Automatic wafer positioning device and manual grinding machine

Abstract

The utility model provides an automatic wafer positioning device and a manual grinder, the automatic wafer positioning device comprises a preliminary positioning jig and a precise positioning jig, the preliminary positioning jig comprises a first driving device and a first limiting strip, and the precise positioning jig comprises a second driving device and a second limiting strip. A first driving device pushes a first limiting strip of the preliminary positioning jig to a second position, so that the first limiting strip encloses a part of area of a wafer initial placement position, an operator is guided to place a wafer, and a second driving device pushes a second limiting strip of the precise positioning jig to move to a fourth position; and the second limiting strip is promoted to push the placed wafer to a preset placement position, so that a high-precision automatic wafer positioning effect is realized. The automatic wafer positioning device is adopted in the manual grinding machine, accurate positioning of the wafer is achieved before grinding, the problem that the wafer is broken in the grinding process is solved, and therefore the production efficiency and the yield of grinding machining of the manual grinding machine are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor integrated circuit manufacturing, and relates to an automatic wafer positioning device and a manual grinding machine. Background Art

[0002] Wafer is the basis for making semiconductor integrated circuits. Its manufacturing process includes: the first step of wafer front filming, the second step of wafer back thinning, the third step of wafer front film stripping, the fourth step of wafer back silicon etching, the fifth step of wafer back high energy implantation, the sixth step of wafer back annealing, the seventh step of wafer back silicon oxide etching and the eighth step of wafer back metal evaporation. Wafer front filming can protect the front of the wafer when the back of the wafer is thinned to prevent the grinding disc from damaging the front of the wafer. Wafer back thinning is a physical mechanical back grinding, which can grind the product to the required target thickness. Among them, Z1 uses coarse grinding, Z2 uses fine grinding, and Z1 and Z2 can use different types of grinding wheels. Wafer front film stripping refers to the removal of the protective film on the front of the wafer after the back thinning process is completed. The silicon etching process on the back of the wafer generally uses wet etching, which can remove the rough texture on the back of the wafer after grinding, effectively reducing the contact resistance. High-energy injection on the back of the wafer uses back-sputtering technology to sputter aluminum, titanium, nickel, and silver onto the back of the wafer through a physical vapor deposition machine. In addition, the wafer back thinning process relies on a manual grinder. Before the grinding operation, the operator usually uses a manual positioning fixture to locate the wafer position. The manual positioning process mainly relies on human eye judgment. The wafer position positioned in this way is prone to deviation, resulting in wafer breakage during the grinding process.

[0003] Therefore, how to provide an automatic wafer positioning device and a manual grinder to achieve a high-precision automatic wafer positioning function has become an important technical problem that needs to be solved urgently by those skilled in the art.

[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present application. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide an automatic wafer positioning device and a manual grinder to solve the problem of inaccurate manual wafer positioning in the prior art and the problem of wafer breakage during the grinding process of the manual grinder due to deviation in the manual wafer positioning.

[0006] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides an automatic wafer positioning device, the automatic wafer positioning device comprising:

[0007] A preliminary positioning jig, the preliminary positioning jig comprising a first driving device and a first limiting bar, the first driving device being connected to the first limiting bar to drive the first limiting bar to move back and forth between a first position and a second position on a first side of the wafer, and when the first limiting bar is located at the second position, the first limiting bar surrounds a portion of the initial placement position of the wafer;

[0008] A precise positioning jig, the precise positioning jig comprising a second drive device and a second limit bar, the second drive device being connected to the second limit bar to drive the second limit bar to move back and forth between a third position and a fourth position on a second side arranged opposite to the first side of the wafer, when the second limit bar is located at the fourth position, the second limit bar pushes the wafer to a predetermined placement position.

[0009] Optionally, the first position, the second position, the third position and the fourth position are located on a straight line, and the straight line is parallel to the plane where the wafer is located.

[0010] Optionally, the first driving device includes a first cylinder and a first telescopic rod connected to the first cylinder; the second driving device includes a second cylinder and a second telescopic rod connected to the second cylinder.

[0011] Optionally, the first limiting strip is in an arc shape, a wave shape or a broken line shape, and the second limiting strip is in an arc shape, a wave shape or a broken line shape.

[0012] Optionally, the first limiting strip and the second limiting strip are both in the shape of arc lines, and the length of the first limiting strip and the length of the second limiting strip are both less than half of the circumference of the wafer.

