Component for MOCVD (Metal Organic Chemical Vapor Deposition) heater

Abstract

The utility model discloses an MOCVD heater assembly, which comprises a heater body and a heat transfer assembly, the heater body comprises a shell, a heating device is arranged in the shell, a graphite carrying disc is arranged on the heating device, a reflecting layer is arranged at the bottom of the heating device, a heat preservation layer is arranged at the bottom of the reflecting layer, and a heat insulation layer is arranged at the bottom of the heat preservation layer. The bottom of the heat preservation layer abuts against the side wall of the bottom of the shell. The heat transfer assembly comprises a heating wire, the heating wire is installed on a heating device, and a plurality of heat conduction protrusions are integrally formed on the heating device. The heating device is provided with a plurality of heat conduction protrusions, the bottom of the graphite carrying disc is provided with a heat conduction groove, and the heat conduction protrusions are matched with the heat conduction groove, so that the heat transfer area between the heating device and the graphite carrying disc is increased, the graphite carrying disc is heated more uniformly, and the temperature distribution of the surface of the graphite carrying disc is uniform; and the efficiency of the heater is further improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a component for an MOCVD heater. Background Art

[0002] In the production process of semiconductor wafers, one of the key steps is to place the semiconductor wafer on a heater for heating. Among them, the MOCVD heater is a relatively commonly used heating equipment. It usually uses the substrate to energize the heating plate or heating wire to heat up, and then the stone mill carrying the wafer is placed on the heating plate for heating treatment.

[0003] The existing heaters have poor heating uniformity, which may lead to inconsistent local temperatures and low heater efficiency.

[0004] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0005] The utility model aims to provide a component for an MOCVD heater, which can solve the problem of low heating efficiency caused by poor heating uniformity of the heater.

[0006] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0007] An MOCVD heater assembly, comprising:

[0008] The heater body includes a shell, and a heating device is installed in the shell. The heating device generates heat so that the heater body is heated, so that the heater body can heat the semiconductor wafer placed in the shell. A graphite carrier is installed on the heating device, and the heating device transfers heat to the graphite carrier so that the semiconductor wafer placed on the graphite carrier is heated by the graphite carrier. A reflecting layer is provided at the bottom of the heating device. Since the heat generated by the heating device needs to heat the semiconductor wafer on the graphite carrier, in order to avoid heat waste caused by the downward transfer of heat, the heat transferred downward is reflected by the reflecting layer. A thermal insulation layer is provided at the bottom of the reflecting layer, and the bottom of the thermal insulation layer abuts on the bottom side wall of the shell, so that the downward transfer of heat is further restricted by the thermal insulation layer, and the heat loss is further reduced.

[0009] The heat transfer component includes a heating wire, which is installed on a heating device. The heating wire is a heating component in the heating device. By providing power to the heating wire, the heating wire can generate heat to heat the heating device. The heating device is integrally formed with a plurality of heat-conducting protrusions to increase the heating area of ​​the upper surface of the heating device, thereby increasing the area of ​​heat transfer. The bottom of the graphite carrier is provided with a plurality of heat-conducting grooves matching the heat-conducting protrusions. The heat-conducting protrusions are sleeved in the heat-conducting grooves. Through the cooperation of the heat-conducting protrusions and the heat-conducting grooves, the heat on the heating device can be transferred to the graphite carrier through the heat-conducting protrusions, so that the heating area of ​​the graphite carrier is larger, thereby improving the heating efficiency of the graphite carrier. At the same time, since there are a plurality of heat-conducting protrusions and heat-conducting grooves, the heat of the heating device can be evenly transferred to the graphite carrier, so that the graphite carrier is evenly heated, avoiding uneven heating of the semiconductor wafer caused by uneven heat on the graphite carrier, and at the same time, the improvement of the heating efficiency of the graphite carrier improves the heating efficiency of the semiconductor wafer.

[0010] In one or more embodiments of the utility model, assembly holes are provided on the bottom wall panel of the shell, the heating device, the reflective layer and the thermal insulation layer, and thermal insulation sleeves are installed in the assembly holes. The thermal insulation connecting sleeves are used to facilitate the installation of components such as power lines, while preventing the heat of the heating device from being transferred through the thermal insulation connecting sleeves.

[0011] In one or more embodiments of the present invention, the upper end of the thermal insulation connecting sleeve passes through the bottom wall panel of the shell, the insulation layer, the reflective layer and the heating device in sequence through the assembly hole and is placed in the heating device, and the lower end of the thermal insulation connecting sleeve is placed on the lower side of the bottom wall panel of the shell, so that the power supply enters the thermal insulation connecting sleeve through the lower end of the thermal insulation connecting sleeve and is finally connected to the heating wire, thereby providing power to the heating wire.

