Hoisting evaporation tool

Abstract

The utility model discloses a hoisting evaporation tool which comprises a disc, a cover plate, a hoisting mechanism and a plurality of pressing mechanisms, a supporting ring is clamped in the disc, and a supporting plate is placed on the supporting ring; the cover plate is arranged on the upper side of the supporting plate; the hoisting mechanism is mounted on the disc and comprises a plurality of studs, the studs are fixedly connected with the disc, locking buckles are in threaded connection with the studs, a top plate is arranged among the studs and fixed to the studs through the locking buckles, and a hoisting buckle plate is mounted in the center of the top plate; the pressing mechanism is installed on the disc and corresponds to the cover plate, the supporting ring and the supporting plate are both made of metal materials, and a pair of vent pipes is installed on the cover plate. According to the utility model, the hoisting of the semiconductor wafer produced by the evaporator can be realized, so that the semiconductor wafer can be conveniently transferred, the probability of damage of the semiconductor wafer in the transfer process is effectively reduced, and meanwhile, the normal production of the semiconductor wafer is not easily influenced.

Description

Technical Field

[0001] The utility model belongs to the technical field of hoisting tools, and in particular relates to a hoisting evaporation tool. Background Art

[0002] An evaporation machine is a device used to evaporate or sublimate materials in a vacuum environment and form a thin film on other surfaces. That is, in a vacuum environment, the material to be formed into a film is evaporated or sublimated so that it precipitates on the surface of the workpiece. This process can accurately reproduce the luminous material of the screen on the screen board without error. Therefore, evaporation machines are widely used in many fields, including electronic devices, optical equipment, and material science.

[0003] Among them, in the field of electronic devices, evaporation machines are often used for processing semiconductor wafers. For example, the Chinese utility model patent with publication number: CN211689201U discloses an evaporation machine that can realize the processing of semiconductor wafers and can meet the processing requirements of semiconductor wafers to a certain extent.

[0004] However, there are few lifting tools for semiconductor wafers produced by vapor deposition machines on the market, which makes the subsequent transportation of semiconductor wafers relatively troublesome. It also increases the chance of damage to semiconductor wafers during transportation, which in turn affects the normal production of semiconductor wafers.

[0005] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0006] The utility model aims to provide a hoisting evaporation tool, which can solve the problem that semiconductor wafers produced by an evaporation machine are inconvenient to transport.

[0007] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0008] A hoisting evaporation tool, including: a disc, a cover plate, a hoisting mechanism and several clamping mechanisms;

[0009] A support ring is clamped in the disc, and a support plate is placed on the support ring;

[0010] The cover plate is arranged on the upper side of the support plate;

[0011] The hoisting mechanism is installed on the disc, and the hoisting mechanism includes a plurality of studs, the studs are fixedly connected to the disc, a locking buckle is threadedly connected to the studs, a top plate is provided between the plurality of studs, the top plate is fixed to the studs through the locking buckle, and a hanging buckle plate is installed at the center of the top plate;

[0012] The pressing mechanism is installed on the disc and corresponds to the cover plate.

[0013] In one or more embodiments of the present invention, the support ring and the support plate are both made of metal.

[0014] In one or more embodiments of the present invention, a pair of air tubes are installed on the cover plate. When the cover plate is in contact with the semiconductor wafer, the air between the cover plate and the semiconductor wafer can be exhausted through the air tubes, so that the cover plate can better contact with the semiconductor wafer, thereby improving the fixing effect of the semiconductor wafer.

[0015] In one or more embodiments of the utility model, the clamping mechanism includes a bottom column, the bottom column is fixedly connected to the disc, and the bottom column is used to install the elastic pressure strip;

[0016] The bottom column is provided with elastic pressure strips, and the cover plate can be fixed by using a plurality of elastic pressure strips, so that the cover plate and the semiconductor wafer are firmly attached, thereby ensuring the fixing effect of the semiconductor wafer, so as to facilitate the transportation of the semiconductor wafer.

