Quick cooling equipment for silicon-manganese alloy

Abstract

The utility model discloses a silicon-manganese alloy rapid cooling device, which relates to the technical field of silicon-manganese alloy manufacture, and comprises a water cooling pool, a heat exchanger, guide rails symmetrically arranged on the left side and the right side of the water cooling pool, and a cooling mechanism arranged inside the water cooling pool. The cooling mechanism absorbs heat of the silicon-manganese alloy through circulating cooling and a heat exchanger arranged below the cooling mechanism, so that time and energy needed by the silicon-manganese alloy in the cooling process are saved, a cooling mechanism is arranged on one side of the water cooling pool, and the cooling mechanism conducts circulating treatment on the interior of liquid. And the liquid is cooled while impurities in the liquid are filtered. The heat of the silicon-manganese alloy is taken away through liquid circulation, meanwhile, the heat exchanger is used for absorbing heat at the bottom end of the material box body, then the liquid in the heat exchanger is heated, the heat is recycled, and the energy utilization rate of the refrigerating unit is greatly increased.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon-manganese alloy manufacturing, in particular to silicon-manganese alloy rapid cooling equipment. Background Art

[0002] Aluminum-manganese alloy is an alloy with strong deoxidation ability and a specific gravity of about 2 times that of metal aluminum. It can improve the aluminum recovery rate in deoxidation alloying, thereby reducing the consumption of metal aluminum. Simplify the deoxidation process and facilitate operation. In the production process of aluminum-manganese alloy, it is necessary to cool the circulating water, and cooling equipment is needed to cool it down during the circulation of circulating water.

[0003] Traditional cooling methods mostly use static water, which causes the heat in local areas of the water to be too high or even boiling. The heat surrounding the casting is not taken away in time, which not only has low cooling efficiency, but also poses a safety hazard. During the operation of the cooling equipment, the liquid needs to circulate, but metal debris will block the corresponding pipes, reduce the flow rate of the liquid, and affect the cooling efficiency of the liquid. Summary of the invention

[0004] The purpose of the utility model is to provide a silicon-manganese alloy rapid cooling device to solve the above-mentioned defects caused by the prior art.

[0005] The silicon-manganese alloy rapid cooling equipment comprises a water cooling pool and a heat exchanger, wherein guide rails are symmetrically arranged on the left and right sides of the water cooling pool, and a cooling mechanism is arranged inside the water cooling pool, and the cooling mechanism absorbs the heat of the silicon-manganese alloy through circulating cooling and a heat exchanger arranged below, thereby saving the time and energy required for the silicon-manganese alloy in the cooling process, and a cooling mechanism is arranged on one side of the water cooling pool, and the cooling mechanism circulates the liquid inside, filters impurities in the liquid and cools the liquid at the same time.

[0006] Preferably, the cooling mechanism includes a guide rail, a suspension frame, an electric cylinder, an electromagnetic suction cup, and a material box. Two sides of the suspension frame are arranged directly above the guide rail. The electric cylinder is arranged directly above the guide rail. The output end of the electric cylinder is connected to the electromagnetic suction cup. The outer side of the electromagnetic suction cup is adsorbed and connected to the material box. The material box is arranged directly above the water cooling pool.

[0007] Preferably, the guide rail is connected to the top of the material box through suspension frames arranged on both sides.

[0008] Preferably, the cooling mechanism includes a cooling box, an extraction pipe, a purification network box, a liquid filter element, a semiconductor refrigeration component and a water pump. The cooling box is installed on one side of the water cooling pool. The semiconductor refrigeration component is symmetrically arranged at the bottom end of the cooling box. A water pump is arranged inside the cooling box. The input end of the water pump is connected to the extraction pipe, one end of the extraction pipe is connected to the purification network box, and liquid filter elements are arranged at equal intervals inside the purification network box.

[0009] Preferably, the cooling box is connected to one side of the water cooling pool through a reflux valve arranged at the bottom.

[0010] Preferably, a heat exchanger is provided at the inner bottom end of the water cooling pool.

[0011] Compared with the prior art, the utility model has the following advantages:

[0012] 1. While taking away the heat of silicon-manganese alloy through liquid circulation, the heat exchanger is used to absorb the heat at the bottom of the material box, and then the liquid inside the heat exchanger is heated, the heat is recovered and the efficiency of heat utilization is improved. The operator drives the material box to move inside the water cooling pool through the suspension frame, and uses the relative movement between the casting and the water to effectively use the large specific heat capacity of water to take away the heat around the casting in time, thereby improving the treatment effect.

[0013] 2. The suspension frame is pushed by the electric telescopic rod and the cylinder. During use, multiple groups of material boxes can be placed at one time, and the two sides of the material box can be magnetically sucked by the electromagnetic suction cup to improve the efficiency of the displacement and placement of the material box. The impurities in the liquid are filtered through the purification net box set on one side to avoid metal dust and debris clogging the pipes during the circulation process, thereby affecting the cooling and circulation efficiency of the liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model.

[0015] Figure 2 It is a schematic diagram of the side structure of the water cooling pool in the utility model.

[0016] Figure 3 It is a schematic diagram of the front section structure of the water cooling pool in the utility model.

[0017] Figure 4 It is a schematic diagram of the top view of the water cooling pool in the utility model.

[0018] Figure 5 It is a schematic diagram of the internal structure of the cooling box in the utility model.

