Semiconductor wafer cutting device with high cutting efficiency

Abstract

The utility model discloses a semiconductor wafer cutting device with high cutting efficiency, and relates to the technical field of semiconductor wafer cutting, the semiconductor wafer cutting device with high cutting efficiency comprises a cutting table, the surface of the cutting table is fixedly connected with a support frame, the inner wall of the support frame is fixedly connected with a telescopic rod, and the telescopic rod is fixedly connected with the cutting table. A blanking hole penetrating through the surface of the cutting table is formed in the surface of the cutting table, two U-shaped frames are fixedly connected to the surface of the cutting table, a limiting plate is slidably connected to the inner walls of the two U-shaped frames, through holes arranged at equal intervals are formed in the surface of the limiting plate, and a fan-shaped bearing block is arranged above the cutting table; and supporting cylinders which are arranged at equal intervals are arranged on the surface of the bearing block. According to the semiconductor wafer cutting device with the high cutting efficiency, when a wafer rod is cut, the two ends of the wafer rod are supported, and the situations that the wafer rod is broken and the edge of the wafer rod is damaged due to uneven stress when the wafer rod is cut are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer cutting, in particular to a semiconductor wafer cutting device with high cutting efficiency. Background Art

[0002] After being cut, rolled, sliced, chamfered, polished, laser engraved and packaged, the silicon crystal rod becomes the basic raw material for the integrated circuit factory - silicon wafer, which is the "wafer".

[0003] Patent number: CN 212072481 U, discloses a semiconductor wafer cutting device with high cutting efficiency, which uses a motor to drive a spiral rod to rotate, and fixes the length of the wafer rod by moving a baffle, and then cuts the wafer rod to make the wafer cutting more precise, and the cutting thickness of the wafer is more accurate, thereby improving the production efficiency of the wafer and reducing the production cost of the wafer.

[0004] However, during the implementation of this solution, only one end of the wafer rod is clamped and fixed, while the other end of the wafer rod lacks support, which results in uneven force on both ends of the wafer rod when the device cuts the wafer rod and the cutting knife cuts the wafer rod, which can easily cause the wafer rod to warp up, thereby causing the wafer rod to break, and the edge of the wafer rod collides with the pressure plate, causing the edge of the wafer rod to wear. Therefore, a semiconductor wafer cutting device with high cutting efficiency is proposed. Utility Model Content

[0005] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and to provide a semiconductor wafer cutting device with high cutting efficiency, which can solve the problems of the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor wafer cutting device with high cutting efficiency, comprising a cutting table, the surface of the cutting table is fixedly connected to a support frame, the inner wall of the support frame is fixedly connected to a telescopic rod, the output end of the telescopic rod is fixedly connected to a cutting blade, the surface of the cutting table is provided with a blanking hole that passes through the surface of the cutting table, the surface of the cutting table is fixedly connected to two U-shaped frames, the inner walls of the two U-shaped frames are slidably connected to limiting plates, the surface of the limiting plates is provided with through holes arranged at equal distances, a fan-shaped carrying block is arranged above the cutting table, the surface of the carrying block is provided with supporting tubes arranged at equal distances, and the supporting tubes and the through holes correspond to each other.

[0007] Preferably, the surface of the cutting table is slidably connected to two moving blocks, both ends of the supporting block are fixedly connected to fixed shafts, the surface of the fixed shaft is rotatably connected to the inside of the moving block, the surface of the fixed shaft is movably sleeved with a torsion spring, and both ends of the torsion spring are respectively fixedly connected to the inside of the moving block and the surface of the fixed shaft.

[0008] Preferably, two fixed plates are fixedly connected on both sides of the cutting table surface, a guide rod is arranged between the two fixed plates on one side, the guide rod passes through the surface of one moving block and is slidably connected to the inside of the moving block, a threaded rod is rotatably connected between the two fixed plates on the other side, the threaded rod passes through the surface of another moving block and is threadedly connected to the inside of the moving block, a motor is fixedly connected to the surface of the cutting table, and the output end of the motor is fixedly connected to one end of the threaded rod.

[0009] Preferably, the surface of the cutting table is slidably connected to a T-shaped plate that passes through the surface of the cutting table, the surface of the T-shaped plate is fixedly connected to push rods that are equidistantly arranged, the push rods and the through holes correspond to each other, the bottom of the cutting table is fixedly connected to an electric push rod, and the output end of the electric push rod is fixedly connected to the surface of the T-shaped plate.

