Cooling liquid cooling device for silicon wafer linear cutting
By designing a coolant cooling device including a coolant recovery chamber, a coolant chamber and a central partition, the problem of high coolant temperature after silicon wafer cutting is solved, and effective cooling and recycling of coolant is achieved.
Patent Information
- Application Number
- CN202421470873.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-06-26
AI Technical Summary
In the prior art, the coolant after the cut silicon wafer is filtered due to the high temperature, and the coolant cannot be effectively cooled down, resulting in failure during recycling.
A coolant cooling device for silicon wafer wire cutting is designed, including a coolant recovery chamber, a coolant chamber and a central partition. By mixing the coolant with a cooling water source, filtering and disturbing cooling with a filter cloth and a stirring paddle, the re-precipitation and cooling of the coolant can be achieved.
It effectively reduces the temperature of the coolant, ensures that it can continue to play a cooling role during recycling, and improves the cooling effect during the silicon wafer cutting process.
Smart Images
Figure CN222832115U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of silicon slice cutting, in particular to a cooling liquid cooling device for silicon slice wire cutting. Background Art
[0002] Silicon wafers are an important material for making integrated circuits. Various semiconductor devices can be made through photolithography, ion implantation and other methods. The cutting fluid used in the silicon wafer cutting process can play a cooling role, dissipate the heat generated by the cutting machine, and reduce cutting stress.
[0003] However, when the coolant after silicon wafer cutting is filtered, it is recycled. Since the filtered coolant has a high temperature, it cannot achieve a good cooling purpose if used directly. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model provides a cooling liquid cooling device for silicon wafer wire cutting, which solves the problems mentioned in the above background.
[0005] The utility model provides the following technical solutions: a coolant cooling device for silicon wafer wire cutting, comprising a wire cutting machine, the wire cutting machine comprising: a coolant recovery bin, a coolant bin, a middle partition plate connected and installed between the coolant recovery bin and the coolant bin, an inclined baffle plate is installed on the upper surface of the coolant recovery bin above the middle partition plate, one side of the inclined baffle plate is located on the outer side of the coolant recovery bin and an array of drainage holes is opened, a filter cloth is installed below the inclined baffle plate, circulating water pipes are installed inside the coolant recovery bin and the coolant bin, a side baffle plate is installed inside the coolant recovery bin on a side away from the middle baffle plate, a stirring paddle is installed on one side of the side baffle plate located inside the coolant recovery bin, and a water guide inclined plate is connected to the lower side of the inclined baffle plate located above the side baffle plate.
[0006] As a further solution of the utility model: a pickup plate is installed on the upper surface of the coolant recovery bin just above the water guide inclined plate, and an overflow hole is opened inside the middle partition.
[0007] As a further solution of the utility model: cutting guide rails are symmetrically installed inside the wire cutting machine, steel wire rollers are installed inside the cutting guide rails, and cooling liquid spray pipes are arranged above the steel wire rollers.
[0008] As a further solution of the utility model: the middle partition plate and the side partition plates are both fixedly connected to the wire cutting machine, and the water guide inclined plate is fixedly connected to the inclined baffle plate.
[0009] As a further solution of the utility model: the drainage through hole is connected to the inclined baffle, and one end of the stirring blade is located outside the coolant recovery bin and is equipped with a driving motor.
[0010] As a further solution of the utility model: a rotating shaft is connected between the pickup plate and the coolant recovery bin.
[0011] As a further solution of the utility model: a cutting steel wire is wound around the outer sides of the two steel wire rollers, and a silicon rod to be cut is installed inside the wire cutting machine between the two cutting guide rails.
[0012] As a further solution of the utility model: the steel wire roller is slidably connected to the cold cutting guide rail, and the end of the coolant spray pipe is located inside the coolant tank and a spray pump is installed.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] When the coolant level rises and overflows into the cavity between the middle partition and the side partition, the coolant tank is connected to an external cooling water source to absorb heat and cool the coolant. The coolant collected inside can be precipitated and cooled again in a relatively static state.
