Heat treatment equipment

Abstract

A heat treatment device is mainly characterized in that a semiconductor device is placed in the heat treatment device, waste heat in the heat treatment process is discharged through a heat discharge pipe of the heat treatment device, and the waste heat is converted into electric energy through a thermoelectric conversion device arranged on the heat discharge pipe. And preheating gas through the waste heat by using a gas pipeline for connecting the heat discharge pipe of the heat treatment equipment with a machine table of the heat treatment equipment, and inputting the gas into the machine table of the heat treatment equipment, so as to recycle the waste heat.

Description

Technical Field

[0001] The present application relates to a thermal processing apparatus and method, and more particularly to a thermal processing apparatus for a semiconductor device. Background Art

[0002] With the rapid development of portable electronic products in recent years, the development of various related products is also moving towards high density, high performance, light, thin, short and small trends. To this end, the industry has developed various integrated multi-functional packaging forms in order to meet the requirements of light, thin, short and high density of electronic products.

[0003] In the current semiconductor packaging process, the semiconductor chip is mainly attached to the substrate for molding operation, and then the substrate is placed on a carrier and sent to an oven for high-temperature heating to solidify the molding compound.

[0004] However, the operation of existing ovens will produce a large amount of waste heat, and there is currently no solution for recycling it.

[0005] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Utility Model Content

[0006] In view of the various deficiencies of the above-mentioned prior art, the present application provides a heat treatment equipment, including: a machine; a heat exhaust pipe connected to the machine and used to exhaust waste heat generated when the machine is in operation out of the machine; a thermoelectric conversion device, which is arranged on the heat exhaust pipe and used to convert the thermal energy of the waste heat into electrical energy; and a gas pipeline, which connects the heat exhaust pipe and the machine to preheat the external gas through the waste heat and then input it into the machine.

[0007] The present application also provides a heat treatment method, comprising: placing a semiconductor device in the aforementioned heat treatment equipment; discharging waste heat during the heat treatment process through a heat exhaust pipe of the heat treatment equipment; using a thermoelectric conversion device arranged on the heat exhaust pipe to convert the waste heat into electrical energy; and using a gas pipeline connecting the heat exhaust pipe of the heat treatment equipment and the machine of the heat treatment equipment to pre-heat the gas through the waste heat and then input it into the machine of the heat treatment equipment.

[0008] In the aforementioned heat treatment equipment and method, the machine is provided with at least one chamber for accommodating a plurality of semiconductor devices.

[0009] In the aforementioned heat treatment equipment and method, the chamber is provided with a heater to perform temperature-raising heating treatment on the plurality of semiconductor devices.

[0010] In the aforementioned heat treatment equipment and method, the chamber is provided with an air supply device to distribute the heat energy generated by the heater to the plurality of semiconductor devices.

[0011] In the aforementioned heat treatment equipment and method, a control interface is provided on the surface of the machine to allow the user to operate and control the operation of the heat treatment equipment.

[0012] In the aforementioned heat treatment equipment and method, the thermoelectric conversion device has an electrothermal chip to convert thermal energy into electrical energy using the Schiebeck effect.

[0013] In the aforementioned heat treatment equipment and method, the gas pipeline includes a first pipeline, a second pipeline and a third pipeline. The first pipeline connects the external gas supply device and the heat exhaust pipe, the second pipeline connects the heat exhaust pipe and the machine, and the third pipeline connects the first pipeline and the second pipeline and is arranged in the heat exhaust pipe.

[0014] In the aforementioned heat treatment equipment and method, the third pipeline is spirally arranged around the inner pipe wall of the heat exhaust pipe so as to utilize the exhaust gas to heat the gas in the third pipeline.

[0015] Through the implementation of this application, the waste heat of the heat treatment equipment is mainly recycled and reused to generate electricity, which greatly saves energy and reduces carbon emissions. It can also generate electricity and save energy, and improve the purpose of zero carbon emission / energy saving. At the same time, the waste heat is used to preheat the nitrogen temperature, and then it is led to the internal use of the heat treatment equipment to solve the shortcomings of the existing oven operation that produces a large amount of waste heat gas and has no recycling. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an overall schematic diagram of the heat treatment equipment of the present application.

