Workpiece carrying table for patch welding

Abstract

The utility model relates to a workpiece carrying table for patch welding, which comprises a bottom plate and a pressing plate, the length direction of the pressing plate is consistent with the length direction of the bottom plate, the pressing plate is detachably connected to the top of the bottom, the pressing plate is provided with a heating hole, the bottom is used for carrying a chip substrate, and the bottom of the pressing plate is used for being in contact with the chip substrate. When the chip substrate is subjected to heat treatment, the pressing plates press the four edges of the chip substrate, so that the situation that the chip substrate is warped and deformed in the heat treatment process is avoided as much as possible, and the quality of the chip substrate is improved.

Description

Technical Field

[0001] The present application relates to the field of heat treatment equipment, and in particular to a workpiece carrier for patch welding. Background Art

[0002] With the advancement of technology, chips are everywhere in people's lives today, from mobile phones, computers, televisions, home appliances, self-driving cars to LED lights, etc., changing our lives all the time.

[0003] Reference Figure 1 and Figure 2 In the prior art, the chip substrate 1 is made of copper, and during the production process of the chip substrate 1, a plurality of protrusions 4 are punched on one side of the surface of the chip substrate 1, and a groove 2 is formed on the other side, and a plurality of circular holes 3 are opened on the surface of the chip substrate 1.

[0004] During heat treatment, the chip is placed on the surface of the protrusion 4, and flux is added between the protrusion 4 and the chip to facilitate the welding of the chip and the protrusion 4 during heating.

[0005] The Chinese patented metal heat treatment device with authorization announcement number CN210620867U includes a base plate, a moving device, a heating unit and a cooling unit; the base plate: the base plate is rectangular, and a groove is provided at the top of the base plate; the moving device: the moving device includes a support plate, a support column, a movable block, a lead screw and a motor; a lead screw is provided in the groove at the top of the base plate, and the left end of the lead screw is connected to the output shaft of the motor, the motor is located on the outer side of the left end of the base plate, the screw hole on the side of the movable block is threadedly connected to the lead screw, the movable block is located in the top groove of the base plate, and the top four corners of the movable block are connected to the bottom four corners of the support plate through four support columns; the heating unit: the heating unit includes an electric push door, an electrical connector, a heating shell and a heating tube; the interior of the heating shell is hollow, and the metal heat treatment device has a simple structure, is easy to operate, and has a moderate equipment size, and will not cause environmental pollution and energy waste.

[0006] Regarding the above-mentioned related technologies, metal workpieces are prone to warping and deformation during the heating process, which affects the quality of the chip substrate. Utility Model Content

[0007] In order to avoid warping and deformation of the chip substrate during heat treatment, the present application provides a workpiece carrier for chip welding.

[0008] The present application provides a workpiece carrier for patch welding using the following technical solution:

[0009] A workpiece carrier for patch welding comprises a base plate and a pressure plate. The length direction of the pressure plate is consistent with the length direction of the base plate. The pressure plate is detachably connected to the top of the base plate. The pressure plate is provided with a heating hole. The base plate is used to carry a chip substrate, and the bottom of the pressure plate is used to contact the chip substrate.

[0010] By adopting the above technical solution, when the chip substrate is heat-treated, the pressing plate presses the four edges of the chip substrate, thereby avoiding warping and deformation of the chip substrate during the heat treatment process as much as possible and improving the quality of the chip substrate.

[0011] Optionally, the bottom plate is connected to a plurality of magnetic blocks, and the pressure plate is made of a ferromagnetic material. When the pressure plate and the bottom plate are close to each other, the magnetic blocks and the pressure plate attract each other.

[0012] By adopting the above technical solution, the bottom plate and the pressing plate are connected to each other through the magnetic block, thereby making the installation and disassembly of the pressing plate more convenient.

[0013] Optionally, a plurality of convex strips are connected to the top of the bottom plate, and the plurality of convex strips correspond to the grooves of the chip substrate one by one, and the convex strips are embedded in the grooves of the chip substrate.

[0014] By adopting the above technical solution, when the chip substrate is placed on the top of the base plate, the convex strip is embedded in the groove of the chip substrate, so as to limit the position of the chip substrate on the base plate and avoid the chip substrate from being offset on the top of the base plate as much as possible. The convex strip is embedded in the groove, which reduces the deformation of the chip substrate during heating.

[0015] Optionally, a bump is connected to the top of the bottom plate, and the bump is used to pass through the circular hole of the chip substrate.

