Display module

Abstract

The utility model discloses a display module, which is characterized in that a driving chip is arranged on a first flexible circuit board, a first connecting part and a second connecting part of a display substrate are in short circuit, a fourth connecting point and a fifth connecting point of the first flexible circuit board are in short circuit, the first connecting point is communicated with a third connecting point, and the second connecting point is communicated with the fourth connecting point; the second flexible circuit board comprises a first measuring point, a second measuring point and a third measuring point; the first connecting part is connected with the first connecting point, and the second connecting part is connected with the second connecting point; the first measuring point is connected with the third connecting point, the second measuring point is connected with the fourth connecting point, and the third measuring point is connected with the fifth connecting point. According to the utility model, six measuring points are reserved at the two ends of the second flexible circuit board, so that the binding impedance of the left and right ends can be accurately detected. The occupation of the measuring points on the surface space of the second flexible circuit board is reduced, and the design difficulty of the second flexible circuit board is reduced.

Description

Technical Field

[0001] The utility model relates to the field of display technology, and in particular to a display module. Background Art

[0002] At present, a flexible active-matrix organic light-emitting diode (AMOLED) display module generally includes a display substrate, a driver chip for driving the display substrate to display images, and a flexible circuit board for connecting other components such as a power supply. These three usually require a bonding process to achieve electrical connection between each other.

[0003] In order to check whether the binding process is qualified, the binding impedance needs to be tested. At present, when testing the binding impedance, eight measuring points need to be reserved on the flexible circuit board. When measuring the impedance, the multimeter is connected to the measuring points to obtain the binding impedance value of a certain line. However, too many measuring points reserved on the flexible circuit board will occupy the space of the flexible circuit board, increasing the difficulty of designing the flexible circuit board. Utility Model Content

[0004] The utility model provides a display module to solve the problem that too many measuring points are reserved on the flexible circuit board, resulting in the space of the flexible circuit board being occupied, thereby increasing the difficulty of designing the flexible circuit board.

[0005] According to one aspect of the utility model, a display module is provided, wherein the display module includes a display substrate, a driving chip, a first flexible circuit board, and a second flexible circuit board;

[0006] The driving chip is arranged on the first flexible circuit board, the display substrate comprises a first connection part and a second connection part, the first connection part and the second connection part are short-circuited, the first flexible circuit board comprises a first connection point, a second connection point, a third connection point, a fourth connection point and a fifth connection point, the fourth connection point and the fifth connection point are short-circuited, the first connection point and the third connection point are connected, and the second connection point and the fourth connection point are connected; the second flexible circuit board comprises a first measuring point, a second measuring point and a third measuring point;

[0007] The first connection part is connected to the first connection point, the second connection part is connected to the second connection point; the first measuring point is connected to the third connection point, the second measuring point is connected to the fourth connection point, and the third measuring point is connected to the fifth connection point.

[0008] Optionally, the driving chip is welded to the first flexible circuit board, the first flexible circuit board is bound and connected to the display substrate, and the first flexible circuit board is bound and connected to the second flexible circuit board;

[0009] The first connection part is bound and connected to the first connection point, the second connection part is bound and connected to the second connection point; the first measuring point is bound and connected to the third connection point, the second measuring point is bound and connected to the fourth connection point, and the third measuring point is bound and connected to the fifth connection point.

[0010] Optionally, the first flexible circuit board includes a first connecting line and a second connecting line;

[0011] The first connection point and the third connection point are connected through a first connection line, and the second connection point and the fourth connection point are connected through a second connection line.

[0012] Optionally, the driving chip includes a first connecting pin, a second connecting pin, a third connecting pin and a fourth connecting pin;

[0013] The first flexible circuit board is arranged in the display substrate, the driving chip is bound and connected to the display substrate, and the second flexible circuit board is bound and connected to the display substrate;

[0014] The first connecting pin is bound and connected to the first connecting point, the second connecting pin is bound and connected to the second connecting point, the third connecting pin is bound and connected to the third connecting point, and the fourth connecting pin is bound and connected to the fourth connecting point; the first measuring point is bound and connected to the third connecting point, the second measuring point is bound and connected to the fourth connecting point, and the third measuring point is bound and connected to the fifth connecting point.

