Novel 3D hemispherical high-thermal-conductivity metal substrate

Abstract

The utility model relates to a novel 3D hemispherical high-thermal-conductivity metal substrate, which belongs to the technical field of high-thermal-conductivity metal substrates and comprises a metal substrate, a composite component is arranged in the metal substrate, and a metal layer is arranged on the lower end face of the composite component. An annular groove is formed in the edge of the lower end face of the metal layer, reinforcing ribs are fixedly connected to the interior of the annular groove, a first mounting frame is arranged at the position, close to the center, of the lower end face of the metal layer, a second mounting frame is arranged on the outer ring of the first mounting frame, and the metal substrate is of a 3D hemispherical structure. The beneficial effects of the utility model are that the metal substrate is arranged to be a 3D hemispherical structure, so that the contact area between the metal substrate and air can be increased, heat exchange can be more effectively carried out, and the hemispherical structure has better stability in mechanics and can bear forces from all directions, so that the heat exchange efficiency is improved. The 3D hemispherical high-thermal-conductivity metal substrate has higher structural strength.

Description

Technical Field

[0001] The utility model relates to the technical field of high thermal conductivity metal substrates, in particular to a novel 3D hemispherical high thermal conductivity metal substrate. Background Art

[0002] With the rapid development of modern electronic technology, the integration and performance of electronic equipment are constantly improving, which also brings higher heat generation and heat dissipation requirements. Especially in the fields of LED lights, high-frequency circuits, high-power electronic equipment, etc., higher requirements are placed on the thermal conductivity and structural strength of metal substrates.

[0003] Traditional metal substrates usually adopt a planar structure, and their heat dissipation performance and structural strength have gradually failed to meet the needs of modern electronic devices. In response to the above situation, we have launched a new type of 3D hemispherical high thermal conductivity metal substrate. Utility Model Content

[0004] The purpose of the utility model is to provide a novel 3D hemispherical high thermal conductivity metal substrate to solve the problem of inconvenience in controlling the position of the laser body in the above background technology.

[0005] The technical solution of the utility model is:

[0006] A metal substrate, wherein a composite component is disposed inside the metal substrate, and a metal layer is disposed on the lower end surface of the composite component;

[0007] An annular groove is provided at the edge of the lower end surface of the metal layer, and a reinforcing rib is fixedly connected inside the annular groove. A first mounting frame is provided near the center of the lower end surface of the metal layer, and a second mounting frame is provided on the outer ring of the first mounting frame. The metal substrate is provided as a 3D hemispherical structure.

[0008] Furthermore, the composite component includes a first insulating layer, a heat-conducting layer, an anti-corrosion layer and a second insulating layer, the first insulating layer is located on the upper end surface of the metal layer, the upper end of the first insulating layer is fixedly provided with a heat-conducting layer, the upper end surface of the heat-conducting layer is provided with an anti-corrosion layer, and the upper end surface of the anti-corrosion layer is provided with a second insulating layer.

[0009] The rubber cover makes it easy to hold and provides sufficient comfort, thereby improving stability when held in hand, and the user can choose to use different grips according to different operating requirements or personal habits to achieve better operating effects.

[0010] Furthermore, the reinforcing ribs are in a triangular block structure.

[0011] The reinforcing ribs are designed in a triangular block structure, which significantly enhances the structural strength of the ring groove, enables it to withstand greater external pressure and torque, and effectively prevents the ring groove from deforming when subjected to external forces, thereby improving the structural strength of the metal base plate.

[0012] The utility model provides a new type of 3D hemispherical high thermal conductivity metal substrate through improvement, which has the following improvements and advantages compared with the prior art:

[0013] First: The utility model, by setting the metal substrate as a 3D hemispherical structure, can increase the contact area between the metal substrate and the air, thereby more effectively exchanging heat, and the hemispherical structure has good mechanical stability and can withstand forces from all directions. The 3D hemispherical high thermal conductivity metal substrate has higher structural strength.

[0014] Secondly: The utility model, when using high thermal conductivity materials such as copper or aluminum for the metal layer at the bottom of the metal substrate, can effectively conduct the heat on the substrate to the external environment, thereby improving the heat dissipation performance of the entire component, and the opened annular groove increases the contact area between the metal substrate and the equipment, which is beneficial to the dissipation of heat and reduces the weight of the entire substrate. Finally, reinforcing ribs with a triangular structure are evenly fixed on the inner wall of the annular groove, which significantly enhances the structural strength of the annular groove, enables it to withstand greater external pressure and torque, and effectively prevents the annular groove from being deformed when subjected to external force, thereby improving the structural strength of the metal substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further explained below in conjunction with the accompanying drawings and embodiments:

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the lower end surface structure of the metal layer of the utility model;

[0018] Figure 3 It is a schematic diagram of the structure of the composite assembly of the utility model.

[0019] Explanation of the accompanying drawings: 1. Metal substrate; 2. Composite component; 201. First insulating layer; 202. Heat conductive layer; 203. Anti-corrosion layer; 204. Second insulating layer; 3. Metal layer; 4. Ring groove; 401. Reinforcing rib; 5. First mounting bracket; 501. Second mounting bracket; 502. First welding plate; 503. Second welding plate; 504. Filling hole. DETAILED DESCRIPTION

[0020] The following will be combined with the attached Figures 1 to 3The utility model is described in detail, and the technical solutions in the embodiments of the utility model are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] The utility model provides a novel 3D hemispherical high thermal conductivity metal substrate through improvement, such as Figure 1-Figure 3 As shown, it comprises a metal substrate 1, a composite component 2 is arranged inside the metal substrate 1, and a metal layer 3 is arranged on the lower end surface of the composite component 2;

[0022] An annular groove 4 is provided at the edge of the lower end surface of the metal layer 3, and a reinforcing rib 401 is fixedly connected inside the annular groove 4. A first mounting frame 5 is provided near the center of the lower end surface of the metal layer 3, and a second mounting frame 501 is provided on the outer ring of the first mounting frame 5. The metal substrate 1 is arranged as a 3D hemispherical structure.

