Curing all-in-one machine

Abstract

The utility model discloses a curing all-in-one machine, which comprises a curing section, a light injection section and a connecting device, the curing section extends along the transmission direction, and two ends of the curing section are respectively a feeding end and a discharging end. The curing section comprises a first transmission device which is used for transferring the silicon wafers from the feeding end to the discharging end. The light injection section extends along the transmission direction, and two ends are respectively an inlet end and an outlet end. And the inlet end corresponds to the discharge end. The curing section comprises a second transmission device which is used for transferring the silicon wafers from the inlet end to the outlet end. And the joining device is arranged between the inlet end and the discharge end, so that the silicon wafers are transferred from the first transmission device to the second transmission device through the joining device. The joining device separates the transmission mechanisms of the curing section and the light injection section, the transmission devices of the curing section and the light injection section can also be separated, and the corresponding transmission speed and transmission distance are set according to requirements, so that the limit of the curing process and the annealing process is separated, and the silicon wafer can more easily meet the corresponding temperature requirements of the two processes in the limit.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cell production, in particular to an all-in-one curing machine. Background Art

[0002] In the prior art, a continuous integrated machine is often used for the curing and light injection processing of silicon wafers, that is, the curing section and the light injection section are transmitted by the same transmission device, so that the speeds of the two must be consistent. From the perspective of the process flow, due to the characteristics of light, the optimal time, optimal light intensity and light temperature for light injection into silicon wafers to achieve a good passivation effect on silicon wafers are usually fixed in the industry. Since the speeds of the curing section and the light injection section are consistent, the silicon wafer needs to seek the best processing ratio in the curing section and the light injection section at a certain speed. Therefore, in order to seek a good curing effect, the curing section has to lengthen the curing length at this speed. Then, from the perspective of device use, a longer transmission distance will usually cause small errors in the equipment process to be magnified, resulting in chain jitter, abnormal transmission noise, unstable transmission, etc., affecting the stability of the device in transmitting silicon wafers. Utility Model Content

[0003] In order to overcome the above shortcomings, the purpose of the present invention is to provide a curing all-in-one machine to solve the problems raised in the above background technology.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is a curing all-in-one machine, comprising:

[0005] The curing section extends along the transmission direction, and has two ends, namely, a feeding end and a discharging end. The curing section includes a first transmission device, which is used to transfer the silicon wafer from the feeding end to the discharging end.

[0006] The light injection section extends along the transmission direction, and has an inlet end and an outlet end at both ends. The inlet end is arranged corresponding to the discharge end. The light injection section includes a second transmission device for transferring the silicon wafer from the inlet end to the outlet end.

[0007] The connecting device is arranged between the inlet end and the discharge end, so that the silicon wafer is transferred from the first transmission device to the second transmission device through the connecting device.

[0008] The utility model provides an all-in-one curing machine, which separates the curing section and the light injection section by placing the transmission mechanisms of the curing section and the light injection section on the same horizontal plane and connecting them horizontally with a connecting device. The transmission devices of the two can also be separated, and the corresponding transmission speed and transmission distance can be set according to requirements, thereby separating the boundaries of the curing process and the annealing process, making it easier for the silicon wafer to reach the corresponding temperature requirements of the two processes within the boundaries.

[0009] In some embodiments, the connection device includes a plurality of connection rods, a first synchronous belt and an adjustment component. The plurality of connection rods are arranged at intervals along the transmission direction. A synchronous wheel is provided at one end of each connection rod and an adjustment plate is provided at the other end. The plurality of connection rods can rotate synchronously for transmitting the silicon wafer. The first synchronous belt is wound between the synchronous wheels of two adjacent connection rods. The adjustment component includes a synchronous rod and a transfer component. The synchronous rod is indirectly connected to one of the plurality of connection rods via the transfer component. The synchronous rod is synchronously driven by the second transmission device.

[0010] By adopting the above technical scheme, the connecting device assists in connecting in series two transmission devices arranged at intervals on the same silicon wafer transmission line. Both the first transmission device and the rear transmission device are provided with a plurality of transmission rods extending along the second direction. The transmission rods are driven by the transmission chain and rotate cyclically along the transmission direction. The plurality of connecting rods in the connecting device are arranged parallel to these transmission rods, linked by the first synchronous belt, and driven to rotate by the rear transmission device through the synchronous rod and the adapter assembly, so as to form a carrying space for silicon wafer transmission, so that the silicon wafer can be transmitted in sequence through the two transmission devices along the transmission direction without the need for additional transfer actions, thereby improving the overall work efficiency.

