Connection structure and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, and discloses a connecting structure and electronic equipment. The connecting structure comprises a shell assembly and a connecting assembly, wherein the shell assembly is provided with an accommodating cavity; the flexible circuit board is arranged in the containing cavity, the flexible circuit board comprises a first connecting part and a second connecting part which are connected, and the end, away from the first connecting part, of the second connecting part is bent and extends in the first direction; the two connecting units comprise at least two devices, one connecting unit is connected with the first connecting part, the other connecting unit is connected with the second connecting part, and the devices are electrically conducted with the flexible circuit board; and the battery is electrically connected with the flexible circuit board. The embodiment of the utility model provides a connection structure and an electronic device, and can solve the problem that the arrangement of devices in the internal space of the electronic device or the further reduction of the size of the electronic device is influenced because the connection structure needs to occupy a larger part of the internal space of the electronic device in the related technology.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a connection structure and electronic equipment. Background Art

[0002] In some electronic devices, such as watches, bracelets, and headphones, the size of the electronic devices is often small due to the requirement of being lightweight. As the functions of electronic devices increase, various devices are set on the electronic devices to achieve the corresponding functions. For example, in order to achieve health detection functions such as heart rate, blood pressure, blood oxygen, and sleep, various vital sign sensors are set inside the electronic devices.

[0003] On the one hand, electronic devices are required to be lightweight and small in size, and on the other hand, in order to realize various functions of electronic devices, various devices are required to be arranged on the electronic devices and effectively connected. Therefore, it is necessary to make full use of the internal space of the electronic devices.

[0004] In the related art, in order to make full use of the internal space of the electronic device and reduce the size of the electronic device in the length and width direction, the circuit board is divided into two and stacked together in the thickness direction of the electronic device, and different devices are respectively arranged on the two circuit boards. Since the bottom of the battery is generally provided with a base plate, and the base plate is installed with a wireless charging coil and a vital sign sensor, etc., when installing the electronic device, it is necessary to first connect the base plate with the circuit board close to the base plate, and then set an additional connector to electrically connect the two circuit boards, which causes the related connection structure to occupy a large part of the internal space of the electronic device, thereby affecting the arrangement of devices in the internal space of the electronic device or affecting the further reduction of the size of the electronic device. Utility Model Content

[0005] The embodiments of the present application provide a connection structure and an electronic device, which can improve the problem in the related art that the connection structure needs to occupy a large part of the internal space of the electronic device, thereby affecting the arrangement of components in the internal space of the electronic device or affecting the further reduction of the size of the electronic device.

[0006] To achieve the above purpose, the embodiment of the present application adopts the following technical solution:

[0007] In a first aspect, an embodiment of the present application provides a connection structure, the connection structure comprising:

[0008] A housing assembly, wherein the housing assembly is provided with a receiving cavity;

[0009] A flexible circuit board is arranged in the accommodating cavity, wherein the flexible circuit board comprises a first connecting portion and a second connecting portion connected to each other, wherein an end of the second connecting portion away from the first connecting portion is bent and extends toward a first direction;

[0010] Two connecting units are sequentially arranged along the first direction, the connecting units include at least two devices, one of the connecting units is connected to the first connecting portion, the other connecting unit is connected to the second connecting portion, and the devices are electrically connected to the flexible circuit board;

[0011] A battery, wherein the battery is electrically connected to the flexible circuit board, the first connecting portion and the battery are arranged in sequence in the first direction, and the orthographic projection of the connecting unit on a reference plane perpendicular to the first direction does not completely overlap with the orthographic projection of the battery on the reference plane.

[0012] The connection structure provided by the embodiment of the present application has at least the following technical effects: since the flexible circuit board includes a first connection part and a second connection part connected to each other, the end of the second connection part away from the first connection part is bent and extended in the first direction, and the two connection units are arranged in sequence along the first direction, and the connection unit includes at least two devices, so compared with the related art that requires additional connection parts to electrically connect the devices on the two connection units, the connection structure provided by the embodiment of the present application can directly electrically connect the devices on the two connection units through the first part and the second part of the flexible circuit board, without the need for additional connection parts, thereby reducing the space occupied by the connection unit of the integrated chip and the connection part of the flexible circuit board, and also reducing the production cost. The connection structure provided by the embodiment of the present application is convenient for arranging devices in the accommodating cavity or further reducing the size of the electronic device.

[0013] In some of the embodiments, at least one of the two connection units is configured as an integrated chip.

[0014] By adopting the above scheme, the electrical signals of multiple devices in a connection unit configured as an integrated chip can be uniformly connected to another connection unit by a flexible circuit board, thereby saving the layout area occupied by the connection unit and the connection part of the flexible circuit board, facilitating the arrangement of devices in the accommodating cavity or further reducing the size of the electronic device, and simplifying the assembly process and enhancing the connection reliability.

[0015] In some embodiments, one of the connection units is configured as an integrated chip, and the other connection unit includes a mainboard, the device is connected to the mainboard and is electrically conductive, and the second connection portion is connected to the mainboard and is electrically conductive.

[0016] By adopting the above solution, the electrical signals of multiple devices in one of the connection units can be uniformly connected to the main board by the flexible circuit board, thereby saving the layout area occupied by the connection unit and the connection part of the flexible circuit board, facilitating the arrangement of devices in the accommodating cavity or further reducing the size of the electronic device, simplifying the electrical connection relationship, and simplifying assembly.

[0017] In some embodiments, the connection portion between the second connection portion and the mainboard is located on a side of the mainboard close to the integrated chip.

[0018] By adopting the above solution, the space between the mainboard and the integrated chip can be more fully utilized, thereby preventing the connection part between the second connection part and the mainboard from protruding from the mainboard in the first direction, causing the connection part between the second connection part and the mainboard to occupy additional space.

[0019] In some of the embodiments, at least part of the devices are disposed on a side of the mainboard close to the integrated chip.

[0020] By adopting the above solution, the space between the mainboard and the integrated chip can be more fully utilized, thereby avoiding some components from occupying additional space.

[0021] In some of the embodiments, an orthographic projection of the device disposed on a side of the mainboard close to the integrated chip on the reference plane does not overlap with an orthographic projection of the second connecting portion on a plane perpendicular to the first direction.

[0022] By adopting the above scheme, the device arranged on the side of the mainboard close to the integrated chip and the second connecting part can have a partial overlapping space in the first direction, so that the overall thickness of the device arranged on the side of the mainboard close to the integrated chip and the second connecting part in the first direction can be less than the sum of the thickness of the device arranged on the side of the mainboard close to the integrated chip in the first direction and the thickness of the battery in the first direction.

[0023] In some of the embodiments, some of the devices are disposed on a side of the mainboard close to the integrated chip, and the rest of the devices are disposed on a side of the mainboard away from the integrated chip.

[0024] By adopting the above solution, it is possible to avoid the device connected to the mainboard occupying a large space in the direction perpendicular to the first direction, thereby causing the connection structure to be larger in size in the direction perpendicular to the first direction.

[0025] In some embodiments, the integrated chip is a SIP integrated chip.

[0026] Such a configuration can make the size of the integrated chip smaller, and the SIP integrated chip Sputter (sputtering) self-shielding can replace the first shielding cover and the second shielding cover in the related technology, saving layout area and reducing the weight of the electronic device.

