Vapor chamber

Abstract

The utility model provides a vapor chamber which comprises a bottom plate, the bottom plate comprises a protruding part, and the protruding part can be used for making contact with electronic equipment; a groove is formed in the side, away from the electronic equipment, of the protruding part, a plurality of heat dissipation blocks protruding out of the surface of the groove are arranged in the groove, each heat dissipation block is provided with a powder column with a capillary structure, and the end, away from the heat dissipation block, of each powder column is used for abutting against a cover plate of the vapor chamber; the heat dissipation block comprises a base body part and a first capillary layer arranged on the surface of the base body part. According to the vapor chamber, the multiple protruding heat dissipation blocks are arranged in the groove of the bottom plate, the surface area of the relatively flat groove surface is larger, the groove surface can make better contact with a heat dissipation medium, and therefore the heat dissipation efficiency of the vapor chamber is improved; besides, each heat dissipation block is provided with a powder column with a capillary structure, one end of each powder column abuts against the cover plate, the other end of each powder column is connected with the first capillary layer of the corresponding heat dissipation block, heat dissipation media can efficiently flow back into the grooves, meanwhile, the heat resistance of the vapor chamber is basically not increased, and the vapor chamber can stably and efficiently operate.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices, and in particular to a heat spreader. Background Art

[0002] As electronic products continue to develop towards miniaturization and high performance, electronic chips are becoming smaller and smaller, but their performance is getting higher and higher. This means that more heat needs to be processed in a smaller space. In order to meet this challenge, the heat spreader used to dissipate heat for electronic products needs to have a higher heat flux density and power handling capacity to ensure that the electronic chip can perform stably in a small space.

[0003] In the process of implementing this application, the inventors found that there are at least the following problems in the prior art:

[0004] Existing solutions mostly increase the amount of liquid injected into the vapor chamber to keep the evaporation surface moist and working normally. This solution will cause the interior of the vapor chamber to be oversaturated with liquid, and the heat dissipation medium will float on the surface of the internal capillary structure. This will cause the steam channel to be blocked and increase thermal resistance. In addition, the vapor chamber is prone to swelling and deformation in extreme high and low temperature environments, reducing the working stability of the vapor chamber. Summary of the invention

[0005] Based on this, the present application provides a vapor chamber to improve the technical problems of large thermal resistance and poor working stability of the vapor chamber in the prior art.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] The present application provides a heat spreader, comprising a bottom plate, the bottom plate comprising a raised portion, the raised portion being used to contact an electronic device to be cooled; the raised portion forming a groove on a side away from the electronic device, the groove being provided with a plurality of heat dissipation blocks protruding from the surface of the groove, each of the heat dissipation blocks being provided with a powder column having a capillary structure, the end of the powder column away from the heat dissipation block being used to abut against a cover plate of the heat spreader; the heat dissipation block comprising a base portion and a first capillary layer provided on the surface of the base portion.

[0008] In a possible design, the base portion of the heat dissipation block is a metal block, and the powder column is formed by sintering copper powder.

[0009] In a possible design, the heat dissipation blocks are evenly distributed in a matrix on the surface of the groove, and the base of the heat dissipation blocks is made of copper blocks.

[0010] In a possible design, the capillary force of the first capillary layer is greater than the capillary force of the powder column.

[0011] In a possible design, a plurality of first support columns are provided in the groove on the periphery of the heat dissipation block, the first support columns are used to support the cover plate, and the area enclosed by the heat dissipation block matches the heating area of ​​the electronic device.

[0012] In a possible design, a plurality of second support columns are evenly distributed on the surface of the bottom plate on one side close to the cover plate except for the groove.

[0013] In a possible design, the heat spreader further includes a cover plate, which is disposed on a side of the base plate away from the electronic device and is used to form a storage space for the heat dissipation medium together with the base plate.

[0014] In a possible design, a second capillary layer is provided at a position corresponding to the cover plate and the groove, and the capillary force of the second capillary layer is smaller than the capillary force of the first capillary layer.

[0015] In a possible design, more than two powder columns are respectively provided on the heat dissipation block.

[0016] In one possible design, the shape of the heat sink includes a cylinder or a prism, and the heat sink includes two parallel end faces, one of which is fixedly connected to the groove surface, and the other end face is connected to the powder column, and the side surface of the heat sink is used to increase the heat dissipation area of ​​the protrusion.

[0017] Compared with the prior art, this application has at least the following beneficial effects:

[0018] The heat spreader provided by the present application is provided with a number of protruding heat sinks in the groove of the base plate. The heat sink has a larger surface area relative to the flat groove surface, and can better contact with the heat dissipation medium, thereby improving the heat dissipation efficiency of the heat spreader. In addition, a powder column is provided on each heat dissipation block, and the powder column has a capillary structure, and one end of the powder column abuts against the cover plate, and the other end is connected to the first capillary layer of the heat dissipation block, so that the heat dissipation medium can efficiently flow back to the groove of the base plate, and at the same time, the thermal resistance of the heat spreader is basically not increased, so that the heat spreader can operate stably and efficiently. In summary, the heat spreader provided by the present application can improve the technical problems of large thermal resistance and poor working stability of the heat spreader in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the main structure of the base plate of an embodiment of the present application.

