Heat dissipation case

Abstract

The utility model belongs to the technical field of heat dissipation of electronic devices, and discloses a heat dissipation case which comprises a case body, a first heat conduction structure, a second heat conduction structure and a first fan. The box body forms an accommodating space for accommodating the heating element. The first heat conduction structure comprises a substrate, the substrate forms part of the side wall of the box body, and the heating element is installed on the substrate. The second heat conduction structure is located in the containing space and connected to the substrate, and the second heat conduction structure transmits heat in air in the containing space to the outside of the box body through the substrate. The first fan is connected to the inner wall of the box body and correspondingly arranged on the second heat conduction structure. According to the heat dissipation case, heat convection of air in the case body can be increased, uniform diffusion of heat is achieved, outward radiation heat dissipation of the case body is increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic devices, in particular to a heat dissipation chassis. Background Art

[0002] With the rapid development of electronic and power technologies, the modularization and integration of electronic devices have been greatly improved. The higher the integration, the higher the heat generated by the electronic devices, and the lower the working stability of the electronic devices. If the heat cannot be dissipated in time, the reliability of the electronic devices will be greatly reduced, and they may even fail to operate normally. In order to ensure that the heat-generating electronic devices can operate normally, a heat dissipation chassis is usually installed on the heat-generating electronic devices to discharge the heat generated by them.

[0003] In the heat dissipation chassis currently used, one side of the heat exchange plate exchanges heat with the hot air flow inside the chassis, and the other side exchanges heat with the cold air flow outside the chassis, thereby achieving heat dissipation of heat-generating electronic components in the chassis. It heavily relies on the chassis surface to radiate heat to the outside, and the heat dissipation efficiency is low.

[0004] Therefore, a heat dissipation chassis is urgently needed to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a heat dissipation chassis, which can increase the heat convection of the air inside the chassis and the air flow outside the chassis, increase the external radiation heat dissipation of the chassis, and improve the heat dissipation efficiency.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A heat dissipation chassis is provided, comprising:

[0008] A box body, wherein the box body forms a receiving space for receiving the heating element;

[0009] A first heat-conducting structure, wherein the first heat-conducting structure comprises a substrate, the substrate forms a part of the side wall of the box, and the heating element is mounted on the substrate;

[0010] a second heat-conducting structure, the second heat-conducting structure is located in the accommodating space, the second heat-conducting structure is connected to the substrate, and the second heat-conducting structure transfers heat in the air in the accommodating space to the outside of the box through the substrate;

[0011] A first fan is connected to the inner wall of the box body, and the first fan is correspondingly arranged on the second heat-conducting structure.

[0012] As an optional solution for the heat dissipation chassis, the heat dissipation chassis also includes a duct bend plate, both ends of the duct bend plate are connected to the substrate to form a first duct, the second heat conductive structure is located in the first duct, and the first fan is correspondingly arranged at the air inlet of the first duct.

[0013] As an optional solution for the heat dissipation chassis, the air duct curved plate includes a main body portion and a flared portion, the main body portion forms the first air duct, and the flared portion is connected to one end of the main body portion facing the first fan.

[0014] As an optional solution for the heat dissipation chassis, the second heat-conducting structure includes a heat-conducting part and a second heat-dissipating fin, the heat-conducting part is connected to the substrate, and the second heat-dissipating fin is connected to a side of the heat-conducting part facing the first air duct.

[0015] As an optional solution of the heat dissipation chassis, the heat dissipation chassis includes a plurality of the second heat-conducting structures, and the plurality of the second heat-conducting structures are connected to the substrate and located in the first air duct.

[0016] As an optional solution for the heat dissipation chassis, the heat dissipation chassis includes a plurality of the first fans, at least one of the first fans fans air into the first air duct, and at least one of the first fans fans air toward the heating element.

[0017] As an optional solution for the heat dissipation chassis, the first heat-conducting structure further includes a first heat dissipation fin, and the first heat dissipation fin is connected to a side of the substrate facing away from the chassis.

[0018] As an optional solution for the heat dissipation chassis, the heat dissipation chassis further includes a second fan, which is connected to the outside of the chassis and is used to blow air toward the first heat-conducting structure.

