Substrate heating assembly

Abstract

The utility model discloses a substrate heating assembly, and relates to the technical field of semiconductor processing equipment. The substrate heating assembly comprises a heating module, the heating module comprises N heating units arranged in the first direction, a queue formed by arranging the N heating units is provided with a head end and a tail end, the rated heating power of the M heating units closest to the head end is sequentially increased in the direction from the head end to the tail end, N is larger than or equal to 2, and M is larger than or equal to 2 and smaller than or equal to N. When the substrate is heated, the area, needing to be heated, on the substrate can sequentially pass through all the heating units from the first heating unit at the head end. Therefore, the substrate can be gradually heated from low temperature to high temperature, and the risk that the substrate is damaged due to high and low temperature stress when the substrate is directly heated at too high temperature is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing equipment, and in particular to a substrate heating assembly. Background Art

[0002] In the field of semiconductor packaging, it is sometimes necessary to heat the substrate to meet the needs of subsequent process technology. For example, the substrate needs to be heated to above 100°C. However, when the existing heating equipment heats the substrate, the substrate may be damaged due to the sudden increase in temperature. Utility Model Content

[0003] The purpose of the present application is to provide a substrate heating assembly, which can reduce the risk of damage to the substrate due to too rapid temperature rise.

[0004] The embodiment of the present application is implemented as follows:

[0005] In a first aspect, the present application provides a substrate heating assembly, comprising a heating module, wherein the heating module comprises N heating units arranged along a first direction, wherein a queue formed by the N heating units has a head end and a tail end, and the rated heating powers of the M heating units closest to the head end increase sequentially in a direction from the head end to the tail end, wherein N≥2, 2≤M≤N.

[0006] In an optional implementation, M=N=4.

[0007] In an optional embodiment, the rated heating powers of the L heating units closest to the tail end decrease sequentially in the direction from the head end to the tail end, wherein M<N, L≥2.

[0008] In an alternative embodiment, M+L=N+1.

[0009] In an optional implementation, the M=4, the L=4, and the N=7.

[0010] In an optional embodiment, the heating unit includes a PTC heating element and / or a heating wire.

[0011] In an optional embodiment, the substrate heating assembly also includes a support rail, and the heating module also includes a seat body, the seat body is connected to the support rail, the heating module can adjust its position in a second direction relative to the support rail, the second direction is perpendicular to the first direction, and the N heating units are arranged on a side of the seat body away from the support rail.

[0012] In an optional embodiment, a mounting groove extending along the first direction is provided on a side of the base body facing away from the support rail, and the N heating units are embedded in the mounting groove.

[0013] In an optional embodiment, the support rail includes a guide groove extending along the second direction, a portion of the seat body is inserted into the guide groove, a guide boss extending along the second direction is provided at the bottom of the guide groove, and a slide groove is provided on the seat body, and the slide groove cooperates with the guide boss.

[0014] In an optional embodiment, the support rail includes two support bosses spaced apart in the first direction, the support bosses extend along the second direction, a guide groove is formed between the two support bosses, and the base body is respectively provided with connecting parts on opposite sides in the first direction, and the two connecting parts are located outside the guide groove and are respectively supported on the two support bosses.

[0015] In an optional embodiment, a mating groove extending along the second direction is provided on the support boss, the bottom width of the mating groove is greater than the opening width, the connecting portion is connected to the mating groove through a connecting piece, one end of the connecting piece is connected to the connecting portion, and the other end is located in the mating groove and has a size greater than the opening width of the mating groove.

[0016] The beneficial effects of the embodiments of the present application are:

[0017] The substrate heating assembly provided in the embodiment of the present application includes a heating module, and the heating module includes N heating units arranged along a first direction. The queue formed by the arrangement of the N heating units has a head end and a tail end, and the rated heating power of the M heating units closest to the head end increases in sequence from the head end to the tail end, wherein N≥2, 2≤M≤N. When heating the substrate, the area on the substrate that needs to be heated can be made to pass through each heating unit in sequence starting from the first heating unit at the head end. The substrate first passes through the M heating units closest to the head end, and the rated heating power of these heating units increases in sequence, that is, the heating temperature increases in sequence, so the substrate will be gradually heated from low temperature to high temperature, reducing the risk of directly using an excessively high temperature to heat the substrate, causing the substrate to be damaged due to high and low temperature stress. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 is a schematic diagram of a substrate;

[0020] Figure 2This is a schematic diagram of a substrate heating assembly in one embodiment of the present application;

[0021] Figure 3 This is a schematic diagram of the parallel connection of various heating units in one embodiment of the present application.

