Anti-falling device for scribing machine

Abstract

The utility model discloses an anti-drop device used for a scribing machine, the scribing machine comprises a grabbing mechanism used for grabbing a wafer, the anti-drop device comprises a plurality of baffle plates movably arranged on the grabbing mechanism, each baffle plate is provided with a connecting part and a blocking part, the connecting part is movably connected with the grabbing mechanism, the blocking part is connected with the connecting part, and the blocking part is connected with the grabbing mechanism. Therefore, the blocking part enters or exits from the space below the wafer. According to the utility model, the movable baffle plate is arranged on the grabbing mechanism, and the connecting part on the baffle plate is movably connected with the grabbing mechanism, so that the blocking part on the baffle plate is driven to move relative to the wafer, and the blocking part can be positioned below the wafer to realize protection of the wafer. When the grabbing mechanism fails, the wafer is separated from the grabbing mechanism, and then the blocking part can catch the wafer, so that the wafer is prevented from falling down and being damaged, and the effect of protecting the wafer is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of dicing machines, and in particular to an anti-drop device for dicing machines. Background Art

[0002] A dicing machine is a cutting device. In the semiconductor manufacturing process, a dicing machine is required to cut wafers into chips of a predetermined size. In order to improve the cutting efficiency of the slicer, a loading preparation station is usually set near the cutting station. A wafer is grabbed by a gripping mechanism such as a suction cup at the preparation station and waits for it. When the wafer at the cutting station is cut, the wafer at the preparation station can be moved to the processing station for cutting in time, so as to reduce the idle time of the slicer and improve the efficiency of batch cutting.

[0003] However, since the gripping mechanism at the preparation station needs to grip the wafer for a long time to wait for the processing at the processing station to complete the processing, the gripping parts (such as suction cups, etc.) in the gripping mechanism are prone to failure, causing the wafer to fall from the gripping mechanism, thereby causing a series of accidents such as wafer damage. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to propose an anti-drop device for a dicing machine, which is used to solve the problem that the wafer falls and is damaged due to the failure of the gripping mechanism at the preparation station of the dicing machine in the prior art.

[0005] The utility model solves the technical problem by adopting a technical solution that is an anti-drop device for a dicing machine, wherein the dicing machine comprises a gripping mechanism for gripping a wafer, and the anti-drop device comprises:

[0006] A plurality of baffles are movably arranged on the gripping mechanism, wherein the baffles have a connecting portion and a blocking portion, and the connecting portion is movably connected to the gripping mechanism so that the blocking portion enters or exits the space below the wafer.

[0007] Furthermore, the connecting portion is slidably connected to the gripping mechanism, and the baffle can slide along the inner circle of the wafer toward or away from the outer circle of the wafer, so that the blocking portion enters or exits the space below the wafer.

[0008] Furthermore, the baffle further includes a connecting section, and the connecting portion and the blocking portion are respectively located at two ends of the connecting section.

[0009] Furthermore, the connecting section is arranged along the vertical direction, and the blocking portion is vertically fixed to the connecting section.

[0010] Furthermore, the blocking portion has a connecting end and a free end which are opposite to each other, the connecting end is fixedly connected to the blocking portion, and the blocking portion gradually tilts or bends upward along the connecting end toward the free end.

[0011] Furthermore, the connecting section is located on the inner side or the outer side of the wafer.

[0012] Furthermore, the anti-drop device also includes a driving cylinder arranged on the grasping mechanism, and a telescopic rod of the driving cylinder is fixedly connected to the connecting part.

[0013] Furthermore, the connecting portion is rotatably connected to the gripping mechanism, and the baffle can rotate relative to the gripping mechanism so that the blocking portion enters or exits the space below the wafer.

[0014] Furthermore, the anti-drop device also includes a driving motor arranged on the grasping mechanism, and the driving motor is connected to the connecting part to drive the baffle to rotate.

[0015] Furthermore, four baffles are evenly arranged along the circumference of the wafer.

