Wafer box cover loading and unloading mechanism and wafer loading and unloading device

Abstract

The utility model discloses a wafer box cover loading and unloading mechanism and a wafer loading and unloading device. The wafer box cover loading and unloading mechanism comprises a door body with a supporting part, and a cover taking assembly, a box cover detection assembly and a wafer detection assembly which are all installed on the door body. The wafer detection assembly comprises a first swing arm, a second swing arm, a first correlation sensor, a second correlation sensor, a first driver and a second driver. The transmission part of the first swing arm is in transmission connection with the first driver, the transmission part of the second swing arm is in transmission connection with the second driver, the first correlation sensor is installed on the movable part of the first swing arm, and the second correlation sensor is installed on the movable part of the second swing arm. When the wafer detection assembly is located at the storage position, the movable part of the first swing arm and the movable part of the second swing arm abut against the supporting part. When the wafer detection assembly is located at the detection position, a detection space is formed between the first correlation sensor and the second correlation sensor. The wafer box cover assembling and disassembling mechanism not only can save installation space, but also is high in safety.

Description

Technical Field

[0001] The utility model relates to the field of chip processing technology, in particular to a wafer box cover loading and unloading mechanism and a wafer loading and unloading device. Background Art

[0002] In the semiconductor manufacturing process, wafer boxes such as front-opening wafer transfer boxes (FOUP) or front-opening shipping boxes (FOSB) are required to transport wafers between various processing steps. Existing wafer loading and unloading devices generally include a gantry, a door panel assembly rotatably mounted on the gantry, and a wafer detection assembly mounted on the gantry. In the actual production process, the cover removal assembly on the door panel assembly can realize the opening and closing of the cover of the wafer box, and the wafer detection assembly can detect the position of the wafer to facilitate the loading and unloading of wafers by the robot. At present, the two opposing sensors of the wafer detection assembly are generally installed on the door frame by sliding up and down through a mapping sensor bracket. The mapping sensor bracket slides up and down to detect the wafer position. Most mapping sensor brackets and sensors on the mapping sensor brackets always remain in an extended and suspended state, with low rigidity. The mapping sensor bracket vibrates greatly during the up and down sliding process, and the operation is unstable. At the same time, the installation space required for the wafer detection assembly is large and the safety is low. Especially when the door body drives the cover removal assembly to open or close the box cover, etc., and there is no need to detect the wafer position, the wafer detection assembly is prone to interference or collision with the door body, cover removal assembly and other components, which is very dangerous. Utility Model Content

[0003] The purpose of the embodiments of the utility model is to provide a wafer box cover loading and unloading mechanism and a wafer loading and unloading device, which can not only save installation space but also improve the safety of wafer loading and unloading.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] In one aspect, a wafer box cover loading and unloading mechanism is provided, comprising:

[0006] A door body having a supporting portion;

[0007] A cover assembly is installed on the door body;

[0008] A box cover detection component is installed on the door body;

[0009] as well as

[0010] A wafer detection assembly having a storage position and a detection position;

[0011] The wafer detection assembly includes a first swing arm, a second swing arm, a first through-beam sensor, a second through-beam sensor, a first driver installed on the door body, and a second driver installed on the door body; the first swing arm and the second swing arm both have a transmission part and a movable part that can rotate relative to the support part, the transmission part of the first swing arm is in transmission connection with the first driver, the transmission part of the second swing arm is in transmission connection with the second driver, the first through-beam sensor is installed on the movable part of the first swing arm, and the second through-beam sensor is installed on the movable part of the second swing arm;

[0012] When the wafer detection assembly is located at the storage position, the movable part of the first swing arm and the movable part of the second swing arm are both located above the support part and abut against the support part; when the wafer detection assembly is located at the detection position, the movable part of the first swing arm and the movable part of the second swing arm are both separated from the support part, the first and second matching sensors are distributed at intervals and a detection space is formed between the first and second matching sensors.

[0013] Optionally, the first driver includes a first cylinder installed on the door body, a first pushing seat connected to the output end of the first cylinder, a first base installed on the door body, a first shaft body rotatably installed on the first base, and a first push rod provided on the first shaft body; the first push rod and the rotation axis of the first shaft body are arranged at intervals, a first strip guide groove is provided on the first pushing seat, the first pushing seat is sleeved on the first push rod through the first strip guide groove, and the transmission part of the first swing arm is installed on the first shaft body;

[0014] The second driver includes a second cylinder installed on the door body, a second pushing seat connected to the output end of the second cylinder, a second base installed on the door body, a second shaft body rotatably installed on the second base, and a second push rod arranged on the second shaft body; the second push rod and the rotation axis of the second shaft body are arranged at intervals, a second strip guide groove is opened on the second pushing seat, the second pushing seat is sleeved on the second push rod through the second strip guide groove, and the transmission part of the second swing arm is installed on the second shaft body.

[0015] Optionally, the wafer detection assembly further includes a first cover body and a second cover body; a first mounting groove and a first detection hole for allowing a light beam of the first through-beam sensor to pass through are provided on the movable portion of the first swing arm, the first through-beam sensor is installed in the first mounting groove, the first cover body is installed in the first swing arm and covers a notch of the first mounting groove, and the first mounting groove is connected to the outside of the first swing arm through the first detection hole;

[0016] A second mounting groove and a second detection hole for allowing the light beam of the second matching sensor to pass through are provided on the movable part of the second swing arm, the second matching sensor is installed in the second mounting groove, the second cover body is installed on the second swing arm and covers the groove opening of the second mounting groove, and the second mounting groove is connected to the outside of the second swing arm through the second detection hole.