[0020] Figure 2 for Figure 1 AA section structure schematic diagram of the base plate.

[0021] Figure 3 for Figure 1A schematic diagram of the main structure of the groove of the base plate and its internal components.

[0022] The meanings of the symbols in the accompanying drawings are as follows:

[0023] 1. Flange; 2. First support column; 3. Groove; 4. Second support column; 5. Powder column; 6. Heat sink; 7. Protrusion. DETAILED DESCRIPTION

[0024] The technical solution of the present application is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the implementation of this application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating positions or positional relationships, are based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] like Figure 1 As shown, the heat spreader provided in the embodiment of the present application includes a base plate and a cover plate (not shown) disposed on the base plate. A flange 1 is disposed at the peripheral edge of the base plate on the side facing the cover plate, and the flange 1 and the surface of the base plate form a box-like structure. After the cover plate is covered on the base plate, a storage space for accommodating the heat dissipation medium is formed together.

[0029] like Figure 1 and Figure 2As shown, the bottom plate includes a protrusion 7, and the protrusion 7 can be used to contact with the electronic device to be cooled, such as direct contact. The direct contact between the protrusion 7 and the electronic device can shorten the heat transfer path, reduce thermal resistance, and improve the heat transfer effect; the protrusion 7 forms a groove 3 on the side away from the electronic device, and a plurality of heat dissipation blocks 6 protruding from the surface of the groove 3 are arranged in the groove 3, and each of the heat dissipation blocks 6 is respectively provided with a powder column 5 with a capillary structure, and the end of the powder column 5 away from the heat dissipation block 6 is used to abut against the cover plate of the heat spreader; the heat dissipation block 6 includes a base portion (not shown) and a first capillary layer (not shown) arranged on the surface of the base portion.

[0030] like Figure 3 As shown, specifically, in this embodiment, the middle area of ​​the groove 3 is evenly distributed with heat sink blocks 6, and the heat sink blocks 6 are distributed in a matrix shape on the surface of the groove 3. For example, the heat sink blocks 6 can be scattered in the middle of the surface of the groove 3, and no heat sink blocks 6 are set around the edges of the groove 3; or, the heat sink blocks 6 can be scattered in the center of the length direction of the surface of the groove 3, and no heat sink blocks 6 are set at the two ends of the length direction of the groove 3; or, the heat sink blocks 6 can be scattered in the center of the width direction of the surface of the groove 3, and no heat sink blocks 6 are set at the two ends of the length direction of the groove 3. Specifically, the shape and area of ​​the area surrounded by the heat sink blocks 6 need to match the heating area of ​​the electronic device, that is, the shape of the area surrounded by the heat sink blocks 6 is consistent with the surface shape of the heating element of the electronic device, and the area is not less than the surface area of ​​the heating element, so as to better cool down the electronic device.

[0031] The base structure of the heat sink block 6 of this embodiment is a metal block, such as a copper block, and a first capillary layer is also provided on the surface of the base, which can be formed by sintering copper powder, for example. The first capillary layer can only cover the surface of the base of the heat sink block 6, or cover the base and the surface of the groove 3 together, so as to disperse the heat flux density. The shape of the heat sink block 6 is not limited, as long as it has two parallel end faces, that is, the heat sink block 6 has two parallel end faces (upper end face and lower end face, or bottom end face and top end face), for example, it can be a cylinder or a prism. For example, in this embodiment, the heat sink block 6 is a rectangular parallelepiped, and the length, width and height of the rectangular parallelepiped can be adjusted according to the heat dissipation power to adjust the corresponding evaporation area to ensure that the heat source is not dry-burned and is the optimal design size. One of the end faces of the heat sink block 6 is fixedly connected to the surface of the groove 3, and the other end face is connected to the powder column 5. The side surface of the heat sink block 6 can increase the evaporation area of ​​the heat source area, thereby achieving efficient heat dissipation.

[0032] The powder column 5 of this embodiment is a slender cylinder formed by sintering copper powder. In other embodiments, the powder column 5 may also be other capillary structures, which is not specifically limited.

[0033] The heat sink 6 can be fixed on the surface of the groove 3 by diffusion welding or other welding methods, and the powder column 5 can be sintered and fixed on the surface of the heat sink 6 close to the cover plate by a sintering fixture.