[0012] In one or more embodiments of the utility model, a heat preservation ring is installed between the outer side wall of the heating device and the graphite carrier and the inner side wall of the shell, and the heat of the heating device and the side wall of the graphite carrier is blocked by the heat preservation ring to reduce heat loss. A mounting seat is installed at the bottom of the shell, and the shell is installed and supported by the mounting seat.

[0013] In one or more embodiments of the present invention, the heating wire is composed of a plurality of rings, which increases the heating area of ​​the heating wire, thereby improving the efficiency of heat transfer. A plurality of connectors are provided between the plurality of rings of the heating wire to facilitate heat transfer.

[0014] In one or more embodiments of the present invention, mounting grooves are provided on the upper surface of the heating device and the heat-conducting protrusions, and the heating wire is installed on the heating device through the mounting grooves. The mounting grooves make the heating wire stable and easy to disassemble.

[0015] In one or more embodiments of the present invention, the plurality of heat-conducting protrusions are arranged in a ring shape, and the plurality of ring shapes of the heating wire are respectively installed between the plurality of heat-conducting protrusions, so that the heating wire can quickly transfer heat to the heat-conducting protrusions, so that the heat-conducting protrusions can quickly transfer the heat after being heated.

[0016] In one or more embodiments of the present invention, the height of the heat-conducting protrusion is equal to the depth of the heat-conducting groove, so that when the heat-conducting protrusion is sleeved in the heat-conducting groove, the upper surface of the heating device and the lower surface of the graphite carrier are in contact with each other, so that the heating device can transfer heat not only through the heat-conducting protrusion, but also through the upper surface of the heating device, so that the heat transfer area between the heating device and the graphite carrier is larger, thereby improving the efficiency and uniformity of heat transfer.

[0017] In one or more embodiments of the utility model, a heat-conducting block is installed in the assembly hole of the heating device, and the upper surface of the heat-conducting block is in contact with the lower surface of the graphite carrier, so that the heat-conducting block can transfer heat to the non-contact portion between the heating device and the graphite carrier, so that the heat on the graphite carrier is evenly distributed.

[0018] In one or more embodiments of the present invention, the heating device and the heat-conducting protrusion are both made of ceramic material, and the ceramic material is boron nitride ceramic.

[0019] Compared with the prior art, the utility model provides a plurality of heat-conducting protrusions on the heating device and a heat-conducting groove at the bottom of the graphite carrier. Through the cooperation of the heat-conducting protrusions and the heat-conducting grooves, the area of ​​heat transfer between the heating device and the graphite carrier is increased, so that the graphite carrier is heated more evenly, thereby making the temperature distribution on the surface of the graphite carrier uniform, thereby improving the efficiency of the heater. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A three-dimensional diagram of a component for a MOCVD heater in one embodiment of the utility model;

[0022] Figure 2 A cross-sectional view of a component for a MOCVD heater in one embodiment of the utility model;

[0023] Figure 3 It is a cross-sectional view of a component for a MOCVD heater in one embodiment of the utility model;

[0024] Figure 4 The invention is a MOCVD heater component explosion Figure 1 ;

[0025] Figure 5 The invention is a MOCVD heater component explosion Figure 2 .

[0026] Description of main reference numerals:

[0027] 1-heater body, 11-shell, 12-heating device, 13-graphite carrier, 14-reflection layer, 15-insulation layer, 16-assembly hole, 17-insulation connecting sleeve, 18-mounting seat, 19-insulation ring, 2-heat transfer component, 21-heating wire, 22-mounting groove, 23-heat conductive protrusion, 24-heat conductive groove, 25-heat conductive block. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0029] like Figure 1 to Figure 3 As shown, a component for an MOCVD heater in an embodiment of the utility model includes a heater body 1 and a heat transfer component 2 .

[0030] like Figure 1 to Figure 3As shown, the heater body 1 includes a shell 11, and a heating device 12 is installed in the shell 11. The heating device 12 generates heat, so that the heater body 1 is heated, so that the heater body 1 can heat the semiconductor wafer placed in the shell 11. A graphite carrier 13 is installed on the heating device 12, and the heating device 12 transfers heat to the graphite carrier 13, so that the semiconductor wafer placed on the graphite carrier 13 is heated by the graphite carrier 13. A reflective layer 14 is provided at the bottom of the heating device 12. Since the heat generated by the heating device 12 needs to heat the semiconductor wafer on the graphite carrier 13, in order to avoid heat waste caused by the downward transfer of heat, the reflective layer 14 is used to reflect the heat transferred downward. A thermal insulation layer 15 is provided at the bottom of the reflective layer 14, and the bottom of the thermal insulation layer 15 abuts on the bottom side wall of the shell 11, so that the downward transfer of heat is further restricted by the thermal insulation layer 15, and the heat loss is further reduced.