[0017] In one or more embodiments of the utility model, a fastening bolt is slidably provided on the bottom column, and the elastic pressure strip is connected to the bottom column through the fastening bolt;

[0018] A movable plate is slidably provided in the bottom column, and the fastening bolt is threadedly connected to the movable plate. The movable plate is used to fix the fastening bolt and can also make the fastening bolt and the bottom column slide relative to each other so as to adjust the elastic pressure strip;

[0019] An elastic sleeve is provided at the lower side of the movable plate, which is used to squeeze the movable plate so that the movable plate can better contact with the positioning column, thereby fixing the elastic pressure strip and ensuring the pressing effect of the elastic pressure strip on the cover plate.

[0020] In one or more embodiments of the present invention, a protrusion is fixedly connected to the side wall of the bottom column, and a positioning column is slidably provided in the protrusion. One end of the positioning column is arranged in the bottom column and corresponds to the movable plate. When the positioning column is on the upper side of the movable plate, the elastic pressure strip is not fastened by the fastening bolts, and the elastic pressure strip can rotate around the fastening bolts to remove the cover plate; when the positioning column is on the lower side of the movable plate, the elastic pressure strip is fastened by the fastening bolts, and the elastic pressure strip will press the cover plate to ensure the firmness of the semiconductor wafer on the lower side of the cover plate.

[0021] In one or more embodiments of the utility model, a movable groove is provided in the protrusion, and the side wall of the positioning column located in the movable groove is connected to a limiting ring for limiting the sliding of the positioning column so that the positioning column is not easy to completely slide out of the protrusion.

[0022] In one or more embodiments of the present invention, a spring is provided in the movable groove, and the spring is provided on the outside of the positioning column to apply a force to the limit ring, so that one end of the positioning column can be inserted into the bottom column in a natural state.

[0023] In one or more embodiments of the present invention, a clamping plate is connected to one end of the elastic pressure strip away from the bottom column, and the clamping plate is in contact with the cover plate, which can increase the clamping effect of the elastic pressure strip on the cover plate.

[0024] In one or more embodiments of the present invention, the pressing plate is made of rubber material, which is not easy to cause hard squeezing on the cover plate and will not leave scratches on the surface of the cover plate.

[0025] Compared with the prior art, the hoisting evaporation tool of the utility model can realize the hoisting of semiconductor wafers produced by the evaporation machine, thereby facilitating the transfer of semiconductor wafers, effectively reducing the probability of damage to semiconductor wafers during transportation, and at the same time is not easy to affect the normal production of semiconductor wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A three-dimensional diagram of a hoisting evaporation tool in one embodiment of the utility model;

[0028] Figure 2 for Figure 1 Schematic diagram of the structure at A in the middle;

[0029] Figure 3 for Figure 1 Schematic diagram of the structure at B in the middle;

[0030] Figure 4 It is a partial structural cross-sectional view of a hoisting evaporation tool in one embodiment of the utility model;

[0031] Figure 5 for Figure 4 Schematic diagram of the structure at C in the middle;

[0032] Figure 6 for Figure 4 Schematic diagram of the structure at point D in the middle.

[0033] Description of main reference numerals:

[0034] 1-disc, 101-support ring, 102-support plate, 2-cover plate, 201-ventilation tube, 3-lifting mechanism, 301-stud, 302-top plate, 303-locking buckle, 304-hanging buckle plate, 4-clamping mechanism, 401-bottom column, 402-elastic pressure strip, 403-fastening bolt, 404-movable plate, 405-elastic sleeve, 406-protrusion, 407-positioning column, 408-limiting ring, 409-spring, 410-clamping plate. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0036] like Figure 1-Figure 6 As shown, a hoisting evaporation tool in an embodiment of the utility model includes a disc 1, a cover plate 2, a hoisting mechanism 3 and a plurality of pressing mechanisms 4.

[0037] A support ring 101 is engaged in the disc 1 for fixing a support plate 102 so that the semiconductor wafer can be placed on the support plate 102 to realize the transportation of the semiconductor wafer.

[0038] In addition, a support plate 102 is placed on the support ring 101 for placing a semiconductor wafer.

[0039] Preferably, the support ring 101 and the support plate 102 are both made of metal.

[0040] like Figure 1-Figure 6 As shown, the cover plate 2 is arranged on the upper side of the support plate 102, and the cover plate 2 is placed on the upper side of the semiconductor wafer, that is, the semiconductor wafer can be fixed between the support plate 102 and the cover plate 2, thereby realizing the transportation of the semiconductor wafer.