[0013] Optionally, the first limit strip is wavy or zigzag, the second limit strip is wavy or zigzag, the straight-line distance between the two ends of the first limit strip is smaller than the diameter of the wafer, and the straight-line distance between the two ends of the second limit strip is smaller than the diameter of the wafer.

[0014] Optionally, a first buffer is provided on a side of the first limiting strip facing the wafer, and a second buffer is provided on a side of the second limiting strip facing the wafer.

[0015] The utility model also provides a manual grinding machine, comprising:

[0016] Grinding chamber;

[0017] A processing table, wherein the processing table is located in the grinding chamber;

[0018] A grinding disc, the grinding disc is located on the processing table, and the upper surface of the grinding disc is provided with a vacuum suction port for adsorbing the wafer;

[0019] The automatic wafer positioning device as described in any one of the above items is installed on the processing table, and the preliminary positioning fixture and the precise positioning fixture are distributed on opposite sides of the grinding disc.

[0020] Optionally, the automatic wafer positioning device is fixed on the processing table, or the automatic wafer positioning device is fixed on the cavity wall of the grinding cavity.

[0021] Optionally, the top surface of the processing table is rectangular, and the preliminary positioning jig and the precise positioning jig are located on a diagonal line of the processing table.

[0022] As described above, the automatic wafer positioning device of the utility model includes a preliminary positioning jig and a precise positioning jig, the preliminary positioning jig includes a first drive device and a first limit bar, and the precise positioning jig includes a second drive device and a second limit bar. The first drive device pushes the first limit bar of the preliminary positioning jig to the second position, so that the first limit bar surrounds a part of the initial placement position of the wafer, and guides the operator to place the wafer near the predetermined placement position. The second drive device is used to push the second limit bar of the precise positioning jig to move to the fourth position, prompting the second limit bar to move the placed wafer to the predetermined placement position, thereby achieving a high-precision automatic wafer positioning effect, and avoiding wafer position deviation relative to the manual positioning jig. The manual grinder of the utility model adopts the above-mentioned automatic wafer positioning device, which can realize the precise positioning of the wafer before grinding, improve the problem of wafer breakage during grinding by the manual grinder, and thus improve the production efficiency and yield rate of the manual grinder's grinding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Shown is a process flow diagram for a manual grinding machine.

[0024] Figure 2 Shown is a structural schematic diagram of the automatic wafer positioning device of the present utility model.

[0025] Figure 3 Shown is a schematic structural diagram of a preliminary positioning fixture of the automatic wafer positioning device of the present invention.

[0026] Figure 4 Shown is a structural schematic diagram of a precise positioning fixture of the automatic wafer positioning device of the present utility model.

[0027] Figure 5 Shown is a structural schematic diagram of the manual grinder of the utility model.

[0028] Figure 6 Shown is a top view of a processing table and the structure thereon of a manual grinder of the present invention.

[0029] Figure 7 Another structural schematic diagram of the manual grinder of the utility model is shown.

[0030] Figure 8 Shown is a flowchart of the steps of the manual grinder of the present invention.

[0031] Description of Reference Numerals

[0032] 1 Preliminary positioning of the fixture

[0033] 11. First drive unit

[0034] 111 First Cylinder

[0035] 112 First Telescopic Rod

[0036] 12 First limit bar

[0037] 2 Precision positioning fixture

[0038] 21 Second drive unit

[0039] 211 Second Cylinder

[0040] 212 Second telescopic rod

[0041] 22 Second limit bar

[0042] 3 Grinding chamber

[0043] 4 Workbench

[0044] 5 Grinding disc

[0045] 6 Vacuum suction port

[0046] D Diagonal DETAILED DESCRIPTION

[0047] The following is an explanation of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0048] It should be emphasized that the term “include / comprises” when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components.

[0049] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0050] When describing the embodiments of the present invention in detail, for the sake of convenience, the schematic diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0051] For ease of description, spatially relative terms such as "under," "below," "below," "below," "above," "on," etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

[0052] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0053] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0054] See also Figure 1 , showing a process flow chart of a manual grinding machine, including the following steps:

[0055] S1: Open the manual grinding chamber cover;

[0056] S2: Place the wafer positioning jig, place the wafer positioning jig on the grinding disc, perform manual positioning, and check the position of the positioning jig;

[0057] S3: Place the wafer into a well-positioned positioning fixture;

[0058] S4: Click vacuum adsorption to fix the wafer on the grinding disc through the vacuum adsorption port;

[0059] S5: Take out the wafer positioning jig, leaving only the wafer that has been positioned on the grinding disc, and observe whether the wafer position is offset, and check the positioning of the wafer;

[0060] S6: Close the machine cavity cover;

[0061] S7: Select the operation program;

[0062] S8: Start the operation.

