Single-tower double-fan radiator

Abstract

The utility model discloses a single-tower double-fan radiator, and relates to the technical field of radiators. The single-tower double-fan radiator comprises a base, a heat pipe, a radiating fin group and a fan. And the radiating fin group is provided with a hollow mounting channel. The fans comprise a first fan installed on one outer side face of the heat dissipation fin set and a second fan placed in the installation channel and parallel to the first fan. A first air inlet surface of the first fan is opposite to the radiating fin group, and a first air outlet surface of the first fan faces the radiating fin group; the second air inlet face of the second fan faces the first air outlet face of the first fan, and the second air outlet face of the second fan is opposite to the first air outlet face of the first fan. By adopting the technical scheme, on the premise that the weight of the radiator is not greatly increased, the radiating effect of the radiator is further improved, and the radiating requirement of a high-performance chip can be met.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a single-tower dual-fan radiator. Background Art

[0002] In current computer hardware technology, as the core component, the chip has been continuously improving in performance, and the heat dissipation problem has become increasingly prominent. As the key equipment to solve this problem, the performance of the chip heat sink directly affects the stability and service life of the chip.

[0003] At present, common chip air-cooled radiators are mainly classified into single-tower and multi-tower types according to the number of cooling fin groups. Among them, air-cooled radiators are widely used due to their simple structure and easy maintenance. However, there is still room for improvement in the heat dissipation efficiency of existing air-cooled radiators. Especially for single-tower air-cooled radiators, due to the relatively small number of fin groups and small heat dissipation power, it is difficult to meet the heat dissipation requirements of high-performance chips; however, due to its small mass, it has good anti-drop ability during transportation. Although the multi-tower air-cooled radiator has a large heat dissipation power, it has a poor anti-drop ability due to its large mass and the fin group often only relies on heat pipes for positioning and support, which makes it easy to be damaged during transportation. Utility Model Content

[0004] The purpose of the utility model is to provide a single-tower dual-fan radiator in view of the defects and shortcomings of the prior art, which has the advantage of further improving the heat dissipation effect of the radiator without significantly increasing the weight of the radiator, and can meet the heat dissipation requirements of high-performance chips.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is: a single-tower dual-fan radiator, including: a base, a heat pipe, a heat dissipation fin group and a fan;

[0006] The heat dissipation fin group has a hollow installation channel;

[0007] The fan comprises: a first fan installed on an outer side of the heat dissipation fin group, and a second fan placed in the installation channel and arranged parallel to the first fan;

[0008] The first air inlet surface of the first fan faces away from the heat dissipation fin group, and the first air outlet surface of the first fan faces toward the heat dissipation fin group;

[0009] The second air inlet surface of the second fan faces the first air outlet surface of the first fan, and the second air outlet surface of the second fan faces away from the first air outlet surface of the first fan.

[0010] The utility model is further arranged that a cover plate is arranged on one end of the heat dissipation fin group away from the base; and the second fan is installed on the cover plate.

[0011] The utility model is further arranged that a mounting plate extending into the mounting channel and for mounting the second fan is arranged on the surface of the cover plate facing the base.

[0012] The utility model is further arranged that a first mounting hole is provided on the mounting plate, and a second mounting hole corresponding to the first mounting hole is provided on the second fan.

[0013] The utility model is further configured that two mounting plates are provided and are arranged diagonally.

[0014] The utility model is further arranged that the mounting plate is formed by bending a part of the structure of the cover plate.

[0015] The utility model further arranges that the heat pipe extends from one end of the heat dissipation fin group close to the cover plate, the cover plate is provided with a positioning hole corresponding to the heat pipe, and the cover plate is installed on the heat pipe through the positioning hole by interference fit.

[0016] The utility model is further configured that the first fan and the second fan rotate in opposite directions.

[0017] The utility model is further configured that the blades of the first fan and the second fan are both forward-swept wings or backward-swept wings, and the bending directions of the two are opposite; or the blades of the first fan and the second fan, one is a forward-swept wing and the other is a backward-swept wing, and the bending directions of the two are the same.