[0022] Icon: 010-substrate heating assembly; 100-heating module; 101-head end; 102-tail end; 110-heating unit; 120-base; 122-connecting part; 200-support rail; 210-guide groove; 211-guide boss; 220-support boss; 221-matching groove; 020-substrate; 021-first heat processing area; 022-second heat processing area; 023-third heat processing area; 024-fourth heat processing area. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0026] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0027] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0028] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] In the field of semiconductor packaging, it is sometimes necessary to heat the substrate to meet the process requirements. For example, the substrate needs to be heated to above 100°C. However, when the existing heating equipment heats the substrate, the substrate may be damaged due to sudden local temperature rise and large thermal stress.

[0030] To this end, an embodiment of the present application provides a substrate heating assembly, which realizes gradient heating through a plurality of heating units with different powers (ie, different heating temperatures), thereby reducing the risk of damage to the substrate due to sudden temperature changes.

[0031] Figure 1 is a schematic diagram of a substrate 020; Figure 2 FIG. 1 is a schematic diagram of a substrate heating assembly 010 in one embodiment of the present application. Figure 1 and Figure 2 As shown, the substrate heating assembly 010 provided in the embodiment of the present application can be used to heat the substrate 020. The substrate 020 includes one or more thermal processing areas. Figure 1 As shown in the figure, the substrate 020 includes a first thermal processing area 021, a second thermal processing area 022, a third thermal processing area 023 and a fourth thermal processing area 024 arranged in sequence. These thermal processing areas need to be heated to a certain temperature and maintained for a certain time, and then cooled to room temperature. For example, they need to be heated to 180°C and maintained for 1 minute.

[0032] like Figure 2 As shown, the substrate heating assembly 010 provided in the embodiment of the present application includes a heating module 100 and a support rail 200 . The heating module 100 is installed on the support rail 200 and the position of the heating module 100 can be adjusted on the support rail 200 .

[0033] In this embodiment, the heating module 100 includes a base 120 and a plurality of heating units 110 disposed on the base 120. Specifically, the heating module 100 includes N heating units 110 arranged along a first direction (the direction indicated by arrows ab in the figure), and the queue formed by the arrangement of the N heating units 110 has a head end 101 and a tail end 102, and the rated heating power of the M heating units 110 closest to the head end 101 increases in sequence from the head end 101 to the tail end 102, wherein N≥2, 2≤M≤N. In this embodiment, the head end 101 is the end most forward in the a direction, and the tail end 102 is the end most forward in the b direction. Since the rated heating power of the M heating units 110 closest to the head end 101 increases successively in the direction from the head end 101 to the tail end 102 (i.e., direction b), the heating temperature of the hot processing area on the substrate 020 gradually increases when moving from the head end 101 to the tail end 102, thereby achieving gradient heating and reducing the risk of damage caused by excessive heating.

[0034] Figure 3 FIG. 1 is a schematic diagram of the parallel connection of the heating units 110 in one embodiment of the present application. Figure 3 As shown, in this embodiment, the heating unit 110 uses the electric heating principle for heating. The heating units 110 can be arranged in parallel. The rated heating power of the M heating units 110 closest to the head end 101 increases in the direction b, which means that under the same voltage, the temperatures of these heating units 110 are different and increase in the direction b. When the heating units 110 are connected in parallel, according to the formula P = U 2 / R (where P is heating power, U is voltage, and R is resistance), the M heating units 110 closest to the head end 101 can be set so that the resistance decreases in sequence along direction b.

[0035] In this embodiment, M=N=4. In other words, the heating module 100 includes four heating units 110, and the rated heating powers of the four heating units 110 are successively increased in the b direction. Optionally, the rated heating temperatures are 80°C, 120°C, 160°C, and 180°C, respectively. It should be understood that the heating temperature is positively correlated with the rated heating power.

[0036] In other optional embodiments, the number of heating units 110 can be increased or decreased as needed, such as 2, 3, 5, 6, 7 or even more. The above-mentioned rated heating temperature can be adjusted according to the temperature required by the substrate 020. The heating units 110 may also not be arranged in parallel, but in series or independently controlled. It should be understood that in the case of series connection, the higher the resistance value, the higher the heating power.

