Rotary positioning disc based on wafer disc sputtering

Abstract

The utility model discloses a rotary positioning disc based on wafer disc sputtering, which comprises a positioning assembly, a rotating assembly and a driving assembly, a through connecting hole is formed in the middle of the positioning assembly, and a plurality of groups of through first positioning holes are radially formed outwards; the driving assembly penetrates through the connecting hole and is fixed to the rotating assembly on the front end face. The rotating assembly is arranged on the front end face of the positioning assembly in parallel. A plurality of groups of radial second positioning holes are formed in the periphery where the rotating assembly is located, so that when the rotating assembly rotates, the second positioning holes correspond to the first positioning holes in the positioning assembly one to one, a buffer piece is arranged on each group of second positioning holes, and a wafer is borne through the buffer pieces. According to the whole device, rapid sputtering of the wafer can be achieved, and the sputtering efficiency and the sputtering precision are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing equipment, and in particular relates to a rotating positioning disk based on wafer disk sputtering. Background Art

[0002] In the semiconductor manufacturing process, the wafer disk is a key component that supports and rotates the wafer. Sputtering is an important thin film preparation technology used to deposit various materials on the wafer. The turntable system plays an important role in the sputtering process. It not only needs to ensure uniform rotation of the wafer, but also maintain a stable rotation speed and precise position control during the rotation process.

[0003] At present, in actual operation, when sputtering wafers, multiple target materials need to be used for multiple sputtering operations. The manual method of transporting wafers individually will affect the quality of the sputtered film on the surface of the wafer, and will also affect the actual sputtering efficiency of the wafer.

[0004] The patent application in China is a wafer rotation angle detection device in a thin film sputtering device. The thin film sputtering device includes a wafer stage, the top of the cavity of the wafer stage is sealed with transparent glass, and the cavity of the wafer stage is loaded with wafers. The device includes a detection camera and a control box. The detection camera is installed directly above the transparent glass through a bracket. Without changing the original equipment circuit, it can effectively detect the position angle of the wafer in the cavity and control the operation of the thin film sputtering device. However, this detection method cannot improve the sputtering efficiency. Utility Model Content

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a rotating positioning plate based on wafer disk sputtering, which solves the above-mentioned technical problems existing in the prior art.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A rotating positioning plate based on wafer disk sputtering, comprising a positioning assembly, a rotating assembly, and a driving assembly, wherein a through connection hole is arranged in the middle of the positioning assembly, and multiple groups of through first positioning holes are radially opened outward with the connection hole as the center, and the rear end of each group of the first positioning holes is externally connected to a target material of different types;

[0008] The driving assembly passes through the connecting hole and is fixed to the rotating assembly on the front end surface;

[0009] The rotating assembly is arranged parallel to the front end surface of the positioning assembly;

[0010] A plurality of groups of radial second positioning holes are provided on the periphery of the rotating component, so that when the rotating component rotates, the second positioning holes correspond one-to-one with the first positioning holes on the positioning component, and a buffer is provided on each group of the second positioning holes, and the buffer is used to support the wafer. The second positioning hole carrying the wafer is rotated to the position of the first positioning hole, and the wafer rotated to the position of the first positioning hole is sputtered by the target material, and then rotated to the next first positioning hole to continue sputtering.

[0011] Furthermore, the distances between the plurality of groups of the first positioning holes and the middle connecting hole are equal.

[0012] Furthermore, the buffer component includes a buffer strip and a buffer ring component. The buffer strip has an arc-shaped structure, and one end of the buffer strip is connected to the inner wall of the second positioning hole, and the other end is connected to the second positioning hole to form a buffer ring component located in the middle of the second positioning hole.

[0013] Furthermore, the buffer ring is connected to the second positioning hole in a non-contact manner and is concentrically arranged.

[0014] Furthermore, the buffer strips are provided in multiple groups and are evenly distributed on the inner wall of the second positioning hole, so as to wrap the outer periphery of the buffer ring from the circumferential direction.

[0015] Furthermore, a connecting groove is provided on the end surface of the second positioning hole between two adjacent groups of the rotating components.

[0016] Furthermore, the driving assembly includes a driving motor and a coupling, and the front end of the coupling passes through a connecting hole and is connected to the center of the rear end face of the rotating assembly, so that the rotating assembly can rotate around the center or move forward and backward along the axis of the coupling.