[0019] As an optional solution for the heat dissipation chassis, the heat dissipation chassis also includes an external air duct plate, which is connected to the outside of the chassis, the external air duct plate forms a second air duct, and the external air duct plate covers the first heat conducting structure and the second fan.

[0020] As an optional solution for the heat dissipation chassis, the second air duct includes an upper air duct and a lower air duct that are interconnected, the cross-sectional area of ​​the upper air duct is larger than the cross-sectional area of ​​the lower air duct, the second fan is located in the upper air duct, and the first heat conductive structure is located in the lower air duct.

[0021] Beneficial effects of the utility model:

[0022] The utility model provides a heat dissipation chassis, comprising a chassis, a first heat-conducting structure, a second heat-conducting structure, and a first fan, wherein a heating element is installed in a receiving space formed by the chassis, a substrate of the first heat-conducting structure forms a part of the side wall of the chassis, and the heating element is installed on the substrate, and can directly transfer heat to the first heat-conducting structure; the first fan can fan the second heat-conducting structure in the receiving space, so that a circulating airflow can be formed in the receiving space, the heat convection of the air inside the chassis is increased, the uniform diffusion of heat is achieved, and the situation of local high temperature inside the chassis is reduced; the heating element can transfer heat to the circulating airflow, the circulating airflow transfers heat to the second heat-conducting structure, and the second heat-conducting structure transfers heat to the first heat-conducting structure, and further realizes the transfer of heat inside the chassis to the outside of the chassis. The heat dissipation chassis has a good heat flow effect in the chassis, so that the temperature of each component inside the chassis is uniform, which is conducive to ensuring the service life of each component; through the connection of the first heat-conducting structure and the second heat-conducting mechanism, the efficiency of transferring heat from the chassis to the outside of the chassis is improved, and the heat dissipation effect is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the first heat-conducting structure and the second heat-conducting structure of the heat-dissipating chassis provided by the utility model;

[0024] Figure 2 This is a schematic diagram of the internal structure of the second air duct of the heat dissipation chassis provided by the utility model;

[0025] Figure 3 It is a schematic diagram of the interior of the heat dissipation chassis provided by the utility model;

[0026] Figure 4 It is a schematic diagram of the airflow inside the heat dissipation chassis provided by the utility model;

[0027] Figure 5 It is a schematic diagram of the internal airflow of the external air duct plate of the heat dissipation chassis provided by the utility model.

[0028] In the figure:

[0029] 1. Box body; 11. Accommodation space;

[0030] 2. first heat-conducting structure; 21. substrate; 22. first heat-dissipating fin;

[0031] 3. A second heat-conducting structure; 31. A second heat-dissipating fin;

[0032] 4. First fan;

[0033] 5. Air duct curved plate; 51. First air duct; 52. Main body; 53. Expanding portion;

[0034] 6. Second fan;

[0035] 7. External air duct plate; 71. Second air duct; 711. Upper air duct; 712. Lower air duct. DETAILED DESCRIPTION

[0036] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] like Figures 1 to 3As shown, the heat dissipation chassis of this embodiment includes a housing 1, a first heat-conducting structure 2, a second heat-conducting structure 3, and a first fan 4. The housing 1 forms a receiving space 11 for receiving a heating element. The first heat-conducting structure 2 includes a substrate 21, which forms a part of the side wall of the housing 1, and the heating element is mounted on the substrate 21. The second heat-conducting structure 3 is located in the receiving space 11, and the second heat-conducting structure 3 is connected to the substrate 21. The second heat-conducting structure 3 transfers the heat in the air in the receiving space 11 to the outside of the housing 1 through the substrate 21. The first fan 4 is connected to the inner wall of the housing 1, and the first fan 4 is correspondingly arranged on the second heat-conducting structure 3.