[0010] Preferably, the inner walls of the two U-shaped frames are slidably connected with pads, the pads are located at the bottom of the limiting plate, the bottom of the cutting table is rotatably connected with two adjusting screws, the upper ends of the two adjusting screws are rotatably connected to the bottoms of the two pads respectively, the surface of the support tube is also fixedly connected with an adjusting screw, and the end of the adjusting screw away from the support tube is connected to the internal thread of the supporting block.

[0011] Preferably, both sides of the cutting blade are fixedly connected to an extension plate, the surfaces of the two extension plates are fixedly connected to a sliding rod, the sliding rod is slidably connected to the inside of the cutting table, the surface of the cutting table is rotatably connected to a second gear, the sliding rod is slidably connected to the inner wall of the second gear, the surface of the sliding rod is provided with a first vertical groove and an inclined groove, the upper end of the inclined groove is connected to the upper end of the first vertical groove, the depth of the inclined groove is greater than the depth of the first vertical groove, the surface of the sliding rod is provided with a second vertical groove, the upper end of the second vertical groove is connected to the lower end of the inclined groove, the depth of the second vertical groove gradually becomes shallower from top to bottom, the depth of the upper end of the second vertical groove is the same as the depth of the inclined groove, the depth of the lower end of the second vertical groove is the same as the depth of the first vertical groove, and the surface of the cutting table is provided with an arc groove, the two ends of the arc groove are respectively connected to the lower end of the second vertical groove and the lower end of the first vertical groove.

[0012] Preferably, a fixed sleeve is fixedly connected to the interior of the second gear, and the surface of the fixed sleeve slides with the inner walls of the first vertical groove, the inclined groove, the second vertical groove and the arc groove. The inner wall of the fixed sleeve is slidably connected to a moving rod, and the surface of the moving rod also slides with the inner walls of the first vertical groove, the inclined groove, the second vertical groove and the arc groove. The surface of the moving rod is fixedly connected to a spring, and the end of the spring away from the moving rod is fixedly connected to the inner wall of the fixed sleeve.

[0013] Preferably, the surface of the cutting table is slidably connected to a second rack, the surface of the second rack is meshingly connected to the surface of the second gear, the inside of the second rack is slidably connected to the first rack, the surface of the fixed shaft is fixedly connected to the first gear, the surface of the first gear is meshingly connected to the surface of the first rack, and the surface of the second rack is threadedly connected to a fastening bolt.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] (1) The semiconductor wafer cutting device with high cutting efficiency supports both ends of the wafer rod when cutting the wafer rod, thereby avoiding uneven force on the wafer rod during cutting, which may cause the wafer rod to break, and the edge of the wafer rod to be squeezed by the clamping device, which may cause the edge of the wafer rod to be damaged. This ensures the cutting effect of the wafer and improves the use effect of the device, which is worthy of promotion.

[0016] (2) The semiconductor wafer cutting device with high cutting efficiency can lock the position of the first rack by setting a fastening bolt, thereby preventing the first rack and the second rack from sliding against each other when the device is in use, thereby ensuring the smooth operation of the device.

[0017] (3) The semiconductor wafer cutting device with high cutting efficiency can adjust the height of the cushion block in the U-shaped frame by adjusting the setting of the screw, thereby adjusting the position of the limiting plate in the U-shaped frame, thereby ensuring that the through hole, the push rod and the support tube are in the same straight line. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0019] Figure 1 It is a schematic diagram of the structure of the utility model;

[0020] Figure 2 For this utility model Figure 1 The enlarged schematic diagram at A in the middle;

[0021] Figure 3 For this utility model Figure 1 The enlarged schematic diagram of point B in the middle;

[0022] Figure 4 This is a schematic diagram of the bottom structure of the cutting table of the utility model;

[0023] Figure 5 This is a schematic diagram of the surface structure of the slide bar of the utility model;

[0024] Figure 6 This is a schematic diagram of the internal structure of the second gear of the utility model;

[0025] Figure 7 This is a schematic diagram of the internal structure of the second rack of the utility model.