[0015] Optionally, the display substrate further includes a third connection portion and a fourth connection portion, the third connection portion and the fourth connection portion are short-circuited, the first flexible circuit board further includes a sixth connection point, a seventh connection point, an eighth connection point, a ninth connection point and a tenth connection point, the ninth connection point and the tenth connection point are short-circuited, the sixth connection point and the eighth connection point are connected, and the seventh connection point and the ninth connection point are connected; the second flexible circuit board includes a fourth measuring point, a fifth measuring point and a sixth measuring point;

[0016] The third connection part is connected to the sixth connection point, the fourth connection part is connected to the seventh connection point; the fourth measuring point is connected to the eighth connection point, the fifth measuring point is connected to the ninth connection point, and the sixth measuring point is connected to the tenth connection point.

[0017] Optionally, the driving chip is welded to the first flexible circuit board, the first flexible circuit board is bound and connected to the display substrate, and the first flexible circuit board is bound and connected to the second flexible circuit board;

[0018] The third connection part is bound and connected to the sixth connection point, the fourth connection part is bound and connected to the seventh connection point; the fourth measuring point is bound and connected to the eighth connection point, the fifth measuring point is bound and connected to the ninth connection point, and the sixth measuring point is bound and connected to the tenth connection point.

[0019] Optionally, the first flexible circuit board includes a third connecting line and a fourth connecting line;

[0020] The sixth connection point and the eighth connection point are connected through the third connection line, and the seventh connection point and the ninth connection point are connected through the fourth connection line.

[0021] Optionally, the driving chip includes a fifth connecting pin, a sixth connecting pin, a seventh connecting pin and an eighth connecting pin;

[0022] The first flexible circuit board is arranged in the display substrate, the driving chip is bound and connected to the display substrate, and the second flexible circuit board is bound and connected to the display substrate;

[0023] The fifth connecting pin is bound and connected to the sixth connecting point, the sixth connecting pin is bound and connected to the seventh connecting point, the seventh connecting pin is bound and connected to the eighth connecting point, and the eighth connecting pin is bound and connected to the ninth connecting point; the fourth measuring point is bound and connected to the eighth connecting point, the fifth measuring point is bound and connected to the ninth connecting point, and the sixth measuring point is bound and connected to the tenth connecting point.

[0024] Optionally, the first measuring point includes a first copper leak, the second measuring point includes a second copper leak, and the third measuring point includes a third copper leak.

[0025] Optionally, the fourth measuring point includes a fourth copper leakage, the fifth measuring point includes a fifth copper leakage, and the sixth measuring point includes a sixth copper leakage.

[0026] The technical solution of the utility model is to share one detection line in the detection circuits of different binding impedances, so that a measurement point on the second flexible circuit board can be used as a detection measurement point of different binding impedances at the same time. It is realized that only three measurement points are required to be set at one end of the second flexible circuit board to realize the detection of the binding impedance of COF bonding and FOF bonding or the binding impedance of COP bonding and FOP bonding. Six measurement points are reserved at both ends of the second flexible circuit board to accurately detect the binding impedance of the left and right ends. The occupation of the surface space of the second flexible circuit board by the measurement points is reduced, and the design difficulty of the second flexible circuit board is reduced. The saved space can be used to increase the area of ​​the ground leakage copper area of ​​the electromagnetic shielding film (Electromagnetic Interference, EMI), or it can also be directly used as a leakage copper area to fit the cover tape (cover tape) of the driver chip to improve the electromagnetic shielding effect and anti-interference ability of the second flexible circuit board, improve the reliability of the display module and the anti-static discharge (Electro-Static Discharge, ESD) surge specification, thereby improving the overall performance of the display module.

[0027] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present utility model, nor are they intended to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a schematic diagram of a bonding impedance detection circuit in a display module provided by the related technology;

[0030] Figure 2 It is a schematic diagram of another bonding impedance detection circuit in a display module provided by the related art;

[0031] Figure 3 It is a schematic diagram of a binding impedance detection circuit in a display module provided by an embodiment of the utility model;

[0032] Figure 4 It is a schematic diagram of another bonding impedance detection circuit in a display module provided by an embodiment of the utility model. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0034] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0035] Currently, there are usually two design schemes for AMOLED display modules:

[0036] The first option, Figure 1 It is a schematic diagram of a bonding impedance detection circuit in a display module provided by the related technology, such as Figure 1 As shown, the driver chip 3 is packaged in an independent flexible circuit board 2, and one side of the flexible circuit board 2 where the driver chip 3 is located is bound and connected to the display substrate 1. This binding connection can be called COF (Chip On FPCB) bonding, and the dotted box 5 represents COF bonding. The other side of the flexible circuit board 2 where the driver chip 3 is located is bound and connected to the flexible circuit board 4 used to connect the display module and other components. This binding connection can be called FOF (FPCB On FPCB) bonding, and the dotted box 6 represents FOF bonding. For the accuracy of detection, there are usually two binding impedance detection circuits, and 4 measuring points need to be set on the flexible circuit board 4. In order to accurately detect the binding impedance at the left and right ends, 8 measuring points need to be set on the flexible circuit board 4. Too many reserved measuring points on the flexible circuit board will occupy the space of the flexible circuit board, increasing the difficulty of designing the flexible circuit board.