[0017] Figure 2 This is a schematic diagram of the heat treatment equipment of the present application.

[0018] Figure 3 It is a partially enlarged schematic diagram of the heat exhaust pipe and the thermoelectric conversion device of the heat treatment equipment of the present application.

[0019] Figure 4 This is a partially enlarged schematic diagram of the heat exhaust pipe and gas pipeline of the heat treatment equipment of the present application.

[0020] Main component symbols

[0021] 1 Heat treatment equipment

[0022] 11 Machine

[0023] 111 Chamber

[0024] 112 Heater

[0025] 113 Air supply device

[0026] 12 Heat dissipation pipe

[0027] 13 Thermoelectric conversion device

[0028] 131 Electric heating chip

[0029] 14 Gas pipeline

[0030] 141 First Pipeline

[0031] 142 Second Pipeline

[0032] 143 Third Pipeline

[0033] 2 Semiconductor devices

[0034] 3 External air supply. DETAILED DESCRIPTION

[0035] The following describes the implementation methods of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0036] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical content disclosed in this application. At the same time, the terms such as "on", "first", "second", and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.

[0037] See also Figure 1 , which is a schematic diagram of the heat treatment equipment 1 of the present application. The heat treatment equipment 1 comprises: a machine 11, a heat exhaust pipe 12 connected to the machine 11, a thermoelectric conversion device 13 disposed on the heat exhaust pipe 12, and a gas pipeline 14 connecting the heat exhaust pipe 12 and the machine 11.

[0038] Please also refer to Figure 2 In one embodiment, the machine 11 is provided with at least one chamber 111 for accommodating a plurality of semiconductor devices 2. A heater 112 is further provided at the bottom of the chamber 111 to heat the plurality of semiconductor devices 2; and an air supply device 113 (such as a fan) is provided at the side of the chamber 111 to evenly distribute the heat energy generated by the heater 112 to the plurality of semiconductor devices 2 at a constant temperature.

[0039] In addition, a control interface 114 may be provided on the surface of the machine 11 for a user to operate and control the operation of the heat treatment equipment 1 .

[0040] Please also refer to Figure 3 The heat exhaust pipe 12 is connected to the machine 11 and is used to discharge the waste heat generated when the heat treatment equipment 1 (machine 11) is in operation out of the machine 11. It mainly discharges the waste heat generated by the hot gas circulation during the heat treatment process of the heat treatment equipment 1 from normal temperature operation to a constant temperature of more than 100 degrees out of the machine 11.

[0041] like Figure 3 As shown, the thermoelectric conversion device 13 is disposed on the outer surface of the heat exhaust pipe 12 to sense temperature and then convert it into electrical energy. In detail, the thermoelectric conversion device 13 has an electric heat chip 131, which utilizes the Seebeck effect to convert heat energy (temperature difference) into electrical energy through P-type semiconductors and N-type semiconductors in series and parallel connection. Among them, thermoelectric power generation has the advantages of simple equipment, no transmission parts, low noise, no emission pollution, easy access, safety and reliability, long life, no maintenance, etc., and the heat source required for the temperature difference can be waste heat, and there is no mechanical driving part, so it has the advantages of not easy to be worn or deteriorated and no maintenance.

[0042] Please also refer to Figure 4 The gas pipeline 14 includes a first pipeline 141, a second pipeline 142 and a third pipeline 143, wherein the first pipeline 141 is connected to the external gas supply device 3 and the heat exhaust pipe 12, the second pipeline 142 is connected to the heat exhaust pipe 12 and the machine 11, and the third pipeline 143 is connected to the first pipeline 141 and the second pipeline 142 and is arranged in the heat exhaust pipe 12.