[0041] A pair of air permeable tubes 201 are installed on the cover plate 2. When the cover plate 2 contacts the semiconductor wafer, the air between the cover plate 2 and the semiconductor wafer can be evacuated through the air permeable tubes 201, so that the cover plate 2 can better contact the semiconductor wafer, thereby improving the fixing effect of the semiconductor wafer.

[0042] like Figure 1-Figure 6 As shown, the hoisting mechanism 3 is installed on the disc 1, and the hoisting mechanism 3 is used to connect with external hoisting equipment, thereby realizing balanced transportation of semiconductor wafers.

[0043] The hoisting mechanism 3 includes a plurality of studs 301 , which are fixedly connected to the disc 1 and used to fix the top plate 302 .

[0044] In addition, a locking buckle 303 is threadedly connected to the stud 301 , and a top plate 302 is provided between the studs 301 , and the top plate 302 is fixed to the stud 301 through the locking buckle 303 .

[0045] Specifically, a hanging plate 304 is installed at the center of the top plate 302, and the hanging plate 304 is connected to other lifting devices, such as an electromagnetic suction cup device, so as to achieve safe transportation of semiconductor wafers.

[0046] like Figure 1-Figure 6 As shown, the clamping mechanism 4 is installed on the disc 1 and corresponds to the cover plate 2. The clamping mechanism 4 is used to fix the cover plate 2, thereby fixing the semiconductor wafer so as to safely transport the semiconductor wafer.

[0047] The pressing mechanism 4 includes a bottom column 401 , which is fixedly connected to the disc 1 , and is used to install an elastic pressure strip 402 .

[0048] In addition, elastic strips 402 are installed on the bottom column 401, and the cover plate 2 can be fixed by using a plurality of elastic strips 402, so that the cover plate 2 and the semiconductor wafer are firmly attached, thereby ensuring the fixing effect of the semiconductor wafer, so as to facilitate the transportation of the semiconductor wafer.

[0049] Preferably, the elastic pressure strip 402 is made of elastic metal.

[0050] Specifically, a fastening bolt 403 is slidably provided on the bottom column 401, and the elastic strip 402 is connected to the bottom column 401 through the fastening bolt 403. A movable plate 404 is slidably provided in the bottom column 401, and the fastening bolt 403 is threadedly connected to the movable plate 404. The movable plate 404 is used to fix the fastening bolt 403 and also allows the fastening bolt 403 and the bottom column 401 to slide relative to each other, so as to adjust the elastic strip 402.

[0051] Preferably, the movable plate 404 is a square plate, so that when the fastening bolt 403 is inserted into the bottom column 401 and rotates, the movable plate 404 is not easy to rotate with the fastening bolt 403, so as to achieve a threaded connection between the fastening bolt 403 and the movable plate 404.

[0052] In addition, an elastic sleeve 405 is provided on the lower side of the movable plate 404 for squeezing the movable plate 404 so that the movable plate 404 can better contact with the positioning column 407, thereby fixing the elastic pressure strip 402 and ensuring the pressing effect of the elastic pressure strip 402 on the cover plate 2.

[0053] like Figure 1-Figure 6As shown, a protrusion 406 is fixedly connected to the side wall of the bottom column 401 , and a positioning column 407 is slidably arranged in the protrusion 406 . One end of the positioning column 407 is arranged in the bottom column 401 and corresponds to the movable plate 404 .

[0054] When the positioning column 407 is on the upper side of the movable plate 404, the elastic pressure strip 402 is not tightened by the tightening bolt 403, and the elastic pressure strip 402 can rotate around the tightening bolt 403 to remove the cover plate 2. When the positioning column 407 is on the lower side of the movable plate 404, the elastic pressure strip 402 is tightened by the tightening bolt 403, and the elastic pressure strip 402 will press the cover plate 2 to ensure the fixation of the semiconductor wafer on the lower side of the cover plate 2.

[0055] A movable groove is provided in the protrusion 406 , and the side wall of the positioning column 407 located in the movable groove is connected to a limiting ring 408 for limiting the sliding of the positioning column 407 so that the positioning column 407 is not easy to completely slide out of the protrusion 406 .

[0056] In addition, a spring 409 is provided in the movable groove, and the spring 409 is provided on the outer side of the positioning column 407 to apply a force to the limit ring 408, so that one end of the positioning column 407 can be inserted into the bottom column 401 in a natural state.