[0037] The second option, Figure 2 is another schematic diagram of a bonding impedance detection circuit in a display module provided by the related art, such as Figure 2As shown, the display substrate 1 includes a flexible circuit board 2, a certain area of ​​the display substrate 1 is provided with a circuit, and the area of ​​the display substrate 1 where the circuit is provided is the flexible circuit board 2, and the display substrate 1 and the flexible circuit board 2 are an integral structure. The driving chip 3 is bound and connected to the flexible circuit board 2, that is, the driving chip 3 is bound and connected to the display substrate 1, and the binding connection can be called COP (Chip On Panel, chip on the display substrate) bonding, and the dotted box 7 represents COP bonding. The flexible circuit board 4 used to connect the display module with other components is also bound and connected to the flexible circuit board 2, that is, the flexible circuit board 4 used to connect the display module with other components is bound and connected to the display substrate 1, and the binding connection can be called FOP (FPCB On Panel, flexible circuit board on the display substrate) bonding, and the dotted box 8 represents FOP bonding. For the accuracy of detection, there are usually two binding impedance detection circuits, and 4 measuring points need to be set on the flexible circuit board 4. In order to accurately detect the binding impedance at the left and right ends, 8 measuring points need to be set on the flexible circuit board 4. Too many reserved measuring points on the flexible circuit board will occupy the space of the flexible circuit board, increasing the difficulty of designing the flexible circuit board.

[0038] In order to solve the problem in the above-mentioned related art that too many reserved measuring points on the flexible circuit board will occupy the space of the flexible circuit board, thereby increasing the design difficulty of the flexible circuit board, the technical solution of the utility model is as follows:

[0039] Figure 3 is a schematic diagram of a binding impedance detection circuit in a display module provided by an embodiment of the utility model, Figure 4 is a schematic diagram of another embodiment of the present utility model provided in the display module binding impedance detection circuit, such as Figure 3 and Figure 4 As shown, the display module includes a display substrate 10, a driving chip 12, a first flexible circuit board 11 and a second flexible circuit board 13. The driving chip 12 is arranged on the first flexible circuit board 11, the display substrate 10 includes a first connection part A1 and a second connection part A2, the first connection part A1 and the second connection part A2 are short-circuited, the first flexible circuit board 11 includes a first connection point B1, a second connection point B2, a third connection point B3, a fourth connection point B4 and a fifth connection point B5, the fourth connection point B4 and the fifth connection point B5 are short-circuited, the first connection point B1 is connected to the third connection point B3, and the second connection point B2 is connected to the fourth connection point B4; the second flexible circuit board 13 includes a first measuring point C1, a second measuring point C2 and a third measuring point C3. The first connecting part A1 is connected to the first connecting point B1, the second connecting part A2 is connected to the second connecting point B2; the first measuring point C1 is connected to the third connecting point B3, the second measuring point C2 is connected to the fourth connecting point B4, and the third measuring point C3 is connected to the fifth connecting point B5.

[0040] Specifically, Figure 3 As shown, the display module includes a display substrate 10, a first flexible circuit board 11, a driver chip 12, and a second flexible circuit board 13 for connecting the display module with other components. The driver chip 12 is packaged in an independent first flexible circuit board 11. Exemplarily, the driver chip 12 can be soldered on the surface of the first flexible circuit board 11. The first flexible circuit board 11 is bonded to the display substrate 10, and the bonding connection can be called COF bonding. The dotted line box 14 represents COF bonding. The first flexible circuit board 11 and the second flexible circuit board 13 are connected based on a bonding process. The bonding connection can be called FOF bonding. The dotted line box 15 represents FOF bonding.

[0041] The first connection part A1 is bound and connected to the first connection point B1, the first connection point B1 is connected to the third connection point B3, and the third connection point B3 is bound and connected to the first measuring point C1. The second connection part A2 is bound and connected to the second connection point B2, the second connection point B2 is connected to the fourth connection point B4, and the fourth connection point B4 is bound and connected to the second measuring point C2. The fourth connection point B4 and the fifth connection point B5 are short-circuited, and the fifth connection point B5 is bound and connected to the third measuring point C3. By using the first measuring point C1 and the second measuring point C2 as the detection line of the input pin and the output pin of the detection signal respectively, the bonding impedance of COF bonding and FOF bonding can be detected. By using the third measuring point C3 and the second measuring point C2 as the detection line of the input pin and the output pin of the detection signal respectively, the bonding impedance of FOF bonding can be detected.