[0017] Optionally, the first driver also includes a first torsion spring; the second driver also includes a second torsion spring; the first torsion spring is sleeved on the first shaft, the first torsion axis of the first torsion spring is connected to the door body, the second torsion axis of the first torsion spring is connected to the first swing arm, the second torsion spring is sleeved on the second shaft, the first torsion axis of the second torsion spring is connected to the door body, and the second torsion axis of the second torsion spring is connected to the second swing arm.

[0018] Optionally, the lid removal assembly includes a suction device having an adsorption end and a latch module having a latch body; the box lid detection assembly has a detection part, and the door body has a lid removal surface. The suction device, the latch module, and the box lid detection assembly are all installed on the door body and the suction end, the latch body, and the detection part are all located at the lid removal surface.

[0019] Optionally, the latch module includes a third base installed on the door body, a third cylinder installed on the third base, a third pushing seat connected to the output end of the third cylinder, a third shaft rotatably installed on the third base, and a third push rod arranged on the third shaft; the third push rod and the rotation axis of the third shaft are arranged at intervals, a third strip guide groove is provided on the third pushing seat, the third push seat is sleeved on the third push rod through the third strip guide groove, and the latch body is installed on the third shaft.

[0020] Optionally, the adsorber includes a vacuum pad, a positioning column having an air hole and arranged on the vacuum pad, and a pipe joint connected to the air hole; the adsorption end is located on the positioning column, and the adsorption end and the vacuum pad are both located at the cover removal surface.

[0021] Optionally, the box cover detection assembly includes a fourth base installed on the door body, an optical coupler installed on the fourth base, a trigger member, a spring mounted on the trigger member, and a pressure ring installed on the fourth base and abutting against the optical coupler; one end of the trigger member is slidably mounted on the fourth base, and the other end of the trigger member is located at the cover removal surface, one end of the spring is connected to the fourth base, and the other end of the spring is connected to the trigger member, and the pressure ring is located on the sliding path of the trigger member moving along the direction of compressing the spring.

[0022] Optionally, the wafer box cover loading and unloading mechanism also includes a circuit board and a wire pressing plate; the door body includes a support frame, a front cover arranged on the support frame, and a rear cover arranged on the support frame; the support frame is clamped between the front cover and the rear cover and the support frame, the front cover and the rear cover together enclose a wiring cavity, the cover removal assembly, the box cover detection assembly, and the wafer detection assembly are all electrically connected to the circuit board, and the wire pressing plate and the circuit board are both installed on the inner wall of the wiring cavity.

[0023] Optionally, the wafer box cover loading and unloading mechanism further includes a slide seat for being mounted on a guide rail; the slide seat is mounted on the door body.

[0024] On the other hand, a wafer handling device is provided, comprising the above-mentioned wafer box cover handling mechanism.

[0025] The beneficial effects of the utility model are as follows: the wafer box cover loading and unloading mechanism installs the wafer detection assembly on the door body, and the suspended extended bracket specially used for installing the sensor on the door frame of the loading and unloading device can be cancelled. The wafer detection assembly can move with the door body, avoiding the collision between the wafer detection assembly and the door body and other components; and the wafer detection assembly has a first swing arm and a second swing arm that are rotatably installed relative to the door body, and the first and second pairing sensors are installed on the first and second swing arms respectively. When the wafer position detection is required, the wafer detection assembly switches to the detection position, and the first and second pairing sensors are used to detect the wafer position. When the wafer position detection is no longer required, the wafer detection assembly can be switched to the storage position, which not only saves the installation space, but also avoids the collision between the wafer detection assembly and the door frame, and the safety is greatly improved. At the same time, when the wafer detection assembly switches to the storage position, it is supported by the door body, so that the rigidity of the overall structure of the wafer box cover loading and unloading mechanism is relatively large, the vibration of the wafer detection assembly is relatively small during movement, the stability is relatively good, and the ability to resist external interference is strong.

[0026] The wafer loading and unloading device adopts the above-mentioned wafer box cover loading and unloading mechanism, which can not only save installation space but also improve the safety of wafer loading and unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The utility model is further described in detail below based on the drawings and embodiments.

[0028] Figure 1 It is a structural schematic diagram of the wafer box cover loading and unloading mechanism;

[0029] Figure 2 A schematic structural diagram of the wafer box cover loading and unloading mechanism from another perspective;

[0030] Figure 3It is a schematic diagram of the structure of the support frame, front cover, wafer detection component, circuit board, and wire pressing plate;

[0031] Figure 4 It is a structural schematic diagram of a first swing arm and a first driver;

[0032] Figure 5 It is a schematic diagram of the coordination of the first swing arm, the first base, the first push rod and the first shaft;

[0033] Figure 6 It is a schematic diagram of the coordination of the first swing arm, the first beam sensor, the first cylinder, the first push rod, and the first shaft;

[0034] Figure 7 It is a working schematic diagram of the first swing arm, the first beam sensor and the first driver;

[0035] Figure 8 It is a structural schematic diagram of the adsorber;

[0036] Fig. 9 It is a structural schematic diagram of the adsorber from another perspective;

[0037] Fig.10 It is a structural schematic diagram of a door latch module;

[0038] Fig.11 This is a structural diagram of the door latch module from another perspective;

[0039] Fig.12 It is a structural schematic diagram of the box cover detection component;

[0040] Fig.13 A structural diagram of the box cover detection component from another perspective

[0041] Fig.14 This is a half-section view of the box cover detection component.