[0043] When the heat treatment equipment 1 is in operation, an inert gas (such as nitrogen) can be used to reduce the oxygen content to achieve control of the oxygen content of the process space. When the inert gas is currently sent into the machine 11, the temperature of the chamber 111 will be greatly reduced. At this time, the heater 112 will start heating again, causing power consumption. Therefore, the present application mainly connects the first pipeline 141 of the gas pipeline 14 (nitrogen input pipeline) to the external gas supply device 3 and the heat exhaust pipe 12 to provide nitrogen to enter the third pipeline 143 located in the heat exhaust pipe 12, wherein the third pipeline 143 is, for example, spirally wrapped around the inner wall of the heat exhaust pipe 12, and the exhaust gas is used to fully heat the nitrogen in the third pipeline 143, and then the heated nitrogen is sent from the third pipeline 143 located in the heat exhaust pipe 12 to the chamber 111 in the machine 11 through the second pipeline 142, so as to avoid continuous heating of the heater 112 by preheating the nitrogen before transmitting it to the chamber 111, thereby saving power consumption.

[0044] Through the aforementioned heat treatment equipment 1, the present application also discloses a heat treatment method, including: placing the semiconductor device 2 in the aforementioned heat treatment equipment 1; discharging the waste heat in the heat treatment process through the heat exhaust pipe 12 of the heat treatment equipment 1; using a thermoelectric conversion device 13 arranged on the heat exhaust pipe 12 to convert the waste heat into electrical energy; and using a gas pipeline 14 connecting the heat exhaust pipe 12 of the heat treatment equipment 1 and the machine 11 of the heat treatment equipment 1 to pre-heat the gas (such as nitrogen) through the waste heat and then input it into the machine 11 of the heat treatment equipment 1.

[0045] Therefore, the heat treatment equipment and heat treatment method of the present application mainly recycle the waste heat of the heat treatment equipment to generate electricity, greatly save energy and reduce carbon emissions, and can also generate electricity and save energy, thereby improving the purpose of zero carbon emission / energy saving. At the same time, the waste heat is used to preheat the nitrogen temperature, and then it is led to the internal use of the heat treatment equipment to solve the problem that the existing oven operation produces a large amount of waste heat gas without recycling.

[0046] The above embodiments are only used to illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present application. Therefore, the scope of protection of the present application should be as listed in the claims.

Claims

1. A heat treatment device, characterized in that: include: Machine; A heat exhaust pipe connected to the machine and used to exhaust waste heat generated when the machine is in operation; a thermoelectric conversion device, which is disposed on the heat exhaust pipe and is used to convert the thermal energy of the waste heat into electrical energy; and A gas pipeline connects the heat exhaust pipe and the machine to preheat the external gas through the waste heat and then input it into the machine.

2. The heat treatment equipment according to claim 1, characterized in that The machine is provided with at least one chamber for accommodating a plurality of semiconductor devices.

3. The heat treatment equipment according to claim 2, characterized in that The chamber is provided with a heater to perform a heating process on the plurality of semiconductor devices.

4. The heat treatment equipment according to claim 3, characterized in that The chamber is provided with an air supply device to distribute the heat energy generated by the heater to the plurality of semiconductor devices.

5. The heat treatment equipment according to claim 1, characterized in that The machine surface is provided with a control interface for users to operate and control the operation of the heat treatment equipment.

6. The heat treatment equipment according to claim 1, characterized in that The thermoelectric conversion device has an electrothermal chip to convert thermal energy into electrical energy using the Schiebeck effect.

7. The heat treatment equipment according to claim 1, characterized in that The gas pipeline includes a first pipeline, a second pipeline and a third pipeline. The first pipeline connects an external gas supply device and the heat exhaust pipe, the second pipeline connects the heat exhaust pipe and the machine, and the third pipeline connects the first pipeline and the second pipeline and is arranged in the heat exhaust pipe.

8. The heat treatment equipment according to claim 7, characterized in that The third pipeline is spirally arranged around the inner pipe wall of the heat exhaust pipe so as to utilize the exhaust gas to heat the gas in the third pipeline.

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