[0023] In this embodiment: by setting the metal substrate 1 as a 3D hemispherical structure, the contact area between the metal substrate 1 and the air can be increased, so that heat exchange can be more effectively performed, and the hemispherical structure has good mechanical stability and can withstand forces from all directions. The 3D hemispherical high thermal conductivity metal substrate 1 has higher structural strength. Then, when the metal layer 3 at the bottom of the metal substrate 1 uses high thermal conductivity materials such as copper or aluminum, the heat on the substrate can be effectively conducted to the external environment, thereby improving the heat dissipation performance of the entire component, and the opened annular groove 4 increases the contact area between the metal substrate 1 and the equipment, which is beneficial to the dissipation of heat and reduces the weight of the entire substrate. Finally, reinforcing ribs 401 with a triangular structure are evenly fixed on the inner wall of the annular groove 4, which significantly enhances the structural strength of the annular groove 4, enables it to withstand greater external pressure and torque, and effectively prevents the annular groove 4 from being deformed when subjected to external force, thereby improving the structural strength of the metal substrate 1.

[0024] In a preferred embodiment, the composite component 2 includes a first insulating layer 201, a heat-conducting layer 202, an anti-corrosion layer 203 and a second insulating layer 204. The first insulating layer 201 is located on the upper end surface of the metal layer 3. The upper end of the first insulating layer 201 is fixedly provided with a heat-conducting layer 202, the upper end surface of the heat-conducting layer 202 is provided with an anti-corrosion layer 203, and the upper end surface of the anti-corrosion layer 203 is provided with a second insulating layer 204. The presence of the first insulating layer 201 and the second insulating layer 204 ensures that the metal substrate 1 has good insulation properties. The heat-conducting layer 202 is made of aluminum alloy or copper alloy with good thermal conductivity, so that the metal substrate 1 has excellent thermal conductivity. The heat-conducting layer 202 can quickly conduct heat from the heat source to the heat dissipation area, reduce the operating temperature of the equipment, and improve the stability and reliability of the equipment. The anti-corrosion layer 203 is coated with anti-corrosion paint to enhance the anti-corrosion performance of the metal substrate 1. The specific anti-corrosion layer material may vary depending on application scenarios, design requirements and other factors. It belongs to the prior art and will not be elaborated in detail.

[0025] In a preferred embodiment, the diameter of the second mounting frame 501 is larger than that of the first mounting frame 5, and a first welding plate 502 is provided at the lower end of the second mounting frame 501, and a second welding plate 503 is provided at the lower end of the first welding plate 502 through a support rod, which can provide a wider support area for the metal substrate 1, thereby increasing the stability of the installation, and four groups of welding plates are provided at the lower end of the first mounting frame 5, and six groups of welding plates are provided at the lower end of the second mounting frame 501 to meet the connection requirements of multiple electronic components. The thermal pad is connected to the substrate by welding, crimping, etc. to ensure that heat can be quickly transferred to the substrate, and a filling hole 504 is provided inside the second welding plate 503, and the inner wall is filled with a high thermal conductivity insulating material, which is convenient for the installation of electronic components while ensuring safety and reliability.

[0026] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A new type of 3D hemispherical high thermal conductivity metal substrate, characterized by: It comprises a metal substrate (1), a composite component (2) is arranged inside the metal substrate (1), and a metal layer (3) is arranged on the lower end surface of the composite component (2); An annular groove (4) is provided at the edge of the lower end surface of the metal layer (3), a reinforcing rib (401) is fixedly connected inside the annular groove (4), a first mounting frame (5) is provided near the center of the lower end surface of the metal layer (3), a second mounting frame (501) is provided on the outer ring of the first mounting frame (5), and the metal substrate (1) is configured as a 3D hemispherical structure.

2. According to claim 1, a novel 3D hemispherical high thermal conductivity metal substrate is characterized in that: The composite component (2) comprises a first insulating layer (201), a heat-conducting layer (202), an anti-corrosion layer (203) and a second insulating layer (204); the first insulating layer (201) is located on the upper end surface of the metal layer (3); and the heat-conducting layer (202) is fixedly arranged on the upper end of the first insulating layer (201).

3. The novel 3D hemispherical high thermal conductivity metal substrate according to claim 2 is characterized in that: An anti-corrosion layer (203) is provided on the upper end surface of the heat-conducting layer (202), and a second insulating layer (204) is provided on the upper end surface of the anti-corrosion layer (203).

4. The novel 3D hemispherical high thermal conductivity metal substrate according to claim 1, characterized in that: The reinforcing rib (401) is in a triangular block structure.

5. The novel 3D hemispherical high thermal conductivity metal substrate according to claim 1, characterized in that: The diameter of the second mounting frame (501) is larger than that of the first mounting frame (5).

6. The novel 3D hemispherical high thermal conductivity metal substrate according to claim 1, characterized in that: A first welding plate (502) is arranged at the lower end of the second mounting frame (501), and a second welding plate (503) is arranged at the lower end of the first welding plate (502) via a support rod.

7. The novel 3D hemispherical high thermal conductivity metal substrate according to claim 6, characterized in that: A filling hole (504) is provided inside the second welding plate (503).

Images