[0042] Description of the accompanying drawings:

[0043] 11. Door body; 12. Cover removal assembly; 13. Box cover detection assembly; 14. Wafer detection assembly; 15. Circuit board; 16. Wire pressing plate; 17. Sliding seat; 18. Mounting seat;

[0044] 111, support frame; 112, front cover; 113, rear cover; 114, support part; 115, cover surface;

[0045] 121. Adsorber; 122. Latch module;

[0046] 1211, vacuum pad; 1212, positioning column; 1213, air hole; 1214, pipe joint; 1215, adsorption end;

[0047] 1221, third base; 1222, third cylinder; 1223, third push seat; 1224, third shaft; 1225, third push rod; 1226, third strip guide groove; 1227, bolt body;

[0048] 131, fourth base; 132, optical coupler; 133, trigger member; 134, spring; 135, pressure ring; 136, detection unit;

[0049] 141. first swing arm; 142. second swing arm; 143. first beam sensor; 145. first driver; 146. second driver; 147. transmission part; 148. movable part;

[0050] 1411, first installation slot; 1412, first detection hole;

[0051] 1451. first cylinder; 1452. first push seat; 1453. first base; 1454. first shaft; 1455. first push rod; 1456. first strip guide groove; 1457. first cover; 1458. first torsion spring; 1459. bearing. DETAILED DESCRIPTION

[0052] In order to make the technical problems solved by the utility model, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the utility model will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0053] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "fixed", "connected", "communicated", "abutted", "clamped" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0055] In the description of this article, it should be understood that the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0056] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0057] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0058] Unless specifically stated or defined otherwise, the term “and / or” used in the present invention includes any and all combinations of one or more of the associated listed items.

[0059] For the convenience of description, unless otherwise specified, the up and down directions mentioned below are the same as Figure 1 The up and down directions are consistent with the left and right directions mentioned below. Figure 1 The left and right directions are consistent with the Figure 1 The projection direction itself is consistent.

[0060] In the existing semiconductor technology field, wafer boxes are generally used to store wafers. When wafers are transported between processing steps, the wafer box cover loading and unloading mechanism of the wafer loading and unloading device is generally used to open and close the box cover of the wafer box. The door body of the wafer box cover loading and unloading mechanism drives the cover removal assembly to move to realize the opening and closing of the box cover of the wafer box. The opening of the box cover refers to separating the box cover from the wafer box so that the robot can load or unload the wafer. The closing of the box cover refers to installing the box cover on the wafer box. After the box cover is opened, the position of the wafer in the wafer box is detected by the wafer detection assembly. The existing wafer detection assembly generally includes a mapping sensor bracket and a through-beam sensor installed on the mapping sensor bracket. There are at least two through-beam sensors, and the position information of the wafer is detected by the through-beam of the two through-beam sensors. At present, one end of the Mapping sensor bracket of the wafer loading and unloading device is installed on the door frame in an up and down sliding manner, and the rest of the part is suspended and equipped with a through-shooting sensor. The through-shooting sensor and most of the Mapping sensor brackets are always kept in an extended state. When the wafer loading and unloading device is working, under the influence of other mechanisms, the Mapping sensor bracket has serious shaking, which causes the Mapping sensor bracket to be unstable when sliding up and down. At the same time, when wafer inspection is not needed, the Mapping sensor bracket is always kept in an extended state, which not only occupies a large space, but also easily interferes with and collides with the moving door body, cover removal assembly and other components in the wafer box cover loading and unloading mechanism, causing safety accidents.

[0061] like Figures 1 to 5 As shown, this embodiment provides a wafer box cover loading and unloading mechanism, including a door body 11 having a support portion 114, and a cover removal assembly 12, a box cover detection assembly 13, and a wafer detection assembly 14, all of which are installed on the door body 11. The door body 11 serves as a main support member, and the cover removal assembly 12, the box cover detection assembly 13, the wafer detection assembly 14, etc. are all installed on the door body 11. When the door body 11 is installed on the door frame, it can be driven by a driving device such as a cylinder, a motor, and a screw module to realize the movement of the door body 11 relative to the door frame. After the cover removal assembly 12 on the door body 11 absorbs or grabs the box cover of the wafer box, the door frame moves relative to the door frame to drive the box cover of the wafer box to move, thereby realizing the opening or closing of the box cover of the wafer box. The cover removal component 12 is used to absorb or clamp the cover of the wafer box, and the cover detection component 13 is used to detect whether there is a cover on the wafer box, which facilitates the cover removal component 12 of the wafer box cover loading and unloading mechanism to absorb or clamp the cover, and also facilitates the robot arm of the wafer loading and unloading device to load and unload wafers.

[0062] The wafer detection assembly 14 has a storage position and a detection position. When the position of the wafer does not need to be detected, the wafer detection assembly 14 switches to the storage position, reducing the impact of the shaking generated during the operation of the wafer box cover loading and unloading mechanism on the wafer detection assembly 14, while realizing the storage of the wafer detection assembly 14, reducing the space occupied by the wafer detection assembly 14, and avoiding the wafer detection assembly 14 from colliding with other components, thereby improving safety. When the wafer detection assembly 14 switches to the storage position, it is supported by the support portion 114 of the door body 11, thereby improving the overall rigidity and stability of the wafer box cover loading and unloading mechanism. The support portion 114 can be set at the top of the door body 11, or it can be set in the middle of the door body 11 in the up-down direction, and a storage groove is opened in the middle of the door body 11 in the up-down direction, and the bottom wall of the storage groove is used to support the wafer detection assembly 14. When the position of the wafer needs to be detected, the wafer detection assembly 14 switches to the detection position. At this time, the movement of the wafer detection assembly 14 is driven by the movement of the door body 11. Compared with the mapping sensor bracket of the wafer detection assembly 14 installed on the door frame, the movement of the wafer detection assembly 14 is smoother.