[0042] like Figure 4 As shown, the display module includes a display substrate 10, a first flexible circuit board 11, a driving chip 12, and a second flexible circuit board 13 for connecting the display module with other components. In this case, the display substrate 10 may include the first flexible circuit board 11. A certain area of ​​the display substrate 10 is provided with a circuit pattern, and this area may be the first flexible circuit board 11. The driving chip 12 is connected to the first flexible circuit board 11 based on a bonding process, that is, the driving chip 12 is connected to the display substrate 10 based on a bonding process, and the bonding connection may be called COP bonding, and the dotted line box 16 represents COP bonding. The second flexible circuit board 13 is connected to the first flexible circuit board 11 based on a bonding process, that is, the second flexible circuit board 13 is connected to the display substrate 10 based on a bonding process, and the bonding connection may be called FOP bonding, and the dotted line box 17 represents FOP bonding.

[0043] The driver chip 12 can be connected to the first connection point B1, the second connection point B2, the third connection point B3, and the fourth connection point B4 based on the binding process, the first connection part A1 is connected to the first connection point B1, and the second connection part A2 is connected to the second connection point B2. The fourth connection point B4 and the fifth connection point B5 are short-circuited. The third connection point B3 is bound and connected to the first measuring point C1, the fourth connection point B4 is bound and connected to the second measuring point C2, and the fifth connection point B5 is bound and connected to the third measuring point C3. By using the first measuring point C1 and the second measuring point C2 as the detection line of the input pin of the detection signal and the output pin of the detection signal respectively, the binding impedance of COPbonding and FOP bonding can be detected. By using the third measuring point C3 and the second measuring point C2 as the detection line of the input pin of the detection signal and the output pin of the detection signal respectively, the binding impedance of FOP bonding can be detected.

[0044] The technical solution of the embodiment of the utility model is to share one detection line in the detection circuits of different binding impedances, so that a measurement point on the second flexible circuit board can be used as a detection measurement point of different binding impedances at the same time. It is realized that only three measurement points are set at one end of the second flexible circuit board to realize the detection of the binding impedance of COF bonding and FOF bonding or the binding impedance of COP bonding and FOP bonding. Six measurement points are reserved at both ends of the second flexible circuit board to accurately detect the binding impedance of the left and right ends. The occupation of the surface space of the second flexible circuit board by the measurement points is reduced, and the design difficulty of the second flexible circuit board is reduced. The saved space can be used to increase the area of ​​the electromagnetic shielding film (Electromagnetic Interference, EMI) grounding copper leakage area, or it can also be directly used as a copper leakage area to fit the cover tape (cover tape) of the driver chip to improve the electromagnetic shielding effect and anti-interference ability of the second flexible circuit board, improve the reliability of the display module and the anti-static discharge (Electro-Static Discharge, ESD) surge specification, thereby improving the overall performance of the display module.

[0045] Optionally, based on the above embodiment, continue to refer to Figure 3 The driving chip 12 is welded to the first flexible circuit board 11, the first flexible circuit board 11 is bound and connected to the display substrate 10, and the first flexible circuit board 11 is bound and connected to the second flexible circuit board 13. The first connecting portion A1 is bound and connected to the first connecting point B1, and the second connecting portion A2 is bound and connected to the second connecting point B2; the first measuring point C1 is bound and connected to the third connecting point B3, the second measuring point C2 is bound and connected to the fourth connecting point B4, and the third measuring point C3 is bound and connected to the fifth connecting point B5.

[0046] Specifically, the driving chip 12 can be welded on the surface of the first flexible circuit board 11, the first flexible circuit board 11 is bonded and connected to the display substrate 10, and the bonding connection can be called COF bonding. The first flexible circuit board 11 and the second flexible circuit board 13 are connected based on a bonding process, and the bonding connection can be called FOF bonding.