[0027] In some embodiments, the flexible circuit board is provided with connection pads, and the integrated chip is soldered to the connection pads.

[0028] By adopting the above solution, the integrated chip is conveniently connected to the connection pad and electrically conductive.

[0029] In some embodiments, the connection structure includes a charging component disposed in the accommodating cavity, the charging component and the first connecting portion are disposed in sequence, and the charging component is connected to the first connecting portion and is electrically conductive.

[0030] By adopting the above solution, the charging component can be conveniently electrically connected to the connection unit and the battery through the flexible circuit board.

[0031] In some of the embodiments, the connection unit close to the charging component is configured as an integrated chip, and the device in the integrated chip includes a charging circuit.

[0032] By adopting the above solution, the connection path between the charging components can be shortened, and there is no need to set a first spring sheet and a second spring sheet as in the related art, so that the impedance characteristics between the charging component and the battery are better.

[0033] In some embodiments, the connection structure includes a connection member, which is connected to the housing assembly and is used to fix the position of the connection unit in the accommodating cavity.

[0034] By adopting the above solution, the position of the connecting unit in the accommodating cavity can be fixed, thereby preventing the connecting unit from moving randomly in the accommodating cavity.

[0035] In some embodiments, the orthographic projection of the second connecting portion on the reference plane does not completely coincide with the orthographic projection of the battery on the reference plane.

[0036] By adopting the above solution, the second connecting part and the battery can have an overlapping portion in the first direction, that is, the overall thickness of the second connecting part and the battery in the first direction is less than the sum of the thickness of the second connecting part in the first direction and the thickness of the battery in the first direction, thereby reducing the space occupied by the second connecting part and the battery in the first direction.

[0037] In some embodiments, the orthographic projection of the connecting unit on a plane perpendicular to the first direction does not coincide with the orthographic projection of the battery on a plane perpendicular to the first direction, and the orthographic projection of the second connecting portion on a plane perpendicular to the first direction does not coincide with the orthographic projection of the battery on a plane perpendicular to the first direction.

[0038] By adopting the above scheme, the connection unit and the battery can have an overlapping portion in the first direction, and the second connection part and the battery can have an overlapping portion in the first direction, that is, the overall thickness of the connection unit, the second connection part and the battery in the first direction is smaller than the sum of the thickness of the connection unit in the first direction, the thickness of the second connection part in the first direction and the thickness of the battery in the first direction, thereby reducing the space occupied by the connection unit, the second connection part and the battery in the first direction.

[0039] In some embodiments, the battery includes a first energy storage part and a second energy storage part which are sequentially arranged and connected along a second direction, the second direction is perpendicular to the first direction, and in the second direction, the second energy storage part is located between the two connecting units.

[0040] By adopting the above solution, the space between the two connecting units can be more fully utilized, so that the capacity of the battery can be increased through the second energy storage part located between the two connecting units.

[0041] In some embodiments, the orthographic projection of the second energy storage portion on the reference plane does not completely overlap with the orthographic projection of the connection unit on the reference plane.

[0042] By adopting the above scheme, the connecting unit and the second energy storage part can have an overlapping portion in the first direction, that is, the overall thickness of the connecting unit and the second energy storage part in the first direction is smaller than the sum of the thickness of the connecting unit in the first direction and the thickness of the second energy storage part in the first direction, thereby reducing the space occupied by the connecting unit and the second energy storage part in the first direction.

[0043] In some embodiments, the orthographic projection of the second energy storage portion on the reference plane does not completely overlap with the orthographic projection of the second connecting portion on the reference plane.

[0044] By adopting the above scheme, the second connecting portion and the second energy storage portion can have an overlapping portion in the first direction, that is, the overall thickness of the second connecting portion and the second energy storage portion in the first direction is smaller than the sum of the thickness of the second connecting portion in the first direction and the thickness of the second energy storage portion in the first direction, thereby reducing the space occupied by the second connecting portion and the second energy storage portion in the first direction.

[0045] In some of the embodiments, a functional element is disposed in the accommodating cavity, and in the first direction, at least part of the functional element is located between the two connecting units.

[0046] By adopting the above solution, the released internal space of the accommodating cavity can be used to add layout functional elements.

[0047] In some embodiments, an orthographic projection of the functional element on the reference plane does not coincide with an orthographic projection of the second connecting portion on the reference plane.

[0048] By adopting the above solution, the space occupied by the functional element and the second connecting portion in the first direction can be reduced.

[0049] In some of the embodiments, the device includes an EMMC memory chip, a wireless charging RX, an ECG measurement circuit module, an AFE circuit module, an LDO, a BTB connector, an RFIC, an AP, a Modem, a GPS module, a BT module, an RFFE, a PA, an MCU subsystem or an NFC module.

[0050] By adopting the above solution, the types of components can be set as needed, so that the electronic device has more functions.

[0051] In some embodiments, the shell assembly includes a display screen, a first shell and a second shell, the first shell is provided with a through hole, the display screen and the second shell are respectively covered at the openings at both ends of the through hole to enclose the accommodating cavity together with the first shell.

[0052] By adopting the above solution, the first shell and the display screen can be assembled together first, and then the battery, the flexible circuit board and the connection unit are connected and placed between the first shell and the second shell, and then the first shell and the second shell are put together, which is simple and convenient to operate.

[0053] In a second aspect, an embodiment of the present application provides an electronic device, wherein the electronic device includes the connection structure as described in the first aspect.

[0054] The electronic device provided by the embodiment of the present application has a flexible circuit board including a first connection part and a second connection part connected to each other, an end of the second connection part away from the first connection part is bent and extended in the first direction, and two connection units are arranged in sequence along the first direction, and the connection unit includes at least two devices. Therefore, compared with the related art that requires additional connection parts to electrically connect the devices on the two connection units, the connection structure provided by the embodiment of the present application can directly electrically connect the devices on the two connection units through the first part and the second part of the flexible circuit board, without the need for additional connection parts, thereby reducing the space occupied by the connection unit of the integrated chip and the connection part of the flexible circuit board, and also reducing the production cost. The electronic device provided by the embodiment of the present application is convenient for arranging devices in the accommodating cavity or further reducing the size of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 Schematic diagram of electronic equipment provided for related art;

[0056] Figure 2 for Figure 1 A schematic diagram of the internal structure of the electronic device shown;

[0057] Figure 3 for Figure 2 A schematic diagram of a partial structure of an electronic device shown;

[0058] Figure 4 A schematic diagram of an electronic device provided in accordance with a first embodiment of the present application;

[0059] Figure 5 for Figure 1 A schematic diagram of the internal structure of the electronic device shown;

[0060] Figure 6 for Figure 5 A top view of a flexible circuit board, a connection unit, and a battery in the electronic device shown;

[0061] Figure 7 for Figure 6 A perspective view of the flexible circuit board shown;

[0062] Figure 8 for Figure 7 A three-dimensional view of the flexible circuit board from another perspective;

[0063] Fig. 9 for Figure 7 A front view of the flexible circuit board shown;

[0064] Fig.10 for Figure 5 A schematic diagram of a flexible circuit board and a connection unit in the electronic device shown;

[0065] Fig.11 A schematic diagram of an electronic device provided for a second embodiment of the present application;

[0066] Fig.12 A schematic diagram of an electronic device provided in accordance with a third embodiment of the present application;

[0067] Fig.13 A schematic diagram of an electronic device provided in accordance with a fourth embodiment of the present application;

[0068] Fig.14 for Fig.13 A top view of a flexible circuit board, a connection unit, and a battery in the electronic device shown;

[0069] Fig.15 A schematic diagram of an electronic device provided in accordance with the fifth embodiment of the present application.