[0057] Specifically, one end of the elastic pressure strip 402 away from the bottom column 401 is connected to a pressing plate 410 , and the pressing plate 410 is in contact with the cover plate 2 , which can increase the pressing effect of the elastic pressure strip 402 on the cover plate 2 .

[0058] Preferably, the pressing plate 410 is made of rubber, which is not easy to cause hard squeezing to the cover plate 2 and will not leave scratches on the surface of the cover plate 2.

[0059] When in use, the support ring 101 is engaged on the disc 1 , the support plate 102 is placed on the support ring 101 , and then the semiconductor wafer is placed on the support plate 102 , and then the cover plate 2 is covered.

[0060] Place the elastic strip 402 on the base column 401, then insert the fastening bolt 403 through the elastic strip 402 into the base column 401, and rotate it so that the fastening bolt 403 is threadedly connected with the movable plate 404. At this time, the movable plate 404 is located on the upper side of the positioning column 407 under the action of the elastic sleeve 405.

[0061] The elastic pressure strip 402 is rotated so that the clamping plate 410 connected to the elastic pressure strip 402 is located on the upper side of the cover plate 2. The positioning column 407 is pulled so that one end of the positioning column 407 is contracted in the protrusion 406, and the fastening bolt 403 is pressed so that the movable plate 404 moves downward in the bottom column 401, and the elastic sleeve 405 is compressed. When the movable plate 404 moves to the lower side of the positioning column 407, the positioning column 407 is released, and the positioning column 407 is reinserted into the bottom column 401 under the cooperation of the limiting ring 408 and the spring 409, and the position of the movable plate 404 is limited, that is, Figure 4-Figure 6 At this time, the elastic pressure strip 402 can press the cover plate 2 under the action of the fastening bolts 403 to ensure the fixing effect of the cover plate 2 on the semiconductor wafer.

[0062] The top plate 302 is mounted on the studs 301 through a plurality of locking buckles 303, and then other lifting equipment is used to contact the hanging buckle plate 304, so that the semiconductor wafer can be safely transported.

[0063] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0064] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A hoisting evaporation tool, characterized in that: include: A disc, wherein a support ring is engaged in the disc, and a support plate is placed on the support ring; A cover plate, arranged on the upper side of the support plate; A lifting mechanism is installed on the disc, the lifting mechanism includes a plurality of studs, the studs are fixedly connected to the disc, a locking buckle is threadedly connected to the studs, a top plate is provided between the plurality of studs, the top plate is fixed to the studs through the locking buckle, and a hanging buckle plate is installed at the center of the top plate; A plurality of pressing mechanisms are installed on the disc and correspond to the cover plate.

2. The hoisting evaporation tool according to claim 1, characterized in that: The support ring and the support plate are both made of metal.

3. The hoisting evaporation tool according to claim 1, characterized in that: A pair of air permeable tubes are installed on the cover plate.

4. The hoisting evaporation tool according to claim 1, characterized in that: The clamping mechanism comprises a bottom column, the bottom column is fixedly connected to the disc, and an elastic pressure strip is installed on the bottom column.

5. The hoisting evaporation tool according to claim 4, characterized in that: A fastening bolt is slidably provided on the bottom column, a movable plate is slidably provided inside the bottom column, the fastening bolt is threadedly connected with the movable plate, and an elastic sleeve is provided at the lower side of the movable plate.

6. The hoisting evaporation tool according to claim 5, characterized in that: A protrusion is fixedly connected to the side wall of the bottom column, a positioning column is slidably arranged in the protrusion, and one end of the positioning column is arranged in the bottom column and corresponds to the movable plate.

7. The hoisting evaporation tool according to claim 6, characterized in that: A movable groove is arranged in the protrusion, and the positioning column is located at a side wall of the movable groove and is connected to a limiting ring.

8. The hoisting evaporation tool according to claim 7, characterized in that: A spring is arranged in the movable groove, and the spring is arranged on the outer side of the positioning column.

9. The hoisting evaporation tool according to claim 4, characterized in that: One end of the elastic pressure strip away from the bottom column is connected with a pressing plate, and the pressing plate is in contact with the cover plate.

10. The hoisting evaporation tool according to claim 9, characterized in that: The pressing plate is made of rubber.

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