[0026] 1. Cutting table; 2. Motor; 3. Fixed plate; 4. Threaded rod; 5. Support frame; 6. Telescopic rod; 7. Cutting blade; 8. U-shaped frame; 9. Limiting plate; 10. Through hole; 11. T-shaped plate; 12. Push rod; 13. Blanking hole; 14. Moving block; 15. First gear; 16. Fixed shaft; 17. First rack; 18. Support cylinder; 19. Bearing block; 20. First vertical groove; 21. Extension plate; 22. Inclined groove; 23. Second gear; 24. Second rack; 25. Pad; 26. Second vertical groove; 27. Arc groove; 28. Sliding rod; 29. ​​Moving rod; 30. Spring; 31. Fixed sleeve; 32. Fastening bolt; 33. Adjusting screw; 34. Electric push rod. DETAILED DESCRIPTION

[0027] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0028] See also Figure 1-7 The utility model provides a technical solution: a semiconductor wafer cutting device with high cutting efficiency, comprising a cutting table 1, a support frame 5 is fixedly connected to the surface of the cutting table 1, a telescopic rod 6 is fixedly connected to the inner wall of the support frame 5, a cutting blade 7 is fixedly connected to the output end of the telescopic rod 6 for cutting wafer rods, a blanking hole 13 penetrating the surface of the cutting table 1 is opened on the surface of the cutting table 1, two U-shaped frames 8 are fixedly connected to the surface of the cutting table 1, a limiting plate 9 is slidably connected to the inner walls of the two U-shaped frames 8, a through hole 10 arranged equidistantly is opened on the surface of the limiting plate 9 for placing the wafer rods, a fan-shaped carrying block 19 is arranged above the cutting table 1, and a support cylinder 18 arranged equidistantly is arranged on the surface of the carrying block 19, and the support cylinder 18 corresponds to the through hole 10, so as to be used in conjunction with the through hole 10 to place the wafer rods.

[0029] The surface of the cutting table 1 is slidably connected to two moving blocks 14, and both ends of the carrying block 19 are fixedly connected to a fixed shaft 16. The surface of the fixed shaft 16 is rotatably connected to the inside of the moving block 14, and the surface of the fixed shaft 16 is movably sleeved with a torsion spring. The two ends of the torsion spring are respectively fixedly connected to the inside of the moving block 14 and the surface of the fixed shaft 16, so as to reset the fixed shaft 16.

[0030] Furthermore, two fixed plates 3 are fixedly connected on both sides of the surface of the cutting table 1, and a guide rod is arranged between the two fixed plates 3 on one side, which passes through the surface of a moving block 14 and is slidably connected to the inside of the moving block 14, and a threaded rod 4 is rotatably connected between the two fixed plates 3 on the other side, which passes through the surface of another moving block 14 and is threadedly connected to the inside of the moving block 14, and a motor 2 is fixedly connected to the surface of the cutting table 1, and the output end of the motor 2 is fixedly connected to one end of the threaded rod 4, so that the distance between the supporting block 19 and the limiting plate 9 can be changed, so that the device can cut wafers of different sizes, thereby improving the use effect of the device.

[0031] The surface of the cutting table 1 is slidably connected to a T-shaped plate 11 that passes through the surface of the cutting table 1. The surface of the T-shaped plate 11 is fixedly connected to push rods 12 that are equidistantly arranged. The push rods 12 correspond to the through holes 10 and are used to feed the wafer rod. The bottom of the cutting table 1 is fixedly connected to an electric push rod 34, and the output end of the electric push rod 34 is fixedly connected to the surface of the T-shaped plate 11.

[0032] Furthermore, the inner walls of the two U-shaped frames 8 are slidably connected with pads 25, and the pads 25 are located at the bottom of the limiting plate 9 to support the limiting plate 9. The bottom of the cutting table 1 is rotatably connected to two adjusting screws 33, and the upper ends of the two adjusting screws 33 are rotatably connected to the bottoms of the two pads 25, respectively. Then, by setting the adjusting screws 33, the height of the pads 25 in the U-shaped frame 8 can be adjusted, so that the position of the limiting plate 9 in the U-shaped frame 8 can be adjusted, thereby ensuring that the through hole 10, the push rod 12 and the support tube 18 are in the same straight line.