[0016] Compared with the prior art, the utility model has at least the following beneficial effects:

[0017] A movable baffle is provided on the gripping mechanism, which is movably connected to the gripping mechanism through the connecting part on the baffle, thereby driving the blocking part on the baffle to move relative to the wafer, so that the blocking part can be located below the wafer to protect the wafer. When the gripping mechanism fails, the wafer is separated from the gripping mechanism, and then the blocking part can catch the wafer to prevent the wafer from falling down and being damaged, thereby protecting the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the structure of the gripping mechanism, wafer and anti-drop device in the embodiment;

[0019] Figure 2 Schematic diagram of the structure of the baffle and the driving cylinder in the embodiment;

[0020] In the figure:

[0021] 100. Grasping mechanism;

[0022] 200, baffle; 210, connecting portion; 220, blocking portion; 230, connecting section;

[0023] 300, driving cylinder;

[0024] 400. Wafer. DETAILED DESCRIPTION

[0025] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0026] Please refer to Figure 1-Figure 2 The utility model discloses an anti-drop device for a dicing machine, wherein the dicing machine comprises a gripping mechanism 100 for gripping a wafer 400, and the anti-drop device comprises:

[0027] A plurality of baffles 200 are movably disposed on the gripping mechanism 100 , and the baffles 200 have a connecting portion 210 and a blocking portion 220 . The connecting portion 210 is movably connected to the gripping mechanism 100 so that the blocking portion 220 enters or exits the space below the wafer 400 .

[0028] Specifically, the present application provides a movable baffle 200 on the gripping mechanism 100, which is movably connected to the gripping mechanism 100 through the connecting portion 210 on the baffle 200, thereby driving the blocking portion 220 on the baffle 200 to move relative to the wafer 400, so that the blocking portion 220 can be located below the wafer 400 to protect the wafer 400. When the gripping mechanism 100 fails, the wafer 400 is separated from the gripping mechanism 100, and then the blocking portion 220 can catch the wafer 400 to prevent the wafer 400 from falling downward and being damaged, thereby protecting the wafer 400.

[0029] At the same time, since the baffle 200 is movably connected to the gripping mechanism 100 , when the wafer 400 needs to be moved to a processing station, the baffle 200 can be removed so that the blocking portion 220 can avoid the space below the wafer 400 to facilitate the movement of the wafer 400 .

[0030] Furthermore, the baffle 200 is made of metal, and a layer of silicone is provided on the upper surface or the entire outer surface of the blocking portion 220. When the wafer 400 is separated from the grasping mechanism 100, the wafer 400 contacts the silicone to prevent the wafer 400 from being scratched by direct contact with the metal baffle 200. The silicone layer can protect the wafer 400.

[0031] Furthermore, the connecting portion 210 is slidably connected to the grasping mechanism 100 , and the baffle 200 can slide along the inner circle of the wafer 400 toward or away from the outer circle of the wafer 400 , so that the blocking portion 220 enters or exits the space below the wafer 400 .

[0032] Specifically, the connecting part 210 and the grasping mechanism 100 are slidably connected. Through the sliding of the connecting part 210 and the grasping mechanism 100, the blocking part 220 is driven to move laterally, so that it is located below the wafer 400 to protect the wafer 400, or to avoid the space below the wafer 400 to facilitate the movement of the wafer 400.

[0033] Furthermore, the baffle 200 further includes a connecting section 230 , and the connecting portion 210 and the blocking portion 220 are respectively located at two ends of the connecting section 230 .

[0034] Since the gripping mechanism 100 is located above the wafer 400 and the blocking portion 220 needs to be disposed below the wafer 400 , a connecting section 230 is required to connect the blocking portion 220 and the connecting portion 210 so that the baffle 200 can extend from above the wafer 400 to below the wafer 400 .

[0035] Furthermore, the connecting section 230 is arranged along the vertical direction, and the blocking portion 220 is vertically fixed to the connecting section 230 .

[0036] Specifically, the connecting section 230 is vertically arranged, the blocking portion 220 is horizontally arranged, and the blocking portion 220 and the connecting section 230 are perpendicular to each other. When the grasping mechanism 100 fails, the horizontally arranged blocking portion 220 can hold up the wafer 400 to play a protective role.

[0037] Furthermore, the blocking portion 220 has a connecting end and a free end which are opposite to each other, the connecting end is fixedly connected to the blocking portion 220, and the blocking portion 220 is gradually inclined or bent upward along the connecting end toward the free end.