[0031] like Figure 2 and Figure 3 As shown, assembly holes 16 are provided on the bottom wall plate of the shell 11, the heating device 12, the reflective layer 14 and the insulation layer 15, and a heat-insulating connecting sleeve 17 is installed in the assembly hole 16. The heat-insulating connecting sleeve 17 facilitates the installation of components such as power lines, while preventing the heat of the heating device 12 from being transferred through the heat-insulating connecting sleeve 17.

[0032] like Figure 2 and Figure 3 As shown, the upper end of the thermal insulation connecting sleeve 17 passes through the bottom wall plate of the shell 11, the insulation layer 15, the reflective layer 14 and the heating device 12 in sequence through the assembly hole 16 and is placed in the heating device 12, and the lower end of the thermal insulation connecting sleeve 17 is placed on the lower side of the bottom wall plate of the shell 11, so that the power supply enters the thermal insulation connecting sleeve 17 through the lower end of the thermal insulation connecting sleeve 17, and is finally connected to the heating wire 21, thereby providing power to the heating wire 21.

[0033] like Figure 2 and Figure 3 As shown, a heat preservation ring 19 is installed between the outer side wall of the heating device 12 and the graphite carrier 13 and the inner side wall of the shell 11, and the heat preservation ring 19 blocks the heat of the side wall of the heating device 12 and the graphite carrier 13 to reduce the heat loss. A mounting seat 18 is installed at the bottom of the shell 11, and the shell 11 is installed and supported by the mounting seat 18.

[0034] like Figure 3 to Figure 5As shown, the heat transfer component 2 includes a heating wire 21, which is installed on the heating device 12. The heating wire 21 is a heating component in the heating device 12. By providing power to the heating wire 21, the heating wire 21 can generate heat to heat the heating device 12. A plurality of heat-conducting protrusions 23 are integrally formed on the heating device 12 to increase the heating area of ​​the upper surface of the heating device 12, thereby increasing the area of ​​heat transfer. A plurality of heat-conducting grooves 24 matching the heat-conducting protrusions 23 are provided at the bottom of the graphite carrier 13. The heat-conducting protrusions 23 are sleeved in the heat-conducting grooves 24. Through the cooperation of the heat-conducting protrusions 23 and the heat-conducting grooves 24, the heat on the heating device 12 can be transferred to the graphite carrier 13 through the heat-conducting protrusions 23, so that the heating area of ​​the graphite carrier 13 is larger, thereby improving the heating efficiency of the graphite carrier 13.

[0035] Preferably, since there are multiple heat-conducting protrusions 23 and heat-conducting grooves 24, the heat of the heating device 12 can be evenly transferred to the graphite carrier 13, so that the graphite carrier 13 is evenly heated, and the uneven heating of the semiconductor wafer caused by the uneven heat on the graphite carrier 13 is avoided. At the same time, the improvement of the heating efficiency of the graphite carrier 13 improves the efficiency of heating the semiconductor wafer. At the same time, through the cooperation of the heat-conducting protrusions 23 and the heat-conducting grooves 24, the graphite carrier 13 is stably installed on the heating device 12, so as to ensure the stable heating of the semiconductor wafer.

[0036] like Figure 4 and Figure 5 As shown, the heating wire 21 is composed of a plurality of rings, which increases the heating area of ​​the heating wire 21, thereby improving the efficiency of heat transfer. A plurality of connecting pieces are arranged between the plurality of rings of the heating wire 21, so as to facilitate heat transfer between them.

[0037] like Figure 4 and Figure 5 As shown, mounting grooves 22 are provided on the upper surface of the heating device 12 and the heat-conducting protrusions 23 , and the heating wire 21 is installed on the heating device 12 through the mounting grooves 22 . The mounting grooves 22 ensure that the heating wire 21 is stably installed and easy to disassemble and assemble.

[0038] like Figure 4 and Figure 5 As shown, the multiple heat-conducting protrusions 23 are all arranged in a ring shape, and the multiple ring shapes of the heating wire 21 are respectively installed between the multiple heat-conducting protrusions 23, so that the heating wire 21 can quickly transfer heat to the heat-conducting protrusions 23, so that the heat-conducting protrusions 23 can quickly transfer the heat after being heated.