[0037] In the above embodiment, M=N, in other words, from the head end 101 to the tail end 102, the rated heating power of each heating unit 110 only has a gradually increasing trend. In other optional embodiments, M can be less than N, and the rated heating power of the L heating units 110 closest to the tail end 102 decreases in the direction from the head end 101 to the tail end 102, where L≥2. In other words, among the heating units 110 close to the tail end 102, the rated heating power gradually decreases along the direction from the head end 101 to the tail end 102, so as to ensure that the hot processing area on the substrate 020 is not easily damaged due to increased stress caused by rapid cooling after passing through the Mth heating unit 110 with the highest temperature.

[0038] Optionally, M, N, and L are set to satisfy: M+L=N+1. In this setting, starting from the Mth heating unit 110, the rated heating power of the L heating units 110 arranged toward the tail end 102 gradually decreases. For example, M=4, L=4, N=7, along the direction from the head end 101 to the tail end 102, the fourth heating unit 110 reaches the highest temperature, and starting from the fourth heating unit 110, the heating temperatures of the fifth, sixth, and seventh heating units 110 decrease in sequence. Specifically, the rated heating temperatures of the first to seventh heating units 110, counting from the head end 101, are 80°C, 120°C, 160°C, 180°C, 160°C, 120°C, and 80°C, respectively.

[0039] It should be understood that in other embodiments, M+L may also be less than N, that is, there may be one or more heating units 110 between the M heating units 110 near the head end 101 and the L heating units 110 near the tail end 102, and these heating units 110 can maintain the highest heating temperature, that is, the heating temperature of the Mth heating unit 110.

[0040] In the embodiment of the present application, the heating unit 110 may include a PTC heating element and / or a heating wire. The PTC heating element uses a PTC ceramic heating element, which has the advantages of low thermal resistance and high heat exchange efficiency, and is an automatic constant temperature and power-saving electric heater.

[0041] In this embodiment, the base 120 of the heating module 100 is connected to the support rail 200. The heating module 100 can adjust its position in a second direction (the direction indicated by the cd arrow in the figure) relative to the support rail 200, the second direction is perpendicular to the first direction, and the N heating units 110 are arranged on the side of the base 120 away from the support rail 200. By setting the support rail 200, the position of the heating module 100 can be adjusted to adapt to more application scenarios.

[0042] Furthermore, a mounting groove extending along the first direction is provided on one side of the base body 120 away from the support rail 200, and the N heating units 110 are embedded in the mounting groove. By arranging the heating units 110 in the mounting groove, the stability of the heating units 110 can be improved.

[0043] Further, the support rail 200 includes a guide groove 210 extending in the second direction, and a part of the seat 120 is inserted into the guide groove 210. A guide boss 211 extending in the second direction is provided at the bottom of the guide groove 210, and a slide groove is provided on the seat 120, and the slide groove cooperates with the guide boss 211. By providing the guide groove 210, the guide boss 211 and the slide groove, the support rail 200 can well limit the movement of the heating module 100 in the first direction, so that it can only move along the second direction, thereby improving the stability of the heating module 100.

[0044] Further, the support track 200 includes two support bosses 220 spaced apart in the first direction, the support bosses 220 extend along the second direction, and the guide groove 210 is formed between the two support bosses 220. The base 120 is provided with connecting parts 122 on opposite sides in the first direction, respectively, and the two connecting parts 122 are located outside the guide groove 210 and supported on the two support bosses 220 respectively. In this embodiment, the connecting parts 122 are used to connect with the support bosses 220, so as to lock the relative position of the heating module 100 and the support track 200, and ensure the stability of the heating module 100 in the process of heating the substrate 020.

[0045] In an optional embodiment, a matching groove 221 extending along the second direction is provided on the support boss 220, the bottom width of the matching groove 221 is greater than the opening width, the connecting portion 122 is connected to the matching groove 221 through a connecting member (not shown in the figure), one end of the connecting member is connected to the connecting portion 122, and the other end is located in the matching groove 221 and has a size greater than the opening width of the matching groove 221. The matching groove 221 can be a dovetail groove or an inverted T-shaped groove.

[0046] In this embodiment, a hole is provided on the connection portion 122, and the connection member can be a screw. The head of the screw is located in the matching groove 221 and is larger than the opening width of the matching groove 221. The screw rod portion of the screw passes through the matching groove 221 and the hole on the connection portion 122, and then is screwed with the nut. In this arrangement, if the position of the heating module 100 needs to be adjusted, the nut is loosened (without completely separating it from the screw), and then the heating module 100 can be moved along the second direction; after moving to the target position, the nut can be tightened. In other embodiments, the connection member can also be a T-shaped structure or a dovetail structure fixedly connected to the connection portion 122, and slidingly matched with the matching groove 221.