[0070] Among them, the reference numerals in the figure are:

[0071] 0100, watch;

[0072] 001, housing; 002, mounting cavity; 003, first circuit board; 004, second circuit board; 005, third circuit board; 006, fourth circuit board; 007, first device; 008, second device; 009, power supply battery; 010, wireless charging coil; 011, first shielding cover; 012, second shielding cover; 013, first spring sheet; 014, second spring sheet; 015, BTB connector;

[0073] 100. Electronic equipment;

[0074] 10. Shell assembly;

[0075] 101, accommodating cavity;

[0076] 11. display screen; 12. first housing; 13. second housing;

[0077] 20. Flexible circuit board;

[0078] 21. first connection portion; 22. second connection portion; 23. connection pad;

[0079] 30. Connecting unit;

[0080] 301, main board; 302, elevated board; 303, reinforcement board;

[0081] 31. Device; 32. Packaging material; 33. Shielding layer; 34. Substrate;

[0082] 40. Battery;

[0083] 41. a first energy storage unit; 42. a second energy storage unit;

[0084] 50. Charging components;

[0085] 60. Vital sign sensor;

[0086] 200, reference plane;

[0087] 300. Functional elements. DETAILED DESCRIPTION

[0088] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0089] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inside", "outside", "up", "down", "left", "right", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0090] The terms "first", "second", "third", "fourth", etc. are only used to distinguish descriptions and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. For example, the first push part and the second push part are only used to distinguish different push parts, and their order is not limited. The first push part can also be named as the second push part, and the second push part can also be named as the first push part without departing from the scope of the various described embodiments. And the terms "first", "second", "third", "fourth", etc. do not limit the indicated features to be different.

[0091] In this application, unless otherwise clearly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0092] In this application, "and / or" is only a description of the association relationship of associated objects, indicating that there can be three relationships; for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0093] It should be noted that, in this application, words such as "in one embodiment", "exemplarily", "for example", etc. are used to indicate examples, illustrations or descriptions. Any embodiment or design described in this application as "in one embodiment", "exemplarily", "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "in one embodiment", "exemplarily", "for example", etc. is intended to present related concepts in a specific way.

[0094] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0095] In the related art, in order to make full use of the internal space of the electronic device and reduce the size of the electronic device in the length and width direction, the circuit board is divided into two and stacked together in the thickness direction of the electronic device, and different devices are respectively arranged on the two circuit boards. Since the bottom of the battery is generally provided with a base plate, and the base plate is installed with a wireless charging coil and a vital sign sensor, etc., when installing the electronic device, it is necessary to first connect the base plate with the circuit board close to the base plate, and then set an additional connector to electrically connect the two circuit boards, which causes the related connection structure to occupy a large part of the internal space of the electronic device, thereby affecting the arrangement of devices in the internal space of the electronic device or affecting the further reduction of the size of the electronic device.

[0096] For example, see Figure 1 , Figure 2 and Figure 3 , Figure 1 A schematic diagram of an electronic device provided for related art, Figure 2 for Figure 1 The internal structure diagram of the electronic device shown in FIG. Figure 3 for Figure 2 A schematic diagram of a partial structure of an electronic device shown.

[0097] In the related art, an electronic device is taken as an example of a watch 0100 , the electronic device includes a housing 001 , the housing 001 is provided with an installation cavity 002 , and a first circuit board 003 , a second circuit board 004 , a third circuit board 005 and a fourth circuit board 006 are arranged in the installation cavity 002 .

[0098] The first circuit board 003 can be installed with vital sign sensors such as PPG (Photoplethysmography) as well as a microphone, an earpiece, a motor, a barometer and a wireless charging coil 010, etc. The wireless charging coil 010 can be set at the bottom of the electronic device.

[0099] A power supply battery 009 is disposed in the installation cavity 002. The first circuit board 003 and the power supply battery 009 are sequentially disposed along a first direction. The first direction may be parallel to the thickness direction of the housing 001. For example, the first direction may be Figure 2 The direction indicated by the arrow Z. The first circuit board 003 is electrically connected to the power supply battery 009.

[0100] Since many devices need to be installed in the electronic device, in order to reduce the size of the housing 001 in the first direction, the second circuit board 004 and the fourth circuit board 006 are arranged in sequence in the first direction in a three-dimensional double-layer stacking arrangement.

[0101] The second circuit board 004 can be used as an elevated board. A first device 007 is mounted on the second circuit board 004 , and a plurality of first devices 007 can be provided.

[0102] The fourth circuit board 006 can be used as a main board, on which a second device 008 is mounted, and a plurality of second devices 008 can be provided.

[0103] Meanwhile, in order to avoid mutual interference between the first device 007 and other devices, a first shielding cover 011 is provided on the first device 007. In order to avoid mutual interference between the second device 008 and other devices, a second shielding cover 012 is provided on the second device 008.

[0104] Among them, the first device 007 may include an EMMC (Embedded Multi Media Card) storage chip and charging circuits such as wireless charging RX (receiving end), SC (Switched Capacitor converter) fast charging, and 5V Charge (charging). The first device 007 may also include an ECG (Electrocardiogram) measurement circuit module, an AFE (Analog Front End) circuit module, a vital sign sensor circuit, an LDO (Low Dropout Regulator), a first spring clip 013 for connecting to the first circuit board 003, a second spring clip 014 for connecting to the first circuit board 003, and a BTB (Board-to-Board) connector 015 for connecting to the first circuit board 003, etc. The BTB connector 015, the first spring clip 013 and the second spring clip 014 are all located on the side of the second circuit board 004 away from the fourth circuit board 006.

[0105] Specifically, the wireless charging coil 010 is electrically connected to the charging circuit via the first circuit board 003 , the first spring piece 013 and the second circuit board 004 in sequence, and the charging circuit is electrically connected via the second circuit board 004 , the second spring piece 014 , the first circuit board 003 and the power supply battery 009 in sequence.

[0106] Since the path from the power supply battery 009 to the wireless charging coil 010 is long and needs to pass through the first spring clip 013 and the second spring clip 014, the self-impedance of the first spring clip 013 and the self-impedance of the second spring clip 014 are both poor, and the contact impedance of the elastic connection between the first spring clip 013 and the second circuit board 004 is large, and the contact impedance of the elastic connection between the second spring clip 014 and the second circuit board 004 is large, so the impedance characteristics between the power supply battery 009 and the wireless charging coil 010 path are poor.

[0107] The first circuit board 003 and the second circuit board 004 can be used as bottom shell circuit components, assembled and fixed on the bottom of the shell 001, and the first circuit board 003 and the second circuit board 004 can be connected by BTB connector connection or welding.

