Optical coupler, circuit board and device for reducing infrared light transmittance

Abstract

The utility model provides an optocoupler for reducing infrared light transmittance, a circuit board and a device thereof, the optocoupler for reducing infrared light transmittance comprises a light emitting module for emitting a light signal and a light-transmitting packaging module covering the light emitting module, and the light-transmitting packaging module comprises a first light-transmitting package and a second light-transmitting package. The first light-transmitting packaging is white light-transmitting silica gel, and the second light-transmitting packaging silica gel is a temperature-control light-transmitting material. Through the first light-transmitting package, the light transmittance of the light emitting module can be reduced, the current transmission ratio of the photoelectric coupler can be reduced, through the second light-transmitting package, the light transmittance of the light emitting module can be further controlled under the condition that the temperature rises when a circuit works, and the working stability of the photoelectric coupler is improved.

Description

Technical Field

[0001] The present application relates to the field of optical coupling, and in particular to an optical coupling, a circuit board and a device thereof for reducing infrared transmittance. Background Art

[0002] Optocoupler (photoelectric coupler) is an electric-optical-electrical conversion device that uses light as a medium to transmit electrical signals. It plays an important role in various circuits and systems and has good electrical insulation and anti-interference capabilities. With the continuous advancement of technology, the types and application areas of optocouplers are also expanding. Optocouplers include a light source and a photoreceiver. By connecting an electrical signal to the input end of the optocoupler, the light source emits light. When the light is irradiated on the packaged photoreceiver, a photocurrent is generated due to the photoelectric effect, which is drawn out from the output end of the photoreceiver, realizing the electric-optical-electrical conversion.

[0003] In applications, if the transmittance between the optocoupler light source and the light receiver is too high, the light receiver may receive too many light signals, thereby increasing the signal interference between the input and output. At the same time, some optocouplers require low energy transmission efficiency, and the temperature rises when the circuit is working, requiring the transmittance of the optocoupler to be controlled. Utility Model Content

[0004] The main purpose of the embodiments of the present application is to propose an optical coupler, a circuit board and a device thereof that reduce infrared transmittance, so as to reduce signal interference in the optical coupler and reduce energy transmission efficiency.

[0005] To achieve the above-mentioned purpose, a first aspect of an embodiment of the present application provides an optical coupler for reducing infrared transmittance, the optical coupler comprising:

[0006] An optical transmission module, wherein the optical transmission module is used to transmit an optical signal;

[0007] A light-transmitting packaging module covering the light-emitting module, through which infrared transmittance is reduced;

[0008] The light-transmitting packaging module includes a first light-transmitting packaging and a second light-transmitting packaging, the first light-transmitting packaging is white light-transmitting silicone, and the second light-transmitting packaging silicone is a temperature-controlled light-transmitting material.

[0009] According to the optical coupler with reduced infrared transmittance provided in some embodiments of the present application, the first light-transmitting package covers the light emitting module, and the second light-transmitting package covers the first light-transmitting package.

[0010] According to the optical coupler with reduced infrared transmittance provided in some embodiments of the present application, the optical coupler also includes a light receiving module, and the light receiving module is used to receive the light signal emitted by the light transmitting module.

[0011] According to some embodiments of the present application, an optical coupler for reducing infrared transmittance is provided, the optical coupler includes:

[0012] An optical coupler housing, wherein the optical transmitting module and the optical receiving module are arranged in the optical coupler housing.

[0013] According to the optical coupler with reduced infrared transmittance provided in some embodiments of the present application, the light emitting module is a light emitting diode.

[0014] According to the optical coupler with reduced infrared transmittance provided in some embodiments of the present application, the light receiving module is a photosensor.

[0015] According to the optical coupler for reducing infrared transmittance provided in some embodiments of the present application, the light receiving module is arranged in parallel with the light transmitting module.

[0016] According to the optical coupler with reduced infrared transmittance provided in some embodiments of the present application, the optical coupler housing is a light-opaque housing.

[0017] To achieve the above-mentioned purpose, the second aspect of the embodiments of the present application proposes a circuit board with an optical coupler with reduced infrared transmittance, and the circuit board includes the optical coupler with reduced infrared transmittance as described in the first aspect of the embodiments of the present application.

[0018] To achieve the above-mentioned purpose, a third aspect of an embodiment of the present application proposes a device with an optical coupler having reduced infrared transmittance, wherein the device includes the circuit board described in the second aspect of an embodiment of the present application.