[0047] Below Figure 1Taking the substrate 020 shown as an example, the method of using the substrate heating assembly 010 is introduced:

[0048] The substrate 020 is parallel to the first direction and the second direction, and is close to the heating module 100, and each thermal processing area on the substrate 020 is moved along the first direction from the head end 101 to the tail end 102 of the multiple heating units 110. Specifically, the first thermal processing area 021, the second thermal processing area 022, the third thermal processing area 023, and the fourth thermal processing area 024 are arranged along the first direction, and then the first thermal processing area 021 is directly opposite or attached to the first heating unit 110 of the head end 101, and stays for a set time (for example, 1 minute). Then the substrate 020 is moved (the substrate heating assembly 010 can also be moved) so that the first thermal processing area 021 is moved to be directly opposite or attached to the second heating unit 110, and the second thermal processing area 022 is moved to be directly opposite or attached to the first heating unit 110, and stays for a set time (for example, 1 minute). And so on, until the fourth thermal processing area 024 passes the last heating unit 110 of the tail end 102, then the heating of this row of thermal processing areas is completed. It can be seen that the substrate heating assembly 010 provided in the embodiment of the present application can heat the substrate 020 from low to high in a gradient manner, so that the substrate 020 will not be damaged due to large thermal stress generated by rapid temperature rise.

[0049] In summary, the embodiment of the present application provides a substrate heating assembly 010. The substrate heating assembly 010 includes a heating module 100, and the heating module 100 includes N heating units 110 arranged along a first direction. The queue formed by the arrangement of the N heating units 110 has a head end 101 and a tail end 102. The rated heating power of the M heating units 110 closest to the head end 101 increases in sequence from the head end 101 to the tail end 102, wherein N≥2, 2≤M≤N. When heating the substrate 020, the area on the substrate 020 that needs to be heated can be made to start from the first heating unit 110 at the head end 101 and pass through each heating unit 110 in sequence. The substrate 020 first passes through the M heating units 110 closest to the head end 101, and the rated heating powers of these heating units 110 are increased successively, that is, the heating temperature is increased successively, so the substrate 020 will be gradually heated from low temperature to high temperature, reducing the risk of directly using too high a temperature to heat the substrate 020 and causing the substrate 020 to be damaged due to high and low temperature stress.

[0050] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A substrate heating assembly, characterized in that: It includes a heating module, which includes N heating units arranged along a first direction, the queue formed by the N heating units has a head end and a tail end, and the rated heating power of the M heating units closest to the head end increases successively in the direction from the head end to the tail end, wherein N≥2, 2≤M≤N.

2. The substrate heating assembly according to claim 1, characterized in that: The M=N=4.

3. The substrate heating assembly according to claim 1, characterized in that: The rated heating powers of the L heating units closest to the tail end decrease in sequence from the head end to the tail end, wherein M<N, L≥2.

4. The substrate heating assembly according to claim 3, characterized in that: The M=4, the L=4, and the N=7.

5. The substrate heating assembly according to any one of claims 1 to 4, characterized in that: The heating unit includes a PTC heating element and / or a heating wire.

6. The substrate heating assembly according to any one of claims 1 to 4, characterized in that: The substrate heating assembly also includes a support rail, and the heating module also includes a seat body, the seat body is connected to the support rail, the heating module can adjust its position in a second direction relative to the support rail, the second direction is perpendicular to the first direction, and the N heating units are arranged on a side of the seat body away from the support rail.

7. The substrate heating assembly according to claim 6, characterized in that: A mounting groove extending along the first direction is provided on one side of the base body away from the supporting track, and the N heating units are embedded in the mounting groove.

8. The substrate heating assembly according to claim 6, characterized in that: The support rail includes a guide groove extending along the second direction, a part of the seat body is inserted into the guide groove, a guide boss extending along the second direction is arranged at the bottom of the guide groove, and a slide groove is arranged on the seat body, and the slide groove cooperates with the guide boss.

9. The substrate heating assembly according to claim 8, characterized in that: The support rail includes two support bosses spaced apart in the first direction, the support bosses extend along the second direction, and the guide groove is formed between the two support bosses; the seat body is provided with connecting parts on opposite sides of the first direction, and the two connecting parts are located outside the guide groove and are respectively supported on the two support bosses.

10. The substrate heating assembly according to claim 9, characterized in that: A mating groove extending along the second direction is provided on the supporting boss, the bottom width of the mating groove is greater than the opening width, the connecting portion is connected to the mating groove through a connecting piece, one end of the connecting piece is connected to the connecting portion, and the other end is located in the mating groove and has a size greater than the opening width of the mating groove.

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