[0047] The first connection part A1 is bound and connected to the first connection point B1, the first connection point B1 is connected to the third connection point B3, and the third connection point B3 is bound and connected to the first measuring point C1. The second connection part A2 is bound and connected to the second connection point B2, the second connection point B2 is connected to the fourth connection point B4, and the fourth connection point B4 is bound and connected to the second measuring point C2. The fourth connection point B4 and the fifth connection point B5 are short-circuited, and the fifth connection point B5 is bound and connected to the third measuring point C3. By using the first measuring point C1 and the second measuring point C2 as the detection line of the input pin and the output pin of the detection signal respectively, the bonding impedance of COF bonding and FOF bonding can be detected. By using the third measuring point C3 and the second measuring point C2 as the detection line of the input pin and the output pin of the detection signal respectively, the bonding impedance of FOF bonding can be detected.

[0048] Optionally, based on the above embodiments, continue to refer to Figure 3 The first flexible circuit board 11 includes a first connection line and a second connection line. The first connection point B1 and the third connection point B3 are connected through the first connection line, and the second connection point B2 and the fourth connection point B4 are connected through the second connection line.

[0049] Specifically, a circuit pattern can be set on the surface of the first flexible circuit board 11, and a first connecting line and a second connecting line can be set on the surface of the first flexible circuit board 11. The first connecting point B1 and the third connecting point B3 can be connected through the first connecting line, and the second connecting point B2 and the fourth connecting point B4 can be connected through the second connecting line.

[0050] Optionally, based on the above embodiments, continue to refer to Figure 4, the driving chip 11 includes a first connecting pin D1, a second connecting pin D2, a third connecting pin D3 and a fourth connecting pin D4. The first flexible circuit board 11 is arranged in the display substrate 10, the driving chip 12 is bound and connected to the display substrate 10, and the second flexible circuit board 13 is bound and connected to the display substrate 10. The first connecting pin D1 is bound and connected to the first connection point B1, the second connecting pin D2 is bound and connected to the second connection point B2, the third connecting pin D3 is bound and connected to the third connection point B3, and the fourth connecting pin D4 is bound and connected to the fourth connection point B4; the first measuring point C1 is bound and connected to the third connection point B3, the second measuring point C2 is bound and connected to the fourth connection point B4, and the third measuring point C3 is bound and connected to the fifth connection point B5.

[0051] Specifically, the display substrate 10 may include a first flexible circuit board 11, and a certain area of ​​the display substrate 10 is provided with a circuit pattern, and this area may be the first flexible circuit board 11. The driving chip 12 is connected to the first flexible circuit board 11 based on a bonding process, that is, the driving chip 12 is connected to the display substrate 10 based on a bonding process, and the bonding connection may be called COPbonding, and the second flexible circuit board 13 is connected to the first flexible circuit board 11 based on a bonding process, that is, the second flexible circuit board 13 is connected to the display substrate 10 based on a bonding process, and the bonding connection may be called FOP bonding.

[0052] The first connection pin D1, the second connection pin D2, the third connection pin D3 and the fourth connection pin D4 of the driver chip 12 can be connected to the first connection point B1, the second connection point B2, the third connection point B3 and the fourth connection point B4 based on the binding process, the first connection part A1 is connected to the first connection point B1, and the second connection part A2 is connected to the second connection point B2. The fourth connection point B4 and the fifth connection point B5 are short-circuited. The third connection point B3 is bound and connected to the first measuring point C1, the fourth connection point B4 is bound and connected to the second measuring point C2, and the fifth connection point B5 is bound and connected to the third measuring point C3. By using the first measuring point C1 and the second measuring point C2 as the detection circuit of the input pin and the output pin of the detection signal respectively, the binding impedance and of COP bonding and FOP bonding can be detected. By using the third measuring point C3 and the second measuring point C2 as the detection circuit of the input pin and the output pin of the detection signal respectively, the binding impedance of FOP bonding can be detected.

[0053] Optionally, based on the above embodiments, continue to refer to Figure 3 and Figure 4, the display substrate 10 further includes a third connection portion A3 and a fourth connection portion A4, the third connection portion A3 and the fourth connection portion A4 are short-circuited, the first flexible circuit board 11 further includes a sixth connection point B6, a seventh connection point B7, an eighth connection point B8, a ninth connection point B9 and a tenth connection point B10, the ninth connection point B9 and the tenth connection point B10 are short-circuited, the sixth connection point B6 and the eighth connection point B8 are connected, and the seventh connection point B7 and the ninth connection point B9 are connected; the second flexible circuit board 13 includes a fourth measuring point C4, a fifth measuring point C5 and a sixth measuring point C6. The third connection portion A3 is connected to the sixth connection point B6, the fourth connection portion A4 is connected to the seventh connection point B7; the fourth measuring point C4 is connected to the eighth connection point B8, the fifth measuring point C5 is connected to the ninth connection point B9, and the sixth measuring point C6 is connected to the tenth connection point B10.