[0063] Before grinding the wafer through the above process, the operator needs to manually place an external manual positioning fixture on the grinding disc to position the wafer. After positioning, the positioning fixture needs to be manually taken out, which will cause the already positioned wafer to deviate and collide with fragments. In response to this problem, the utility model designs an automatic wafer positioning device that can be used for manual grinding machines or other equipment that needs to position wafers.

[0064] Embodiment 1

[0065] This embodiment provides an automatic wafer positioning device. Figure 2 , which is a structural schematic diagram of the automatic wafer positioning device, and the automatic wafer positioning device includes a preliminary positioning fixture 1 and a precise positioning fixture 2.

[0066] As an example, see Figure 3 , which is a schematic structural diagram of the preliminary positioning jig 1 , wherein the preliminary positioning jig 1 includes a first driving device 11 and a first limiting strip 12 .

[0067] As an example, the first driving device 11 includes a first cylinder 111 and a first telescopic rod 112 connected to the first cylinder 111. The first driving device 11 is connected to the first limit bar 12 through the first telescopic rod 112. The first driving device 11 can drive the first limit bar 12 to move back and forth between a first position and a second position on the first side of the wafer.

[0068] Specifically, the first position is the starting position of the preliminary positioning jig 1, and the second position is the position where the preliminary positioning jig 1 guides the operator to place the wafer. When the first limit bar 12 is pushed to the second position by the first driving device 11, the shape of the first limit bar 12 encloses a part of the initial placement position of the wafer. The first limit bar 12 gives the approximate position for placing the wafer, guiding the operator to place the wafer near the predetermined position to prevent the subsequent wafer from moving too long during the positioning process, ensuring that the wafer is not broken due to long-distance pushing.

[0069] See also Figure 4The precise positioning fixture 2 includes a second driving device 21 and a second limiting strip 22. The second driving device 21 includes a second cylinder 211 and a second telescopic rod 212 connected to the second cylinder 211. The second driving device 21 is connected to the second limiting strip 22 through the second telescopic rod 212. The second driving device 21 can drive the second limiting strip 22 to move back and forth between a third position and a fourth position on the second side opposite to the first side of the wafer.

[0070] Specifically, the third position is the starting position of the precise positioning jig 2, and the fourth position is the position of the precise positioning jig 2 for precisely positioning the wafer. When the second limit bar 22 is located at the fourth position, the second limit bar 22 pushes the wafer to a predetermined placement position, and cooperates with the preliminary positioning jig 1 to accurately position the wafer, thereby ensuring high precision of wafer positioning.

[0071] As an example, the first position, the second position, the third position and the fourth position are located on a straight line, which is parallel to the plane where the wafer is located, and the first cylinder 111, the second cylinder 211, the first telescopic rod 112, the second telescopic rod 212, the first limit bar 12 and the second limit bar 22 are located on the same straight line, and the first limit bar 12 and the second limit bar 22 are in the same horizontal plane with the wafer, ensuring that the second limit bar 22 can contact the outer edge of the wafer and can limit and promote the movement of the wafer.

[0072] As an example, the stroke of the first telescopic rod 112 and the second telescopic rod 212 is controlled by a programmable logic controller, the input and output module of the programmable logic controller is connected to the control valve in the gas circuit of the first cylinder 111 and the second cylinder 211, the second position and the fourth position are calculated through the predetermined position of the wafer, and a preset program logic is designed. The programmable logic controller controls the extension and retraction of the first telescopic rod 112 and the second telescopic rod 212 through the control valve according to the preset program logic.

[0073] As an example, the first limiting strip 12 is in an arc, wave or fold line shape, and the second limiting strip 22 is in an arc, wave or fold line shape, which can adapt to the edges of wafers of different shapes and sizes to achieve automatic and precise positioning of wafers of different shapes and sizes.

[0074] In some embodiments, the first limit strip 12 and the second limit strip 22 are both arc-shaped, and the length of the first limit strip 12 and the length of the second limit strip 22 are both less than half of the circumference of the wafer. This ensures that when the first limit strip 12 and the second limit strip 22 work together, the first limit strip 12 and the second limit strip 22 will not collide with each other to affect the positioning of the wafer.