[0063] The wafer detection assembly 14 includes a first swing arm 141, a second swing arm 142, a first through-beam sensor 143, a second through-beam sensor, a first driver 145 installed on the door body 11, and a second driver 146 installed on the door body 11. The first swing arm 141 and the second swing arm 142 both have a transmission part 147 and a movable part 148 that can rotate relative to the support part 114. The transmission part 147 is located at the lower end surface of one end of the first swing arm 141. The transmission part 147 of the first swing arm 141 is in transmission connection with the first driver 145, and the transmission part 147 of the second swing arm 142 is in transmission connection with the second driver 146. The first through-beam sensor 143 is installed on the movable part 148 of the first swing arm 141, and the second through-beam sensor is installed on the movable part 148 of the second swing arm 142. Driven by the first driver 145 and the second driver 146, the first swing arm 141 and the second swing arm 142 can rotate relative to the door body 11, thereby driving the first and second beam sensors 143 and 144 to rotate relative to the door body 11. The first and second beam sensors 143 and 145 can beam each other to detect the position of the wafer. Using the first and second beam sensors 143 and 146 to detect the position of an object belongs to the prior art and will not be described in detail here.

[0064] When the wafer detection assembly 14 is located in the storage position, the movable portion 148 of the first swing arm 141 and the movable portion 148 of the second swing arm 142 are both located above the support portion 114 and abut against the support portion 114. The support portion 114 is used to support the wafer detection assembly 14 to prevent the wafer detection assembly 14 from being suspended, thereby saving space and reducing the impact of the vibration generated when the wafer box cover loading and unloading mechanism is working on the wafer detection assembly 14. When the wafer detection assembly 14 is located at the detection position, the movable part 148 of the first swing arm 141 and the movable part 148 of the second swing arm 142 are separated from the support part 114, that is, the movable part 148 of the first swing arm 141 and the movable part 148 of the second swing arm 142 extend out of the support part 114. Specifically, when extending out of the support part 114, the movable part 148 of the first swing arm 141 and the movable part 148 of the second swing arm 142 rotate forward relative to the support part 114, and extend forward relative to the top of the door body 11, so that the movable part 148 of the first swing arm 141 and the movable part 148 of the second swing arm 142 are suspended, and a wafer box can be placed below the movable part 148 of the first swing arm 141 and the movable part 148 of the second swing arm 142, and the first matching sensor 143 on the movable part 148 of the first swing arm 141 and the second matching sensor on the movable part 148 of the second swing arm 142 can extend into the wafer box. The first through-beam sensor 143 and the second through-beam sensor are arranged at intervals and a detection space is formed between the first through-beam sensor 143 and the second through-beam sensor. When the wafer box cover loading and unloading mechanism is working, the door body 11 approaches the wafer box, and then uses the cover removal assembly 12 to suck or clamp the cover of the wafer box, and then the door body 11 drives the cover removal assembly 12 to move, thereby driving the cover to separate from the wafer box. When the door body 11 uses the cover removal assembly 12 to drive the cover to separate from the wafer box, the door body 11 can also drive the wafer detection assembly 14 to approach the wafer in the wafer box, and then the wafer detection assembly 14 switches to the detection position, and then the door body 11 drives the first and second shooting sensors 143 and 143 to extend into the wafer box. Finally, the door body 11 drives the first and second shooting sensors 143 and 143 to move in the wafer box. When the wafer enters the detection space between the first and second shooting sensors, the first and second shooting sensors can recognize the presence of the wafer, thereby obtaining the position of the wafer, which is convenient for the robot to grab the wafer.

[0065] In this way, this embodiment avoids suspension by installing the wafer detection assembly 14 on the door body 11, so that the wafer detection assembly 14 is switched to the storage position, and the overall rigidity and stability of the wafer box cover loading and unloading mechanism are improved, and it can be applied to the Load port wafer loading and unloading device that meets the SEMI standard, so that the overall structure of the Load port wafer loading and unloading device has greater rigidity, better stability, less vibration during movement, and strong resistance to external interference. The wafer detection assembly 14 of this embodiment not only realizes a simplified functional design, but also has better rigidity and stability in structure, and saves more time and space in operation. This wafer detection assembly 14 with better rigidity and stability is conducive to a more stable and reliable operation of the wafer loading and unloading device.

[0066] Optionally, the through-beam sensor can be divided into photoelectric type and fiber optic type. The photoelectric through-beam sensor mainly includes photoelectric sensor, and the fiber optic through-beam sensor mainly includes fiber optic sensor. In the present embodiment, the first through-beam sensor 143 and the second through-beam sensor are both fiber optic sensors. The photosensitive element of the photoelectric through-beam sensor directly faces the light object, and the detection range is clear. The fiber optic through-beam sensor transmits light signals through optical fibers, and can transmit signals and detect objects over a long distance. At the same time, compared with the reflective sensor, the detection of the present application is more accurate, and the reflective sensor is larger in size, which is not conducive to the miniaturization of the wafer box cover loading and unloading mechanism.