[0033] The surface of the support tube 18 is also fixedly connected with an adjusting screw 33, and the end of the adjusting screw 33 away from the support tube 18 is connected to the internal thread of the supporting block 19, which makes it convenient for the staff to replace the support tubes 18 of different sizes. At the same time, when processing wafer rods of different sizes, the staff can first insert the limiting plates 9 and through holes 10 of corresponding sizes between the two U-shaped frames 8, and then install the support tube 18 of the corresponding size on the supporting block 19, and then adjust the position of the limiting plate 9 by rotating the adjusting screw 33 at the bottom of the cutting table 1, so that the support tube 18, the through hole 10 and the push rod 12 are located in the same straight line to ensure the normal feeding of the wafer rod.

[0034] Further, both sides of the cutting blade 7 are fixedly connected with extension plates 21, and the surfaces of the two extension plates 21 are fixedly connected with slide bars 28, which are slidably connected to the inside of the cutting table 1, and the surface of the cutting table 1 is rotatably connected with a second gear 23, and the slide bar 28 is slidably connected to the inner wall of the second gear 23, and the surface of the slide bar 28 is provided with a first vertical groove 20 and an inclined groove 22, and the upper end of the inclined groove 22 is connected to the upper end of the first vertical groove 20, and the depth of the inclined groove 22 is greater than the first vertical groove 20. The depth of the groove 20, a second vertical groove 26 is opened on the surface of the slide bar 28, the upper end of the second vertical groove 26 is connected with the lower end of the inclined groove 22, the depth of the second vertical groove 26 gradually becomes shallower from top to bottom, the depth of the upper end of the second vertical groove 26 is the same as the depth of the inclined groove 22, the depth of the lower end of the second vertical groove 26 is the same as the depth of the first vertical groove 20, and an arc groove 27 is opened on the surface of the cutting table 1, and the two ends of the arc groove 27 are respectively connected with the lower end of the second vertical groove 26 and the lower end of the first vertical groove 20.

[0035] A fixing sleeve 31 is fixedly connected to the interior of the second gear 23, and the surface of the fixing sleeve 31 slides with the inner walls of the first vertical groove 20, the inclined groove 22, the second vertical groove 26 and the arc groove 27. A moving rod 29 is slidably connected to the inner wall of the fixing sleeve 31, and the surface of the moving rod 29 also slides with the inner walls of the first vertical groove 20, the inclined groove 22, the second vertical groove 26 and the arc groove 27. A spring 30 is fixedly connected to the surface of the moving rod 29, and one end of the spring 30 away from the moving rod 29 is fixedly connected to the inner wall of the fixing sleeve 31 to reset the moving rod 29. In the initial state of the device, the moving rod 29 and the fixing sleeve 31 are located at the connecting point between the lower end of the first vertical groove 20 and the arc groove 27, and the moving rod 29 is completely retracted into the fixing sleeve 31, and the spring 30 is in a compressed state.

[0036] The surface of the cutting table 1 is slidably connected to the second rack 24, the surface of the second rack 24 is meshed with the surface of the second gear 23, the interior of the second rack 24 is slidably connected to the first rack 17, the surface of the fixed shaft 16 is fixedly connected to the first gear 15, the surface of the first gear 15 is meshed with the surface of the first rack 17, and the surface of the second rack 24 is threadedly connected to the fastening bolt 32, and then by setting the fastening bolt 32, the position of the first rack 17 can be locked, thereby avoiding the first rack 17 and the second rack 24 from sliding against each other when the device is in use, thereby ensuring the smooth operation of the device.

