Anti-slip integrated circuit manufacturing chip mounting device

Abstract

The utility model relates to the technical field of chip mounting devices, and discloses an anti-slip integrated circuit manufacturing chip mounting device which comprises a workbench, a positioning groove is formed in the middle end of the top of the workbench, a vertical plate is fixedly connected to the left end of the top of the workbench, and a top plate is fixedly connected to the top of the vertical plate. The bottom of the top plate is fixedly connected with a first electric sliding table. According to the utility model, the semiconductor crystal wafer can be adsorbed through the adsorption head, the clamping plate can be driven to move back and forth through the second electric sliding table, so that the adsorbed semiconductor crystal wafer can be clamped, the fixing effect can be improved, the semiconductor crystal wafer can be prevented from sliding down, and the clamping plate can be driven to move up and down through the second electric telescopic rod. The height of the clamping plate can be conveniently changed according to the thickness of the semiconductor crystal wafer, and the left-right position of the adsorption head can be adjusted by using the first electric sliding table, so that the chip mounting position can be conveniently changed.

Description

Technical Field

[0001] The utility model relates to the technical field of patch devices, in particular to an anti-slip patch device for integrated circuit manufacturing. Background Art

[0002] An integrated circuit is a miniature electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected and made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function; all the components have formed a whole in structure, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letter "IC" in the circuit. The inventors of the integrated circuit are Jack Kilby (integrated circuit based on germanium (Ge)) and Robert Noyce (integrated circuit based on silicon (Si)). Most of the integrated circuits used in today's semiconductor industry are based on silicon.

[0003] However, the current integrated circuit manufacturing chip placement device is not convenient for people to adjust the chip position, resulting in poor use effect, and has no anti-slip function, which causes the semiconductor chip to fall easily during the chip placement process, affecting the use effect. Therefore, we propose an anti-slip integrated circuit manufacturing chip placement device. Utility Model Content

[0004] The purpose of the utility model is to provide an anti-slip integrated circuit manufacturing patch device, which can adsorb semiconductor crystal wafers through an adsorption head, and can drive the clamping plate to move back and forth by utilizing a second electric slide, so that the adsorbed semiconductor crystal wafer can be clamped, thereby improving the fixing effect and preventing the semiconductor crystal wafer from slipping, and can drive the clamping plate to move up and down by utilizing a second electric telescopic rod, so that people can change the height of the clamping plate according to the thickness of the semiconductor crystal wafer, and can adjust the left and right position of the adsorption head by utilizing the first electric slide, so that people can change the patch position conveniently, thereby solving the problems raised in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an anti-slip integrated circuit manufacturing patch device, comprising a workbench, a positioning groove is opened at the middle end of the top of the workbench, the left end of the top of the workbench is fixedly connected to a vertical plate, the top of the vertical plate is fixedly connected to a top plate, the bottom of the top plate is fixedly connected to a first electric slide, the bottom of the first electric slide is fixedly connected to a first electric telescopic rod, the bottom of the first electric telescopic rod is fixedly connected to a connecting plate, the middle end of the bottom of the connecting plate is equipped with an adsorption head, the front and rear ends of the bottom of the connecting plate are both equipped with a second electric slide, the bottom of the second electric slide is fixedly connected to a second electric telescopic rod, and the bottom of the second electric telescopic rod is fixedly connected to a splint.

[0006] As a preferred embodiment of the anti-slip integrated circuit manufacturing patch device of the utility model, a tool box is fixedly connected to the front end of the left side of the workbench, and a partition is fixedly connected to the inner cavity of the tool box.

[0007] As a preferred embodiment of the anti-slip integrated circuit manufacturing patch device of the utility model, a box door is arranged on the front of the tool box, and a lock is arranged on the box door.

[0008] As a preferred embodiment of the anti-slip integrated circuit manufacturing patch device of the utility model, a battery box is fixedly connected to the rear end of the left side of the workbench, and a storage battery is fixedly connected to the inner cavity of the battery box.

[0009] As a preferred embodiment of an anti-slip integrated circuit manufacturing patch device of the utility model, a charging port is provided on the left side of the battery box, and the output end of the charging port is electrically connected to the input end of the battery.