[0054] Specifically, Figure 3 As shown, the third connection part A3 is bound and connected to the sixth connection point B6, the sixth connection point B6 is connected to the eighth connection point B8, and the eighth connection point B8 is bound and connected to the fourth measuring point C4. The fourth connection part A4 is bound and connected to the seventh connection point B7, the seventh connection point B7 is connected to the ninth connection point B9, and the ninth connection point B9 is bound and connected to the fifth measuring point C5. The ninth connection point B9 and the tenth connection point B10 are short-circuited, and the tenth connection point B10 is bound and connected to the sixth measuring point C6. By using the fourth measuring point C4 and the fifth measuring point C5 as the detection line of the input pin of the detection signal and the output pin of the detection signal, the binding impedance of COF bonding and FOF bonding can be detected. By using the sixth measuring point C6 and the fifth measuring point C5 as the detection line of the input pin of the detection signal and the output pin of the detection signal, the binding impedance of FOF bonding can be detected.

[0055] like Figure 4 As shown, the driver chip 12 can be connected to the sixth connection point B6, the seventh connection point B7, the eighth connection point B8, and the ninth connection point B9 based on the binding process, the third connection part A3 is connected to the sixth connection point B6, and the fourth connection part A4 is connected to the seventh connection point B7. The ninth connection point B9 and the tenth connection point B10 are short-circuited. The eighth connection point B8 is bound and connected to the fourth measuring point C4, the ninth connection point B9 is bound and connected to the fifth measuring point C5, and the tenth connection point B10 is bound and connected to the sixth measuring point C6. By using the fourth measuring point C4 and the fifth measuring point C5 as the detection line of the input pin of the detection signal and the output pin of the detection signal respectively, the binding impedance of COP bonding and FOP bonding can be detected. By using the sixth measuring point C6 and the fifth measuring point C5 as the detection line of the input pin of the detection signal and the output pin of the detection signal respectively, the binding impedance of FOP bonding can be detected.

[0056] Optionally, based on the above embodiments, continue to refer to Figure 3 , the driving chip 12 is welded to the first flexible circuit board 11, the first flexible circuit board 11 is bound and connected to the display substrate 10, and the first flexible circuit board 11 is bound and connected to the second flexible circuit board 13. The third connection part A3 is bound and connected to the sixth connection point B6, the fourth connection part A4 is bound and connected to the seventh connection point B7; the fourth measuring point C4 is bound and connected to the eighth connection point B8, the fifth measuring point C5 is bound and connected to the ninth connection point B9, and the sixth measuring point C6 is bound and connected to the tenth connection point B10.

[0057] Specifically, the driving chip 12 can be welded on the surface of the first flexible circuit board 11, the first flexible circuit board 11 is bonded and connected to the display substrate 10, and the bonding connection can be called COF bonding. The first flexible circuit board 11 and the second flexible circuit board 13 are connected based on a bonding process, and the bonding connection can be called FOF bonding.

[0058] The third connection part A3 is bound and connected to the sixth connection point B6, the sixth connection point B6 is connected to the eighth connection point B8, and the eighth connection point B8 is bound and connected to the fourth measuring point C4. The fourth connection part A4 is bound and connected to the seventh connection point B7, the seventh connection point B7 is connected to the ninth connection point B9, and the ninth connection point B9 is bound and connected to the fifth measuring point C5. The ninth connection point B9 and the tenth connection point B10 are short-circuited, and the tenth connection point B10 is bound and connected to the sixth measuring point C6. By using the fourth measuring point C4 and the fifth measuring point C5 as the detection line of the input pin of the detection signal and the output pin of the detection signal, the bonding impedance of COF bonding and FOF bonding can be detected. By using the sixth measuring point C6 and the fifth measuring point C5 as the detection line of the input pin of the detection signal and the output pin of the detection signal, the bonding impedance of FOF bonding can be detected.

[0059] Optionally, based on the above embodiments, continue to refer to Figure 3 , the first flexible circuit board 11 includes a third connection line and a fourth connection line; the sixth connection point B6 and the eighth connection point B8 are connected through the third connection line, and the seventh connection point B7 and the ninth connection point B9 are connected through the fourth connection line.

[0060] Specifically, a circuit pattern can be set on the surface of the first flexible circuit board 11, and a third connecting line and a fourth connecting line can be set on the surface of the first flexible circuit board 11. The sixth connection point B6 and the eighth connection point B8 can be connected through the third connecting line, and the seventh connection point B7 and the ninth connection point B9 can be connected through the fourth connecting line.