[0067] like Figures 4 to 7 As shown, in one embodiment, a receiving groove is provided at the top of the door body 11 , the support portion 114 is located at the top of the door body 11 , and the first driver 145 and the second driver 146 are both installed in the receiving groove.

[0068] The first driver 145 includes a first cylinder 1451 installed on the door body 11, a first push seat 1452 connected to the output end of the first cylinder 1451, a first base 1453 installed on the door body 11, a first shaft 1454 rotatably installed on the first base 1453, and a first push rod 1455 provided on the first shaft 1454. The first push rod 1455 is arranged at intervals with respect to the rotation axis of the first shaft 1454, the first push rod 1455 and the first shaft 1454 are eccentrically arranged, and the first push rod 1455 and the rotation axis of the first shaft 1454 are arranged at intervals along the axial projection of the first shaft 1454. A first strip guide groove 1456 is provided on the first push seat 1452, and the first push seat 1452 is sleeved on the first push rod 1455 through the first strip guide groove 1456, and the transmission part 147 of the first swing arm 141 is installed on the first shaft 1454. The output shaft of the first cylinder 1451 drives the first pushing seat 1452 to move linearly. Under the guidance of the first strip guide groove 1456, the first push rod 1455 moves in the first strip guide groove 1456 along the extension path of the first strip guide groove 1456, so that the first pushing seat 1452 pushes the first shaft body 1454 to rotate. When the first shaft body 1454 rotates, it drives the first swing arm 141 to rotate, so that the movable part 148 of the first swing arm 141 can abut against the support part 114 of the door body 11 or leave the support part 114 and be suspended.

[0069] The second driver 146 includes a second cylinder installed on the door body 11, a second push seat connected to the output end of the second cylinder, a second base installed on the door body 11, a second shaft body rotatably installed on the second base, and a second push rod arranged on the second shaft body. The second push rod is arranged at intervals from the rotation axis of the second shaft body, a second strip guide groove is provided on the second push seat, the second push seat is sleeved on the second push rod through the second strip guide groove, and the transmission part 147 of the second swing arm 142 is installed on the second shaft body. The output shaft of the second cylinder drives the second push seat to move linearly, and under the guidance of the second strip guide groove, the second push rod moves in the second strip guide groove along the extension path of the second strip guide groove, so that the second push seat pushes the second shaft body to rotate, and when the second shaft body rotates, it drives the second swing arm 142 to rotate, so that the movable part 148 of the second swing arm 142 can abut against the support part 114 of the door body 11 or leave the support part 114 and suspend.

[0070] The first driver 145 can drive the first swing arm 141 to rotate forward and reverse 90 degrees, and the second driver 146 can drive the second swing arm 142 to rotate forward and reverse 90 degrees, so that the movable portion 148 of the first swing arm 141 and the movable portion 148 of the second swing arm 142 can be away from or close to the support portion 114. After the movable portion 148 of the first swing arm 141 and the movable portion 148 of the second swing arm 142 rotate 90 degrees and leave the support portion 114, the first and second beam sensors 143 and 143 are spaced apart and a detection space is formed between the first and second beam sensors, and the light beams generated by the first and second beam sensors pass through the detection space and are mutually reflected.

[0071] The existing wafer detection assembly 14 has a complex structure, a high probability of failure, and is prone to locking. In this embodiment, the first cylinder 1451 and the second cylinder push and pull the first push rod 1455 and the second push rod respectively to realize the switching of the wafer detection assembly 14 between the detection position and the storage position. A single first cylinder 1451 controls a single first beam sensor 143, and a single second cylinder controls a single second beam sensor. The control structure is simple and easy to implement.

[0072] Furthermore, the wafer detection assembly 14 further includes a first cover 1457 and a second cover. The movable portion 148 of the first swing arm 141 is provided with a first mounting groove 1411 and a first detection hole 1412 for allowing the light beam of the first through-beam sensor 143 to pass through. The first through-beam sensor 143 is mounted in the first mounting groove 1411. The first cover 1457 is mounted on the first swing arm 141 and covers the notch of the first mounting groove 1411 to protect the first through-beam sensor 143. The first mounting groove 1411 is connected to the outside of the first swing arm 141 through the first detection hole 1412.

[0073] A second mounting groove and a second detection hole for allowing the light beam of the second through-beam sensor to pass through are provided on the movable portion 148 of the second swing arm 142. The second through-beam sensor is installed in the second mounting groove. The second cover is installed on the second swing arm 142 and covers the notch of the second mounting groove to protect the first through-beam sensor 143. The second mounting groove is connected to the outside of the second swing arm 142 through the second detection hole.

[0074] When the wafer inspection assembly 14 switches to the inspection position, the first inspection hole 1412 and the second inspection hole are opposite, the light beam of the first matching sensor 143 passes through the first inspection hole 1412, and the light beam of the second matching sensor passes through the second inspection hole, thereby realizing matching between the first matching sensor 143 and the second matching sensor.

[0075] Optionally, the first base 1453 and the second base both include a box body and a box cover mounted on the box body. The box body and the box cover together enclose a cavity, a bearing 1459 is installed in the cavity, the first shaft 1454 is rotatably mounted on the first base 1453 through the bearing 1459, and the second shaft is rotatably mounted on the second base through the bearing 1459.