[0011] In some embodiments, the synchronization rod is arranged below the connecting rod along the third direction, and a third synchronization wheel is arranged at both ends. The transfer assembly includes a transfer rod, a transfer wheel and a bearing seat. The bearing seat is arranged on the same side as the third synchronization wheel. Both ends of the transfer rod are rotatably connected to the bearing seat. The transfer wheel is arranged on the transfer rod and can rotate synchronously with the transfer rod.

[0012] By adopting the above technical solution, the bearing seat is arranged on the same side as the third synchronous wheel, and both are arranged below the two connecting rods. A rotatable transfer rod and transfer wheel are provided in the bearing seat to link with other synchronous wheels.

[0013] In some embodiments, the adapter assembly further includes an extension end, a second synchronous belt and a third synchronous belt. The extension end is arranged at both ends of the connecting rod. The second synchronous belt is wound between the third synchronous wheel and the adapter rod. The third synchronous belt is wound between the adapter wheel and the extension end.

[0014] By adopting the above technical solution, the synchronization rod and the third synchronization wheel are driven to rotate by the rear transmission device, and the transfer rod and the transfer wheel are driven to rotate by the second synchronization belt. The transfer wheel drives the extension end and the first synchronization wheel to rotate, and finally the second synchronization wheel rotates accordingly, thereby achieving the effect of driving multiple connecting rods to rotate through the synchronization rod.

[0015] In some embodiments, the curing section includes a plurality of curing modules, which are arranged in sequence along the transmission direction.

[0016] By adopting the above technical solution, the curing process of the silicon wafer is completed through the joint heating action of multiple curing modules.

[0017] In some embodiments, each of the curing modules includes an upper heating module and a lower heating module. The upper heating module and the lower heating module are respectively arranged on the upper and lower sides of the first transmission device and can be fastened and fixed. Multiple groups of heating units are arranged inside the upper heating module and the lower heating module, and each group of the heating units is provided with a separate temperature control element for independent temperature control.

[0018] With the above technical solution, the upper heating module and the lower module are arranged relative to each other, and after being buckled, an inner cavity can be formed between the two for the first transmission device and the silicon wafer to pass through. The curing module cures the silicon wafer through the heat generated by the multiple groups of heating units in the upper heating module and the lower heating module. Each curing module is independently temperature controlled by a separate temperature control element inside it. Since the positions of the multiple curing modules are different, the heat loss and consumption are also different, so independent temperature control is required.

[0019] In some embodiments, each group of the curing modules is further provided with a thermocouple for detecting the temperature inside the curing module.

[0020] Using the above technical solution, the thermocouple detects the temperature inside the curing module.

[0021] In some embodiments, a plurality of cooling modules are further provided at the discharge end of the curing section, each of the cooling modules comprises an air pipe, the opening direction of the air pipe is perpendicular to the transmission direction, and is used for blowing air to cool the silicon wafer.

[0022] By adopting the above technical solution, a cooling module is set up to blow air to cool the silicon wafer, so that the temperature curve of the silicon wafer is closer to the temperature curve of the HJT process.

[0023] In some embodiments, the light injection section includes a pre-set curing module and a plurality of light injection modules. The pre-set curing module and the plurality of light injection modules are sequentially arranged along the transmission direction. The pre-set curing module is arranged at the inlet end.

[0024] Using the above technical solution, the pre-set curing module is located at the entrance end of the light injection section. In the present application, there is no limitation on the number of pre-set curing modules, and one or more than one are acceptable. The purpose is to preheat the silicon wafer to be subjected to light injection treatment, thereby reducing the temperature difference of the silicon wafer before and after entering the light injection module, thereby preventing the silicon wafer from expanding and contracting due to excessive temperature difference, which leads to a decrease in product yield.

[0025] In some embodiments, the light injection module includes an upper module and a lower module. The upper module and the lower module are respectively arranged on the upper and lower sides of the second transmission device and can be fastened and fixed. The upper module is provided with a light source component, and the lower module is provided with a cooling component.