[0041] In the heat dissipation chassis, the heating element is installed in the accommodation space 11 formed by the box body 1, the substrate 21 of the first heat-conducting structure 2 forms part of the side wall of the box body 1, and the heating element is installed on the substrate 21, which can directly transfer heat to the first heat-conducting structure 2, and the first fan 4 can fan the first air duct 51, so that in the accommodation space 11, a circulating airflow can be formed inside and outside the first air duct 51, increasing the heat convection of the air inside the box body 1, achieving uniform diffusion of heat, and reducing the situation of local high temperature inside the box body 1; the heating element can transfer heat to the circulating airflow, and the circulating airflow transfers the heat to the second heat-conducting structure 3, and the second heat-conducting structure 3 transfers the heat to the first heat-conducting structure 2, further realizing the transfer of heat from the inside of the box body 1 to the outside of the box body 1. The heat dissipation chassis has a good heat flow effect in the box body 1, and through the connection between the first heat-conducting structure 2 and the second heat-conducting structure 3, the efficiency of heat transfer from the inside of the box body 1 to the outside of the box body 1 is improved, and the heat dissipation effect is improved.

[0042] Optionally, the heat dissipation chassis includes a plurality of first fans 4, at least one of which fans air into the first air duct 51, and at least one of which fans air toward the heating element. The first fan 4 that fans air toward the heating element can not only improve the efficiency of heat dissipation from the heating element to the air, but also speed up the flow speed of the airflow in the accommodating space 11, improve the heat transfer efficiency inside the box body 1, and further ensure that the temperature of each component in the box body 1 is evenly diffused. In this embodiment, two first fans 4 are provided, and the two first fans 4 are staggered on both sides of the substrate 21, and the fanning directions of the two first fans 4 are opposite, thereby enhancing the circulation effect of the airflow.

[0043] Furthermore, the heat dissipation chassis also includes a duct bend plate 5, both ends of which are connected to the substrate 21 to form a first duct 51, the second heat-conducting structure 3 is located in the first duct 51, and the first fan 4 is correspondingly arranged at the air inlet of the first duct 51, and can fan the first duct 51 to gather the flowing air in the first duct 51, so that the air can transfer heat to the second heat-conducting structure 3 more concentratedly, thereby improving the thermal efficiency. At the same time, it can also isolate the air flow path formed inside and outside the duct bend plate 5, so that the air can circulate regularly.

[0044] Optionally, the air duct curved plate 5 includes a main body 52 and a flared portion 53, the main body 52 forms a first air duct 51, the flared portion 53 is connected to one end of the main body 52 facing the first fan 4, and the flared portion 53 is used to expand the air inlet of the first air duct 51. When the first fan 4 blows air into the flared portion 53, the air inlet volume of the first air duct 51 can be increased, and the flow rate of the circulating airflow in the accommodating space 11 can be increased. When the airflow flows from the flared portion 53 to the main body 52, the cross-sectional area of ​​the airflow flow path becomes smaller, which can speed up the airflow velocity in the main body 52, further increase the airflow velocity in the accommodating space 11, and improve the heat dissipation efficiency inside the box 1.

[0045] Further, the heat dissipation chassis includes a plurality of second heat-conducting structures 3, which are connected to the substrate 21 and are located in the first air duct 51. The plurality of second heat-conducting structures 3 can simultaneously transfer heat to the first heat-conducting structure 2, thereby improving the efficiency of heat dissipation from the inside of the chassis 1 to the outside. In this embodiment, three second heat-conducting structures 3 are provided, and the three second heat-conducting structures 3 are arranged along the direction of the airflow in the first air duct. In some other embodiments, the number of the second heat-conducting structures 3 can also be set to two, four, five, etc.

[0046] Optionally, the second heat-conducting structure 3 includes a heat-conducting portion (not shown in the figure) and a second heat-dissipating fin 31, the heat-conducting portion is connected to the substrate 21, and the second heat-dissipating fin 31 is connected to a side of the heat-conducting portion facing the first air duct 51. A plurality of second heat-dissipating fins 31 are provided, and the plurality of second heat-dissipating fins 31 are arranged at intervals from each other in a direction perpendicular to the airflow in the first air duct 51 and extend along the airflow direction. The second heat-dissipating fins 31 increase the contact area between the second heat-conducting structure 3 and the airflow in the first air duct 51, thereby increasing the heat transferred from the airflow to the second heat-dissipating fin 31, thereby improving the efficiency of the second heat-conducting structure 3 transferring heat to the first heat-conducting structure 2.