[0016] By adopting the above technical solution, when the chip substrate is placed on the top of the base plate, the bump passes through the circular hole of the chip substrate, thereby positioning the chip substrate on the top of the base plate and reducing the chip substrate offset.

[0017] Optionally, the pressing plate is provided with a positioning hole, the positioning hole is used to communicate with the circular hole of the chip substrate, and the positioning hole is used for the bump to pass through.

[0018] By adopting the above technical solution, after the chip substrate is placed, when the pressure plate is installed on the top of the base plate, the bumps pass through the circular holes and positioning holes of the chip substrate in sequence, so as to facilitate the positioning of the pressure plate on the top of the base plate, avoid the pressure plate from shifting on the top of the base plate as much as possible, and make the pressure plate stably connected to the base plate.

[0019] Optionally, both ends of the bottom plate along its length direction are provided with first through holes for facilitating taking the pressing plate, the length of the pressing plate is smaller than the length of the bottom plate, and both ends of the pressing plate along its length direction are respectively arranged above the two first through holes.

[0020] By adopting the above technical solution, a first through hole is added, so that it is convenient for the operator's hand to pass through the first through hole and contact the bottom of the pressing plate, so as to facilitate taking the pressing plate and keeping the pressing plate away from the bottom plate.

[0021] Optionally, first clearance grooves are provided on both sides of the top of the bottom plate along its width direction, and the first clearance grooves are respectively provided on both sides of the pressing plate along its width direction, and first connecting holes for facilitating the removal of the chip substrate are provided in the first clearance grooves.

[0022] By adopting the above technical solution, a first connection hole is opened, so that when an operator takes the chip substrate, he can contact the bottom of the chip substrate through the first connection hole, thereby facilitating the operator to take the chip substrate and keeping the chip substrate away from the bottom plate.

[0023] Optionally, a plurality of second make way grooves are provided on both sides of the top of the bottom plate along its width direction, the plurality of second make way grooves are spaced in sequence along the length direction of the bottom plate, and a second connecting hole for facilitating taking the pressure plate is provided in the second make way grooves.

[0024] By adopting the above technical solution, when taking the pressing plate, the operator can contact the bottom of the pressing plate through the second connecting hole, so that it is convenient for the operator to take the pressing plate and to keep the pressing plate away from the bottom plate.

[0025] Optionally, the bottom plate is provided with second through holes at both ends along its length direction for facilitating taking out the chip substrate.

[0026] By adopting the above technical solution, when taking the chip substrate, the operator's hand can contact the bottom of the chip substrate through the second through hole, thereby facilitating the taking of the chip substrate and keeping the chip substrate away from the bottom plate.

[0027] In summary, the present application includes at least one of the following beneficial technical effects:

[0028] 1. When the chip substrate is heat treated, the pressing plate presses the four sides of the chip substrate to avoid warping and deformation of the chip substrate during the heat treatment process and improve the quality of the chip substrate;

[0029] 2. When the chip substrate is placed on the top of the bottom plate, the convex strip is embedded in the groove of the chip substrate, so as to limit the position of the chip substrate on the bottom plate, and try to avoid the chip substrate from being offset on the top of the bottom plate. The convex strip is embedded in the groove, which reduces the deformation of the chip substrate during the heating process;

[0030] 3. After the chip substrate is placed, when the pressure plate is installed on the top of the base plate, the bumps pass through the circular holes and positioning holes of the chip substrate in sequence, so as to facilitate the positioning of the pressure plate on the top of the base plate, try to avoid the pressure plate from shifting on the top of the base plate, and make the pressure plate stably connected to the base plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a three-dimensional structural diagram of a chip substrate in the prior art.

[0032] Figure 2 It is existing technology Figure 1 Enlarged view of part A.

[0033] Figure 3 It is a three-dimensional structural diagram of this embodiment.

[0034] Figure 4 It is a three-dimensional structural diagram of the base plate in this embodiment.

[0035] Figure 5 It is a three-dimensional structural diagram of the pressing plate in this embodiment.

[0036] Figure 6 It is a top view of this embodiment.

[0037] Figure 7 This embodiment Figure 6 Cross-sectional view along the BB axis.

[0038] Figure 8 This embodiment Figure 6 Sectional view along CC direction.

[0039] Explanation of the reference numerals: 1. chip substrate; 2. groove; 3. circular hole; 4. protrusion; 100. bottom plate; 110. mounting hole; 120. first clearance groove; 121. first connecting hole; 130. second clearance groove; 131. second connecting hole; 140. first through hole; 150. second through hole; 160. convex strip; 170. bump; 180. magnetic block; 200. pressing plate; 210. heating hole; 220. positioning hole. DETAILED DESCRIPTION

[0040] The following is combined with Figure 3-8 This application is described in further detail.

