Heat dissipation mechanism for automobile electronic water pump control circuit board

Abstract

The utility model discloses an automobile electronic water pump control circuit board heat dissipation mechanism which comprises a base, a water pump assembly, an inlet assembly and a heat dissipation assembly, the water pump assembly is arranged above the base, the inlet assembly is arranged on one side of the water pump assembly, the heat dissipation assembly is arranged on one side of the water pump assembly, and a heat dissipation plate is arranged, so that the heat dissipation efficiency is improved. The heat dissipation plate is installed and connected with the circuit board, the two sides of the heat dissipation plate are fixedly connected with one ends of the copper pipes, the other ends of the copper pipes are fixedly connected with the heat dissipation fins, when the circuit board works, the heat dissipation plate and the copper pipes conduct heat on the circuit board, the heat is dispersed through the heat dissipation fins, and meanwhile the heat dissipation fan dissipates the heat on the heat dissipation fins; therefore, heat is discharged through the heat dissipation holes in the heat dissipation shell while heat dissipation is conducted on the circuit board, condensate water dissipates heat of the circuit board when passing through the interior of the shell, and the device solves the problems that the heat dissipation effect of the circuit board is poor, and the water pump is damaged.

Description

Technical Field

[0001] The utility model relates to electronic water pump technology, specifically, to a heat dissipation mechanism of a control circuit board of an automobile electronic water pump. Background Art

[0002] The electronic water pump is a new type of water pump that uses piezoelectric materials as a power device, completely realizes electronicization from control to drive, and completely controls liquid transmission with an electronic integrated system, thereby achieving adjustability and precision of liquid transmission.

[0003] During the use of the existing new energy vehicle electronic water pump control circuit board, the circuit board is placed inside the water pump. When dissipating heat, the internal condensed water is usually dissipated when passing through the water pump and through the heat dissipation holes on the water pump. In hot weather, the condensed water alone cannot meet the heat dissipation requirements, causing problems with the water pump.

[0004] Currently, no effective solution has been proposed for the problems in the related technologies. Utility Model Content

[0005] In view of the problems in the related art, the utility model proposes a heat dissipation mechanism for an automobile electronic water pump control circuit board to overcome the above technical problems existing in the existing related art.

[0006] To this end, the specific technical solutions adopted by the utility model are as follows:

[0007] A heat dissipation mechanism for an automotive electronic water pump control circuit board comprises a base, a water pump assembly, an inlet assembly and a heat dissipation assembly, wherein the water pump assembly is arranged above the base, the inlet assembly is arranged on one side of the water pump assembly, and the heat dissipation assembly is arranged on one side of the water pump assembly.

[0008] The utility model further explains: the heat dissipation assembly includes a heat dissipation shell, a second mounting groove, a support ring, a fixing plate, a heat sink, a copper tube, a heat dissipation fan and a heat dissipation plate. The heat dissipation shell is arranged on one side of the water pump assembly, the second mounting groove is arranged on the outside of the heat dissipation shell, the support ring is arranged below the heat dissipation shell, the fixing plate is arranged below the support ring, the heat dissipation fin is arranged inside the heat dissipation shell, the copper tube is arranged on the heat sink, the copper tube is arranged on the heat sink, the heat dissipation fan is arranged on both sides of the heat sink, and the heat dissipation plate is arranged on one side of the heat sink.

[0009] The utility model further explains: the water pump assembly includes a shell, a mounting hole, a mounting ring, a water outlet, a bottom plate, a turbofan and a circuit board, the shell is arranged above the base, the mounting hole is arranged on the outside of the shell, the mounting ring is arranged on the outside of the shell, the water outlet is arranged on one side of the mounting ring, the bottom plate is arranged below the mounting ring, the turbofan is arranged inside the shell, and the circuit board is arranged on the inner side of the shell.

[0010] The utility model further describes: the entry assembly includes a side shell, a first mounting groove, an entry port and a sealing ring, the side shell is arranged on one side of the outer shell, the first mounting groove is arranged on the outer side of the side shell, the entry port is arranged on one side of the side shell, and the sealing ring is arranged on the inner side of the side shell.

[0011] The utility model further explains: a connecting groove is arranged above the base, a mounting plate is arranged in the connecting groove, and a spring is arranged below the mounting plate.

[0012] The utility model further illustrates that: one end of the spring is fixedly connected to the base, and the other end of the spring is fixedly connected to the mounting plate.

[0013] The utility model further explains: the mounting holes are adapted to the first mounting grooves and are installed and connected by bolts, and the other group of mounting holes are adapted to the second mounting grooves and are installed and connected by bolts.

[0014] The utility model further explains: the bottom plate is provided with a mounting port, and is mounted and connected to the mounting plate by bolts; the fixing plate is provided with a connecting port, and is mounted and connected to another set of mounting plates by bolts.