[0018] After adopting the above technical scheme, the beneficial effects of the utility model are as follows: in the utility model, by adopting dual fans and a heat dissipation fin group with a hollow installation channel, the first fan is installed on an outer side of the heat dissipation fin group, the second fan is placed in the installation channel, and the first air inlet surface of the first fan is facing away from the heat dissipation fin group, the first air outlet surface is facing the heat dissipation fin group, the second air inlet surface of the second fan is facing the first air outlet surface of the first fan, and the second air outlet surface is facing away from the first air outlet surface of the first fan; therefore, when the radiator is working, the first fan blows air toward the heat dissipation fin group to take away the heat of the heat dissipation fin group, thereby achieving After achieving the heat dissipation effect, the second air inlet surface of the second fan installed in the channel sucks in the air blown by the first fan and blows it out from the second air outlet surface. The air passes through the other side of the cooling fin group and is finally blown out from the gap of the cooling fin group, further improving the heat dissipation effect. Compared with the traditional single-tower radiator, it adopts a dual-fan design, which makes the air flow rate between the fin groups higher, the air temperature difference between the fins is larger, the heat dissipation efficiency is higher, and it can meet the heat dissipation needs of high-performance chips; compared with the traditional multi-tower radiator, it only has a single tower, with smaller mass, better drop test performance, and lower risk of damage during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 It is a schematic diagram of the structure of a single-tower dual-fan radiator;

[0021] Figure 2 It is an exploded schematic diagram of the second fan being taken out from the upper end of the installation channel;

[0022] Figure 3 It is an exploded diagram of a single tower dual fan radiator;

[0023] Figure 4 This is an exploded diagram of a single-tower dual-fan radiator from another perspective;

[0024] Figure 5 It is a schematic diagram of the structure of the cover;

[0025] Figure 6 It is a schematic diagram of the fan structure.

[0026] Explanation of the reference numerals: 10, heat pipe; 20, base; 30, heat sink fin group; 31, mounting channel; 32, cover plate; 321, mounting plate; 3211, first mounting hole; 322, positioning hole; 40, fan; 41, first fan; 411, first air inlet surface; 412, first air outlet surface; 42, second fan; 421, second air inlet surface; 422, second air outlet surface; 423, second mounting hole; 4231, positioning protrusion. DETAILED DESCRIPTION

[0027] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0028] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

[0029] This embodiment relates to a single-tower dual-fan radiator. Figure 1-Figure 4 , including a base 20, a heat pipe 10, a heat dissipation fin group 30 and a fan 40.

[0030] The heat sink fin group 30 has a hollow installation channel 31. The fan 40 includes a first fan 41 and a second fan 42. The first fan 41 is installed on an outer side of the heat sink fin group 30, and the second fan 42 is placed in the installation channel 31 and arranged parallel to the first fan 41. The first air inlet surface 411 of the first fan 41 faces away from the heat sink fin group 30, and the first air outlet surface 412 faces toward the heat sink fin group 30. The second air inlet surface 421 of the second fan 42 faces toward the first air outlet surface 412 of the first fan 41, and the second air outlet surface 422 faces away from the first air outlet surface 412 of the first fan 41. When the radiator is working, the first fan 41 blows air toward the cooling fin group 30, taking away the heat of the cooling fin group 30, achieving the cooling effect. Then, the second air inlet surface 421 of the second fan 42 in the installation channel 31 inhales the air blown by the first fan 41, and blows it out from the second air outlet surface 422. The air passes through the other side of the cooling fin group 30, and finally blows out from the gap of the cooling fin group 30, further improving the cooling effect and meeting the cooling requirements of high-performance chips. It should be emphasized that in this embodiment, the second air inlet surface 421 of the second fan 42 not only inhales the air blown by the first fan 41, but also inhales the air coming in from other directions of the outside world. It should be emphasized that in this embodiment, part of the wind blown by the first air outlet surface 412 of the first fan 41 flows to the second air inlet surface 421 of the second fan 42, and the other part flows to other directions of the cooling fin group 30.