[0041] The present application embodiment discloses a workpiece carrier for patch welding, referring to Figure 3 and Figure 4A workpiece carrier for patch welding includes a base plate 100 and a pressing plate 200. The length direction of the pressing plate 200 is consistent with the length direction of the base plate 100. The top of the pressing plate 200 is used to carry the chip substrate 1. The pressing plate 200 is provided with a heating hole 210. The bottom of the pressing plate 200 is used to contact the four sides of the chip substrate 1. The bottom of the pressing plate 200 is detachably connected to the top of the pressing plate 200. The length of the pressing plate 200 is less than the length of the base plate 100, and the width of the pressing plate 200 is less than the width of the base plate 100. During the heat treatment process, the pressing plate 200 presses the four sides of the chip substrate 1 to avoid the chip substrate 1 from being warped and deformed due to heat as much as possible, thereby improving the quality of the chip substrate 1.

[0042] Reference Figure 3 and Figure 4 , two mounting holes 110 are provided at both ends of the bottom plate 100 along its length direction. Two first clearance grooves 120 are provided at both ends of the top of the bottom plate 100 along its length direction. The two first clearance grooves 120 are arranged at intervals along the width direction of the bottom plate 100, and the two first clearance grooves (120) are arranged on both sides of the pressing plate (200) along the width direction of the pressing plate (200). The length direction of the first clearance groove 120 is consistent with the width direction of the bottom plate 100, and the first clearance groove 120 is opened away from the other first clearance groove 120. A first connection hole 121 is provided in the first clearance groove 120. The first connection hole 121 is L-shaped. The depth direction of the first connection hole 121 is consistent with the vertical direction. The first connection hole 121 is provided at one end of the first clearance groove 120 along the width direction of the bottom plate 100 and close to the other first clearance groove 120. One side of the chip substrate 1 along its width direction covers above one end of the first connection hole 121 along the width direction of the bottom plate 100. The first connection hole 121 is additionally provided to facilitate operators to take the chip substrate 1 .

[0043] Reference Figure 3 and Figure 4 , three second clearance grooves 130 are provided on both sides of the top of the bottom plate 100 along its width direction, and the three second clearance grooves 130 are sequentially spaced along the length direction of the bottom plate 100, and the length direction of the second clearance groove 130 is consistent with the width direction of the bottom plate 100, and the second clearance groove 130 is opened along its length direction and away from one end of another second clearance groove 130. A second connection hole 131 is provided in the second clearance groove 130, and the second connection hole 131 is provided in a rectangular hole, and the depth direction of the second connection hole 131 is consistent with the vertical direction, and the pressing plate 200 covers one side along its width direction above the second connection hole 131 along the width direction of the bottom plate 100. The second connection hole 131 is added to facilitate the operator to take the pressing plate 200.

[0044] Reference Figure 4 and Figure 5, the bottom plate 100 is provided with first through holes 140 at both ends along its length direction, and the depth direction of the first through holes 140 is consistent with the vertical direction, and the two ends of the pressing plate 200 along its length direction are respectively covered above the two first through holes 140, and the pressing plate 200 covers above one end of the first through holes 140 along the length direction of the bottom plate 100. The first through hole 140 is arranged in a rectangular hole. The bottom plate 100 is provided with second through holes 150 at both ends along its length direction, and the two second through holes 150 are arranged between the two first through holes 140, and the depth direction of the second through holes 150 is consistent with the vertical direction, and the two ends of the chip substrate 1 along its length direction are respectively provided above the two second through holes 150, and the chip substrate 1 covers above one end of the second through hole 150 along the length direction of the bottom plate 100.

[0045] Reference Figure 3 and Figure 4 A plurality of convex strips 160 are connected to the top of the bottom plate 100 , and the convex strips 160 are arranged in the middle of the bottom plate 100 , and the plurality of convex strips 160 correspond one-to-one to the grooves 2 of the chip substrate 1 , and the convex strips 160 are used to be embedded in the grooves 2 of the chip substrate 1 , and the convex strips 160 contact the inner wall of the groove 2 of the chip substrate 1 .

[0046] Reference Figure 4 and Figure 6 Two protrusions 170 are also connected to the top of the bottom plate 100, and the two protrusions 170 are spaced apart along the length direction of the bottom plate 100.

[0047] Reference Figure 5 and Figure 7 The bump 170 is used to pass through the circular hole 3 of the chip substrate 1. The pressing plate 200 is provided with a positioning hole 220, which is used to communicate with the circular hole 3 of the chip substrate 1, and the positioning hole 220 is used for the bump 170 to pass through.