[0076] In one embodiment, the first driver 145 further includes a first torsion spring 1458. The second driver 146 further includes a second torsion spring. The first torsion spring 1458 is sleeved on the first shaft 1454, the first torsion axis of the first torsion spring 1458 is connected to the door body 11, the second torsion axis of the first torsion spring 1458 is connected to the first swing arm 141, the second torsion spring is sleeved on the second shaft, the first torsion axis of the second torsion spring is connected to the door body 11, and the second torsion axis of the second torsion spring is connected to the second swing arm 142. The first torsion spring 1458 and the second torsion spring provide a preload, and when the wafer detection assembly 14 switches to the storage position and the detection position, under the elastic force of the first torsion spring 1458 and the second torsion spring, the first swing arm 141 and the second swing arm 142 can both remain in the current position to prevent the first swing arm 141 and the second swing arm 142 from swinging or rotating.

[0077] like Figures 8 to 11 As shown, in one embodiment, the cover removal assembly 12 includes an absorber 121 having an adsorption end 1215 and a latch module 122 having a latch body 1227. The box cover detection assembly 13 has a detection portion 136, and the door body 11 has a cover removal surface 115. The absorber 121, the latch module 122, and the box cover detection assembly 13 are all installed on the door body 11, and the adsorption end 1215, the latch body 1227, and the detection portion 136 are all located at the cover removal surface 115. The cover removal surface 115 of the door body 11 is moved to the box cover of the wafer box, and the box cover detection assembly 13 is first used to detect whether there is a box cover and the position of the box cover, and then the door body 11 is moved so that the latch body 1227 of the latch module 122 is inserted into the lock body of the box cover. The latch body 1227 is equivalent to a key and can unlock the lock body of the box cover. Then, the absorber 121 is used to adsorb the box cover so that the box cover fits on the cover removal surface 115. Finally, the door body 11 moves to drive the box cover to leave the wafer box.

[0078] Thus, in this embodiment, when the detection unit 136 detects the presence of the cover of the wafer box, the absorber 121 is evacuated under the condition of the vacuum generator, and the absorption end 1215 absorbs the wafer box cover, and cooperates with the latch module 122, so that the cover can be firmly absorbed on the door body 11. If the detection unit 136 detects that the wafer box has no cover, the latch module 122 and the absorber 121 will not respond, and the cover opening link will be directly skipped to proceed to the next step of the loading and unloading process.

[0079] In one embodiment, the latch module 122 includes a third base 1221 installed on the door body 11, a third cylinder 1222 installed on the third base 1221, a third push seat 1223 connected to the output end of the third cylinder 1222, a third shaft 1224 rotatably installed on the third base 1221, and a third push rod 1225 provided on the third shaft 1224. The third push rod 1225 is arranged at intervals from the rotation axis of the third shaft 1224, a third strip guide groove 1226 is provided on the third push seat 1223, the third push seat 1223 is sleeved on the third push rod 1225 through the third strip guide groove 1226, and a latch body 1227 is installed on the third shaft 1224. When the wafer box cover is present, the latch body 1227 rotates to unlock the lock body on the box cover under the action of the third cylinder 1222 and locks the box cover on the door body 11. The rotation of the latch body 1227 is controlled by a single third cylinder 1222, and the control structure is simple and easy to implement.

[0080] In this way, the present application controls the rotation of the first swing arm 141, the second swing arm 142, and the latch body 1227 respectively through the first cylinder 1451, the second cylinder, and the third cylinder 1222, thereby simplifying the control structure, facilitating replacement and maintainability, and reducing the probability of jamming.

[0081] Optionally, the first cylinder 1451 , the second cylinder, and the third cylinder 1222 are all guide rod cylinders, and the first cylinder 1451 , the second cylinder, and the third cylinder 1222 have quick exhaust valves to achieve rapid starting of the first cylinder 1451 , the second cylinder, and the third cylinder 1222 .

[0082] In one embodiment, the absorber 121 includes a vacuum pad 1211, a positioning post 1212 having an air hole 1213 and disposed on the vacuum pad 1211, and a pipe joint 1214 connected to the air hole 1213. The suction end 1215 is located on the positioning post 1212, and the suction end 1215 and the vacuum pad 1211 are both located at the cover removal surface 115. When the cover of the wafer box exists, the positioning post 1212 is inserted into the positioning hole of the cover, and the cover and the vacuum pad 1211 form an air cavity connected to the air hole 1213. The pipe joint 1214 is evacuated under the condition of the vacuum generator, and the air cavity generates negative pressure to absorb the cover.

[0083] like Figure 12 to Figure 14As shown, in one embodiment, the box cover detection assembly 13 includes a fourth base 131 installed on the door body 11, an optical coupler 132 installed on the fourth base 131, a trigger 133, a spring 134 sleeved on the trigger 133, and a pressing ring 135 installed on the fourth base 131 and abutting against the optical coupler 132. One end of the trigger 133 is slidably mounted on the fourth base 131, the other end of the trigger 133 is located at the cover removal surface 115, one end of the spring 134 is connected to the fourth base 131, the other end of the spring 134 is connected to the trigger 133, and the pressing ring 135 is located on the sliding path of the trigger 133 moving along the direction of the compression spring 134. The box cover detection component 13 can sense whether the wafer box has a box cover. After the box cover is pressed on the trigger member 133, the trigger member 133 slides along the direction of the compression spring 134 and approaches the pressure ring 135. The trigger member 133 squeezes the pressure ring 135 so that the pressure ring 135 triggers the optical coupler 132 to respond, thereby using the optical coupler 132 to determine whether the wafer box cover exists.