[0017] Furthermore, the inner diameter of the first positioning hole is larger than the inner diameter of the buffer ring in the middle of the second positioning hole.

[0018] Beneficial effects of the utility model:

[0019] 1. The positioning component and the rotating component used in this device are combined with each other, so that multiple wafers can be carried on the rotating component at a time. Through the rotation of the rotating component, the carried wafers can be brought into contact with multiple targets set on the positioning component, thereby meeting the needs of multiple sputtering when the wafers are carried at a single time. Each sputtering can be accurately matched, thereby improving the accuracy and efficiency of sputtering.

[0020] 2. The driving assembly used in this device can realize rotation and also realize axial displacement in the axial direction, thereby improving the multi-performance operation of the entire equipment in a limited space.

[0021] 3. The buffer strip and buffer ring provided in the device cooperate with each other to produce a buffering effect during the sputtering and extrusion process, thereby avoiding extrusion damage to the wafer when the target material is sputtered. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0023] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;

[0024] Figure 2 It is a side structural schematic diagram of an embodiment of the utility model;

[0025] Figure 3 It is a schematic diagram of the cross-sectional structure of an embodiment of the utility model;

[0026] Figure 4 It is a schematic diagram of the structure of the positioning component of an embodiment of the utility model;

[0027] Figure 5 It is a schematic diagram of the structure of the rotating assembly of an embodiment of the utility model;

[0028] Figure 6 It is a schematic diagram of the partial structure of the buffer member of the embodiment of the utility model;

[0029] Figure 7 It is a schematic diagram of the structure of a buffer ring according to an embodiment of the utility model. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] like Figure 1 , Figure 2 As shown, an embodiment of the utility model provides a rotating positioning disk based on wafer disk sputtering, including a positioning component 1, a rotating component 2, and a driving component 3. A through connecting hole 101 is provided in the middle of the positioning component 1 for through connection of the driving component 3, and with the connecting hole 101 as the center, multiple groups of through first positioning holes 102 are radially opened outward (the spacing between the multiple groups of first positioning holes 102 and the middle connecting hole 101 is equal), and the rear end of each group of first positioning holes 102 is externally connected to a target material of different types.

[0032] like Figure 3 , Figure 4As shown, the driving component 3 passes through the connecting hole 101 and is fixed to the rotating component 2 on the front end face. At this time, the driving component 3 includes a driving motor 31 and a coupling 32. The front end portion of the coupling 32 passes through the connecting hole 101 and is connected to the center of the rear end face of the rotating component 2, so that the rotating component 2 can rotate around the center axis or move back and forth along the axial direction of the coupling 32. When the wafer located on the upper part of the rotating component 2 is transferred from one of the first positioning holes 102 to the adjacent first positioning hole 102, the target material sputtering of one group of wafers is completed, and when it is transferred to another group of first positioning holes 102 by rotation, the next sputtering is completed.

[0033] like Figure 5 , Figure 6 , Figure 7 As shown, at this time, the rotating component 2 is arranged parallel to the front end face of the positioning component 1. A plurality of groups of radial second positioning holes 201 are provided on the periphery of the rotating component 2, so that when the rotating component 2 rotates, the second positioning holes 201 correspond to the first positioning holes 102 on the positioning component 1 one by one (that is, when one group of the second positioning holes 201 is concentric with the first positioning hole 102, the remaining second positioning holes 201 correspond to the first positioning hole 102 one by one), and a buffer 21 is arranged on each group of the second positioning holes 201, and the buffer 21 forms a support for the wafer, and the second positioning hole 201 carrying the wafer is rotated to the position of the first positioning hole 102, and then the wafer rotated to the position of the first positioning hole 102 is sputtered by the target material, and then rotated to the next first positioning hole 102 to continue sputtering, until multiple sputtering operations are completed on one wafer, thereby improving efficiency.

[0034] The buffer ring 212 is connected to the second positioning hole 201 in a non-contact manner and is concentrically arranged.