[0037] Specifically, when the wafer rod is cut, the through hole 10 descends and drives the push slide bar 28 to slide in the second gear 23. At this time, the fixed sleeve 31 and the moving rod 29 slide in the first vertical groove 20 and enter the connection between the first vertical groove 20 and the inclined groove 22, so that the moving rod 29 obtains moving space, so that at this time, under the elastic force of the spring 30, the moving rod 29 protrudes from the fixed sleeve 31 and contacts the inner wall of the first vertical groove 20. After the wafer rod is cut, the through hole 10 rises. At this time, since there is a certain step between the inclined groove 22 and the first vertical groove 20, the moving rod 29 is blocked by the step and slides along the trajectory of the inclined groove 22, thereby driving the second gear 23 to rotate, and driving the second rack 24 and the first rack 17 to move, thereby driving the first gear 15 to rotate, and then driving the fixed shaft 16 and the bearing block 19 to flip, so that the cut wafer rod in the support cylinder 18 is dumped. , discharged from the blanking hole 13, and the rotation of the fixed shaft 16 causes the torsion spring to deform, and then with the rise of the sliding rod 28, the moving rod 29 and the fixed sleeve 31 enter the second vertical groove 26, so that the second vertical groove 26 gradually squeezes the moving rod 29 into the fixed sleeve 31 and compresses the spring 30, and when the moving rod 29 and the fixed sleeve 31 move to the arc groove 27, at this time, under the elastic force of the torsion spring, the fixed shaft 16, the first gear 15, the bearing block 19, the first rack 17, the second rack 24 and the second gear 23 are driven to restore to their original state, waiting for the next cutting, and then when the device cuts the wafer rod, both ends of the wafer rod are supported, thereby avoiding uneven force on the wafer rod during cutting, resulting in the breakage of the wafer rod, and the edge and the clamping device are squeezed, resulting in damage to the edge of the wafer rod, thereby ensuring the cutting effect of the wafer, improving the use effect of the device, and worthy of promotion.

[0038] Working principle: the through hole 10 descends and drives the push slide bar 28 to slide in the second gear 23. At this time, the fixed sleeve 31 and the moving rod 29 slide in the first vertical groove 20 and enter the connection between the first vertical groove 20 and the inclined groove 22, so that the moving rod 29 obtains moving space. At this time, under the elastic force of the spring 30, the moving rod 29 protrudes from the fixed sleeve 31 and contacts the inner wall of the first vertical groove 20. After the wafer rod is cut, the through hole 10 rises. At this time, since there is a certain step between the inclined groove 22 and the first vertical groove 20, the moving rod 29 is blocked by the step and slides along the trajectory of the inclined groove 22, thereby driving the second gear 23 to rotate and driving the second rack 24 and the first rack 17 to rotate. The first gear 15 is moved, thereby driving the fixed shaft 16 and the supporting block 19 to flip, so that the cut wafer rod in the support cylinder 18 is dumped and discharged from the blanking hole 13. The rotation of the fixed shaft 16 causes the torsion spring to deform, and then with the rise of the slide bar 28, the moving rod 29 and the fixed sleeve 31 enter the second vertical groove 26, so that the second vertical groove 26 gradually squeezes the moving rod 29 into the fixed sleeve 31 and compresses the spring 30. When the moving rod 29 and the fixed sleeve 31 move to the arc groove 27, under the elastic force of the torsion spring, the fixed shaft 16, the first gear 15, the supporting block 19, the first rack 17, the second rack 24 and the second gear 23 are restored to their original state.

[0039] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor wafer cutting device with high cutting efficiency, comprising a cutting table (1), characterized in that: The surface of the cutting table (1) is fixedly connected to a support frame (5), the inner wall of the support frame (5) is fixedly connected to a telescopic rod (6), the output end of the telescopic rod (6) is fixedly connected to a cutting blade (7), the surface of the cutting table (1) is provided with a blanking hole (13) penetrating the surface of the cutting table (1), the surface of the cutting table (1) is fixedly connected to two U-shaped frames (8), the inner walls of the two U-shaped frames (8) are slidably connected to limiting plates (9), the surface of the limiting plates (9) is provided with through holes (10) arranged at equal intervals, a fan-shaped bearing block (19) is arranged above the cutting table (1), the surface of the bearing block (19) is provided with supporting tubes (18) arranged at equal intervals, and the supporting tubes (18) and the through holes (10) correspond to each other.

2. A semiconductor wafer cutting device with high cutting efficiency according to claim 1, characterized in that: The surface of the cutting table (1) is slidably connected to two moving blocks (14), both ends of the bearing block (19) are fixedly connected to a fixed shaft (16), the surface of the fixed shaft (16) is rotatably connected to the inside of the moving block (14), the surface of the fixed shaft (16) is movably sleeved with a torsion spring, and the two ends of the torsion spring are respectively fixedly connected to the inside of the moving block (14) and the surface of the fixed shaft (16).

