Integrated circuit double-sided packaging and printing device

Abstract

The utility model relates to an integrated circuit double-sided packaging printing device in the technical field of integrated circuits, which comprises a cover plate, a carrier and a plate fixing jig, the cover plate is buckled on the carrier, the carrier is buckled on the plate fixing jig, the carrier is provided with a sinking part, the plate fixing jig is provided with a reserved part, the bottom of the plate fixing jig is provided with a reinforcing rib, and the reinforcing rib is arranged on the carrier. And the bottom of the carrier is a strip-shaped avoiding position. According to the utility model, the avoidance design is adopted, the width of the reinforcing ribs isolated by each jointed board is 0.3 mm, the avoidance depth is 0.6 mm, and the jointed boards are made of high-strength titanium alloy materials, so that the avoidance and the bearing of fine-pitch elements at the bottom are solved, and the hardness of the reinforcing ribs of the carrier is enhanced; a hardened 0.05 mm cover plate is used in cooperation with a magnet at the bottom of the carrier, the PCB is fixed, and meanwhile the uneven thickness of edge solder paste caused by printing is reduced through the toughness of a printing scraper; and the board fixing jig and the board taking jig are used for fool proofing, so that components at the bottom of the PCB are prevented from being damaged in the board fixing and taking processes of second surface printing.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a double-sided packaging printing device for integrated circuits. Background Art

[0002] The SMT process for double-sided PCBs usually includes the following steps: First, the bottom side of the PCB is printed using stencil printing technology, and then the components are precisely placed on the printed area by a placement machine. Next, the product is soldered in a reflow oven to complete the component fixation on the bottom side. Subsequently, the top side of the PCB is printed, patched, and soldered for the second time. This process is particularly challenging for fine-pitch components because the components cannot directly contact the printing platform, and the top block of the printing machine itself is not suitable for such precision operations.

[0003] When developing SMT processes for dense-pitch, ultra-thin, multi-panel PCBs, researchers faced the following technical challenges: After the first-side component placement and reflow soldering are completed, how to efficiently complete the second-side component placement without plastic encapsulation. Due to the compact spacing of the circuit boards, limited space, and the presence of components on the first side, the traditional printing platform support device cannot be used, which limits the stability and accuracy of the ultra-thin PCB during the second-side printing process. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes an integrated circuit double-sided packaging printing device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an integrated circuit double-sided packaging printing device, including a cover plate, a carrier, and a fixed plate jig, the cover plate is buckled on the carrier, the carrier is buckled on the fixed plate jig, the carrier is provided with a sinking portion, the fixed plate jig is provided with a reserved portion, the bottom of the fixed plate jig is provided with reinforcing ribs, the bottom of the carrier is a strip avoidance, the avoidance depth is designed to be 0.6mm, and the fixed plate jig is provided with a positioning column.

[0006] As a further description of the above technical solution:

[0007] A PCB board is arranged between the cover plate and the carrier, and the thickness of the PCB board is 0.33 mm.

[0008] As a further description of the above technical solution:

[0009] The carrier is of magnetic design.

[0010] As a further description of the above technical solution:

[0011] The thickness of the cover plate is 0.08 mm.

[0012] As a further description of the above technical solution:

[0013] The thickness of the sunken portion is 0.25 mm, and the thickness of the reserved portion is 0.08 mm.

[0014] As a further description of the above technical solution:

[0015] The single-side clearance between the carrier and the fixed plate fixture in the X and Y directions is designed to be 0.05 mm.

[0016] As a further description of the above technical solution:

[0017] The PCB board is placed on the carrier with gaps of 0.09 mm and 0.07 mm in the X and Y directions respectively.

[0018] As a further description of the above technical solution:

[0019] The size of the reinforcing rib is 0.3 mm.

[0020] The utility model has the following beneficial effects:

[0021] 1. The utility model adopts an avoidance design. The width of the reinforcement ribs of each panel isolation is designed to be 0.3mm, and the avoidance depth is designed to be 0.6mm. The panel material is made of high-strength titanium alloy material to solve the avoidance and load-bearing of the bottom fine-pitch components and enhance the hardness of the carrier reinforcement ribs;

[0022] 2. Use a hardened 0.05mm cover plate and the magnet at the bottom of the carrier to fix the PCB board while using the toughness of the printing scraper to reduce the uneven thickness of the edge solder paste caused by printing;

[0023] 3. Use the board fixing jig and the board taking jig to prevent mistakes and prevent personnel from damaging the components at the bottom of the PCB board during the board fixing and board taking process of printing on the second side. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is an exploded schematic diagram of the integrated circuit double-sided packaging printing device proposed by the utility model;

[0025] Figure 2 It is a partial schematic diagram of the upper part of the carrier of the integrated circuit double-sided packaging printing device proposed by the utility model;

[0026] Figure 3 It is a partial bottom schematic diagram of a carrier of the integrated circuit double-sided packaging printing device proposed by the present invention.

[0027] Legend:

[0028] 1. Cover plate; 2. Carrier; 21. Sinking part; 22. Reserved part; 23. Reinforcing rib; 3. Fixing fixture; 31. Positioning column; 4. PCB board. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Reference Figure 1-3 The utility model provides an embodiment: an integrated circuit double-sided packaging printing device, including a cover plate 1, a carrier 2, and a fixed plate fixture 3, the cover plate 1 is buckled on the carrier 2, the carrier 2 is buckled on the fixed plate fixture 3, the carrier 2 is provided with a sinking portion 21, the fixed plate fixture 3 is provided with a reserved portion 22, the bottom of the fixed plate fixture 3 is provided with a reinforcing rib 23, the bottom of the carrier 2 is a strip avoidance, the avoidance depth is designed to be 0.6mm, and the fixed plate fixture 3 is provided with a positioning column 31.