[0108] The second device 008 may include RFIC (Radio Frequency Integrated Circuit), AP (Application Processor), Modem, GPS (Global Positioning System) module, BT (Bluetooth) module, RFFE (Radio Frequency Front-End), PA (Power Amplifier), MCU (Microcontroller Unit) subsystem, NFC (Near Field Communication) module and BTB connector for connecting to the screen, etc.

[0109] The third circuit board 005 can be used as a connector. The main board and the elevated board are electrically connected through the third circuit board 005. The third circuit board 005 can be a flexible circuit board. The connection between the third circuit board 005 and the main board and the connection between the third circuit board 005 and the elevated board can be welding, BTB connector connection, ZIF (Zero Insertion Force, zero insertion force connector) connector, where welding can be hotbar (pulse hot pressing) welding or laser welding, and the connection method is relatively complicated. The connection part occupies a large space.

[0110] In the related art, the main board and the elevated board are stacked in double layers, and the sum of their thicknesses is about 6.5 mm. It is difficult to further reduce the thickness, and the assembly process of the electronic device is complicated. The main board is first installed on the front shell assembly of the shell 001, and the elevated board is then installed into the front shell assembly and fixed with screws. Finally, the rear shell assembly (the rear shell assembly includes a power supply battery 009, a first circuit board 003, and a wireless charging coil 010, etc.) is combined with the front shell assembly. The elevated board and the main board need to be fixed with hardware support columns and screws, which occupies the layout area of ​​the main board and the elevated board. At the same time, the hardware support columns do not reduce the weight of the electronic device.

[0111] At the same time, the connection methods between the first circuit board 003 and the second circuit board 004, between the second circuit board 004 and the third circuit board 005, and between the third circuit boards 005 are complicated. The interconnection of multiple boards not only causes the third circuit board 005 as a connector to occupy a large part of the internal space of the electronic device, but also causes the electrical signal connection parts between the first circuit board 003 and the second circuit board 004, between the second circuit board 004 and the third circuit board 005, and between the third circuit boards 005 to occupy a large part of the internal space of the electronic device, thereby affecting the arrangement of components in the internal space of the electronic device or affecting the further reduction of the size of the electronic device.

[0112] In view of this, an embodiment of the present application provides a connection structure and an electronic device, which can improve the problem in the related art that the connection structure needs to occupy a large part of the internal space of the electronic device, thereby affecting the arrangement of components in the internal space of the electronic device or affecting the further reduction of the size of the electronic device.

[0113] The electronic device provided in the embodiment of the present application can be a watch, a bracelet, smart glasses, headphones, a mobile phone, a tablet computer, a laptop computer, etc., but is not limited thereto. In the embodiment of the present application, the electronic device is a watch as an example for description.

[0114] Please refer to Figure 4 , Figure 5 and Figure 6 , Figure 4 A schematic diagram of an electronic device 100 provided in the first embodiment of the present application, Figure 5 for Figure 1 The internal structure diagram of the electronic device 100 is shown in FIG. Figure 6 for Figure 5 The diagram shows a top view of the flexible printed circuit board 20 , the connecting unit 30 , and the battery 40 in the electronic device 100 .

[0115] In a first aspect, an embodiment of the present application provides a connection structure, which includes a housing assembly 10 , a flexible circuit board 20 , two connection units 30 and at least one battery 40 .

[0116] Please refer to Figure 7 , Figure 8 and Fig. 9 , Figure 7 for Figure 6 The three-dimensional view of the flexible circuit board 20 shown in FIG. Figure 8 for Figure 7 A three-dimensional view of the flexible circuit board 20 from another perspective is shown. Fig. 9 for Figure 7 A front view of the flexible circuit board 20 is shown.

[0117] The housing assembly 10 is provided with a receiving cavity 101 , and the flexible circuit board 20 is provided in the receiving cavity 101 . The flexible circuit board 20 includes a first connecting portion 21 and a second connecting portion 22 connected to each other. One end of the second connecting portion 22 away from the first connecting portion 21 bends and extends toward a first direction.

[0118] The first connection portion 21 and the second connection portion 22 are integrally formed and can be manufactured together during the process of manufacturing the flexible circuit board 20. The second connection portion 22 extends in a straight line or a curved line in the first direction from one end of the first connection portion 21.

[0119] The first connection portion 21 can be installed with a charging component 50 (such as a wireless charging coil), a vital sign sensor 60 such as PPG (Photoplethysmography), a microphone, an earpiece, a motor, a barometer, etc.

[0120] The wireless charging coil can be arranged on the side of the first connecting part 21 away from the battery 40 through a hard circuit board and is connected to the first connecting part 21 and is electrically conductive. The vital sign sensor 60 can be arranged on the side of the first connecting part 21 away from the battery 40 through a hard circuit board and is connected to the first connecting part 21 and is electrically conductive. The vital sign sensor 60 may include a PPG circuit board and a PD Sensor (Photodiode Sensor) around the PPG circuit board. The shell assembly 10 may be provided with an avoidance hole (not shown in the figure) connecting the accommodating cavity 101 with the external space of the shell assembly 10, so that the vital sign sensor 60 can transmit or receive signals to the external space of the shell assembly 10 through the avoidance hole.

[0121] The first direction may be parallel to the thickness direction of the housing assembly 10. For example, the first direction may be Figure 5 The direction indicated by the arrow Z.

[0122] The two connection units 30 are arranged in sequence along the first direction. The connection units 30 include at least two devices 31, one of which is connected to the first connection part 21, and the other is connected to the second connection part 22. The device 31 is electrically connected to the flexible circuit board 20.

[0123] The device 31 may include an EMMC memory chip, a wireless charging RX, an ECG measurement circuit module, an AFE circuit module, an LDO, a BTB connector, an RFIC, an AP, a Modem, a GPS module, a BT module, an RFFE, a PA, an MCU subsystem, or an NFC module. The connection unit 30 and the first connection portion 21 may be welded together or connected via a connector, and the connection unit 30 and the second connection portion 22 may be welded together or connected via a connector. Specifically, the connection unit 30 may be a component including at least two devices 31 and connected to the flexible circuit board 20.

[0124] The type of device 31 can be set as needed so that the electronic device 100 has more functions.

[0125] For example, the device 31 close to the connecting unit 30 of the first part may include an EMMC storage chip and charging circuits such as wireless charging RX (receiving end), SC fast charging, 5V Charge, etc. The first device 31 may also include an ECG measurement circuit module, an AFE circuit module, a vital sign sensor circuit or LDO, etc.

[0126] The device 31 away from the connection unit 30 of the first part may include RFIC, AP, Modem, GPS module, BT module, RFFE, PA, MCU subsystem or NFC module, etc.

[0127] Since one of the connection units 30 is connected to the first connection portion 21, the other connection unit 30 is connected to the second connection portion 22, and the device 31 is electrically conductive with the flexible circuit board 20, the two connection units 30 can be directly connected through the flexible circuit board 20, so that the devices 31 on the two connection units 30 are directly electrically conductive through the flexible circuit board 20, without the need to set up additional connectors.

[0128] The battery 40 is electrically connected to the flexible circuit board 20 , the first connecting portion 21 and the battery 40 are arranged sequentially in the first direction, and the orthographic projection of the connecting unit 30 on the reference plane 200 perpendicular to the first direction does not completely overlap with the orthographic projection of the battery 40 on the reference plane 200 .