[0026] With the above technical solution, the upper module and the lower optical module are arranged opposite to each other, and after being buckled, a chamber can be formed between the two for the second transmission device and the silicon wafer to pass through. The light injection module is used to perform light injection processing on the silicon wafer, and the upper module is provided with a light source component, and the light-emitting side of the light source component is arranged to face the second transmission device to provide light for the silicon wafer being transmitted; the lower module is provided with a cooling component, which is used to cool the light injection chamber to prevent high temperature damage to the silicon wafer and the light source component. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional diagram of an embodiment of a curing integrated machine of the utility model;

[0028] Figure 2 It is a three-dimensional diagram of a connection device of an embodiment of a curing integrated machine of the utility model;

[0029] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0030] In the figure:

[0031] 1-curing machine; 10-frame;

[0032] 2-curing section; 20-feeding end; 21-discharging end; 22-first transmission device; 23-curing module; 24-upper heating module; 25-lower heating module; 26-thermocouple; 27-cooling module;

[0033] 3-light injection section; 30-entrance end; 31-exit end; 32-second transmission device; 33-pre-curing module; 34-light injection module; 35-upper module; 36-lower module;

[0034] 4-connecting device; 5-first connecting rod; 50-first synchronous wheel; 51-first driving rod; 52-first sub-connecting rod; 6-second connecting rod; 60-second synchronous wheel; 61-first synchronous belt; 62-second driving rod; 63-second sub-connecting rod; 7-adjusting assembly; 70-synchronous rod; 71-third synchronous wheel; 72-transfer assembly; 73-transfer rod; 74-transfer wheel; 75-bearing seat; 76-extended end; 77-second synchronous belt; 78-third synchronous belt; 8-base; 80-first adjustment plate; 81-second adjustment plate. DETAILED DESCRIPTION

[0035] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0036] refer to Figure 1 to Figure 3 , Figure 1 A schematic structural diagram of a curing integrated machine 1 provided in an embodiment of the utility model is shown; Figure 2 A three-dimensional diagram of a connection device 4 in a curing integrated machine 1 provided in an embodiment of the utility model is shown; Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0037] like Figure 1 to Figure 3 As shown, the technical solution adopted by the utility model is a curing integrated machine 1, including a curing section 2, a light injection section 3 and a connection device 4, the above-mentioned device is fixedly arranged in a frame 10, wherein the curing section 2 is along the transmission direction ( Figure 1 The curing section 2 includes a first transmission device 22 for transferring the silicon wafer from the feeding end 20 to the discharging end 21. The light injection section 3 extends along the transmission direction, and the two ends are respectively an inlet end 30 and an outlet end 31. The inlet end 30 is arranged corresponding to the discharging end 21. The light injection section 3 includes a second transmission device 32 for transferring the silicon wafer from the inlet end 30 to the outlet end 31. The connecting device 4 is arranged between the inlet end 30 and the discharging end 21, so that the silicon wafer is transferred from the first transmission device 22 to the second transmission device 32 through the connecting device 4.

[0038] The curing all-in-one machine 1 provided by the present invention separates the curing section 2 and the light injection section 3 by placing the transmission mechanisms of the curing section 2 and the light injection section 3 at the same horizontal plane and connecting them horizontally with a connecting device 4, and sets the corresponding transmission speed and transmission distance as required, thereby separating the boundaries of the curing process and the annealing process, making it easier for the silicon wafer to reach the corresponding temperature requirements of the two processes within the boundaries.

[0039] In addition, by adjusting the single-stage transmission in the prior art to a three-stage transmission, i.e., the first transmission device 22 ~ the connecting device 4 ~ the second transmission device 32, the transmission chain can be weakened due to the long-distance transmission constantly entering and exiting each temperature zone and absorbing energy, resulting in each temperature zone needing to continuously control the temperature of the heating unit to compensate for the chamber temperature. In this process, the temperature control accuracy is often poor, and the chamber temperature deviates greatly from the set temperature, so that the chamber temperature is always in the upper and lower bands of the process temperature.