3. A semiconductor wafer cutting device with high cutting efficiency according to claim 2, characterized in that: Two fixed plates (3) are fixedly connected to both sides of the surface of the cutting table (1); a guide rod is arranged between the two fixed plates (3) on one side, the guide rod passes through the surface of a moving block (14) and is slidably connected to the inside of the moving block (14); a threaded rod (4) is rotatably connected between the two fixed plates (3) on the other side, the threaded rod (4) passes through the surface of another moving block (14) and is threadedly connected to the inside of the moving block (14); a motor (2) is fixedly connected to the surface of the cutting table (1), and an output end of the motor (2) is fixedly connected to one end of the threaded rod (4).

4. A semiconductor wafer cutting device with high cutting efficiency according to claim 3, characterized in that: The surface of the cutting table (1) is slidably connected to a T-shaped plate (11) that penetrates the surface of the cutting table (1); the surface of the T-shaped plate (11) is fixedly connected to push rods (12) that are arranged at equal distances; the push rods (12) and the through holes (10) correspond to each other; the bottom of the cutting table (1) is fixedly connected to an electric push rod (34); the output end of the electric push rod (34) is fixedly connected to the surface of the T-shaped plate (11).

5. A semiconductor wafer cutting device with high cutting efficiency according to claim 4, characterized in that: The inner walls of the two U-shaped frames (8) are slidably connected with cushion blocks (25), which are located at the bottom of the limiting plate (9). The bottom of the cutting table (1) is rotatably connected with two adjusting screws (33), and the upper ends of the two adjusting screws (33) are rotatably connected to the bottoms of the two cushion blocks (25). The surface of the support tube (18) is also fixedly connected with an adjusting screw (33), and one end of the adjusting screw (33) away from the support tube (18) is connected to the internal thread of the bearing block (19).

6. A semiconductor wafer cutting device with high cutting efficiency according to claim 5, characterized in that: Both sides of the cutting blade (7) are fixedly connected with extension plates (21), and the surfaces of the two extension plates (21) are fixedly connected with sliding rods (28), the sliding rods (28) are slidably connected to the inside of the cutting table (1), the surface of the cutting table (1) is rotatably connected with a second gear (23), the sliding rod (28) is slidably connected to the inner wall of the second gear (23), the surface of the sliding rod (28) is provided with a first vertical groove (20) and an inclined groove (22), the upper end of the inclined groove (22) is communicated with the upper end of the first vertical groove (20), and the depth of the inclined groove (22) is greater than that of the first vertical groove The surface of the slide bar (28) is provided with a second vertical groove (26), the upper end of the second vertical groove (26) is connected to the lower end of the inclined groove (22), the depth of the second vertical groove (26) gradually becomes shallower from top to bottom, the depth of the upper end of the second vertical groove (26) is the same as the depth of the inclined groove (22), the depth of the lower end of the second vertical groove (26) is the same as the depth of the first vertical groove (20), and the surface of the cutting table (1) is provided with an arc groove (27), the two ends of the arc groove (27) are respectively connected to the lower end of the second vertical groove (26) and the lower end of the first vertical groove (20).

7. A semiconductor wafer cutting device with high cutting efficiency according to claim 6, characterized in that: A fixing sleeve (31) is fixedly connected to the interior of the second gear (23); the surface of the fixing sleeve (31) slides with the inner walls of the first vertical groove (20), the inclined groove (22), the second vertical groove (26) and the arc groove (27); the inner wall of the fixing sleeve (31) is slidably connected with a moving rod (29); the surface of the moving rod (29) also slides with the inner walls of the first vertical groove (20), the inclined groove (22), the second vertical groove (26) and the arc groove (27); the surface of the moving rod (29) is fixedly connected with a spring (30); one end of the spring (30) away from the moving rod (29) is fixedly connected to the inner wall of the fixing sleeve (31).

8. The semiconductor wafer cutting device with high cutting efficiency according to claim 7, characterized in that: The surface of the cutting table (1) is slidably connected to a second rack (24), the surface of the second rack (24) is meshingly connected to the surface of a second gear (23), the interior of the second rack (24) is slidably connected to a first rack (17), the surface of the fixed shaft (16) is fixedly connected to a first gear (15), the surface of the first gear (15) is meshingly connected to the surface of the first rack (17), and the surface of the second rack (24) is threadedly connected to a fastening bolt (32).

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