[0034] A second capillary layer (not shown) is provided at the corresponding position of the cover plate and the groove 3. The second capillary layer can also be a capillary structure formed by sintering copper powder, for example. One end of the powder column 5 is connected to the first capillary layer of the heat sink 6, and the other end is connected to the second capillary layer of the cover plate, which is very conducive to the reflux of the heat dissipation medium condensed on the cover plate. In order to further enhance the heat dissipation function and reflux capacity of the heat spreader, the first capillary layer, the second capillary layer and the powder column 5 can also be designed into different capillary structures respectively. For example, the first capillary layer can be set to have a larger capillary force structure, so that the capillary force of the second capillary layer and the powder column 5 is smaller than the capillary force of the first capillary layer, so that the heat dissipation medium will easily flow from the end with weak capillary force to the end with strong capillary force, so that the condensate on the cover plate directly flows back into the groove 3, and the heat sink 6 can adjust the arrangement density as needed to ensure efficient liquid return function.

[0035] like Figure 1 and Figure 3 As shown, in order to improve the overall strength of the heat spreader and prevent the heat spreader from deforming and affecting its working stability, a number of first support columns 2 can be set around or at both ends of the surface of the groove 3, that is, the area where the heat sink 6 is not scattered. The first support columns 2 abut against the inner surface of the cover plate to form a supporting force on the cover plate. Second support columns 4 can also be set on the surface of the bottom plate close to the cover plate. The second support columns 4 are evenly distributed on the surface of the bottom plate and are set away from the groove 3.

[0036] In some applications, a powder column 5 can be set on each heat sink 6, or two, three or more powder columns 5 can be set in parallel to obtain more liquid return and prevent dry burning at the heat source. The specific number is not limited and can be selected according to actual needs.

[0037] The working principle of the heat spreader of this embodiment is as follows: after the electronic equipment is powered on, the heat source generates heat, and the heat dissipation medium on the surface of the heat dissipation block 6 evaporates and gasifies to form steam. Due to the pressure difference inside the heat spreader, the steam will move toward the cover plate. The steam reaching the surface of the cover plate condenses to form liquid when it is cold and releases heat. The powder column 5 is a capillary structure formed by sintering metal powder. This structure guides the condensed liquid back to the evaporation surface (groove 3 and the surface of the heat dissipation block 6) through capillary action, thereby realizing the circulation of the heat dissipation medium. In this cycle, the heat dissipation block 6 plays a role in expanding the evaporation area and dispersing the heat flow. The powder columns 5 are distributed on the corresponding heat dissipation blocks 6, thereby playing a role in efficient liquid return.

[0038] The heat spreader provided in the embodiment of the present application does not change the appearance and structure of the original heat spreader product. It only welds the heat sink block to the bottom plate by diffusion welding on the groove surface of the bottom plate, which does not affect the uniformity of the product appearance and has good ability to resist extreme environments. It increases the evaporation area of ​​the heat source area by adding the heat sink block, and improves the liquid return capacity of the heat spreader by setting powder columns on the heat sink block, thereby increasing the maximum heat transfer of the heat spreader.

[0039] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0040] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat sink, characterized in that: The invention comprises a bottom plate, wherein the bottom plate comprises a raised portion, wherein the raised portion can be used to contact an electronic device to be cooled; the raised portion forms a groove on a side away from the electronic device, wherein a plurality of heat dissipation blocks protruding from the surface of the groove are arranged in the groove, wherein each heat dissipation block is respectively provided with a powder column having a capillary structure, wherein one end of the powder column away from the heat dissipation block is used to abut against the cover plate of the heat spreader; the heat dissipation block comprises a base portion and a first capillary layer arranged on the surface of the base portion.

2. The heat spreader according to claim 1, wherein: The base of the heat dissipation block is a metal block, and the powder column is formed by sintering copper powder.

3. The heat spreader according to claim 1, wherein: The heat dissipation blocks are evenly distributed in a matrix on the surface of the groove, and the base of the heat dissipation blocks is made of copper blocks.

4. The heat sink according to claim 1, wherein: The capillary force of the first capillary layer is greater than the capillary force of the powder column.

5. The vapor chamber according to claim 1, wherein: A plurality of first support columns are arranged in the groove on the periphery of the heat dissipation block, and the first support columns are used to support the cover plate. The area enclosed by the heat dissipation block matches the heating area of ​​the electronic device.

6. The vapor chamber according to claim 1, wherein: A plurality of second support columns are evenly distributed in other areas of the surface of the bottom plate close to the cover plate except the groove.

7. The vapor chamber according to claim 1, wherein: It also includes a cover plate, which is arranged on a side of the base plate away from the electronic device and is used to form a storage space for the heat dissipation medium together with the base plate.

8. The vapor chamber according to claim 7, wherein: A second capillary layer is provided at a position corresponding to the cover plate and the groove, and the capillary force of the second capillary layer is smaller than the capillary force of the first capillary layer.

9. The vapor chamber according to claim 1, wherein: More than two powder columns are respectively arranged on the heat dissipation blocks.

10. The vapor chamber according to claim 1, wherein: The heat dissipation block comprises two parallel end surfaces, one of which is fixedly connected to the groove surface, and the other end surface is connected to the powder column. The side surface of the heat dissipation block is used to increase the heat dissipation area of ​​the protrusion.

Images