[0039] like Figure 3As shown, the height of the heat-conducting protrusion 23 is equal to the depth of the heat-conducting groove 24, so that when the heat-conducting protrusion 23 is sleeved in the heat-conducting groove 24, the upper surface of the heating device 12 and the lower surface of the graphite carrier 13 fit each other, so that the heating device 12 can transfer heat not only through the heat-conducting protrusion 23, but also through the upper surface of the heating device 12, so that the heat transfer area between the heating device 12 and the graphite carrier 13 is larger, thereby improving the efficiency and uniformity of heat transfer.

[0040] like Figure 2 and Figure 3 As shown, a heat conductive block 25 is installed in the assembly hole 16 of the heating device 12, and the upper surface of the heat conductive block 25 fits with the lower surface of the graphite carrier 13, so that the heat conductive block 25 can transfer heat to the non-contact portion between the heating device 12 and the graphite carrier 13, so that the heat distribution on the graphite carrier 13 is uniform.

[0041] Preferably, the heating device 12 and the heat-conducting protrusion 23 are both made of ceramic material, and the ceramic material is boron nitride ceramic.

[0042] When in use, the graphite carrier 13 is installed on the heating device 12 so that the heat-conducting protrusion 23 on the heating device 12 is sleeved in the heat-conducting groove 24 at the bottom of the graphite carrier 13. When the heating wire 21 is powered on for heating, the heating device 12 and the heat-conducting protrusion 23 are heated. The heating device 12 transfers heat to the graphite carrier 13 through the surface in contact with the graphite carrier 13 and the heat-conducting protrusion 23 transfers heat to the graphite carrier 13 through the surface in contact with the graphite carrier 13, so that the graphite carrier 13 is heated evenly, so that the semiconductor wafer placed on the graphite carrier 13 can be heated through the graphite carrier 13, so that the heater has good heating efficiency and uniform heat distribution.

[0043] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0044] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A component for a MOCVD heater, characterized in that: include: The heater body comprises a shell, a heating device is installed in the shell, a graphite carrier is installed on the heating device, a reflecting layer is arranged at the bottom of the heating device, a heat-insulating layer is arranged at the bottom of the reflecting layer, and the bottom of the heat-insulating layer abuts against the bottom side wall of the shell; The heat transfer component includes a heating wire, which is installed on a heating device. A plurality of heat-conducting protrusions are integrally formed on the heating device. A plurality of heat-conducting grooves matching the heat-conducting protrusions are formed at the bottom of the graphite carrier, and the heat-conducting protrusions are sleeved in the heat-conducting grooves.

2. The MOCVD heater assembly according to claim 1, characterized in that: The bottom wall plate, the heating device, the reflecting layer and the heat-insulating layer of the shell are all provided with assembly holes, and the heat-insulating connecting sleeves are installed in the assembly holes.

3. The MOCVD heater assembly according to claim 2, characterized in that: The upper end of the heat-insulating connecting sleeve passes through the bottom wall plate of the shell, the insulation layer, the reflective layer and the heating device in sequence through the assembly hole and is placed in the heating device, and the lower end of the heat-insulating connecting sleeve is placed on the lower side of the bottom wall plate of the shell.

4. The MOCVD heater assembly according to claim 1, characterized in that: A heat preservation ring is installed between the outer side wall of the heating device and the graphite carrier and the inner side wall of the shell, and a mounting seat is installed at the bottom of the shell.

5. The MOCVD heater assembly according to claim 1, characterized in that: The heating wire is composed of a plurality of rings, and a plurality of connecting pieces are arranged between the plurality of rings of the heating wire.

6. The MOCVD heater assembly according to claim 5, characterized in that: The upper surface of the heating device and the heat-conducting protrusion are both provided with mounting grooves, and the heating wire is mounted on the heating device through the mounting grooves.

7. The MOCVD heater assembly according to claim 6, characterized in that: The plurality of heat-conducting protrusions are all arranged in a ring shape, and the plurality of ring shapes of the heating wire are respectively installed between the plurality of heat-conducting protrusions.

8. The MOCVD heater assembly according to claim 1, characterized in that: The height of the heat-conducting protrusion is equal to the depth of the heat-conducting groove, so that when the heat-conducting protrusion is sleeved in the heat-conducting groove, the upper surface of the heating device and the lower surface of the graphite carrier are in contact with each other.

9. The MOCVD heater assembly according to claim 3, characterized in that: A heat-conducting block is installed in the assembly hole of the heating device, and the upper surface of the heat-conducting block is in contact with the lower surface of the graphite carrier.

10. The MOCVD heater assembly according to claim 1, characterized in that: The heating device and the heat-conducting protrusion are both made of ceramic material, and the ceramic material is boron nitride ceramic.

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