[0048] Reference Figure 3 and Figure 8 A plurality of magnetic blocks 180 are embedded at the bottom of the bottom plate 100, and the pressing plate 200 is made of iron. When the pressing plate 200 and the bottom plate 100 are close to each other, the magnetic blocks 180 and the pressing plate 200 attract each other.

[0049] The protrusion 170 passes through the positioning hole 220 , so that the pressing plate 200 is stably connected to the top of the base plate 100 .

[0050] The implementation principle of a workpiece carrier for patch welding in an embodiment of the present application is as follows: before heating the chip substrate 1, the chip is placed on the protrusion 4, and flux is added between the protrusion 4 and the chip, the chip substrate 1 is placed on the top of the bottom plate 100, and the convex strip 160 is embedded in the groove 2 of the chip substrate 1, so that the bump 170 passes through the circular hole 3 of the chip substrate 1, and the chip substrate 1 is stably placed on the top of the bottom plate 100. After the chip substrate 1 is placed, the pressing plate 200 is placed on the top of the chip substrate 1, and the bottom of the pressing plate 200 contacts the top of the chip substrate 1. When the pressing plate 200 is close to the bottom plate 100, the magnetic block 180 and the pressing plate 200 attract each other, and the bump 170 passes through the positioning hole 220, so that the pressing plate 200 is stably connected to the top of the bottom plate 100, and the pressing plate 200 presses the four sides of the chip substrate 1 to avoid the chip substrate 1 from warping and deformation during the heat treatment process as much as possible, thereby improving the quality of the chip substrate 1.

[0051] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A workpiece carrier for patch welding, characterized in that: The invention comprises a base plate (100) and a pressing plate (200), wherein the length direction of the pressing plate (200) is consistent with the length direction of the base plate (100), the pressing plate (200) is detachably connected to the top of the base plate (100), the pressing plate (200) is provided with a heating hole (210), the base plate (100) is used to carry a chip substrate (1), and the bottom of the pressing plate (200) is used to contact the chip substrate (1).

2. A workpiece carrier for patch welding according to claim 1, characterized in that: The bottom plate (100) is connected to a plurality of magnetic blocks (180), and the pressing plate (200) is made of a ferromagnetic material; when the pressing plate (200) and the bottom plate (100) are close to each other, the magnetic blocks (180) and the pressing plate (200) attract each other.

3. The workpiece carrier for patch welding according to claim 1, characterized in that: A plurality of convex strips (160) are connected to the top of the bottom plate (100), the plurality of convex strips (160) correspond one-to-one to the grooves (2) of the chip substrate (1), and the convex strips (160) are embedded in the grooves (2) of the chip substrate (1).

4. The workpiece carrier for patch welding according to claim 1, characterized in that: A bump (170) is also connected to the top of the bottom plate (100), and the bump (170) is used to pass through the circular hole (3) of the chip substrate (1).

5. The workpiece carrier for patch welding according to claim 4, characterized in that: The pressing plate (200) is provided with a positioning hole (220), the positioning hole (220) being used to communicate with the circular hole (3) of the chip substrate (1), and the positioning hole (220) being used for the bump (170) to pass through.

6. The workpiece carrier for patch welding according to claim 1, characterized in that: The bottom plate (100) is provided with first through holes (140) at both ends along its length direction for facilitating taking out the pressing plate (200); the length of the pressing plate (200) is shorter than that of the bottom plate (100); and the two ends of the pressing plate (200) along its length direction are respectively arranged above the two first through holes (140).

7. The workpiece carrier for patch welding according to claim 1, characterized in that: The top of the bottom plate (100) is provided with first clearance grooves (120) on both sides along the width direction thereof. The first clearance grooves (120) are respectively provided on both sides of the pressing plate (200) along the width direction thereof. The first clearance grooves (120) are provided with first connection holes (121) for facilitating the removal of the chip substrate (1).

8. The workpiece carrier for patch welding according to claim 7, characterized in that: A plurality of second clearance grooves (130) are provided on both sides of the top of the bottom plate (100) along the width direction thereof. The plurality of second clearance grooves (130) are sequentially spaced apart along the length direction of the bottom plate (100), and a second connection hole (131) is provided in the second clearance groove (130) for facilitating taking out the pressing plate (200).

9. The workpiece carrier for patch welding according to claim 6, characterized in that: The bottom plate (100) is provided with second through holes (150) at both ends along its length direction for facilitating taking out the chip substrate (1).

Images