[0047] In this embodiment, the first heat-conducting structure 2 is a heat sink, and the second heat-conducting structure 3 is connected to the substrate 21 of the first heat-conducting structure 2 through a connector. There is no need to make too many adjustments to the original heating elements inside the box 1 and the layout of the second heat-conducting structure 3, which can meet the heat dissipation requirements of most boxes 1, has a simple structure, and a mature manufacturing process. Optionally, the second heat-conducting structure 3 can be connected to the substrate 21 by welding, riveting, or bolting, so as to facilitate the installation of the second heat-conducting structure 3.

[0048] In order to improve the efficiency of heat transfer from the second heat-conducting structure 3 to the first heat-conducting structure 2, in some other embodiments, the first heat-conducting structure 2 and the second heat-conducting structure 3 are configured as an integrated structure to improve the efficiency of heat dissipation from the inside of the box 1 to the outside, while also being able to simplify the production process and save manufacturing costs.

[0049] Furthermore, the first heat-conducting structure 2 also includes a first heat-dissipating fin 22, and the first heat-dissipating fin 22 is connected to a side of the base plate 21 facing away from the box body 1. The first heat-dissipating fin 22 can increase the contact area between the first heat-conducting structure 2 and the air, and improve the efficiency of the first heat-conducting structure 2 in dissipating heat into the air. Specifically, a plurality of first heat-dissipating fins 22 are provided, and the plurality of first heat-dissipating fins 22 are arranged at intervals perpendicular to the fanning direction of the second fan 6 and extend in the fanning direction, so as to maximize the flow speed of the cold air on the surface of the first heat-dissipating fin 22, thereby ensuring the heat dissipation effect of the first heat-conducting structure 2.

[0050] Furthermore, the heat dissipation chassis also includes a second fan 6, which is connected to the outside of the chassis 1 and is used to blow air to the first heat-conducting structure 2 to increase the air flow speed on the surface of the first heat-conducting structure 2, thereby improving the heat dissipation effect of the first heat-conducting structure 2.

[0051] Optionally, the heat dissipation chassis includes a plurality of second fans 6, which are connected to the outside of the chassis 1, thereby improving the efficiency of heat transfer from the first heat-conducting structure 2 to the control. In this embodiment, four second fans 6 are provided, and in some other embodiments, two, three, five, etc. second fans 6 may also be provided.

[0052] Furthermore, the heat dissipation chassis also includes an external air duct plate 7, which is connected to the outside of the box body 1. The external air duct plate 7 forms a second air duct 71. The external air duct plate 7 covers the first heat conducting structure 2 and the second fan 6. The second air duct 71 and the air outside the external air duct plate 7 circulate under the operation of the second fan 6, which is beneficial to the heat transfer between the first heat conducting structure 2 and the cold air, thereby improving the heat dissipation efficiency.

[0053] Furthermore, the second air duct 71 includes an upper air duct 711 and a lower air duct 712 which are interconnected, the cross-sectional area of ​​the upper air duct 711 is larger than the cross-sectional area of ​​the lower air duct 712, the second fan 6 is located in the upper air duct 711, and the first heat-conducting structure 2 is located in the lower air duct 712. When the cold air enters the lower air duct 712 from the upper air duct 711, the cross-sectional area of ​​the air duct becomes smaller, so that the air flow rate in the lower air duct 712 can be greater than the air flow rate in the upper air duct 711, which is beneficial to improving the heat dissipation efficiency of the first heat-conducting structure 2.

[0054] Reference Figure 4 and Figure 5In the heat dissipation chassis provided in this embodiment, the heating element is installed on the top of the substrate 21, and the second heat-conducting structure 3 is connected to the bottom of the substrate 21, that is, the heating element is installed above the second heat-conducting structure 3, a first fan 4 is installed on the left side of the second heat-conducting structure 3, and another first fan 4 is installed on the right side of the heating element. When the heating element generates heat at work, the heating element transfers heat to the air in the accommodating space 11, and the first fan 4 located on the right side of the heating element fans the heating element to make the air on the surface of the heating element flow, and the first fan 4 on the left side of the second heat-conducting structure 3 can fan the first air duct 51. The two first fans 4 can make the air in the accommodating space 11 circulate inside and outside the first air duct 51, and the heat in the air is transferred to the second heat dissipation fins 31 in the first air duct 51, thereby realizing the circulation transfer of heat inside the box body 1. The heat on the second heat dissipation fins 31 is transferred to the bottom of the substrate 21 through the heat conduction part, and the heating element can also directly transfer heat to the top of the substrate 21. The heat of the substrate 21 is transferred to the first heat dissipation fins 22. The second fan 6 is installed below the first heat conduction structure 2. The second fan 6 fans the first heat dissipation fins 22 in the second air duct 71, so that the air on the surface of the first heat dissipation fins 22 flows, thereby realizing the heat transfer from the first heat dissipation fins 22 to the cold air in the second air duct 71, realizing the circulating heat dissipation outside the box 1, and finally realizing the heat dissipation of the heating element.