[0038] Specifically, when the wafer 400 falls downward to the blocking portion 220, the blocking portion 220 deforms downward to achieve buffering, thereby protecting the wafer 400 and preventing the wafer 400 from being damaged by falling too fast. Importantly, since the blocking portion 220 gradually tilts upward from the connection end to the free end, after the blocking portion 220 deforms downward at a certain angle, the blocking portion 220 remains in a roughly horizontal posture, and does not tilt downward at too large an angle to cause the blocking portion 220 to be unable to catch the wafer 400, so that the blocking portion 220 can still catch the wafer 400 under the premise of having a certain deformation angle.

[0039] Furthermore, the connecting section 230 is located inside or outside the wafer 400 .

[0040] The connection section 230 can be arranged on the inner side or the outer side of the wafer 400 according to the use conditions on site, so as to reasonably utilize the space and avoid other devices.

[0041] Furthermore, the anti-drop device further includes a driving cylinder 300 disposed on the grasping mechanism 100 , and a telescopic rod of the driving cylinder 300 is fixedly connected to the connecting portion 210 .

[0042] Specifically, by driving the telescopic rod of the cylinder 300 to extend and retract, the baffle 200 is driven to move laterally, so that the blocking portion 220 is located below the wafer 400 or withdraws from the space below the wafer 400 .

[0043] Furthermore, the connecting portion 210 is rotatably connected to the grasping mechanism 100 , and the baffle 200 can rotate relative to the grasping mechanism 100 , so that the blocking portion 220 enters or exits the space below the wafer 400 .

[0044] Furthermore, the anti-drop device also includes a driving motor disposed on the grabbing mechanism 100 , and the driving motor is connected to the connecting portion 210 to drive the baffle 200 to rotate.

[0045] Of course, the baffle 200 may also be configured to be rotatable, and the baffle 200 may be driven to rotate by a driving motor so that the blocking portion 220 is located below the wafer 400 or exits the space below the wafer 400 .

[0046] Furthermore, four baffles 200 are evenly arranged along the circumference of the wafer 400 .

[0047] Four baffles 200 are evenly arranged around the circumference of the wafer 400 . The four baffles 200 can receive the wafer 400 at the same time to improve the protection effect of the wafer 400 .

[0048] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0049] In addition, in the present invention, the descriptions of "first", "second", "one", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0050] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

Claims

1. A falling prevention device for a dicing machine, the dicing machine comprising a gripping mechanism for gripping a wafer, characterized in that: The anti-fall device comprises: A plurality of baffles are movably arranged on the gripping mechanism, wherein the baffles have a connecting portion and a blocking portion, and the connecting portion is movably connected to the gripping mechanism so that the blocking portion enters or exits the space below the wafer.

2. The anti-drop device for a dicing machine according to claim 1, characterized in that: The connecting portion is slidably connected to the grasping mechanism, and the baffle can slide along the inner circle of the wafer toward or away from the outer circle of the wafer, so that the blocking portion enters or exits the space below the wafer.

3. The anti-drop device for a dicing machine according to claim 2, characterized in that: The baffle further includes a connecting section, and the connecting portion and the blocking portion are respectively located at two ends of the connecting section.

4. The anti-drop device for a dicing machine according to claim 3, characterized in that: The connecting section is arranged along the vertical direction, and the blocking portion is vertically fixed to the connecting section.

5. The anti-drop device for a dicing machine according to claim 3, characterized in that: The blocking portion has a connecting end and a free end which are opposite to each other, the connecting end is fixedly connected to the blocking portion, and the blocking portion is gradually inclined or bent upward along the connecting end toward the free end.

6. The anti-drop device for a dicing machine according to claim 3, characterized in that: The connecting section is located inside or outside the wafer.

7. The anti-drop device for a dicing machine according to claim 2, characterized in that: The anti-drop device also includes a driving cylinder arranged on the grasping mechanism, and a telescopic rod of the driving cylinder is fixedly connected to the connecting part.

8. The anti-drop device for a dicing machine according to claim 1, characterized in that: The connecting portion is rotatably connected to the grasping mechanism, and the baffle can rotate relative to the grasping mechanism so that the blocking portion enters or exits the space below the wafer.

9. The anti-drop device for a dicing machine according to claim 8, characterized in that: The anti-drop device also includes a driving motor arranged on the grabbing mechanism, and the driving motor is connected to the connecting part to drive the baffle to rotate.

10. An anti-drop device for a dicing machine according to any one of claims 1 to 9, characterized in that: Four baffles are evenly arranged along the circumference of the wafer.

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