[0075] In other embodiments, the first limit strip 12 is wavy or broken line shaped, the second limit strip 22 is wavy or broken line shaped, the straight-line distance between the two ends of the first limit strip 12 is smaller than the diameter of the wafer, and the straight-line distance between the two ends of the second limit strip 22 is smaller than the diameter of the wafer, which also ensures that the first limit strip 12 and the second limit strip 22 will not collide with each other during operation to affect the positioning of the wafer.

[0076] As an example, a first buffer is provided on the side of the first limit bar 12 facing the wafer, and a second buffer is provided on the side of the second limit bar 22 facing the wafer. The first buffer and the second buffer are made of flexible materials, so that the first limit bar 12 contacts the edge of the wafer and the second limit bar 22 pushes the wafer to move without damaging the wafer.

[0077] The automatic wafer positioning device of this embodiment includes a preliminary positioning jig and a precise positioning jig. The preliminary positioning jig is used to preliminarily position the wafer and guide the operator to place the wafer near a predetermined placement position. The precise positioning jig is used to precisely position the wafer and can move the preliminarily placed wafer to a predetermined placement position, thereby achieving a high-precision automatic wafer positioning effect. Compared with a manual positioning jig, it avoids wafer position deviation.

[0078] Embodiment 2

[0079] This embodiment provides a manual grinder, which uses the automatic wafer positioning device described in the first embodiment.

[0080] See also Figure 5 , which is a structural schematic diagram of the manual grinder, and the manual grinder includes a grinding chamber 3, a processing table 4, a grinding disc 5 and the automatic wafer positioning device.

[0081] Specifically, the processing table 4 is located in the grinding chamber 3 , the grinding disc 5 is located on the processing table 4 , and the upper surface of the grinding disc 5 is provided with a vacuum suction port 6 for adsorbing wafers.

[0082] Specifically, the automatic wafer positioning device is installed on the processing table 4 , and the preliminary positioning jig 1 and the precise positioning jig 2 are distributed on opposite sides of the grinding disc 5 .

[0083] As an example, the automatic wafer positioning device is fixed on the processing table 4, and the first cylinder 111, the second cylinder 211, the first telescopic rod 112, the second telescopic rod 212, the first limit bar 12 and the second limit bar 22 are located above the grinding disc 5.

[0084] As an example, see Figure 6 , showing a top view of the processing table 4 and the structure thereon. The top surface of the processing table 4 is rectangular, and the preliminary positioning fixture 1 and the precise positioning fixture 2 are located on a diagonal line D of the processing table 4, so that the first telescopic rod 112 and the second telescopic rod 212 can have a larger travel space.

[0085] As an example, the predetermined placement position is the center of the grinding disc 5 .

[0086] See also Figure 8 , which is a flow chart of working steps of the manual grinding machine in this embodiment, including the following steps:

[0087] S1: Open the manual grinding chamber cover, select the operation program, start the operation, and click positioning;

[0088] S2: The preliminary positioning fixture is opened and extended to drive the first limit bar to reach a predetermined second position;

[0089] S3: inserting a wafer and placing the wafer in the wafer initial placement area surrounded by the first limiting strip;

[0090] S4: Click vacuum adsorption, the precise positioning fixture opens and extends, and drives the second limit bar to move along a predetermined path to contact the outer edge of the wafer;

[0091] S5: The second limiting bar pushes the wafer to move to a predetermined placement position;

[0092] S6: Positioning is completed, vacuum adsorption is performed, and the wafer is adsorbed and fixed on the grinding disc;

[0093] S7: The initial positioning jig and the precise positioning jig return to the starting position, and the manual grinder starts the grinding operation.

[0094] The manual grinder of this embodiment adopts the automatic wafer positioning device, so that the wafer can be accurately positioned before grinding, which improves the problem of wafer breakage during grinding by the manual grinder, thereby improving the production efficiency and yield rate of the manual grinder's grinding process.

[0095] Embodiment 3

[0096] This embodiment adopts a technical solution that is basically the same as that of the second embodiment, except that in the second embodiment, the automatic wafer positioning device is installed on the processing table 4, while in this embodiment, the automatic wafer positioning device is installed on the cavity wall of the grinding cavity 3.

[0097] As an example, see Figure 7 , which is a schematic structural diagram of the manual grinder of this embodiment.