[0055] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A heat dissipation chassis, characterized in that: include: A housing (1), wherein the housing (1) forms a receiving space (11) for receiving a heating element; A first heat-conducting structure (2), the first heat-conducting structure (2) comprising a substrate (21), the substrate (21) forming part of a side wall of the box body (1), and the heating element being mounted on the substrate (21); a second heat-conducting structure (3), the second heat-conducting structure (3) being located in the accommodating space (11), the second heat-conducting structure (3) being connected to the substrate (21), and the second heat-conducting structure (3) transferring heat in the air in the accommodating space (11) to the outside of the box (1) through the substrate (21); A first fan (4), the first fan (4) is connected to the inner wall of the box body (1), and the first fan (4) is arranged corresponding to the second heat-conducting structure (3).

2. The heat dissipation chassis according to claim 1, characterized in that: The heat dissipation chassis further comprises an air duct bent plate (5), the two ends of the air duct bent plate (5) being connected to the base plate (21) to form a first air duct (51), the second heat conducting structure (3) being located in the first air duct (51), and the first fan (4) being arranged corresponding to the air inlet of the first air duct (51).

3. The heat dissipation chassis according to claim 2, characterized in that: The air duct curved plate (5) comprises a main body (52) and a flared portion (53), wherein the main body (52) forms the first air duct (51), and the flared portion (53) is connected to one end of the main body (52) facing the first fan (4).

4. The heat dissipation chassis according to claim 2, characterized in that: The second heat-conducting structure (3) comprises a heat-conducting portion and a second heat-dissipating fin (31), the heat-conducting portion being connected to the substrate (21), and the second heat-dissipating fin (31) being connected to a side of the heat-conducting portion facing the first air duct (51).

5. The heat dissipation chassis according to claim 2, characterized in that: The heat dissipation chassis comprises a plurality of the second heat-conducting structures (3), wherein the plurality of the second heat-conducting structures (3) are connected to the substrate (21) and are located in the first air duct (51).

6. The heat dissipation chassis according to claim 2, characterized in that: The heat dissipation chassis comprises a plurality of the first fans (4), at least one of the first fans (4) fans air into the first air duct (51), and at least one of the first fans (4) fans air toward the heating element.

7. The heat dissipation chassis according to claim 1, characterized in that: The first heat-conducting structure (2) further comprises a first heat-dissipating fin (22), wherein the first heat-dissipating fin (22) is connected to a side of the base plate (21) facing away from the box body (1).

8. The heat dissipation chassis according to claim 1, characterized in that: The heat dissipation chassis further comprises a second fan (6), wherein the second fan (6) is connected to the outside of the chassis (1) and is used to blow air toward the first heat-conducting structure (2).

9. The heat dissipation chassis according to claim 8, characterized in that: The heat dissipation chassis further comprises an external air duct plate (7), the external air duct plate (7) being connected to the outside of the chassis (1), the external air duct plate (7) forming a second air duct (71), and the external air duct plate (7) being arranged to cover the first heat conducting structure (2) and the second fan (6).

10. The heat dissipation chassis according to claim 9, characterized in that: The second air duct (71) comprises an upper air duct (711) and a lower air duct (712) which are interconnected, the cross-sectional area of ​​the upper air duct (711) is larger than the cross-sectional area of ​​the lower air duct (712), the second fan (6) is located in the upper air duct (711), and the first heat-conducting structure (2) is located in the lower air duct (712).

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