[0061] Optionally, based on the above embodiments, continue to refer to Figure 4, the driving chip 12 includes a fifth connecting pin D5, a sixth connecting pin D6, a seventh connecting pin D7 and an eighth connecting pin D8. The first flexible circuit board 11 is arranged in the display substrate 10, the driving chip 12 is bound and connected to the display substrate 10, and the second flexible circuit board 13 is bound and connected to the display substrate 10. The fifth connecting pin D5 is bound and connected to the sixth connecting point B6, the sixth connecting pin D6 is bound and connected to the seventh connecting point B7, the seventh connecting pin D7 is bound and connected to the eighth connecting point B8, and the eighth connecting pin D8 is bound and connected to the ninth connecting point B9; the fourth measuring point C4 is bound and connected to the eighth connecting point B8, the fifth measuring point C5 is bound and connected to the ninth connecting point B9, and the sixth measuring point C6 is bound and connected to the tenth connecting point B10.

[0062] Specifically, the display substrate 10 may include a first flexible circuit board 11, and a certain area of ​​the display substrate 10 is provided with a circuit pattern, and this area may be the first flexible circuit board 11. The driving chip 12 is connected to the first flexible circuit board 11 based on a bonding process, that is, the driving chip 12 is connected to the display substrate 10 based on a bonding process, and the bonding connection may be called COPbonding, and the second flexible circuit board 13 is connected to the first flexible circuit board 11 based on a bonding process, that is, the second flexible circuit board 13 is connected to the display substrate 10 based on a bonding process, and the bonding connection may be called FOP bonding.

[0063] The fifth connection pin D5, the sixth connection pin D6, the seventh connection pin D7 and the eighth connection pin D8 of the driver chip 12 can be connected to the sixth connection point B6, the seventh connection point B7, the eighth connection point B8 and the ninth connection point B9 based on the binding process, the third connection part A3 is connected to the sixth connection point B6, and the fourth connection part A4 is connected to the seventh connection point B7. The ninth connection point B9 and the tenth connection point B10 are short-circuited. The eighth connection point B8 is bound and connected to the fourth measuring point C4, the ninth connection point B9 is bound and connected to the fifth measuring point C5, and the tenth connection point B10 is bound and connected to the sixth measuring point C6. The fourth measuring point C4 and the fifth measuring point C5 are used as the detection circuit of the input pin and the output pin of the detection signal respectively, and the bonding impedance and of COP bonding and FOP bonding can be detected. The sixth measuring point C6 and the fifth measuring point C5 are used as the detection circuit of the input pin and the output pin of the detection signal respectively, and the bonding impedance of FOP bonding can be detected.

[0064] Optionally, based on the above embodiments, continue to refer to Figure 3 and Figure 4 The first measuring point C1 includes the first leaking copper, the second measuring point C2 includes the second leaking copper, and the third measuring point C3 includes the third leaking copper.

[0065] Specifically, the surface of the second flexible circuit board 13 is provided with a first leaking copper as a first measuring point C1, a second leaking copper as a second measuring point C2, and a third leaking copper as a third measuring point C3. By providing leaking copper as measuring points on the surface of the second flexible circuit board 13, there is no need to provide test pins on the second flexible circuit board 13, so that the design of the second flexible circuit board 13 is simpler.

[0066] Optionally, based on the above embodiments, continue to refer to Figure 3 and Figure 4 The fourth measuring point C4 includes the fourth leaking copper, the fifth measuring point C5 includes the fifth leaking copper, and the sixth measuring point C6 includes the sixth leaking copper.

[0067] Specifically, the surface of the second flexible circuit board 13 is provided with a fourth leaking copper as a fourth measuring point C4, a fifth leaking copper as a fifth measuring point C5, and a sixth leaking copper as a sixth measuring point C6. By providing leaking copper as measuring points on the surface of the second flexible circuit board 13, there is no need to provide test pins on the second flexible circuit board 13, so that the design of the second flexible circuit board 13 is simpler.