[0010] As a preferred embodiment of an anti-slip integrated circuit manufacturing patch device of the utility model, a PLC controller is fixedly connected to the front of the vertical plate, and the output end of the PLC controller is electrically connected to the input ends of the first electric telescopic rod, the second electric telescopic rod, the adsorption head, the first electric slide and the second electric slide respectively.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0012] 1. The utility model is a non-slip integrated circuit manufacturing patch device. The integrated circuit board can be placed through the positioning groove to prevent the integrated circuit board from being displaced during the patch process. The adsorption head can be used to adsorb the semiconductor crystal piece. The second electric slide can be used to drive the clamp to move back and forth, so that the adsorbed semiconductor crystal piece can be clamped, thereby improving the fixing effect and preventing the semiconductor crystal piece from slipping. The second electric telescopic rod can be used to drive the clamp to move up and down, so that people can change the height of the clamp according to the thickness of the semiconductor crystal piece, and avoid the bottom of the clamp being located at the bottom of the semiconductor crystal piece to affect the patch effect. The first electric slide can be used to adjust the left and right position of the adsorption head, so that people can change the patch position conveniently.

[0013] 2. The utility model is an anti-slip integrated circuit manufacturing patch device. A tool box can be used to store maintenance tools so that people can promptly perform maintenance when the device fails. A battery can be used to power the device so that the device can operate normally during a power outage. A PLC controller can be used to control the operation of the first electric telescopic rod, the second electric telescopic rod, the adsorption head, the first electric slide, and the second electric slide, making it convenient for people to operate the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0015] Figure 1 This is a schematic diagram of the overall structure of an anti-slip integrated circuit patch manufacturing device of the utility model;

[0016] Figure 2 It is a right view structural schematic diagram of an anti-slip integrated circuit manufacturing patch device of the utility model;

[0017] Figure 3 It is a right side cross-sectional structural schematic diagram of an anti-slip integrated circuit manufacturing patch device of the utility model;

[0018] Figure 4 The utility model is a schematic diagram of a left side cross-sectional structure of an anti-slip integrated circuit manufacturing patch device.

[0019] In the figure: 1. workbench; 2. positioning groove; 3. vertical plate; 4. box door; 5. tool box; 6. battery box; 7. top plate; 8. PLC controller; 9. first electric telescopic rod; 10. connecting plate; 11. second electric telescopic rod; 12. clamping plate; 13. adsorption head; 14. first electric slide; 15. second electric slide; 16. charging port; 17. partition; 18. battery. DETAILED DESCRIPTION

[0020] See also Figure 1-4The utility model provides a technical solution for an anti-slip integrated circuit manufacturing patch device: an anti-slip integrated circuit manufacturing patch device, comprising a workbench 1, a positioning groove 2 is opened at the middle end of the top of the workbench 1, a vertical plate 3 is fixedly connected to the left end of the top of the workbench 1, a top plate 7 is fixedly connected to the top of the vertical plate 3, a first electric slide 14 is fixedly connected to the bottom of the top plate 7, a first electric telescopic rod 9 is fixedly connected to the bottom of the first electric slide 14, a connecting plate 10 is fixedly connected to the bottom of the first electric telescopic rod 9, a suction head 13 is installed at the middle end of the bottom of the connecting plate 10, a second electric slide 15 is installed at both the front and rear ends of the bottom of the connecting plate 10, a second electric slide 15 is fixedly connected to the bottom of the second electric telescopic rod 11, and the bottom of the second electric slide 15 is fixedly connected to the second electric telescopic rod 11. A clamping plate 12 is fixedly connected to the part, and an integrated circuit board can be placed through the positioning groove 2 to prevent the integrated circuit board from shifting during the patch process. The adsorption head 13 can be used to adsorb the semiconductor crystal piece. The second electric slide 15 can be used to drive the clamping plate 12 to move back and forth, so that the adsorbed semiconductor crystal piece can be clamped, thereby improving the fixing effect and preventing the semiconductor crystal piece from slipping. The second electric telescopic rod 11 can be used to drive the clamping plate 12 to move up and down, so that people can change the height of the clamping plate 12 according to the thickness of the semiconductor crystal piece, and avoid the bottom of the clamping plate 12 being located at the bottom of the semiconductor crystal piece to affect the patch effect. The first electric slide 14 can be used to adjust the left and right position of the adsorption head 13, so that people can change the patch position conveniently.

[0021] In this embodiment (see Figure 1 and Figure 4 ), a tool box 5 is fixedly connected to the front end of the left side of the workbench 1, and a partition 17 is fixedly connected to the inner cavity of the tool box 5. Repair tools can be stored through the tool box 5, so that people can perform repairs in time when the device fails.

[0022] In this embodiment (see Figure 1 and Figure 2 ), a box door 4 is arranged on the front of the tool box 5, and a lock is arranged on the box door 4.

