membrane; the isolation membrane is installed at one end of the heat-conducting rod, a rod-penetrating hole is opened at one end of the isolation membrane, and the insulating membrane is installed at the upper end of the aluminum substrate body.

[0013] Preferably, the isolation film is connected to the heat-conducting rod by snapping through the rod hole, and the lower end surface of the insulation film is tightly fitted to the upper end surface of the aluminum substrate body.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The utility model can generate high temperature through the operation of the aluminum substrate body installed in the device by setting the aluminum substrate body and the heat dissipation mechanism. The temperature is evenly diffused to the heat dissipation fins along the heat-conducting rod in the guide rod groove, and the heat dissipation effect is enhanced while the material itself is resistant to high temperature, thereby improving the heat resistance of the device;

[0016] 2. The utility model provides an aluminum substrate body and an installation mechanism, and the aluminum substrate body installed in the device can be operated to rotate the support plate rod in the rotating groove, so that the threaded head at the lower end of the support plate rod is embedded in the installed position, and the support plate rod is always limited to the same horizontal position for the aluminum substrate body during installation, effectively preventing the damage to the aluminum substrate body caused by over-tightening of ordinary screws during installation, thereby improving the protection effect of the device installation;

[0017] 3. The utility model provides an aluminum substrate body and a waterproof mechanism, and can improve the insulation and waterproof effect of the device by attaching a separation film and an insulating film to the upper and lower ends of the aluminum substrate body installed in the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front cross-sectional view of the utility model;

[0019] Figure 2 It is a schematic diagram of the top view structure of the utility model;

[0020] Figure 3 It is a structural schematic diagram of the installation mechanism of the utility model;

[0021] Figure 4 It is a structural schematic diagram of the heat dissipation mechanism of the utility model;

[0022] Figure 5 It is a structural schematic diagram of the waterproof mechanism of the utility model.

[0023] In the figure: 1. Aluminum substrate body; 2. Mounting mechanism; 201. Side frame; 202. Rotating groove; 203. Plate support rod; 204. Threaded head; 3. Heat dissipation mechanism; 301. Guide rod groove; 302. Heat conduction rod; 303. Heat dissipation fin; 304. Card slot; 4. Waterproof mechanism; 401. Isolation membrane; 402. Through-rod hole; 403. Insulation membrane. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0025] The following describes an embodiment of the utility model based on its overall structure.

[0026] See also Figure 1-5 , an aluminum substrate with good heat resistance, comprising an aluminum substrate body 1, a mounting mechanism 2, a heat dissipation mechanism 3 and a waterproof mechanism 4, wherein the mounting mechanism 2 is mounted at one end of the aluminum substrate body 1, and the mounting mechanism 2 comprises a side frame 201, a rotation groove 202, a support plate rod 203 and a threaded head 204, wherein the side frame 201 is mounted at one end of the aluminum substrate body 1, a rotation groove 202 is provided at one end of the side frame 201, a support plate rod 203 is mounted at one end of the rotation groove 202, a threaded head 204 is mounted at the lower end of the support plate rod 203, and the support plate rod 203 is passed through The rotating groove 202 and the side frame 201 form a rotating structure, and the aluminum substrate body 1 is snap-connected with the side frame 201. The aluminum substrate body 1 installed in the device is rotated in the rotating groove 202 by operating the supporting plate rod 203, so that the threaded head 204 at the lower end of the supporting plate rod 203 is embedded in the installed position, and the supporting plate rod 203 always limits the aluminum substrate body 1 to the same horizontal position during installation, effectively preventing damage to the aluminum substrate body 1 caused by over-tightening of ordinary screws during installation, thereby improving the protection effect of the device installation.

[0027] See also Figure 1-5, an aluminum substrate with good heat resistance, a heat dissipation mechanism 3 is installed at one end of the aluminum substrate main body 1, and the heat dissipation mechanism 3 includes a guide rod groove 301, a heat conducting rod 302, a heat dissipation fin 303 and a card slot 304. A guide rod groove 301 is opened at one end of the aluminum substrate main body 1, and a heat conducting rod 302 is installed at one end of the guide rod groove 301. The heat dissipation fin 303 is installed at the lower end of the heat conducting rod 302. A card slot 304 is opened at the lower end of the side frame 201, and the heat dissipation fin 303 is connected to the side frame 201 through the card slot 304, and the upper end surface of the heat dissipation fin 303 is tightly fitted with the lower end surface of the heat conducting rod 302. The aluminum substrate main body 1 installed in the device generates high temperature when working, and its temperature is evenly diffused to the heat dissipation fin 303 along with the heat conducting rod 302 in the guide rod groove 301, while its own material is resistant to high temperature, its heat dissipation effect is enhanced, and the heat resistance of the device is improved.