[0068] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0069] The above specific implementations do not constitute a limitation on the protection scope of the present utility model. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A display module, characterized in that: It includes a display substrate, a driving chip, a first flexible circuit board and a second flexible circuit board; The driving chip is arranged on the first flexible circuit board, the display substrate comprises a first connection part and a second connection part, the first connection part and the second connection part are short-circuited, the first flexible circuit board comprises a first connection point, a second connection point, a third connection point, a fourth connection point and a fifth connection point, the fourth connection point and the fifth connection point are short-circuited, the first connection point and the third connection point are connected, and the second connection point and the fourth connection point are connected; the second flexible circuit board comprises a first measuring point, a second measuring point and a third measuring point; The first connection part is connected to the first connection point, and the second connection part is connected to the second connection point; the first measuring point is connected to the third connection point, the second measuring point is connected to the fourth connection point, and the third measuring point is connected to the fifth connection point.

2. The display module according to claim 1, characterized in that: The driving chip is welded to the first flexible circuit board, the first flexible circuit board is bound and connected to the display substrate, and the first flexible circuit board is bound and connected to the second flexible circuit board; The first connection part is bound and connected to the first connection point, and the second connection part is bound and connected to the second connection point; the first measuring point is bound and connected to the third connection point, the second measuring point is bound and connected to the fourth connection point, and the third measuring point is bound and connected to the fifth connection point.

3. The display module according to claim 2, characterized in that: The first flexible circuit board includes a first connecting line and a second connecting line; The first connection point and the third connection point are connected through the first connection line, and the second connection point and the fourth connection point are connected through the second connection line.

4. The display module according to claim 1, characterized in that: The driving chip comprises a first connecting pin, a second connecting pin, a third connecting pin and a fourth connecting pin; The first flexible circuit board is arranged in the display substrate, the driving chip is bound and connected to the display substrate, and the second flexible circuit board is bound and connected to the display substrate; The first connection pin is bound and connected to the first connection point, the second connection pin is bound and connected to the second connection point, the third connection pin is bound and connected to the third connection point, and the fourth connection pin is bound and connected to the fourth connection point; the first measuring point is bound and connected to the third connection point, the second measuring point is bound and connected to the fourth connection point, and the third measuring point is bound and connected to the fifth connection point.

5. The display module according to claim 1, characterized in that: The display substrate further includes a third connection portion and a fourth connection portion, the third connection portion and the fourth connection portion are short-circuited, the first flexible circuit board further includes a sixth connection point, a seventh connection point, an eighth connection point, a ninth connection point and a tenth connection point, the ninth connection point and the tenth connection point are short-circuited, the sixth connection point and the eighth connection point are connected, and the seventh connection point and the ninth connection point are connected; the second flexible circuit board includes a fourth measuring point, a fifth measuring point and a sixth measuring point; The third connection part is connected to the sixth connection point, the fourth connection part is connected to the seventh connection point; the fourth measuring point is connected to the eighth connection point, the fifth measuring point is connected to the ninth connection point, and the sixth measuring point is connected to the tenth connection point.

6. The display module according to claim 5, characterized in that: The driving chip is welded to the first flexible circuit board, the first flexible circuit board is bound and connected to the display substrate, and the first flexible circuit board is bound and connected to the second flexible circuit board; The third connection part is bound and connected to the sixth connection point, the fourth connection part is bound and connected to the seventh connection point; the fourth measuring point is bound and connected to the eighth connection point, the fifth measuring point is bound and connected to the ninth connection point, and the sixth measuring point is bound and connected to the tenth connection point.

7. The display module according to claim 6, characterized in that: The first flexible circuit board includes a third connecting line and a fourth connecting line; The sixth connection point is connected to the eighth connection point through the third connection line, and the seventh connection point is connected to the ninth connection point through the fourth connection line.

8. The display module according to claim 5, characterized in that: The driving chip includes a fifth connecting pin, a sixth connecting pin, a seventh connecting pin and an eighth connecting pin; The first flexible circuit board is arranged in the display substrate, the driving chip is bound and connected to the display substrate, and the second flexible circuit board is bound and connected to the display substrate; The fifth connection pin is bound and connected to the sixth connection point, the sixth connection pin is bound and connected to the seventh connection point, the seventh connection pin is bound and connected to the eighth connection point, and the eighth connection pin is bound and connected to the ninth connection point; the fourth measuring point is bound and connected to the eighth connection point, the fifth measuring point is bound and connected to the ninth connection point, and the sixth measuring point is bound and connected to the tenth connection point.

9. The display module according to claim 1, characterized in that: The first measuring point includes a first copper leak, the second measuring point includes a second copper leak, and the third measuring point includes a third copper leak.

10. The display module according to claim 5, characterized in that: The fourth measuring point includes a fourth leaking copper, the fifth measuring point includes a fifth leaking copper, and the sixth measuring point includes a sixth leaking copper.

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