[0040] In some embodiments, reference Figure 1 to Figure 3 The connection device 4 includes a plurality of connection rods, a first synchronous belt 61 and an adjustment assembly 7. In order to facilitate the description of the connection rod structure and the connection relationship, in this embodiment and subsequent embodiments, the number of the plurality of connection rods is set to two, namely, a first connection rod 5 and a second connection rod 6, which are arranged at intervals along the transmission direction. A first synchronous wheel 50 is provided at one end of the first connection rod 5, and a first adjustment plate 80 is provided at the other end. A second synchronous wheel 60 is provided at one end of the second connection rod 6, and a second adjustment plate 81 is provided at the other end. The first connection rod 5 and the second connection rod 6 can rotate synchronously for transmitting silicon wafers. The first synchronous belt 61 is wound between the first synchronous wheel 50 and the second synchronous wheel 60.

[0041] The adjustment assembly 7 includes a synchronization rod 7 and a switching assembly 72. The synchronization rod 7 is indirectly connected to the first connection rod 5 through the switching assembly 72. The synchronization rod 7 is synchronously driven by the rear transmission device, thereby driving the first connection rod 5 and the second connection rod 6 to rotate, so as to transfer the silicon wafer.

[0042] Exemplarily, the connection device 4 connects the first transmission device 22 and the second transmission device 32 arranged at intervals on the same silicon wafer transmission line in auxiliary series. The first transmission device 22 and the second transmission device 32 are both provided with a plurality of transmission rods extending along the second direction. The transmission rods are driven by the transmission chain and rotate cyclically along the transmission direction. The first connection rod 5 and the second connection rod 6 in the connection device 4 are arranged in parallel with these transmission rods, linked by the first synchronous belt 61, and driven to rotate by the second transmission device 32 through the synchronous rod 7 and the transfer assembly 72, forming a bearing space for silicon wafer transmission, so that the silicon wafer can be transmitted in sequence through the two transmission devices along the transmission direction. The connection device 4 is synchronously driven by the second transmission device 32, and no additional motor is required. Under normal circumstances, only two connection rods are set, and the length of the connection device 4 in the first direction is minimized as much as possible, so that the silicon wafer can be quickly transferred from the first transmission device 22 to the second transmission device 32, and no additional transfer action is required, thereby improving the overall work efficiency.

[0043] Specifically, the first engagement rod 5 includes a first driving rod 51 and a plurality of first sub-engagement rods 52. A first synchronizing wheel 50 is provided at one end of the first driving rod 51, and a first adjustment plate 80 is provided at the other end. Both ends of each first sub-engagement rod 52 are provided with a first adjustment plate 80, which is used to connect the adjacent first driving rod 51 and the plurality of first sub-engagement rods 52 through the first adjustment plate 80.

[0044] The second engagement rod 6 is spaced apart from the first engagement rod 5 along the first direction, and includes a second driving rod 62 and a plurality of second sub-engaging rods 63. A second synchronous wheel 60 is provided at one end of the second driving rod 62, and a second adjustment plate 81 is provided at the other end. A second adjustment plate 81 is provided at both ends of each first sub-engaging rod 52, and is used to connect the adjacent second driving rod 62 and the plurality of second sub-engaging rods 63 through the first adjustment plate 80.

[0045] A plurality of bases 8 are provided at the bottom of the connection device 4 for supporting the first adjustment plate 80 , the second adjustment plate 81 and the adjustment assembly 7 .

[0046] In some embodiments, reference Figure 1 to Figure 3 The synchronization rod 7 is arranged below the connecting rod along the third direction, and the third synchronization wheel 71 is arranged at both ends. The transfer assembly 72 includes a transfer rod 73, a transfer wheel 74 and a bearing seat 75. The bearing seat 75 is arranged on the same side as the third synchronization wheel 71. Both ends of the transfer rod 73 are rotatably connected to the bearing seat 75. The transfer wheel 74 is arranged on the transfer rod 73 and can rotate synchronously with the transfer rod 73.

[0047] Exemplarily, the bearing seat 75 is arranged on the same side as the third synchronous wheel 71, and both are arranged below the two connecting rods. A rotatable transfer rod 73 and a transfer wheel 74 are provided in the bearing seat 75 to link with other synchronous wheels.

[0048] In some embodiments, reference Figure 1 to Figure 3 The adapter assembly 72 further includes an extension end 76, a second synchronous belt 77 and a third synchronous belt 78. The extension end 76 is disposed at both ends of the connecting rod. The second synchronous belt 77 is wound between the third synchronous wheel 71 and the adapter rod 73. The third synchronous belt 78 is wound between the adapter wheel 74 and the extension end 76.