[0031] The setting of the board fixing fixture 3 takes into account that components have been affixed to the bottom of the second-side PCB board 4. In the process of placing the board, the board may be inaccurately fixed, resulting in scratches on the bottom components. Therefore, a matching anti-mistake fixture for fixing and removing the board is designed using the original positioning holes of the PCB board 4, which facilitates personnel to fix and remove the board while reducing the risk of scratches on the bottom components caused by fixing the board.

[0032] A PCB board 4 is arranged between the cover plate 1 and the carrier 2 , and the thickness of the PCB board 4 is 0.33 mm.

[0033] The carrier 2 is of magnetic design, and the cover 1 is fixed to the outer circle of the PCB board 4 by using the magnetism of the magnet on the carrier 2 to meet the printing requirements.

[0034] The thickness of the cover plate 1 is 0.08 mm.

[0035] The thickness of the sunken portion 21 is 0.25 mm, and the thickness of the reserved portion 22 is 0.08 mm.

[0036] The single-side clearance between the carrier 2 and the fixed plate fixture 3 in the X and Y directions is designed to be 0.05 mm.

[0037] The gaps between the PCB board 4 placed on the carrier 2 in the X and Y directions are 0.09 mm and 0.07 mm respectively.

[0038] The reinforcing rib 23 is made of titanium alloy with relatively high strength, and the size of the reinforcing rib 23 is 0.3 mm. The square-shaped avoidance is changed into a strip-shaped avoidance while ensuring that the size of the reinforcing rib 23 0.3 mm remains unchanged.

[0039] Working principle:

[0040] Precise positioning and placement:

[0041] The carrier 2 is accurately placed on the plate fixture 3 by using the positioning posts 31 on the plate fixture 3, thereby ensuring the stability of the PCB board 4 during the printing process.

[0042] Precise placement of PCB board 4:

[0043] With the assistance of the positioning posts 31 , the ultra-thin PCB board 4 (thickness 0.33 mm) is accurately placed on the carrier 2 , and the gap is controlled at 0.09 mm and 0.07 mm, ensuring the precise alignment of component printing.

[0044] Fixing of cover plate 1 and preparation for printing:

[0045] The ultra-thin cover plate 1 is placed on the PCB board 4 along the positioning pillars 31 , and the cover plate 1 is fixed by the magnets on the carrier 2 , so as to prepare for the printing process.

[0046] Stability guarantee of printing process:

[0047] The fixing of the cover plate 1 not only ensures the stability of the PCB board 4 during the printing process, but also improves the printing quality by reducing the problem of uneven thickness of the edge solder paste.

[0048] Accuracy of component placement:

[0049] After printing is completed, the components are accurately placed on the printed solder paste using a placement machine. Thanks to the precise matching of the carrier 2 and the cover 1, the accuracy of component placement is guaranteed.

[0050] Preparation for reflow soldering:

[0051] After the components are mounted, the PCB board 4 will be sent to the reflow oven for soldering. Due to the high precision of printing and mounting, the soldering quality is significantly improved.

[0052] Application of foolproof fixtures:

[0053] During the entire printing and mounting process, the fool-proof design of the board fixing and board taking fixtures reduces operating errors, protects the components at the bottom of the PCB board 4, and improves production efficiency and product quality.

[0054] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit double-sided packaging printing device, comprising a cover plate (1), a carrier (2), and a plate fixing fixture (3), characterized in that: The cover plate (1) is buckled on the carrier (2), the carrier (2) is buckled on the fixed plate fixture (3), the carrier (2) is provided with a sinking portion (21), the fixed plate fixture (3) is provided with a reserved portion (22), the bottom of the fixed plate fixture (3) is provided with a reinforcing rib (23), the bottom of the carrier (2) is a strip-shaped avoidance, and the fixed plate fixture (3) is provided with a positioning column (31).

2. The integrated circuit double-sided packaging printing device according to claim 1, characterized in that: A PCB board (4) is arranged between the cover plate (1) and the carrier (2), and the thickness of the PCB board (4) is 0.33 mm.

3. The integrated circuit double-sided packaging printing device according to claim 2, characterized in that: The carrier (2) is of magnetic design.

4. The integrated circuit double-sided packaging printing device according to claim 3, characterized in that: The thickness of the cover plate (1) is 0.08 mm.

5. The integrated circuit double-sided packaging printing device according to claim 4, characterized in that: The thickness of the sunken portion (21) is 0.25 mm, and the thickness of the reserved portion (22) is 0.08 mm.

6. The integrated circuit double-sided packaging printing device according to claim 5, characterized in that: The single-side clearance between the carrier (2) and the fixed plate fixture (3) in the X and Y directions is designed to be 0.05 mm.

7. The integrated circuit double-sided packaging printing device according to claim 6, characterized in that: The PCB board (4) is placed on the carrier (2) with gaps in the X and Y directions of 0.09 mm and 0.07 mm respectively.

8. The integrated circuit double-sided packaging printing device according to claim 7, characterized in that: The size of the reinforcing rib (23) is 0.3 mm.

9. The integrated circuit double-sided packaging printing device according to claim 1, characterized in that: The bottom clearance depth of the carrier (2) is designed to be 0.6 mm.

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