[0015] The beneficial effects of the utility model are as follows: by providing a heat dissipation plate, the heat dissipation plate is installed and connected with the circuit board, the two sides of the heat dissipation plate are fixedly connected with one end of the copper tube, and the other end of the copper tube is fixedly connected with the heat sink, when the circuit board is working, the heat dissipation plate and the copper tube conduct the heat on the circuit board, and the heat is dispersed through the heat sink, and the heat dissipation fan dissipates the heat on the heat sink, so that the heat is dissipated from the circuit board while the heat is dissipated from the circuit board through the heat dissipation holes on the heat dissipation shell;

[0016] A circuit board is provided, a groove for condensed water to pass through is provided on one side of the inner part of the shell, a mounting port is provided on one side of the inner part of the shell, the circuit board is arranged inside the mounting port, the turbo fan is arranged in the groove, one end of the water outlet is communicated with the outer shell, and when in use, condensed water is condensed, the turbo fan pressurizes the inside of the outer shell, enters the groove inside the outer shell through the entry component, and is then discharged through the water outlet. When the condensed water passes through the inner part of the shell, the circuit board is cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the overall structure according to an embodiment of the utility model;

[0019] Figure 2 It is a schematic diagram of the cross-sectional structure according to an embodiment of the utility model;

[0020] Figure 3 It is a schematic diagram of the disassembled structure according to an embodiment of the utility model;

[0021] Figure 4 It is a schematic diagram of the structure of the heat dissipation assembly according to an embodiment of the utility model;

[0022] Figure 5 It is a schematic diagram of the base structure according to an embodiment of the utility model.

[0023] In the figure:

[0024] 1. Base; 11. Mounting plate; 12. Spring; 2. Water pump assembly; 21. Housing; 22. Mounting hole; 23. Mounting ring; 24. Water outlet; 25. Bottom plate; 26. Turbofan; 27. Circuit board; 3. Entry assembly; 31. Side shell; 32. First mounting groove; 33. Entry port; 34. Sealing ring; 4. Heat dissipation assembly; 41. Heat dissipation housing; 42. Second mounting groove; 43. Support ring; 44. Fixing plate; 45. Heat sink; 46. Copper tube; 47. Cooling fan; 48. Heat dissipation plate. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] like Figure 1-5 As shown, the heat dissipation mechanism of the automotive electronic water pump control circuit board according to the embodiment of the utility model comprises a base 1, a water pump assembly 2, an inlet assembly 3 and a heat dissipation assembly 4, the water pump assembly 2 is arranged above the base 1, the inlet assembly 3 is arranged on one side of the water pump assembly 2, and the heat dissipation assembly 4 is arranged on one side of the water pump assembly 2;

[0027] The heat dissipation assembly 4 includes a heat dissipation shell 41, a second mounting groove 42, a support ring 43, a fixing plate 44, a heat sink 45, a copper tube 46, a heat dissipation fan 47 and a heat dissipation plate 48. The heat dissipation shell 41 is arranged on one side of the water pump assembly 2, the second mounting groove 42 is arranged on the outside of the heat dissipation shell 41, the support ring 43 is arranged below the heat dissipation shell 41, the fixing plate 44 is arranged below the support ring 43, the heat dissipation 45 is arranged inside the heat dissipation shell 41, the copper tube 46 is arranged on the heat dissipation 45, the copper tube 46 is arranged on the heat dissipation 45, and the heat dissipation fan 47 is arranged on the heat dissipation 45. On both sides, the heat sink 48 is arranged on one side of the heat sink 45, the heat sink 45 is installed and connected with the circuit board 27, the two sides of the heat sink 48 are fixedly connected with one end of the copper tube 46, and the other end of the copper tube 46 is fixedly connected with the heat sink 45. When the circuit board 27 is working, the heat sink 48 and the copper tube 46 conduct the heat on the circuit board 27, and disperse the heat through the heat sink 45. At the same time, the heat dissipation fan 47 dissipates the heat on the heat sink 45, so that the heat is discharged through the heat dissipation holes on the heat dissipation shell 41 while the circuit board 27 is dissipated.

[0028] The water pump assembly 2 includes a housing 21, a mounting hole 22, a mounting ring 23, a water outlet 24, a bottom plate 25, a turbofan 26 and a circuit board 27. The housing 21 is arranged above the base 1, the mounting hole 22 is arranged on the outside of the housing 21, the mounting ring 23 is arranged on the outside of the housing 21, the water outlet 24 is arranged on one side of the mounting ring 23, the bottom plate 25 is arranged below the mounting ring 23, the turbofan 26 is arranged inside the housing 21, the circuit board 27 is arranged on the inside of the housing 21, one side of the inside of the housing 21 is provided with a groove for condensed water to pass through, one side of the inside of the housing 21 is provided with a mounting port, the circuit board 27 is arranged inside the mounting port, the turbofan 26 is arranged in the groove, one end of the water outlet 24 is communicated with the housing 21, when condensed water is used, the turbofan 26 pressurizes the inside of the housing 21, enters the groove inside the housing 21 through the inlet assembly 3, and is then discharged through the water outlet 24, and when the condensed water passes through the inside of the housing 21, the circuit board 27 is cooled;

[0029] The inlet assembly 3 includes a side shell 31, a first mounting groove 32, an inlet port 33 and a sealing ring 34. The side shell 31 is arranged on one side of the housing 21, the first mounting groove 32 is arranged on the outside of the side shell 31, the inlet port 33 is arranged on one side of the side shell 31, and the sealing ring 34 is arranged on the inside of the side shell 31.