[0049] Exemplarily, the extension end 76 serves as the driving end of the first synchronous wheel 50, and is linked to the transfer wheel 74 through the third synchronous belt 78. In this embodiment, the extension end 76 is only provided at the first connecting rod 5, but the present application does not limit this. It can also be provided at the second connecting rod 6, or provided at both the first connecting rod 5 and the second connecting rod 6, and then linked to the transfer wheel 74 through the third synchronous belt 78, so as to achieve the purpose of driving the first connecting rod 5 and the second connecting rod 6 to rotate through the transfer wheel 74. The synchronous rod 7 and the third synchronous wheel 71 are driven to rotate by the second transmission device 32, and the transfer rod 73 and the transfer wheel 74 are driven to rotate through the second synchronous belt 77, and the transfer wheel 74 drives the extension end 76 and the first synchronous wheel 50 to rotate, and finally the second synchronous wheel 60 rotates accordingly, so as to achieve the effect of driving the first connecting rod 5 and the second connecting rod 6 to rotate through the synchronous rod 7.

[0050] In some embodiments, reference Figure 1 to Figure 3 The curing section 2 includes a plurality of curing modules 23. The plurality of curing modules 23 are arranged in sequence along the transmission direction.

[0051] Exemplarily, the curing process of the silicon wafer is completed through the joint heating action of multiple curing modules 23.

[0052] In some embodiments, reference Figure 1 to Figure 3 Each curing module 23 includes an upper heating module 24 and a lower heating module 25. The upper heating module 24 and the lower heating module 25 are respectively arranged on the upper and lower sides of the first transmission device 22 and can be fastened and fixed. Multiple groups of heating units are arranged inside the upper heating module 24 and the lower heating module 25, and each group of heating units is provided with a separate temperature control element for independent temperature control.

[0053] Exemplarily, the upper heating module 24 and the lower module are arranged opposite to each other in the upper and lower directions, and after being buckled, an inner cavity can be formed between the two for the first transmission device 22 and the silicon wafer to pass through. The curing module 23 cures the silicon wafer through the heat generated by the multiple groups of heating units in the upper heating module 24 and the lower heating module 25. Each curing module 23 is independently temperature-controlled by a separate temperature control element inside it. Since the positions of the multiple curing modules 23 are different, the heat loss and consumption are also different, so independent temperature control is required.

[0054] In some embodiments, reference Figure 1 to Figure 3 Each curing module 23 is also provided with a thermocouple 26 for detecting the temperature inside the curing module 23 .

[0055] Exemplarily, the thermocouple 26 detects the temperature in the curing module 23. The thermocouple 26 has the advantages of simple assembly, convenient replacement, high measurement accuracy, wide measurement range, fast thermal response time, and long service life, and is therefore often used to measure the temperature of gas or liquid in furnaces and pipelines and the surface temperature of solids.

[0056] In some embodiments, reference Figure 1 to Figure 3 The discharge end 21 of the curing section 2 is also provided with a plurality of cooling modules 27. Each cooling module 27 includes an air pipe, the opening direction of which is perpendicular to the transmission direction, and is used for blowing air to cool the silicon wafer.

[0057] Exemplarily, the cooling module 27 is provided to perform air blowing and cooling treatment on the silicon wafer, so that the temperature curve of the silicon wafer is closer to the temperature curve of the HJT process.

[0058] In some embodiments, reference Figure 1 to Figure 3 The light injection section 3 includes a pre-set curing module 33 and a plurality of light injection modules 34. The pre-set curing module 33 and the plurality of light injection modules 34 are sequentially arranged along the transmission direction. The pre-set curing module 33 is arranged at the inlet end 30.

[0059] Exemplarily, the pre-setting curing module 33 is located at the entrance end 30 of the light injection section 3. In the present application, there is no limitation on the number of pre-setting curing modules 33, and one or more than one is acceptable. The purpose is to preheat the silicon wafer to be subjected to light injection treatment, thereby reducing the temperature difference of the silicon wafer before and after entering the light injection module 34, thereby preventing the silicon wafer from expanding and contracting due to excessive temperature difference, which leads to a decrease in product yield.

[0060] In some embodiments, reference Figure 1 to Figure 3 The light injection module 34 includes an upper module 35 and a lower module 36. The upper module 35 and the lower module 36 are respectively arranged on the upper and lower sides of the second transmission device 32 and can be fastened and fixed. The upper module 35 is provided with a light source component, and the lower module 36 is provided with a cooling component.