[0019] The present application proposes an optical coupler, a circuit board and a device thereof for reducing infrared transmittance. The optical coupler for reducing infrared transmittance includes an optical transmitter module for transmitting optical signals and a light-transmitting packaging module covering the optical transmitter module. The light-transmitting packaging module includes a first light-transmitting packaging and a second light-transmitting packaging. The first light-transmitting packaging is white light-transmitting silicone, and the second light-transmitting packaging silicone is a temperature-controlled light-transmitting material. Through the first light-transmitting packaging, it is possible to reduce the transmittance of the light-transmitting module and reduce the current transfer ratio of the optocoupler. Through the second light-transmitting packaging, when the temperature rises during circuit operation, the transmittance of the light-transmitting module can be further controlled to improve the stability of the optical coupler. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of a cross-sectional structure of an optical coupler for reducing infrared transmittance provided in an embodiment of the present application;

[0021] Figure 2 It is a partial structural schematic diagram of an optical coupler for reducing infrared transmittance provided in an embodiment of the present application.

[0022] Reference numerals:

[0023] The optical transmitting module 100 , the light-transmitting packaging module 200 , the first light-transmitting packaging 201 , the second light-transmitting packaging 202 , the optical receiving module 300 , and the optical coupling housing 400 . DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] It should be noted that, although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first", "second", etc. in the specification, claims and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0027] Optocoupler (photoelectric coupler) is an electric-optical-electrical conversion device that uses light as a medium to transmit electrical signals. It plays an important role in various circuits and systems and has good electrical insulation and anti-interference capabilities. With the continuous advancement of technology, the types and application areas of optocouplers are also expanding. Optocouplers include a light source and a photoreceiver. By connecting an electrical signal to the input end of the optocoupler, the light source emits light. When the light is irradiated on the packaged photoreceiver, a photocurrent is generated due to the photoelectric effect, which is drawn out from the output end of the photoreceiver, realizing the electric-optical-electrical conversion.

[0028] Current Transfer Ratio (CTR) is an important parameter of optocouplers. It describes the proportional relationship between the output current and input current of optocouplers. It is an important parameter in optocoupler performance evaluation and application design. It reflects the proportional relationship between the output current and input current of optocouplers and is affected by many factors. When designing and applying optocouplers, the characteristics of CTR need to be fully considered to ensure the performance and stability of the circuit.

[0029] In applications, if the transmittance between the optocoupler light source and the light receiver is too high, the light receiver may receive too many light signals, thereby increasing the signal interference between the input and output. At the same time, the temperature rises when the circuit is working, requiring the transmittance of the optocoupler to be controlled.

[0030] Based on this, the embodiments of the present application propose an optical coupler, a circuit board and a device thereof for reducing infrared transmittance, which can reduce the transmittance of the optical coupler to reduce signal interference in the optical coupler and reduce the energy transmission efficiency.

[0031] Please refer to Figure 1 , is a schematic cross-sectional structure diagram of an optical coupler for reducing infrared transmittance provided in an embodiment of the present application, such as Figure 1 As shown, the optical coupler for reducing infrared transmittance proposed in the present application includes a light transmitting module 100 , a light-transmitting packaging module 200 , a light receiving module 300 and an optical coupler housing 400 .

[0032] It should be noted that in the embodiment of the present application, the light emitting module 100 can be a light emitting diode. When a forward voltage is applied to the light emitting diode, it can convert electrical energy into light energy and emit light. The light emitting diode can be driven by a DC, AC, pulse or other power source, but the light emitting diode must be applied with a forward voltage when in use. The optical coupler for reducing infrared transmittance provided in the embodiment of the present application transmits a light signal through the light emitting module 100 to realize the conversion of electrical signals into optical signals.

[0033] The light-transmitting packaging module 200 is used to reduce the intensity of the optical signal emitted by the optical transmitting module 100 , that is, to reduce the light transmittance of the optical coupler.

[0034] Please refer to Figure 2 , is a partial structural schematic diagram of an optical coupler for reducing infrared transmittance provided in an embodiment of the present application, such as Figure 2 As shown, in the embodiment of the present application, the light-transmitting packaging module 200 is covered on the light-emitting module 100 , and the light-transmitting packaging module 200 includes a first light-transmitting packaging 201 and a second light-transmitting packaging 202 .

[0035] It should be noted that, in the embodiment of the present application, the first light-transmitting package is white light-transmitting silicone, which is obtained by mixing silicone with white pigment silica paste, wherein the white pigment silica paste is composed of 20% silicone oil and 80% silicone powder, and the content of the white pigment silica paste is generally less than 3%.

[0036] The second light-transmitting encapsulation silica gel is a temperature-controlled light-transmitting material. Exemplarily, the second light-transmitting encapsulation may be a polycarbonate sheet or a temperature-controlled glass, which is a light-transmitting material whose transmittance can change with temperature.