[0129] Among them, the orthographic projection of the connecting unit 30 on the reference plane 200 perpendicular to the first direction does not completely overlap with the orthographic projection of the battery 40 on the reference plane 200, that is, the orthographic projection of the connecting unit 30 on the reference plane 200 perpendicular to the first direction does not overlap with the orthographic projection of the battery 40 on the reference plane 200; or, part of the orthographic projection of the connecting unit 30 on the reference plane 200 perpendicular to the first direction overlaps with part of the orthographic projection of the battery 40 on the reference plane 200, and the other parts do not overlap.

[0130] For example, the orthographic projection of the main energy storage part of the battery 40 on the reference plane 200 does not coincide with the orthographic projection of the connecting unit 30 on the reference plane 200 perpendicular to the first direction, and the orthographic projection of the protective plate at the end of the battery 40 on the reference plane 200 coincides with the orthographic projection of the connecting unit 30 on the reference plane 200 perpendicular to the first direction.

[0131] Since the first connecting portion 21 and the battery 40 are arranged sequentially in the first direction, and the orthographic projection of the connecting unit 30 on the reference plane 200 perpendicular to the first direction does not completely overlap with the orthographic projection of the battery 40 on the reference plane 200, the connecting unit 30 and the battery 40 can have overlapping parts in the first direction, that is, the overall thickness of the connecting unit 30 and the battery 40 in the first direction can be made smaller than the sum of the thickness of the connecting unit 30 in the first direction and the thickness of the battery 40 in the first direction, thereby reducing the space occupied by the connecting unit 30 and the battery 40 in the first direction.

[0132] As can be seen from the above, the connection structure provided in the embodiment of the present application, since the flexible circuit board 20 includes a first connection part 21 and a second connection part 22 connected to each other, the end of the second connection part 22 away from the first connection part 21 is bent and extended in the first direction, and the two connection units 30 are arranged in sequence along the first direction, and the connection unit 30 includes at least two devices 31, so compared with the related art that requires additional connection parts to electrically connect the devices 31 on the two connection units 30, the connection structure provided in the embodiment of the present application can directly electrically connect the devices 31 on the two connection units 30 through the first part and the second part of the flexible circuit board 20, without the need for additional connection parts, thereby reducing the space occupied by the connection unit 30 of the integrated chip and the connection part of the flexible circuit board 20, and also reducing the production cost. The connection structure provided in the embodiment of the present application is convenient for arranging the device 31 in the accommodating cavity 101 or further reducing the size of the electronic device 100.

[0133] At the same time, compared with the related art in which the connection unit 30 and the battery 40 are arranged sequentially along the first direction, for example, the battery 40 is arranged above the connection unit 30, in the connection structure provided in the embodiment of the present application, since the first connection portion 21 and the battery 40 are arranged sequentially in the first direction, and the orthographic projection of the connection unit 30 on the reference plane 200 perpendicular to the first direction does not completely coincide with the orthographic projection of the battery 40 on the reference plane 200, the overall thickness of the connection unit 30 and the battery 40 in the first direction can be made smaller than the sum of the thickness of the connection unit 30 in the first direction and the thickness of the battery 40 in the first direction, thereby reducing the space occupied by the connection unit 30 and the battery 40 in the first direction.

[0134] The connection structure provided in the embodiment of the present application can reduce the space occupied by the connection structure in the first direction, thereby achieving thinning of the electronic device 100 in the first direction; or, it can release the internal space of the accommodating cavity 101 to add new functional components, such as motors, speakers, etc.; or, it can release the internal space of the accommodating cavity 101 to provide heat dissipation space, thereby improving heat dissipation.

[0135] Please refer to Figure 2 and Figure 3 In the related art, multiple devices 31 on the second circuit board are electrically connected to the first circuit board through separate lines, and multiple devices 31 on the fourth circuit board are electrically connected to the third circuit board through separate lines. The connection methods between the second circuit board and the first circuit board, between the second circuit board and the third circuit board, and between the fourth circuit board and the third circuit board are complex, and the electrical signal connection parts occupy a large layout area.

[0136] In addition, in the related art, the first shielding cover 011 and the second shielding cover 012 also occupy a relatively large space.

[0137] To solve the problems in related technologies, please refer to Figure 4 and Figure 5 In this embodiment, at least one of the two connecting units 30 is configured as an integrated chip.

[0138] By adopting the above scheme, the electrical signals of multiple devices 31 in the connection unit 30 set as an integrated chip can be uniformly connected from the flexible circuit board 20 to another connection unit 30, thereby saving the layout area occupied by the connection part of the connection unit 30 and the flexible circuit board 20, facilitating the arrangement of the devices 31 in the accommodating cavity 101 or further reducing the size of the electronic device 100, and simplifying the assembly process and enhancing the connection reliability.

[0139] It is understandable that after the connection unit 30 is set as an integrated chip, a shielding structure can be set on the integrated chip to replace the first shielding cover 011 and the second shielding cover 012 in the related art, thereby saving layout area and reducing the weight of the electronic device 100.

[0140] After the connection unit 30 is configured as an integrated chip, the integrated chip can be directly soldered on the flexible circuit board 20 .

[0141] It should be noted that at least one of the two connection units 30 is configured as an integrated chip, that is, both connection units 30 are configured as integrated chips. Alternatively, only one connection unit 30 is configured as an integrated chip.

[0142] In this embodiment, one of the connection units 30 is configured as an integrated chip, and the other connection unit 30 includes a mainboard 301 , the device 31 is connected to the mainboard 301 and is electrically conductive, and the second connection portion 22 is connected to the mainboard 301 and is electrically conductive.

[0143] By adopting the above scheme, the electrical signals of multiple devices 31 of one connection unit 30 can be uniformly connected to the main board 301 by the flexible circuit board 20, thereby saving the layout area occupied by the connection part of the connection unit 30 and the flexible circuit board 20, facilitating the arrangement of the devices 31 in the accommodating cavity 101 or further reducing the size of the electronic device 100, simplifying the electrical connection relationship, and simplifying assembly.

[0144] Specifically, the connection unit 30 close to the first connection portion 21 is configured as an integrated chip, another connection unit 30 includes a main board 301 , and a reinforcing plate 303 is disposed on a side of the first connection portion 21 away from the connection unit 30 .

[0145] It is understandable that in this embodiment, there is no need to set hardware supports between the integrated chip and the mainboard 301, so as to further reduce the space occupied by the accommodating cavity 101, save layout area, reduce the difficulty of shielding cover design, reduce weight and reduce costs.

[0146] Please refer to Figure 4 and Figure 5 Optionally, the connection portion between the second connection portion 22 and the mainboard 301 is located on a side of the mainboard 301 close to the integrated chip.

[0147] By adopting the above solution, the space between the mainboard 301 and the integrated chip can be more fully utilized, thereby preventing the connection part between the second connection part 22 and the mainboard 301 from protruding out of the mainboard 301 in the first direction, causing the connection part between the second connection part 22 and the mainboard 301 to occupy additional space.

[0148] Optionally, at least part of the components 31 are disposed on a side of the mainboard 301 close to the integrated chip.

[0149] By adopting the above solution, the space between the mainboard 301 and the integrated chip can be more fully utilized, thereby avoiding some components 31 from occupying extra space.