[0098] The automatic wafer positioning device of the utility model realizes the high-precision automatic positioning function of the wafer, and solves the problem of inaccurate positioning of the manual positioning fixture; the manual grinding machine of the utility model is equipped with the above-mentioned automatic wafer positioning device, which realizes high-precision positioning of the wafer before the grinding operation, and solves the problem of wafer breakage during grinding caused by positioning wafer position deviation, and when the position of the placed wafer is offset from the center, the positioning system can also position it normally, and will not cause wafer fragments and the problem of inability to position.

[0099] In summary, the automatic wafer positioning device of the utility model includes a preliminary positioning fixture and a precise positioning fixture, the preliminary positioning fixture includes a first drive device and a first limit bar, and the precise positioning fixture includes a second drive device and a second limit bar. The first drive device pushes the first limit bar of the preliminary positioning fixture to the second position, so that the first limit bar surrounds a part of the initial placement position of the wafer, and guides the operator to place the wafer near the predetermined placement position. The second drive device is used to push the second limit bar of the precise positioning fixture to move to the fourth position, prompting the second limit bar to push the placed wafer to the predetermined placement position, thereby achieving a high-precision automatic wafer positioning effect, and avoiding wafer position deviation relative to the manual positioning fixture. The manual grinder of the utility model adopts the above-mentioned automatic wafer positioning device, which can realize the precise positioning of the wafer before grinding, improve the problem of wafer fragmentation during grinding by the manual grinder, and thus improve the production efficiency and yield rate of the manual grinder grinding process. Therefore, the utility model effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0100] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. An automatic wafer positioning device, characterized in that: include: A preliminary positioning fixture, comprising a first driving device and a first limiting bar, wherein the first driving device is connected to the first limiting bar to drive the first limiting bar to move back and forth between a first position and a second position on a first side of the wafer, and when the first limiting bar is located at the second position, the first limiting bar surrounds a portion of the initial placement position of the wafer; A precise positioning fixture includes a second driving device and a second limiting bar. The second driving device is connected to the second limiting bar to drive the second limiting bar to move back and forth between a third position and a fourth position on a second side opposite to the first side of the wafer. When the second limiting bar is located at the fourth position, the second limiting bar pushes the wafer to a predetermined placement position.

2. The automatic wafer positioning device according to claim 1, characterized in that: The first position, the second position, the third position and the fourth position are located on a straight line, and the straight line is parallel to the plane where the wafer is located.

3. The automatic wafer positioning device according to claim 1, characterized in that: The first driving device includes a first cylinder and a first telescopic rod connected to the first cylinder; the second driving device includes a second cylinder and a second telescopic rod connected to the second cylinder.

4. The automatic wafer positioning device according to claim 1, characterized in that: The first limiting strip is in an arc shape, a wave shape or a broken line shape, and the second limiting strip is in an arc shape, a wave shape or a broken line shape.

5. The automatic wafer positioning device according to claim 4, characterized in that: The first limiting strip and the second limiting strip are both in the shape of arc lines, and the length of the first limiting strip and the length of the second limiting strip are both less than half of the circumference of the wafer.

6. The automatic wafer positioning device according to claim 4, characterized in that: The first limiting strip is wavy or zigzag, the second limiting strip is wavy or zigzag, the straight-line distance between the two ends of the first limiting strip is smaller than the diameter of the wafer, and the straight-line distance between the two ends of the second limiting strip is smaller than the diameter of the wafer.

7. The automatic wafer positioning device according to claim 1, characterized in that: A first buffer is provided on a side of the first limiting strip facing the wafer, and a second buffer is provided on a side of the second limiting strip facing the wafer.

8. A manual grinding machine, characterized in that: include: Grinding chamber; A processing table, located in the grinding chamber; A grinding disc, located on the processing table, wherein the upper surface of the grinding disc is provided with a vacuum suction port for adsorbing the wafer; The automatic wafer positioning device as described in any one of claims 1 to 7 is installed in the grinding chamber, and the preliminary positioning fixture and the precise positioning fixture are distributed on opposite sides of the grinding disc.

9. The manual grinding machine according to claim 8, characterized in that: The automatic wafer positioning device is fixed on the processing table, or the automatic wafer positioning device is fixed on the cavity wall of the grinding cavity.

10. The manual grinding machine according to claim 9, characterized in that: The top surface of the processing table is rectangular, and the preliminary positioning fixture and the precise positioning fixture are located on a diagonal line of the processing table.

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