[0037] It should be noted that, in the embodiment of the present application, the first light-transmitting package 201 covers the optical transmission module 100 , and the second light-transmitting package 202 covers the first light-transmitting package.

[0038] It can be understood that in the embodiment of the present application, the transmittance of the optocoupler can be reduced by the first light-transmitting package, and the second light-transmitting package, based on the first light-transmitting package, allows the optocoupler element to change its transmittance as the temperature changes, thereby further reducing the light energy transmission efficiency and meeting the transmission efficiency requirements.

[0039] The material of the second light-transmitting package can be selected according to actual requirements to select the temperature at which its transmittance changes, so as to adapt to the working environment of the optocoupler, so that it can maintain the required transmittance in a specific environment to control the current transfer ratio of the optocoupler.

[0040] It should be noted that, in the embodiment of the present application, the optical coupler further includes a light receiving module 300 , and the light receiving module 300 is used to receive the optical signal transmitted by the light transmitting module 100 .

[0041] For example, the optical receiving module 300 of the embodiment of the present application can be a photosensitive device, which is generally a photosensitive transistor, and works on the principle that when a reverse voltage is applied to a PN junction, the reverse resistance changes from large to small under light irradiation. The optical signal emitted by the optical transmitting module 100 is received by the optical receiving module 300 to realize the conversion of the optical signal into the electrical signal.

[0042] It should be noted that in the embodiment of the present application, the optical receiving module and the optical transmitting module are arranged in parallel, which is beneficial to the transmission of optical signals between the optical transmitting module 100 and the optical receiving module 300 .

[0043] The optical coupler further includes an optical coupler housing 400 , in which the optical transmitting module 100 and the optical receiving module 300 are disposed.

[0044] The optical coupling housing 400 protects the optical transmitting module 100 and the optical receiving module 300 .

[0045] It should be noted that the optocoupler housing is a light-proof housing, and the use of the light-proof housing prevents external interference with the optical signal transmission of the optocoupler.

[0046] An embodiment of the present application also provides a circuit board with an optical coupler with reduced infrared transmittance, and the circuit board includes the optical coupler with reduced infrared transmittance provided by any embodiment of the present application.

[0047] An embodiment of the present application also provides a device having an optical coupler capable of reducing infrared transmittance, and the device includes a circuit board having an optical coupler capable of reducing infrared transmittance provided by an embodiment of the present application.

[0048] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0049] Those skilled in the art will appreciate that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0050] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0051] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0052] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0053] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0054] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0055] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0056] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0057] The preferred embodiments of the present disclosure are described above with reference to the accompanying drawings, but the scope of the rights of the present disclosure is not limited thereto. Any modification, equivalent substitution and improvement made by those skilled in the art without departing from the scope and essence of the present disclosure should be within the scope of the rights of the present disclosure.

Claims

1. An optical coupler for reducing infrared transmittance, characterized in that: The optical coupler comprises: An optical transmission module, wherein the optical transmission module is used to transmit an optical signal; A light-transmitting packaging module covering the light-emitting module, through which infrared transmittance is reduced; The light-transmitting packaging module includes a first light-transmitting packaging and a second light-transmitting packaging, the first light-transmitting packaging is white light-transmitting silicone, and the second light-transmitting packaging silicone is a temperature-controlled light-transmitting material.

2. The optical coupler for reducing infrared transmittance according to claim 1, characterized in that: The first light-transmitting package covers the light-emitting module, and the second light-transmitting package covers the first light-transmitting package.

3. The optical coupler for reducing infrared transmittance according to claim 1, characterized in that: The optical coupler further includes a light receiving module, and the light receiving module is used to receive the light signal emitted by the light emitting module.

4. The optical coupler for reducing infrared transmittance according to claim 3, characterized in that: The optical coupler comprises: An optical coupler housing, wherein the optical transmitting module and the optical receiving module are arranged in the optical coupler housing.

5. The optical coupler for reducing infrared transmittance according to claim 1, characterized in that: The light emitting module is a light emitting diode.

6. The optical coupler for reducing infrared transmittance according to claim 3, characterized in that: The light receiving module is a photosensitive device.

7. The optical coupler for reducing infrared transmittance according to claim 3, characterized in that: The optical receiving module is arranged in parallel with the optical transmitting module.

8. The optical coupler for reducing infrared transmittance according to claim 4, characterized in that: The optical coupler housing is a light-proof housing.

9. A circuit board, characterized in that: The circuit board includes an optical coupler that reduces infrared transmittance according to any one of claims 1 to 8.

10. A circuit device, characterized in that: The circuit device comprises the circuit board according to claim 9.

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