[0084] like Figures 1 to 3 As shown, in one embodiment, the wafer box cover loading and unloading mechanism also includes a circuit board 15 and a wire pressing plate 16. The circuit board 15 is provided with modules such as a control module and a computing module, and the wire pressing plate 16 is used to fix the communication cable and the power cable, which is convenient for the arrangement of the communication cable and the power cable. The door body 11 includes a support frame 111, a front cover 112 arranged on the support frame 111, and a rear cover 113 arranged on the support frame 111. The support frame 111 is clamped between the front cover 112 and the rear cover 113, and the support frame 111, the front cover 112 and the rear cover 113 are enclosed together to form a wiring cavity, the cover assembly 12, the box cover detection assembly 13, and the wafer detection assembly 14 are all electrically connected to the circuit board 15, and the wire pressing plate 16 and the circuit board 15 are installed on the inner wall of the wiring cavity, which is convenient for the hidden installation of the communication cable and the power cable, and avoids the communication cable and the power cable from being exposed.

[0085] In one embodiment, the wafer box cover loading and unloading mechanism also includes a slide 17 for being mounted on a guide rail. The slide 17 is mounted on the door body 11. Specifically, a mounting seat 18 is mounted on the slide 17, and the slide 17 is mounted on the door body 11 through the mounting seat 18. In the actual production process, when the existing wafer loading and unloading device is in use, the door body 11 of the wafer loading and unloading device is opened by flipping a certain angle relative to the door frame, resulting in a waste of space, and is not suitable for small wafer guide machines. In this embodiment, the slide 17 is installed on the door body 11, and the door body 11 is mounted on the guide rail of the wafer loading and unloading device through the slide 17. By using the guide rail slider as a guide for opening or closing the door body 11, the structure is more reliable, the operation is more stable, and it is less susceptible to external interference.

[0086] This embodiment also provides a wafer handling device, including the above-mentioned wafer box cover loading and unloading mechanism. Specifically, the wafer handling device also includes a moving mechanism having a first linear moving component and a second linear moving component. The first linear moving component is installed on the second linear moving component, the second linear moving component is a vertical moving component, the second linear moving component drives the first linear moving component to move up and down, and the first linear moving component is a horizontal moving component. The first linear moving component has a guide rail extending horizontally and linearly, the door body 11 is installed on the guide rail through a slide 17, and the linear driver of the first linear moving component pushes the slide 17 to slide along the guide rail. The wafer handling device cancels the Mapping sensor bracket for installing the wafer detection component on the door frame, and uses the door body 11 to install the detection component. Due to the higher strength of the door body 11 and the more stable operation state, the operation of the detection component is more stable, and the jitter problem when the sensor scans up and down can be avoided. At the same time, the detection component has a storage position and a detection position, has the function of automatic extension and retraction, and saves space. The first swing arm 141 and the second swing arm 142 of the wafer detection assembly 14 are installed at the top of the door body 11, the cover removal assembly 12 and the box cover detection assembly 13 are both located below the wafer detection assembly 14, the suction end 1215 of the cover removal assembly 12, the latch body and the detection part of the box cover detection assembly 13 are all installed at the cover removal surface 115 of the door body 11, and the wafer box is placed in front of the cover removal surface 115. When the cover needs to be removed, the door body 11 slides downward relative to the door frame, and then moves forward horizontally to approach the wafer box. After the cover removal assembly 12 absorbs the box cover, it drives the box cover to move downward. At this time, the wafer detection assembly 14 moves to the rear of the material removal port of the wafer box, and then the wafer detection assembly 14 switches to the detection position, that is, the first swing arm 141 and the second swing arm 142 rotate forward to leave the support part 114 and extend into the wafer box to detect the position of the wafer.

[0087] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A wafer box cover loading and unloading mechanism, characterized in that: include: The door body (11) has a supporting portion (114); A cover removal assembly (12) is installed on the door body (11); A box cover detection component (13), mounted on the door body (11); as well as A wafer detection assembly (14) having a storage position and a detection position; The wafer detection assembly (14) comprises a first swing arm (141), a second swing arm (142), a first counter-beam sensor (143), a second counter-beam sensor, a first driver (145) installed on the door body (11), and a second driver (146) installed on the door body (11); the first swing arm (141) and the second swing arm (142) both have a transmission part (147) and a movable part (148) rotatable relative to the support part (114); the transmission part (147) of the first swing arm (141) is connected to the first driver (145) in a transmission manner, the transmission part (147) of the second swing arm (142) is connected to the second driver (146) in a transmission manner, the first counter-beam sensor (143) is installed on the movable part (148) of the first swing arm (141), and the second counter-beam sensor is installed on the movable part (148) of the second swing arm (142); When the wafer detection assembly (14) is located at the storage position, the movable part (148) of the first swing arm (141) and the movable part (148) of the second swing arm (142) are both located above the support part (114) and abut against the support part (114); when the wafer detection assembly (14) is located at the detection position, the movable part (148) of the first swing arm (141) and the movable part (148) of the second swing arm (142) are both separated from the support part (114), the first counter-radiation sensor (143) and the second counter-radiation sensor are distributed at intervals, and a detection space is formed between the first counter-radiation sensor (143) and the second counter-radiation sensor.