[0150] Please refer to Figure 4 and Figure 5 In this embodiment, the orthographic projection of the device 31 disposed on the side of the mainboard 301 close to the integrated chip on the reference plane 200 does not overlap with the orthographic projection of the second connecting portion 22 on the plane perpendicular to the first direction.

[0151] By adopting the above scheme, the device 31 arranged on the side of the mainboard 301 close to the integrated chip and the second connecting portion 22 can have a partial overlapping space in the first direction, so that the overall thickness of the device 31 arranged on the side of the mainboard 301 close to the integrated chip and the second connecting portion 22 in the first direction can be less than the sum of the thickness of the device 31 arranged on the side of the mainboard 301 close to the integrated chip in the first direction and the thickness of the battery 40 in the first direction.

[0152] Optionally, some of the components 31 are disposed on a side of the mainboard 301 close to the integrated chip, and the remaining components 31 are disposed on a side of the mainboard 301 away from the integrated chip.

[0153] By adopting the above solution, it is possible to avoid the device 31 connected to the mainboard 301 occupying a large space in the direction perpendicular to the first direction, thereby causing the connection structure to be larger in size in the direction perpendicular to the first direction.

[0154] Please refer to Figure 1 , Figure 2 , Figure 4 , Figure 5 and Fig.10 , Fig.10 for Figure 5 A schematic diagram of a flexible printed circuit board 20 and a connecting unit 30 in an electronic device is shown.

[0155] In this embodiment, the integrated chip is a SIP (System in Package) integrated chip.

[0156] Such a configuration can reduce the size of the integrated chip, and the SIP integrated chip Sputter (sputtering) self-shielding can replace the first shielding cover 011 and the second shielding cover 012 in the related art, saving layout area and reducing the weight of the electronic device 100.

[0157] The SIP integrated chip can package multiple devices 31 onto a substrate 34 through a packaging material 32 and a shielding layer 33 , and the substrate 34 can be welded to the first connection portion 21 .

[0158] For example, the packaging material 32 may be an epoxy molding compound (EMC). The shielding layer 33 may be manufactured by a sputtering process or a spraying process.

[0159] It should be noted that SIP is an advanced integrated circuit packaging technology. The SIP process can integrate multiple active electronic components with different functions and optional passive devices, as well as other devices such as MEMS (Micro-Electro-Mechanical System) or optical devices, into one package to achieve a basically complete functional unit. SIP integrated chips are chips made using the SIP process.

[0160] Specifically, the flexible circuit board 20 is provided with a connection pad 23 , and the integrated chip is soldered to the connection pad 23 .

[0161] By adopting the above solution, the integrated chip is conveniently connected to the connection pad 23 and electrically connected.

[0162] Optionally, the connection structure includes a charging component 50 disposed in the accommodating cavity 101, the charging component 50 and the first connecting portion 21 are disposed in sequence, and the charging component 50 and the first connecting portion 21 are connected and electrically conductive.

[0163] By adopting the above solution, the charging assembly 50 can be conveniently electrically connected to the connection unit 30 and the battery 40 through the flexible circuit board 20.

[0164] For example, the charging component 50 may include a wireless charging coil or a wired charging port, and the charging component 50 may implement a wireless charging function or a wired charging function.

[0165] Optionally, the connection structure includes a magnet connected to the first part, and the magnet can adsorb the power supply device when charging using the wireless charging coil.

[0166] Please refer to Figure 1 , Figure 2 , Figure 4 and Figure 5 In this embodiment, the connection unit 30 close to the charging component 50 is configured as an integrated chip, and the device 31 in the integrated chip includes a charging circuit.

[0167] By adopting the above solution, the connection path between the charging component 50 and the charging component 50 can be shortened, and there is no need to set the first spring piece 013 and the second spring piece 014 as in the related art, so that the impedance characteristics between the charging component 50 and the battery 40 are better.

[0168] Optionally, the connection structure includes a connection piece, which is connected to the housing assembly 10 , and is used to fix the position of the connection unit 30 in the accommodating cavity 101 .

[0169] By adopting the above solution, the position of the connecting unit 30 in the accommodating cavity 101 can be fixed, thereby preventing the connecting unit 30 from moving randomly in the accommodating cavity 101 .

[0170] For example, the connector can be a separate hard circuit board, which is connected to the flexible circuit board 20, and the connector is connected to the housing by bonding, welding, screw connection or bolt connection. Alternatively, the connector is integrally arranged with the circuit board of the integrated chip itself.

[0171] Please refer to Figure 4 and Figure 5 and Figure 6 In some embodiments, the orthographic projection of the second connecting portion 22 on the reference plane 200 does not completely coincide with the orthographic projection of the battery 40 on the reference plane 200 .

[0172] By adopting the above solution, the second connection part 22 and the battery 40 can have an overlapping portion in the first direction, that is, the overall thickness of the second connection part 22 and the battery 40 in the first direction is less than the sum of the thickness of the second connection part 22 in the first direction and the thickness of the battery 40 in the first direction, thereby reducing the space occupied by the second connection part 22 and the battery 40 in the first direction.

[0173] Among them, the orthographic projection of the second connecting portion 22 on the reference plane 200 does not completely overlap with the orthographic projection of the battery 40 on the reference plane 200, that is, the orthographic projection of the second connecting portion 22 on the reference plane 200 does not overlap with the orthographic projection of the battery 40 on the reference plane 200; or, the orthographic projection of the second connecting portion 22 on the reference plane 200 partially overlaps with the orthographic projection of the battery 40 on the reference plane 200, and the other parts do not overlap.

[0174] Specifically, the orthographic projection of the connecting unit 30 on the plane perpendicular to the first direction does not coincide with the orthographic projection of the battery 40 on the plane perpendicular to the first direction, and the orthographic projection of the second connecting portion 22 on the plane perpendicular to the first direction does not coincide with the orthographic projection of the battery 40 on the plane perpendicular to the first direction.

[0175] By adopting the above scheme, the connection unit 30 and the battery 40 can have an overlapping portion in the first direction, and the second connection part 22 and the battery 40 can have an overlapping portion in the first direction, that is, the overall thickness of the connection unit 30, the second connection part 22 and the battery 40 in the first direction can be smaller than the sum of the thickness of the connection unit 30 in the first direction, the thickness of the second connection part 22 in the first direction and the thickness of the battery 40 in the first direction, thereby reducing the space occupied by the connection unit 30, the second connection part 22 and the battery 40 in the first direction.

[0176] Please refer to Figure 4 and Figure 5 In this embodiment, the shell assembly 10 includes a display screen 11, a first shell 12 and a second shell 13. The first shell 12 is provided with a through hole (not shown in the figure). The display screen 11 and the second shell 13 are respectively covered at the openings at both ends of the through hole to enclose the accommodating cavity 101 together with the first shell 12.

[0177] By adopting the above solution, the first shell 12 and the display screen 11 can be assembled together first, and then the battery 40, the flexible circuit board 20 and the connecting unit 30 are connected and placed between the first shell 12 and the second shell 13, and then the first shell 12 and the second shell 13 are put together. The operation is simple and convenient.