[0023] In this embodiment (see Figure 1 and Figure 4 ), the rear end of the left side of the workbench 1 is fixedly connected with a battery box 6, and the inner cavity of the battery box 6 is fixedly connected with a storage battery 18. The storage battery 18 can be used to power the device, so that the device can operate normally even when there is a power outage.

[0024] In this embodiment (see Figure 1 ), a charging port 16 is opened on the left side of the battery box 6, and the output end of the charging port 16 is electrically connected to the input end of the battery 18.

[0025] In this embodiment (see Figure 1), a PLC controller 8 is fixedly connected to the front of the vertical plate 3, and the output end of the PLC controller 8 is electrically connected to the input ends of the first electric telescopic rod 9, the second electric telescopic rod 11, the adsorption head 13, the first electric slide 14 and the second electric slide 15 respectively. The PLC controller 8 can be used to control the operation of the first electric telescopic rod 9, the second electric telescopic rod 11, the adsorption head 13, the first electric slide 14 and the second electric slide 15, so that people can operate the device conveniently.

[0026] It should be noted that the utility model is an anti-slip integrated circuit manufacturing patch device, 1. workbench; 2. positioning groove; 3. vertical plate; 4. box door; 5. tool box; 6. battery box; 7. top plate; 8. PLC controller; 9. first electric telescopic rod; 10. connecting plate; 11. second electric telescopic rod; 12. clamping plate; 13. adsorption head; 14. first electric slide; 15. second electric slide; 16. charging port; 17. partition; 18. battery, all components are universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or through conventional experimental methods. When working, through the positioning groove 2, Placing the integrated circuit board can prevent the integrated circuit board from shifting during the patch process. The adsorption head 13 can be used to adsorb the semiconductor crystal piece. The second electric slide 15 can be used to drive the clamp 12 to move forward and backward, so that the adsorbed semiconductor crystal piece can be clamped, thereby improving the fixing effect and preventing the semiconductor crystal piece from slipping. The second electric telescopic rod 11 can be used to drive the clamp 12 to move up and down, so that people can change the height of the clamp 12 according to the thickness of the semiconductor crystal piece, and avoid the bottom of the clamp 12 being located at the bottom of the semiconductor crystal piece to affect the patch effect. The first electric slide 14 can be used to adjust the left and right position of the adsorption head 13, so that people can change the patch position conveniently.

Claims

1. An anti-slip integrated circuit manufacturing patch device, comprising a workbench (1), characterized in that: A positioning groove (2) is provided at the middle end of the top of the workbench (1); a vertical plate (3) is fixedly connected to the left end of the top of the workbench (1); a top plate (7) is fixedly connected to the top of the vertical plate (3); a first electric slide (14) is fixedly connected to the bottom of the top plate (7); a first electric telescopic rod (9) is fixedly connected to the bottom of the first electric slide (14); a connecting plate (10) is fixedly connected to the bottom of the first electric telescopic rod (9); a suction head (13) is installed at the middle end of the bottom of the connecting plate (10); a second electric slide (15) is installed at both the front and rear ends of the bottom of the connecting plate (10); a second electric slide (15) is fixedly connected to the bottom of the second electric slide (15); a second electric telescopic rod (11) is fixedly connected to the bottom of the second electric telescopic rod (11); a clamping plate (12) is fixedly connected to the bottom of the second electric telescopic rod (11).

2. The anti-slip integrated circuit manufacturing patch device according to claim 1, characterized in that: A tool box (5) is fixedly connected to the front end of the left side of the workbench (1), and a partition (17) is fixedly connected to the inner cavity of the tool box (5).

3. The anti-slip integrated circuit manufacturing chip placement device according to claim 2, characterized in that: The front of the tool box (5) is provided with a box door (4), and the box door (4) is provided with a lock.

4. The anti-slip integrated circuit manufacturing patch device according to claim 1, characterized in that: A battery box (6) is fixedly connected to the rear end of the left side of the workbench (1), and a storage battery (18) is fixedly connected to the inner cavity of the battery box (6).

5. The anti-slip integrated circuit manufacturing patch device according to claim 4, characterized in that: A charging port (16) is provided on the left side of the battery box (6), and an output end of the charging port (16) is electrically connected to an input end of a storage battery (18).

6. The anti-slip integrated circuit manufacturing chip placement device according to claim 1, characterized in that: A PLC controller (8) is fixedly connected to the front of the vertical plate (3), and an output end of the PLC controller (8) is electrically connected to input ends of the first electric telescopic rod (9), the second electric telescopic rod (11), the adsorption head (13), the first electric slide (14), and the second electric slide (15), respectively.

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