[0035] The buffer member 21 includes a buffer strip 211 and a buffer ring 212. The buffer strip 211 has an arc-shaped structure, and multiple groups of buffer strips 211 are evenly distributed on the inner wall of the second positioning hole 201, and one end of the buffer strip 211 is connected to the inner wall of the second positioning hole 201, and the other end is connected to the second positioning hole 201 to form a connection with the buffer ring 212 located in the middle of the second positioning hole 201, forming a circumferential wrapping of the outer periphery of the buffer ring 212. When the driving component 3 drives the entire rotating component 2 to move toward the first positioning hole 102 where the positioning component 1 is located, the buffer ring 212 carrying the wafer will generate an inward extrusion force. However, once the pressure is too large, the buffer strip 211 connected to the buffer ring 212 will be deformed, and will not cause pressure loss to the wafer. Of course, for safety reasons, the inner diameter of the first positioning hole 102 is larger than the inner diameter of the buffer ring 212 in the middle of the second positioning hole 201 to prevent the target material from squeezing the wafer carried in the middle when it contacts the buffer ring 212 .

[0036] A connecting groove 221 is provided on the end face of the second positioning hole 201 between the two adjacent groups where the rotating component 2 is located. This design can save the material of the rotating component 2 (i.e., save material costs), reduce the inertia of the structure during rotation, and thus improve the accuracy of rotation.

[0037] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A rotating positioning plate based on wafer disk sputtering, comprising a positioning component (1), a rotating component (2), and a driving component (3), characterized in that: A through-connecting hole (101) is provided in the middle of the positioning component (1), and a plurality of through-connecting first positioning holes (102) are radially provided outwardly with the connecting hole (101) as the center, and the rear end of each group of the first positioning holes (102) is externally connected to a target material of a different type; The driving assembly (3) passes through the connecting hole (101) and is fixed to the rotating assembly (2) on the front end surface; The rotating assembly (2) is arranged parallel to the front end surface of the positioning assembly (1); The outer periphery of the rotating component (2) is provided with a plurality of groups of radial second positioning holes (201), so that when the rotating component (2) rotates, the second positioning holes (201) correspond to the first positioning holes (102) on the positioning component (1), and a buffer (21) is provided on each group of the second positioning holes (201), and the buffer (21) forms a support for the wafer. By rotating the second positioning hole (201) carrying the wafer to the position of the first positioning hole (102), the wafer rotated to the position of the first positioning hole (102) is sputtered by the target material, and then rotated to the next first positioning hole (102) to continue sputtering.

2. The rotating positioning plate based on wafer disk sputtering according to claim 1, characterized in that: The distances between the plurality of groups of the first positioning holes (102) and the central connecting hole (101) are equal.

3. The rotating positioning plate based on wafer disk sputtering according to claim 1, characterized in that: The buffer member (21) comprises a buffer strip (211) and a buffer ring member (212); the buffer strip (211) is in an arc-shaped structure, and one end of the buffer strip (211) is connected to the inner wall of the second positioning hole (201), and the other end is connected to the second positioning hole (201) to form a connection with the buffer ring member (212) located in the middle of the second positioning hole (201).

4. The rotating positioning plate based on wafer disk sputtering according to claim 3, characterized in that: The buffer ring (212) is connected to the second positioning hole (201) in a non-contact manner and is concentrically arranged.

5. The rotating positioning plate based on wafer disk sputtering according to claim 3, characterized in that: The buffer strips (211) are provided in multiple groups and are evenly distributed on the inner wall of the second positioning hole (201), forming a wrapping around the outer periphery of the buffer ring (212) from the circumferential direction.

6. The rotating positioning plate based on wafer disk sputtering according to claim 3, characterized in that: A communicating groove (221) is provided on the end surface of the second positioning hole (201) located between two adjacent groups of the rotating components (2).

7. The rotating positioning plate based on wafer disk sputtering according to claim 1, characterized in that: The driving assembly (3) comprises a driving motor (31) and a coupling (32), wherein the front end of the coupling (32) passes through a connecting hole (101) and is connected to the center of the rear end face of the rotating assembly (2), so as to enable the rotating assembly (2) to rotate around the center or to move forward and backward along the axis of the coupling (32).

8. The rotating positioning plate based on wafer disk sputtering according to claim 3, characterized in that: The inner diameter of the first positioning hole (102) is larger than the inner diameter of the buffer ring (212) in the middle of the second positioning hole (201).

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