2. The wafer box cover loading and unloading mechanism according to claim 1, characterized in that: The first driver (145) comprises a first cylinder (1451) installed on the door body (11), a first pushing seat (1452) connected to the output end of the first cylinder (1451), a first base (1453) installed on the door body (11), a first shaft (1454) rotatably installed on the first base (1453), and a first push rod (1455) arranged on the first shaft (1454); the first push rod (1455) and the rotation axis of the first shaft (1454) are arranged at intervals, a first strip guide groove (1456) is provided on the first pushing seat (1452), the first pushing seat (1452) is sleeved on the first push rod (1455) through the first strip guide groove (1456), and the transmission part (147) of the first swing arm (141) is installed on the first shaft (1454); The second driver (146) includes a second cylinder installed on the door body (11), a second pushing seat connected to the output end of the second cylinder, a second base installed on the door body (11), a second shaft body rotatably installed on the second base, and a second push rod arranged on the second shaft body; the second push rod and the rotation axis of the second shaft body are arranged at intervals, and a second strip guide groove is opened on the second pushing seat, and the second pushing seat is mounted on the second push rod through the second strip guide groove, and the transmission part (147) of the second swing arm (142) is installed on the second shaft body.

3. The wafer box cover loading and unloading mechanism according to claim 2, characterized in that: The wafer detection assembly (14) further comprises a first cover body (1457) and a second cover body; a first mounting groove (1411) and a first detection hole (1412) for allowing the light beam of the first matching sensor (143) to pass through are provided on the movable portion (148) of the first swing arm (141); the first matching sensor (143) is mounted in the first mounting groove (1411); the first cover body (1457) is mounted on the first swing arm (141) and covers the notch of the first mounting groove (1411); the first mounting groove (1411) is connected to the outside of the first swing arm (141) through the first detection hole (1412); The movable portion (148) of the second swing arm (142) is provided with a second mounting groove and a second detection hole for allowing the light beam of the second counter-radiation sensor to pass through, the second counter-radiation sensor is mounted on the second mounting groove, the second cover body is mounted on the second swing arm (142) and covers the groove opening of the second mounting groove, and the second mounting groove is connected to the outside of the second swing arm (142) through the second detection hole.

4. The wafer box cover loading and unloading mechanism according to claim 2, characterized in that: The first driver (145) also includes a first torsion spring (1458); the second driver (146) also includes a second torsion spring; the first torsion spring (1458) is sleeved on the first shaft (1454), the first torsion axis of the first torsion spring (1458) is connected to the door body (11), the second torsion axis of the first torsion spring (1458) is connected to the first swing arm (141), the second torsion spring is sleeved on the second shaft, the first torsion axis of the second torsion spring is connected to the door body (11), and the second torsion axis of the second torsion spring is connected to the second swing arm (142).

5. The wafer box cover loading and unloading mechanism according to any one of claims 1 to 4, characterized in that: The lid removal component (12) comprises a suction device (121) having a suction end (1215) and a latch module (122) having a latch body (1227); the box lid detection component (13) has a detection portion (136); the door body (11) has a lid removal surface (115); the suction device (121), the latch module (122) and the box lid detection component (13) are all installed on the door body (11); and the suction end (1215), the latch body (1227) and the detection portion (136) are all located on the lid removal surface (115).

6. The wafer box cover loading and unloading mechanism according to claim 5, characterized in that: The latch module (122) includes a third base (1221) installed on the door body (11), a third cylinder (1222) installed on the third base (1221), a third push seat (1223) connected to the output end of the third cylinder (1222), a third shaft (1224) rotatably installed on the third base (1221), and a third push rod (1225) arranged on the third shaft (1224); the third push rod (1225) and the rotation axis of the third shaft (1224) are arranged at intervals, a third strip guide groove (1226) is opened on the third push seat (1223), the third push seat (1223) is sleeved on the third push rod (1225) through the third strip guide groove (1226), and the latch body (1227) is installed on the third shaft (1224).

7. The wafer box cover loading and unloading mechanism according to claim 5, characterized in that: The adsorber (121) comprises a vacuum pad (1211), a positioning column (1212) having an air hole (1213) and arranged on the vacuum pad (1211), and a pipe joint (1214) connected to the air hole (1213); the adsorption end (1215) is located on the positioning column (1212), and the adsorption end (1215) and the vacuum pad (1211) are both located at the cover removal surface (115).

8. The wafer box cover loading and unloading mechanism according to claim 5, characterized in that: The box cover detection component (13) comprises a fourth base (131) installed on the door body (11), an optical coupler (132) installed on the fourth base (131), a trigger member (133), a spring (134) sleeved on the trigger member (133), and a pressure ring (135) installed on the fourth base (131) and abutting against the optical coupler (132); one end of the trigger member (133) is slidably mounted on the fourth base (131), and the other end of the trigger member (133) is located at the cover removal surface (115); one end of the spring (134) is connected to the fourth base (131), and the other end of the spring (134) is connected to the trigger member (133); the pressure ring (135) is located on the sliding path of the trigger member (133) moving along the direction of compressing the spring (134).

9. The wafer box cover loading and unloading mechanism according to any one of claims 1 to 4, characterized in that: The invention also comprises a circuit board (15) and a wire pressing plate (16); the door body (11) comprises a support frame (111), a front cover (112) arranged on the support frame (111), and a rear cover (113) arranged on the support frame (111); the support frame (111) is clamped between the front cover (112) and the rear cover (113), and the support frame (111), the front cover (112) and the rear cover (113) are jointly enclosed to form a wiring cavity; the cover removal component (12), the box cover detection component (13), and the wafer detection component (14) are all electrically connected to the circuit board (15); and the wire pressing plate (16) and the circuit board (15) are both installed on the inner wall of the wiring cavity.

10. A wafer handling device, characterized in that: It comprises a wafer box cover loading and unloading mechanism as described in any one of claims 1 to 9.

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