[0030] A connecting groove is arranged above the base 1 , a mounting plate 11 is arranged in the connecting groove, a spring 12 is arranged below the mounting plate 11 , one end of the spring 12 is fixedly connected to the base 1 , and the other end of the spring 12 is fixedly connected to the mounting plate 11 .

[0031] In order to facilitate understanding of the above technical solution of the present invention, the working principle or operation method of the present invention in the actual process is described in detail below.

[0032] In actual application, the heat sink 45 is installed and connected to the circuit board 27, and both sides of the heat sink 48 are fixedly connected to one end of the copper tube 46, and the other end of the copper tube 46 is fixedly connected to the heat sink 45. When the circuit board 27 is working, the heat sink 48 and the copper tube 46 conduct the heat on the circuit board 27, and disperse the heat through the heat sink 45. At the same time, the heat dissipation fan 47 dissipates the heat on the heat sink 45, so that while the circuit board 27 is dissipated, the heat is discharged through the heat dissipation holes on the heat dissipation shell 41. A groove for condensed water to pass through is provided on one side of the interior of the shell 21, and a mounting port is provided on one side of the interior of the shell 21. The circuit board 27 is arranged inside the mounting port, and the turbofan 26 is arranged in the groove. One end of the water outlet 24 is communicated with the shell 21. When condensed water is used, the turbofan 26 pressurizes the interior of the shell 21, enters the groove inside the shell 21 through the entry component 3, and is then discharged through the water outlet 24. When the condensed water passes through the interior of the shell 21, the circuit board 27 is cooled.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation mechanism for an automotive electronic water pump control circuit board, characterized in that: The invention comprises a base (1), a water pump assembly (2), an inlet assembly (3) and a heat dissipation assembly (4), wherein the water pump assembly (2) is arranged above the base (1), the inlet assembly (3) is arranged on one side of the water pump assembly (2), and the heat dissipation assembly (4) is arranged on one side of the water pump assembly (2); the heat dissipation assembly (4) comprises a heat dissipation shell (41), a second mounting groove (42), a support ring (43), a fixing plate (44), a heat dissipation fin (45), a copper tube (46), a heat dissipation fan (47) and a heat dissipation plate (48), and the heat dissipation shell (41) is provided with a heat dissipation fan (47) and a heat dissipation plate (48). The water pump assembly (41) is arranged on one side of the water pump assembly (2), the second installation groove (42) is arranged on the outside of the heat dissipation shell (41), the support ring (43) is arranged below the heat dissipation shell (41), the fixing plate (44) is arranged below the support ring (43), the heat dissipation fin (45) is arranged inside the heat dissipation shell (41), the copper tube (46) is arranged on the heat dissipation fin (45), the copper tube (46) is arranged on the heat dissipation fin (45), the heat dissipation fan (47) is arranged on both sides of the heat dissipation fin (45), and the heat dissipation plate (48) is arranged on the heat dissipation fin (45). The water pump assembly (2) comprises a housing (21), a mounting hole (22), a mounting ring (23), a water outlet (24), a bottom plate (25), a turbofan (26) and a circuit board (27); the housing (21) is arranged above the base (1); the mounting hole (22) is arranged on the outside of the housing (21); the mounting ring (23) is arranged on the outside of the housing (21); the water outlet (24) is arranged on one side of the mounting ring (23); the bottom plate (25) is arranged on the outside of the mounting ring (2 3), the turbine fan (26) is arranged inside the housing (21), and the circuit board (27) is arranged on the inner side of the housing (21); the inlet assembly (3) comprises a side shell (31), a first mounting groove (32), an inlet port (33) and a sealing ring (34), the side shell (31) is arranged on one side of the housing (21), the first mounting groove (32) is arranged on the outer side of the side shell (31), the inlet port (33) is arranged on one side of the side shell (31), and the sealing ring (34) is arranged on the inner side of the side shell (31).

2. The heat dissipation mechanism of an automotive electronic water pump control circuit board according to claim 1, characterized in that: A connecting groove is arranged above the base (1), a mounting plate (11) is arranged in the connecting groove, and a spring (12) is arranged below the mounting plate (11).

3. The heat dissipation mechanism of an automotive electronic water pump control circuit board according to claim 2, characterized in that: One end of the spring (12) is fixedly connected to the base (1), and the other end of the spring (12) is fixedly connected to the mounting plate (11).

4. The heat dissipation mechanism of an automotive electronic water pump control circuit board according to claim 3, characterized in that: The mounting holes (22) and the first mounting grooves (32) are mutually matched and are installed and connected by bolts, and another group of mounting holes (22) and the second mounting grooves (42) are mutually matched and are installed and connected by bolts.

5. The heat dissipation mechanism of an automotive electronic water pump control circuit board according to claim 4, characterized in that: The bottom plate (25) is provided with a mounting opening and is mounted and connected to the mounting plate (11) by means of bolts. The fixing plate (44) is provided with a connection opening and is mounted and connected to another set of mounting plates (11) by means of bolts.

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