[0015] After one end of the filter cloth is clamped on the inner side of the pickup plate, the coolant will be filtered under the action of the filter cloth and then introduced into one side of the side partition through the water guide inclined plate. The cooling liquid is disturbed and cooled by driving the stirring blades to rotate as a whole, which can cooperate with the subsequent heat exchange to ensure the heat dissipation and cooling effect of the coolant. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the structure of a cooling liquid cooling device for silicon wafer wire cutting;
[0017] Figure 2 It is a partial enlarged view of a coolant recovery bin in a coolant cooling device for silicon wafer wire cutting;
[0018] Figure 3 A cross-sectional view of a wire cutting machine in a cooling liquid cooling device for wire cutting of silicon wafers;
[0019] Figure 4 The figure is a top view of a wire cutting machine in a coolant cooling device for wire cutting of silicon wafers.
[0020] In the figure: 1, wire cutting machine; 2, cutting guide rail; 3, steel wire roller; 4, coolant nozzle; 5, silicon rod to be cut; 6, inclined baffle; 7, coolant recovery bin; 8, pick-up plate; 9, coolant bin; 601, drainage hole; 701, middle partition; 702, overflow hole; 703, circulating water pipe; 704, filter cloth; 705, side partition; 706, stirring paddle; 707, water guide inclined plate. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] like Figure 1-4 As shown, the present embodiment provides a cooling liquid cooling device for silicon wafer wire cutting, including a wire cutting machine 1, the wire cutting machine 1 includes: a cooling liquid recovery bin 7, a cooling liquid bin 9, a middle partition 701 is connected and installed between the cooling liquid recovery bin 7 and the cooling liquid bin 9, a water guide inclined plate 707 is fixedly connected to an inclined baffle 6, an inclined baffle 6 is installed on the upper surface of the cooling liquid recovery bin 7 above the middle partition 701, one side of the inclined baffle 6 is located outside the cooling liquid recovery bin 7 and an array of drainage holes 601 is opened, the drainage holes 601 are connected to the inclined baffle 6, and the lower part of the inclined baffle 6 A filter cloth 704 is installed, and a circulating water pipe 703 is installed inside the coolant recovery bin 7 and the coolant bin 9. A side baffle 705 is installed inside the coolant recovery bin 7 on the side away from the middle baffle 701. The middle baffle 701 and the side baffle 705 are both fixedly connected to the wire cutting machine 1. One side of the side baffle 705 is located inside the coolant recovery bin 7 and a stirring paddle 706 is installed. One end of the stirring paddle 706 is located outside the coolant recovery bin 7 and a driving motor is installed. A water guide inclined plate 707 is connected to the lower side of the inclined baffle 6 and located above the side baffle 705.
[0023] like Figure 2-3 As shown, in this embodiment, a pick-up plate 8 is installed on the upper surface of the coolant recovery bin 7 just above the water guiding inclined plate 707, a rotating shaft is connected between the pick-up plate 8 and the coolant recovery bin 7, an overflow hole 702 is opened inside the middle partition 701, cutting guide rails 2 are symmetrically installed inside the wire cutting machine 1, a silicon rod 5 to be cut is installed inside the wire cutting machine 1 between the two cutting guide rails 2, a steel wire roller 3 is installed inside the cutting guide rail 2, the steel wire roller 3 is slidably connected to the cold cutting guide rail 2, cutting steel wire is wound on the outer sides of the two steel wire rollers 3, a coolant nozzle 4 is arranged above the steel wire roller 3, and the end of the coolant nozzle 4 is located inside the coolant bin 9 and a spray pump is installed.