[0031] In this embodiment, refer to Figure 1-Figure 2 A cover plate 32 is provided on one end of the heat dissipation fin group 30 away from the base 20; the second fan 42 is installed on the cover plate 32. The setting of the cover plate 32 can provide a stable installation platform for the second fan 42, ensure that the second fan 42 remains stable when running at high speed, reduce vibration, ensure that the second fan 42 and the first fan 41 remain on the same horizontal plane, which is conducive to forming an efficient air flow channel, guiding the wind blown by the first fan 41 to flow more concentratedly to the second fan 42, and improving the heat dissipation effect.

[0032] In this embodiment, refer to Figure 2-Figure 5 A mounting plate 321 extending into the mounting channel 31 for mounting the second fan 42 is provided on the surface of the cover plate 32 facing the base 20. The mounting plate 321 provides a precise mounting position for the second fan 42.

[0033] In this embodiment, a first mounting hole 3211 is provided on the mounting plate 321, and a second mounting hole 423 corresponding to the first mounting hole 3211 is provided on the second fan 42. The corresponding design of the first mounting hole 3211 and the second mounting hole 423 ensures that the second fan 42 can be accurately installed at the predetermined position. Specifically in this embodiment, the first mounting hole 3211 and the second mounting hole 423 are fixed by screws passing through the two holes. In other embodiments, the first mounting hole 3211 and the second mounting hole 423 can also be fixed by other fasteners.

[0034] Specifically in this embodiment, refer to Figure 4 , Figure 6 The second fan 42 is provided with a positioning protrusion 4231 which is located around the second mounting hole 423 and protrudes outward. The positioning protrusion 4231 corresponds to the first mounting hole 3211 of the mounting plate 321, so that when the second fan 42 is mounted on the cover plate 32, the second mounting hole 423 limits the first mounting hole 3211, which is convenient for fixed connection.

[0035] In this embodiment, refer to Figure 5 There are two mounting plates 321 , which are arranged diagonally, thereby enhancing the stability of the installation of the second fan 42 .

[0036] In this embodiment, the mounting plate 321 is formed by bending a part of the structure of the cover plate 32 , and the integrated design of the cover plate 32 and the mounting plate 321 simplifies the manufacturing process.

[0037] In this embodiment, refer to Figure 1 , Figure 3-Figure 5 The heat pipe 10 extends from one end of the heat dissipation fin group 30 close to the cover plate 32. The cover plate 32 is provided with a positioning hole 322 corresponding to the heat pipe 10. The cover plate 32 is installed on the heat pipe 10 through the positioning hole 322 by interference fit. The interference fit installation design between the heat pipe 10 and the cover plate 32 improves the heat conduction efficiency, reduces the connection components, and reduces the cost.

[0038] Specifically in this embodiment, the cover plate 32 is a heat dissipation fin. Using the cover plate 32 as a heat dissipation fin not only increases the heat dissipation area but also reduces the manufacturing cost. In other embodiments, the cover plate can be other heat-conducting materials.

[0039] In this embodiment, the installation channel 31 is in a rectangular parallelepiped shape. In other embodiments, the installation channel 31 may also be in other shapes.

[0040] In this embodiment, the first fan 41 and the second fan 42 are both the same in shape and size, but the thickness of the second fan 42 is smaller than the thickness of the second fan 42 and smaller than the width of the installation channel 31, so that the second fan 42 can be placed in the installation channel 31. In other embodiments, the first fan 41 and the second fan 42 may also be different in shape and size.

[0041] In this embodiment, refer to Figure 6 , the first fan 41 rotates in opposite directions to the second fan 42. When the cold air passes through one side of the heat sink fin group through the first fan 41, since the bending direction of the blades of the second fan 42 is opposite to that of the blades of the first fan 41, the direction of rotation is opposite, resulting in more air directly contacting the working surface of the blades of the second fan 42 and blowing toward the other side of the heat sink fin group. As a result, more air can pass through the second fan 42 and blow toward the heat sink fin group, significantly improving the heat dissipation effect.