[0178] Please refer to Fig.11 , Fig.11 A schematic diagram of an electronic device 100 provided in accordance with a second embodiment of the present application.

[0179] Different from the first embodiment, in the second embodiment, the connection unit 30 away from the first connection part 21 is configured as an integrated chip, and another connection unit 30 includes an elevated board 302, the device 31 is connected to the elevated board 302 and is electrically conductive, and the first connection part 21 is connected to the elevated board 302 and is electrically conductive.

[0180] By adopting the above scheme, the electrical signals of multiple devices 31 of one connection unit 30 can be uniformly connected to the elevated board 302 by the flexible circuit board 20, thereby saving the layout area occupied by the connection parts of the connection unit 30 and the flexible circuit board 20, facilitating the arrangement of the devices 31 in the accommodating cavity 101 or further reducing the size of the electronic device 100, simplifying the electrical connection relationship, and simplifying assembly.

[0181] Please refer to Fig.12 , Fig.12 A schematic diagram of an electronic device 100 provided in accordance with a third embodiment of the present application.

[0182] Different from the first embodiment, in the third embodiment, both connection units 30 are configured as integrated chips.

[0183] By adopting the above scheme, the electrical signals of multiple devices 31 of one connection unit 30 can be uniformly connected from the flexible circuit board 20 to the multiple devices 31 of another connection unit 30, thereby saving the layout area occupied by the connection parts of the connection unit 30 and the flexible circuit board 20, facilitating the arrangement of the devices 31 in the accommodating cavity 101 or further reducing the size of the electronic device 100, simplifying the electrical connection relationship, and simplifying assembly.

[0184] Please refer to Fig.13 and Fig.14 , Fig.13A schematic diagram of an electronic device 100 provided in a fourth embodiment of the present application, Fig.14 for Fig.13 The diagram shows a top view of the flexible printed circuit board 20 , the connecting unit 30 , and the battery 40 in the electronic device 100 .

[0185] The connection structure provided in the embodiment of the present application can directly electrically connect the devices 31 on the two connection units 30 through the first part and the second part of the flexible circuit board 20, without the need for additional connectors, thereby reducing the space occupied by the connection part between the connection unit 30 of the integrated chip and the flexible circuit board 20. This reduced space can be used to arrange other components, for example, it can be used to arrange a battery 40, etc.

[0186] For example, unlike the third embodiment, in the fourth embodiment, the battery 40 includes a first energy storage part 41 and a second energy storage part 42 which are arranged in sequence and connected along a second direction, the second direction is perpendicular to the first direction, and in the first direction, the second energy storage part 42 is located between the two connecting units 30.

[0187] The second direction may be parallel to the length direction of the shell or the width direction of the shell. When the shell is cylindrical, the second direction may be parallel to the radial direction of the shell. For example, the second direction may be Fig.13 and Fig.14 The direction indicated by the arrow X.

[0188] By adopting the above solution, the space between the two connecting units 30 can be more fully utilized, so that the capacity of the battery 40 can be increased through the second energy storage part 42 located between the two connecting units 30 .

[0189] It can be understood that the first energy storage part 41 and the second energy storage part 42 can be electrically connected, such as the battery 40 can be set as a special-shaped battery, the battery 40 includes the first energy storage part 41, and the second energy storage part 42 and the protection plate of the battery 40 are arranged at the same end of the first energy storage part 41. Alternatively, the first energy storage part 41 and the second energy storage part 42 are not electrically connected, the first energy storage part 41 and the second energy storage part 42 are separately connected to the flexible circuit board 20, and the first energy storage part 41 and the second energy storage part 42 are respectively connected to different devices 31.

[0190] Optionally, the orthographic projection of the second energy storage portion 42 on the reference plane 200 does not completely overlap with the orthographic projection of the connecting unit 30 on the reference plane 200 .

[0191] By adopting the above scheme, the connection unit 30 and the second energy storage part 42 can have an overlapping portion in the first direction, that is, the overall thickness of the connection unit 30 and the second energy storage part 42 in the first direction is less than the sum of the thickness of the connection unit 30 in the first direction and the thickness of the second energy storage part 42 in the first direction, thereby reducing the space occupied by the connection unit 30 and the second energy storage part 42 in the first direction.

[0192] Among them, the orthographic projection of the second energy storage part 42 on the reference plane 200 does not completely overlap with the orthographic projection of the connecting unit 30 on the reference plane 200, that is, the orthographic projection of the second energy storage part 42 on the reference plane 200 does not overlap with the orthographic projection of the connecting unit 30 on the reference plane 200; or, the orthographic projection of the second energy storage part 42 on the reference plane 200 partially overlaps with the orthographic projection of the connecting unit 30 on the reference plane 200, and the other parts do not overlap.

[0193] Specifically, the orthographic projection of the second energy storage portion 42 on the reference plane 200 does not overlap with the orthographic projection of the connecting unit 30 on the reference plane 200 .

[0194] Optionally, the orthographic projection of the second energy storage portion 42 on the reference plane 200 does not completely overlap with the orthographic projection of the second connecting portion 22 on the reference plane 200 .

[0195] By adopting the above scheme, the second connecting portion 22 and the second energy storage portion 42 can have an overlapping portion in the first direction, that is, the overall thickness of the second connecting portion 22 and the second energy storage portion 42 in the first direction can be less than the sum of the thickness of the second connecting portion 22 in the first direction and the thickness of the second energy storage portion 42 in the first direction, thereby reducing the space occupied by the second connecting portion 22 and the second energy storage portion 42 in the first direction.

[0196] Among them, the orthographic projection of the second energy storage part 42 on the reference plane 200 does not completely overlap with the orthographic projection of the second connecting part 22 on the reference plane 200, that is, the orthographic projection of the second energy storage part 42 on the reference plane 200 does not overlap with the orthographic projection of the second connecting part 22 on the reference plane 200; or, the orthographic projection of the second energy storage part 42 on the reference plane 200 partially overlaps with the orthographic projection of the second connecting part 22 on the reference plane 200, and the other parts do not overlap.

[0197] Specifically, the orthographic projection of the second energy storage portion 42 on the reference plane 200 does not overlap with the orthographic projection of the second connecting portion 22 on the reference plane 200 .

[0198] Please refer to Fig.15 , Fig.15 A schematic diagram of an electronic device provided in accordance with the fifth embodiment of the present application.

[0199] Different from the third embodiment, in the fifth embodiment, a functional element 300 is disposed in the accommodating cavity 101 , and in the first direction, at least a portion of the functional element 300 is located between two connecting units 30 .

[0200] By adopting the above solution, the released internal space of the accommodating cavity 101 can be used to add layout functional elements 300 .

[0201] Specifically, all the functional elements 300 are located between two connecting units 30; or, some of the functional elements 300 are located between two connecting units 30, and some of the functional elements 300 overlap with one of the connecting units 30 in the first direction, in which case the size of one of the connecting units 30 can be set smaller; or, some of the functional elements 300 are located between two connecting units 30, and some of the functional elements 300 overlap with one of the connecting units 30 in the first direction, and some of the functional elements 300 overlap with the other connecting unit 30 in the first direction, in which case the sizes of both connecting units 30 can be set smaller.

[0202] For example, the functional element 300 may include a motor, a speaker, etc. The functional element 300 may be connected to the connection unit 30 , or the functional element 300 may be connected to the housing assembly 10 .