[0024] The working principle of the utility model is as follows: when in use, the steel wire roller 3 is controlled to move downward as a whole inside the cutting guide rail 2, so that the steel wires wound on the outer sides of the two steel wire rollers 3 rotate rapidly to contact the silicon rod 5 to be cut for cutting. When the steel wire roller 3 moves, the coolant nozzle 4 will be driven to move as a whole to spray coolant to cool the cutting position. The used coolant will fall into the upper position of the inclined baffle 6, and under the action of the inclined baffle 6, the used coolant will pass through the drainage hole 601 and fall into the interior of the coolant recovery bin 7 for collection. After the pickup plate 8 is opened as a whole, the filter cloth 704 issued by the inclined baffle 6 is pulled out and covered on the outer side of the drainage hole 601. After one end of 4 is clamped on the inner side of the pickup plate 8, the coolant will be filtered under the action of the filter cloth 704 and then introduced into one side of the side partition 705 through the water guide inclined plate 707. The stirring blade 706 is driven to rotate as a whole to disturb the coolant and cool it down. When the coolant level rises and overflows into the cavity between the middle partition 701 and the side partition 705, the coolant is cooled by absorbing heat after the cooling water source is connected to the cooling liquid tank 9. The coolant collected inside can be precipitated and cooled again in a relatively static state. When the liquid level rises again, it is filled into the interior of the cooling liquid tank 9 through the overflow hole 702 above the middle partition 701 for continued use.
[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.
[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A cooling liquid cooling device for silicon wafer wire cutting, comprising a wire cutting machine (1), characterized in that: The wire cutting machine (1) comprises: a coolant recovery bin (7) and a coolant bin (9); a middle partition (701) is connected and installed between the coolant recovery bin (7) and the coolant bin (9); an inclined baffle (6) is installed above the middle partition (701) and located on the upper surface of the coolant recovery bin (7); one side of the inclined baffle (6) is located outside the coolant recovery bin (7) and is provided with an array of drainage holes (601); a filter cloth (7) is installed below the inclined baffle (6) 04), the coolant recovery bin (7) and the coolant bin (9) are both installed with a circulating water pipe (703), the coolant recovery bin (7) is installed with a side baffle (705) on the side away from the middle baffle (701), the side of the side baffle (705) is installed with a stirring blade (706) on the inside of the coolant recovery bin (7), and the lower side of the inclined baffle (6) is located above the side baffle (705) and is connected to a water guide inclined plate (707).
2. A cooling liquid cooling device for silicon wafer wire cutting according to claim 1, characterized in that: A pick-up plate (8) is installed on the upper surface of the coolant recovery bin (7) directly above the water guide inclined plate (707), and an overflow hole (702) is opened inside the middle partition plate (701).
3. The cooling liquid cooling device for silicon wafer wire cutting according to claim 1, characterized in that: A cutting guide rail (2) is symmetrically installed inside the wire cutting machine (1), a steel wire roller (3) is installed inside the cutting guide rail (2), and a cooling liquid spray pipe (4) is arranged above the steel wire roller (3).
4. The cooling liquid cooling device for silicon wafer wire cutting according to claim 1, characterized in that: The middle baffle (701) and the side baffle (705) are both fixedly connected to the wire cutting machine (1), and the water guide inclined plate (707) is fixedly connected to the inclined baffle (6).
5. The cooling liquid cooling device for silicon wafer wire cutting according to claim 1, characterized in that: The liquid discharge through hole (601) is arranged to be in communication with the inclined baffle (6), and one end of the stirring blade (706) is located outside the coolant recovery bin (7) and is provided with a drive motor.
6. The cooling liquid cooling device for silicon wafer wire cutting according to claim 2, characterized in that: A rotating shaft is connected between the pickup plate (8) and the coolant recovery bin (7).
7. The cooling liquid cooling device for silicon wafer wire cutting according to claim 3, characterized in that: Cutting steel wires are wound around the outer sides of the two steel wire rollers (3), and silicon rods (5) to be cut are installed inside the wire cutting machine (1) between the two cutting guide rails (2).
8. The cooling liquid cooling device for silicon wafer wire cutting according to claim 3, characterized in that: The steel wire roller (3) is slidably connected to the cutting guide rail (2), and the end of the coolant spray pipe (4) is located inside the coolant tank (9) and is equipped with a spray pump.