[0028] See also Figure 1-5 , an aluminum substrate with good heat resistance, a waterproof mechanism 4 is installed at one end of the heat dissipation mechanism 3, the waterproof mechanism 4 includes an isolation film 401, a rod-penetrating hole 402 and an insulating film 403, an isolation film 401 is installed at one end of the heat-conducting rod 302, and a rod-penetrating hole 402 is opened at one end of the isolation film 401, and an insulating film 403 is installed at the upper end of the aluminum substrate body 1, the isolation film 401 is connected with the heat-conducting rod 302 through the rod-penetrating hole 402, the lower end surface of the insulating film 403 is tightly fitted with the upper end surface of the aluminum substrate body 1, and the isolation film 401 and the insulating film 403 are respectively attached to the upper and lower ends of the aluminum substrate body 1 installed in the device, so as to improve the insulation and waterproof effect of the device.

[0029] Working principle: When in use, the aluminum substrate body 1 is preferentially rotated in the rotating groove 202 by operating the supporting plate rod 203, so that the threaded head 204 at the lower end of the supporting plate rod 203 is embedded in the installed position, and the supporting plate rod 203 is always limited to the same horizontal position for the aluminum substrate body 1 during installation, effectively preventing the damage to the aluminum substrate body 1 caused by over-tightening of ordinary screws during installation, thereby improving the protection effect of the device installation, and the aluminum substrate body 1 installed in the device can generate high temperature during operation, and its temperature is evenly diffused to the heat dissipation fins 303 along with the heat-conducting rod 302 in the guide rod groove 301, while its own material is resistant to high temperature and its heat dissipation effect is enhanced, thereby improving the heat resistance of the device, and the upper and lower ends of the aluminum substrate body 1 are respectively attached with an isolation film 401 and an insulating film 403, which improve the insulation and waterproof effect of the device, thus completing the use process of the device. The contents not described in detail in this manual belong to the prior art known to professional and technical personnel in this field.

[0030] The directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the protection content of the present invention.

[0031] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. An aluminum substrate with good heat resistance, comprising an aluminum substrate body (1), a mounting mechanism (2), a heat dissipation mechanism (3) and a waterproof mechanism (4), characterized in that: A mounting mechanism (2) is mounted on one end of the aluminum substrate body (1); A heat dissipation mechanism (3) is installed at one end of the aluminum substrate body (1); A waterproof mechanism (4) is installed at one end of the heat dissipation mechanism (3).

2. The aluminum substrate with good heat resistance according to claim 1, characterized in that: The mounting mechanism (2) comprises a side frame (201), a rotation groove (202), a support plate rod (203) and a threaded head (204); the side frame (201) is mounted on one end of the aluminum substrate body (1); a rotation groove (202) is provided on one end of the side frame (201); a support plate rod (203) is mounted on one end of the rotation groove (202); and a threaded head (204) is mounted on the lower end of the support plate rod (203).

3. The aluminum substrate with good heat resistance according to claim 2, characterized in that: The plate support rod (203) forms a rotating structure with the side frame (201) through the rotating groove (202), and the aluminum base plate body (1) is connected to the side frame (201) by snap-fitting.

4. The aluminum substrate with good heat resistance according to claim 2, characterized in that: The heat dissipation mechanism (3) comprises a guide rod groove (301), a heat conducting rod (302), a heat dissipation fin (303) and a slot (304); one end of the aluminum substrate body (1) is provided with a guide rod groove (301); one end of the guide rod groove (301) is provided with a heat conducting rod (302); the lower end of the heat conducting rod (302) is provided with a heat dissipation fin (303); and the lower end of the side frame (201) is provided with a slot (304).

5. The aluminum substrate with good heat resistance according to claim 4, characterized in that: The heat dissipation fin (303) is snap-connected with the side frame (201) via the snap-in groove (304), and the upper end surface of the heat dissipation fin (303) is tightly fitted with the lower end surface of the heat conducting rod (302).

6. The aluminum substrate with good heat resistance according to claim 4, characterized in that: The waterproof mechanism (4) comprises an isolation membrane (401), a rod-through hole (402) and an insulating membrane (403); the isolation membrane (401) is installed at one end of the heat-conducting rod (302); the rod-through hole (402) is opened at one end of the isolation membrane (401); and the insulating membrane (403) is installed at the upper end of the aluminum substrate body (1).

7. The aluminum substrate with good heat resistance according to claim 6, characterized in that: The isolation film (401) is snap-connected to the heat-conducting rod (302) through the rod-penetrating hole (402), and the lower end surface of the insulation film (403) is tightly fitted to the upper end surface of the aluminum substrate body (1).

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