[0042] In the present embodiment, the blades of the first fan 41 and the second fan 42 are both forward-swept wings or swept wings, and the bending directions of the two are opposite, which can further optimize the direction and speed of the airflow and reduce the mutual interference between the airflows. The forward-swept wing or swept wing design helps to maintain the stability of the airflow, and the opposite bending directions ensure that the airflow can enter and discharge more orderly when passing through the heat sink fin group 30, thereby improving the heat dissipation effect. In other embodiments, the blades of the first fan 41 and the second fan 42 are one forward-swept wing and the other swept wing, and the two have the same bending direction. Such a combination can achieve complementary airflow characteristics. The forward-swept wing design provides strong airflow acceleration, while the swept wing maintains a stable airflow output. Together, they can cover the heat dissipation area more comprehensively and improve the heat dissipation effect.

[0043] In some embodiments, the first fan 41 and the second fan 42 may rotate in the same direction.

[0044] The working principle of the present invention is roughly as follows: when the radiator is working, the first fan 41 blows air to the cooling fin group 30, taking away the heat of the cooling fin group 30, thereby achieving the heat dissipation effect. Then, the second air inlet surface 421 of the second fan 42 installed in the channel 31 inhales the air blown by the first fan 41 and blows it out from the second air outlet surface 422. The air passes through the other side of the cooling fin group 30 and is finally blown out from the gap of the cooling fin group 30, thereby further improving the heat dissipation effect. Compared with the traditional single-tower radiator, a dual-fan design is adopted, which makes the air flow rate between the cooling fin group 30 higher, the air temperature difference between the fins is larger, the heat dissipation efficiency is higher, and the heat dissipation requirements of high-performance chips can be met. Compared with the traditional multi-tower radiator, there is only a single tower, the mass is smaller, the drop test performance is better, and the risk of damage during transportation is smaller. Therefore, without significantly increasing the weight of the radiator, the heat dissipation effect of the radiator is further improved, which can meet the heat dissipation requirements of high-performance chips.

[0045] The above is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.

Claims

1. A single-tower dual-fan radiator, comprising: A base (20), a heat pipe (10), a heat dissipation fin group (30) and a fan (40); characterized in that: The heat dissipation fin group (30) has a hollow installation channel (31); The fan (40) comprises: a first fan (41) installed on an outer side surface of the heat dissipation fin group (30), and a second fan (42) placed in the installation channel (31) and arranged parallel to the first fan (41); The first air inlet surface (411) of the first fan (41) faces away from the heat dissipation fin group (30), and the first air outlet surface (412) faces toward the heat dissipation fin group (30); The second air inlet surface (421) of the second fan (42) faces the first air outlet surface (412) of the first fan (41), and the second air outlet surface (422) faces away from the first air outlet surface (412) of the first fan (41).

2. The single-tower dual-fan radiator according to claim 1, characterized in that: A cover plate (32) is provided on one end of the heat dissipation fin group (30) away from the base (20); the second fan (42) is mounted on the cover plate (32).

3. The single-tower dual-fan radiator according to claim 2, characterized in that: A mounting plate (321) extending into the mounting channel (31) and for mounting the second fan (42) is provided on the surface of the cover plate (32) facing the base (20).

4. The single-tower dual-fan radiator according to claim 3, characterized in that: The mounting plate (321) is provided with a first mounting hole (3211), and the second fan (42) is provided with a second mounting hole (423) corresponding to the first mounting hole (3211).

5. The single-tower dual-fan radiator according to claim 3, characterized in that: Two mounting plates (321) are provided and are arranged diagonally.

6. The single-tower dual-fan radiator according to claim 3, characterized in that: The mounting plate (321) is formed by bending a portion of the structure of the cover plate (32).

7. The single-tower dual-fan radiator according to claim 2, characterized in that: The heat pipe (10) extends from one end of the heat dissipation fin group (30) close to the cover plate (32); the cover plate (32) is provided with a positioning hole (322) corresponding to the heat pipe (10); and the cover plate (32) is installed on the heat pipe (10) through an interference fit through the positioning hole (322).

8. The single-tower dual-fan radiator according to any one of claims 1 to 7, characterized in that: The first fan (41) and the second fan (42) rotate in opposite directions.

9. The single-tower dual-fan radiator according to claim 8, characterized in that: The blades of the first fan (41) and the second fan (42) are both forward-swept wings or backward-swept wings, and the two have opposite bending directions; or the blades of the first fan (41) and the second fan (42) are one forward-swept wing and the other backward-swept wing, and the two have the same bending direction.

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