[0061] Exemplarily, the upper module 35 and the lower optical module are arranged opposite to each other in the upper and lower parts, and after being buckled, a chamber can be formed between the two parts for the second transmission device 32 and the silicon wafer to pass through. The light injection module 34 is used to perform light injection processing on the silicon wafer, and the upper module 35 is provided with a light source component, and the light-emitting side of the light source component is arranged to face the second transmission device 32 to provide light for the silicon wafer being transmitted; the lower module 36 is provided with a cooling component, which is used to cool the light injection chamber to prevent high temperature damage to the silicon wafer and the light source component.

[0062] The above implementation modes are only for illustrating the technical concept and features of the utility model, and their purpose is to allow people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A curing machine, characterized in that: include: A curing section extends along the transmission direction, and has two ends, namely, a feed end and a discharge end; the curing section includes a first transmission device for transferring the silicon wafer from the feed end to the discharge end; A light injection section extends along the transmission direction, and has two ends, an inlet end and an outlet end; the inlet end is arranged corresponding to the discharge end; the light injection section includes a second transmission device for transferring the silicon wafer from the inlet end to the outlet end; The connecting device is arranged between the inlet end and the discharge end, so that the silicon wafer is transferred from the first transmission device to the second transmission device through the connecting device.

2. The curing integrated machine according to claim 1, characterized in that: The connecting device includes a plurality of connecting rods, a first synchronous belt and an adjustment component; the plurality of connecting rods are arranged at intervals along the transmission direction; a synchronous wheel is provided at one end of each connecting rod and an adjustment plate is provided at the other end; the plurality of connecting rods can rotate synchronously for transmitting the silicon wafers; the first synchronous belt is wound between the synchronous wheels of two adjacent connecting rods; the adjustment component includes a synchronous rod and a switching component; the synchronous rod is indirectly connected to one of the plurality of connecting rods via the switching component; the synchronous rod is driven synchronously via the second transmission device.

3. The curing machine according to claim 2, characterized in that: The synchronization rod is arranged below the connecting rod along the third direction, and a third synchronization wheel is arranged at both ends; the transfer assembly comprises a transfer rod, a transfer wheel and a bearing seat; the bearing seat is arranged on the same side as the third synchronization wheel; both ends of the transfer rod are rotatably connected to the bearing seat; The transfer wheel is arranged on the transfer rod and can rotate synchronously with the transfer rod.

4. The curing integrated machine according to claim 3, characterized in that: The transfer assembly also includes an extension end, a second synchronous belt and a third synchronous belt; the extension end is arranged at both ends of the connecting rod; the second synchronous belt is wound between the third synchronous wheel and the transfer rod; the third synchronous belt is wound between the transfer wheel and the extension end.

5. The curing machine according to claim 1, characterized in that: The curing section includes a plurality of curing modules; the plurality of curing modules are arranged in sequence along the transmission direction.

6. The integrated curing machine according to claim 5, characterized in that: Each of the curing modules includes an upper heating module and a lower heating module; the upper heating module and the lower heating module are respectively arranged on the upper and lower sides of the first transmission device and can be buckled and fixed; multiple groups of heating units are arranged inside the upper heating module and the lower heating module, and each group of heating units is provided with a separate temperature control element for independent temperature control.

7. The integrated curing machine according to claim 6, characterized in that: Each group of the curing modules is also provided with a thermocouple for detecting the temperature inside the curing module.

8. The curing machine according to claim 1, characterized in that: The discharge end of the curing section is also provided with a plurality of cooling modules, each of which comprises an air pipe, the opening direction of which is perpendicular to the transmission direction, and is used for blowing air to cool the silicon wafer.

9. The curing integrated machine according to claim 1, characterized in that: The light injection section comprises a preset curing module and a plurality of light injection modules; the preset curing module and the plurality of light injection modules are arranged in sequence along the transmission direction; the preset curing module is arranged at the inlet end.

10. The integrated curing machine according to claim 9, characterized in that: The light injection module comprises an upper module and a lower module; the upper module and the lower module are respectively arranged on the upper and lower sides of the second transmission device and can be fastened and fixed; the upper module is provided with a light source component, and the lower module is provided with a cooling component.

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