[0203] Optionally, the orthographic projection of the functional element 300 on the reference plane 200 does not overlap with the orthographic projection of the second connection portion 22 on the reference plane 200. This arrangement can reduce the space occupied by the functional element 300 and the second connection portion 22 in the first direction.

[0204] Please refer to Figure 4 and Figure 5 In a second aspect, an embodiment of the present application provides an electronic device 100, and the electronic device 100 includes a connection structure as in the first aspect.

[0205] The electronic device 100 provided in the embodiment of the present application, since the flexible circuit board 20 includes a first connection part 21 and a second connection part 22 connected to each other, the end of the second connection part 22 away from the first connection part 21 is bent and extended in the first direction, and the two connection units 30 are arranged in sequence along the first direction, and the connection unit 30 includes at least two devices 31, so compared with the related art that requires additional connection parts to electrically connect the devices 31 on the two connection units 30, the connection structure provided in the embodiment of the present application can directly connect the devices 31 on the two connection units 30 through the first part and the second part of the flexible circuit board 20, without the need for additional connection parts, thereby reducing the space occupied by the connection unit 30 of the integrated chip and the connection part of the flexible circuit board 20, and also reducing the production cost. The electronic device 100 provided in the embodiment of the present application is convenient for arranging the device 31 in the accommodating cavity 101 or further reducing the size of the electronic device 100.

[0206] At the same time, compared with the related art in which the connection unit 30 and the battery 40 are arranged sequentially along the first direction, for example, the battery 40 is arranged above the connection unit 30, in the connection structure provided in the embodiment of the present application, since the first connection portion 21 and the battery 40 are arranged sequentially in the first direction, and the orthographic projection of the connection unit 30 on the reference plane 200 perpendicular to the first direction does not completely coincide with the orthographic projection of the battery 40 on the reference plane 200, the overall thickness of the connection unit 30 and the battery 40 in the first direction can be made smaller than the sum of the thickness of the connection unit 30 in the first direction and the thickness of the battery 40 in the first direction, thereby reducing the space occupied by the connection unit 30 and the battery 40 in the first direction.

[0207] It can be understood that the electronic device 100 provided in the embodiment of the present application can be a watch, a bracelet, smart glasses, headphones, etc.

[0208] The above are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be covered by the protection scope of the present application.

Claims

1. A connection structure, characterized in that: The connection structure comprises: A housing assembly, wherein the housing assembly is provided with an accommodating cavity; A flexible circuit board is arranged in the accommodating cavity, wherein the flexible circuit board comprises a first connecting portion and a second connecting portion connected to each other, wherein an end of the second connecting portion away from the first connecting portion is bent and extends toward a first direction; Two connecting units are sequentially arranged along the first direction, the connecting units include at least two devices, one of the connecting units is connected to the first connecting portion, the other connecting unit is connected to the second connecting portion, and the devices are electrically connected to the flexible circuit board; A battery, wherein the battery is electrically connected to the flexible circuit board, the first connecting portion and the battery are arranged in sequence in the first direction, and the orthographic projection of the connecting unit on a reference plane perpendicular to the first direction does not completely overlap with the orthographic projection of the battery on the reference plane.

2. The connection structure according to claim 1, characterized in that: At least one of the two connection units is configured as an integrated chip.

3. The connection structure according to claim 2, characterized in that: One of the connection units is configured as an integrated chip, and the other connection unit includes a mainboard, the device is connected to the mainboard and is electrically conductive, and the second connection portion is connected to the mainboard and is electrically conductive.

4. The connection structure according to claim 3, characterized in that: The connection portion between the second connection portion and the mainboard is located on a side of the mainboard close to the integrated chip.

5. The connection structure according to claim 4, characterized in that: At least part of the devices are arranged on a side of the mainboard close to the integrated chip.

6. The connection structure according to claim 5, characterized in that: The orthographic projection of the device disposed on a side of the mainboard close to the integrated chip on the reference plane does not overlap with the orthographic projection of the second connecting portion on a plane perpendicular to the first direction.

7. The connection structure according to claim 5, characterized in that: Some of the devices are arranged on a side of the mainboard close to the integrated chip, and the rest of the devices are arranged on a side of the mainboard far from the integrated chip.

8. The connection structure according to claim 2, characterized in that: The integrated chip is a SIP integrated chip.

9. The connection structure according to claim 2, characterized in that: The flexible circuit board is provided with a connecting pad, and the integrated chip is welded to the connecting pad.

10. The connection structure according to claim 2, characterized in that: The connection structure includes a charging component disposed in the accommodating cavity, the charging component and the first connecting portion are disposed in sequence, and the charging component is connected to the first connecting portion and is electrically conductive.

11. The connection structure according to claim 10, characterized in that: The connection unit close to the charging component is configured as an integrated chip, and the device in the integrated chip includes a charging circuit.

12. The connection structure according to claim 1, characterized in that: The connection structure includes a connection piece, the connection piece is connected to the housing assembly, and the connection piece is used to fix the position of the connection unit in the accommodating cavity.

13. The connection structure according to claim 1, characterized in that: The orthographic projection of the second connecting portion on the reference plane does not completely overlap with the orthographic projection of the battery on the reference plane.

14. The connection structure according to claim 13, characterized in that: The orthographic projection of the connecting unit on a plane perpendicular to the first direction does not coincide with the orthographic projection of the battery on a plane perpendicular to the first direction, and the orthographic projection of the second connecting portion on a plane perpendicular to the first direction does not coincide with the orthographic projection of the battery on a plane perpendicular to the first direction.

15. The connection structure according to claim 1, characterized in that: The battery comprises a first energy storage part and a second energy storage part which are sequentially arranged and connected along a second direction, the second direction is perpendicular to the first direction, and in the first direction, the second energy storage part is located between the two connecting units.

16. The connection structure according to claim 15, characterized in that: The orthographic projection of the second energy storage portion on the reference plane does not completely overlap with the orthographic projection of the connection unit on the reference plane.

17. The connection structure according to claim 16, characterized in that: The orthographic projection of the second energy storage portion on the reference plane does not completely overlap with the orthographic projection of the second connecting portion on the reference plane.

18. The connection structure according to claim 1, characterized in that: Functional elements are arranged in the accommodating cavity, and in the first direction, at least part of the functional elements are located between the two connecting units.

19. The connection structure according to claim 18, characterized in that: The orthographic projection of the functional element on the reference plane does not overlap with the orthographic projection of the second connecting portion on the reference plane.

20. The connection structure according to any one of claims 1 to 19, characterized in that: The device includes an EMMC memory chip, a wireless charging RX, an ECG measurement circuit module, an AFE circuit module, an LDO, a BTB connector, an RFIC, an AP, a Modem, a GPS module, a BT module, an RFFE, a PA, an MCU subsystem or an NFC module.

21. The connection structure according to any one of claims 1 to 19, characterized in that: The shell assembly includes a display screen, a first shell and a second shell. The first shell is provided with a through hole. The display screen and the second shell are respectively covered at the openings at both ends of the through hole to enclose the accommodating cavity together with the first shell.

22. An electronic device, characterized in that: The electronic device comprises the connection structure according to any one of claims 1 to 21.

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