[0019] in:

[0020] 1. Water cooling pool; 2. Guide rail; 3. Suspension frame; 4. Electric cylinder; 5. Electromagnetic suction cup; 6. Material box; 7. Cooling mechanism; 8. Extraction pipe; 9. Purification net box; 10. Reflux valve; 11. Cooling mechanism; 12. Cooling box; 13. Heat exchanger; 14. Liquid filter element; 15. Semiconductor refrigeration component; 16. Water pump. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] like Figures 1 to 5 As shown, the silicon-manganese alloy rapid cooling equipment includes a water cooling pool 1 and a heat exchanger 13, guide rails 2 are symmetrically arranged on the left and right sides of the water cooling pool 1, and a cooling mechanism 7 is arranged inside the water cooling pool 1. The cooling mechanism 7 absorbs the heat of the silicon-manganese alloy through circulating cooling and the heat exchanger 13 arranged below, thereby saving the time and energy required for the silicon-manganese alloy in the cooling process. A cooling mechanism 11 is arranged on one side of the water cooling pool 1, and the cooling mechanism 11 circulates the liquid inside, filters impurities in the liquid and cools the liquid at the same time.

[0023] In this embodiment, the cooling mechanism 7 includes a guide rail 2, a suspension frame 3, an electric cylinder 4, an electromagnetic suction cup 5 and a material box 6. The two sides of the suspension frame 3 are arranged directly above the guide rail 2, and the electric cylinder 4 is arranged directly above the guide rail 2. The output end of the electric cylinder 4 is connected to the electromagnetic suction cup 5, and the outer side of the electromagnetic suction cup 5 is adsorbed and connected to the material box 6. The material box 6 is arranged directly above the water cooling pool 1. The top of the material box 6 is released vertically by the electric cylinder 4 to complete the delivery and cooling of multiple groups of materials.

[0024] In this embodiment, the guide rail 2 is connected to the top of the material box 6 through the suspension frames 3 provided on both sides, and the purification net box 9 is moved by the guide rail 2 to accelerate the cooling speed of the workpiece.

[0025] In this embodiment, the cooling mechanism 11 includes a cooling box 12, an extraction pipe 8, a purification network box 9, a liquid filter element 14, a semiconductor refrigeration component 15 and a water pump 16. The cooling box 12 is installed on one side of the water cooling pool 1. The semiconductor refrigeration component 15 is symmetrically arranged at the bottom end of the cooling box 12. A water pump 16 is arranged inside the cooling box 12. The input end of the water pump 16 is connected to the extraction pipe 8. One end of the extraction pipe 8 is connected to the purification network box 9. Liquid filter elements 14 are arranged at equal intervals inside the purification network box 9.

[0026] In this embodiment, the cooling box 12 is connected to one side of the water cooling pool 1 through a reflux valve 10 provided at the bottom. The flow rate is controlled by the reflux valve 10 to increase the cooling speed of silicon manganese alloys of different sizes.

[0027] In this embodiment, a heat exchanger 13 is provided at the inner bottom of the water cooling pool 1, and the heat exchanger 13 is used to absorb heat from the surface of the silicon manganese alloy, thereby improving the efficiency of heat recovery of the product.

[0028] The practical application of this silicon-manganese alloy rapid cooling equipment includes the following work contents:

[0029] Step 1: During use, first connect the suspension frame 3 with the outer side of the guide rail 2. During use, connect one side of the suspension frame 3 through an electric telescopic rod or a cylinder. During use, push the suspension frame 3 through the electric telescopic rod and the cylinder. The operator directly introduces the shaped silicon-manganese alloy into the material box 6, and turns on the electric cylinder 4. The electric cylinder 4 is used to make vertical contact with the electromagnetic suction cup 5, so that the electromagnetic suction cup 5 is in contact with the outer side of the material box 6 for adsorption;

[0030] Step 2: The operator pushes the hanger 3 through the electric telescopic rod, so that the hanger 3 slides directly on the outside of the guide track 2, so that the hanger 3 and the material box 6 move to the top of the heat exchanger 13, and the electromagnetic chuck 5 and the material box 6 are vertically lowered to the surface of the heat exchanger 13 through the electric cylinder 4, and the material box 6 transfers heat to the surface of the heat exchanger 13, and circulates and heats the internal liquid of the heat exchanger 13 to complete the heat recovery process;

[0031] Step 3: Then, the cooling liquid is directly injected into the water cooling pool 1, and the cooling liquid is used to cool the material inside the material box 6. A water pump 16 is set by opening one side, and the water pump 16 is used to suck the liquid in the cooling cycle. During the suction process, some metal debris in the liquid is filtered through the liquid filter element 14, and the liquid to be cooled is directly injected into the cooling box 12;

[0032] Step 4: During use, according to the amount of material and the amount of water required for cooling at one time, one of the three groups of water pumps 16 can be turned on, and the outer side of the cooling box 12 can be cooled by the semiconductor refrigeration component 15. After the liquid is cooled, the inside of the cooling box 12 is directly discharged into the water cooling pool 1 through the reflux valve 10 arranged below, thereby lowering the temperature of the silicon manganese alloy, and then the material box 6 is extracted from the water tank 1 by the electric cylinder 4.

[0033] Therefore, the embodiments disclosed above are only illustrative in all aspects and are not exclusive. All changes within the scope of the present invention or within the scope equivalent to the present invention are included in the present invention.

Claims

1. Silicon manganese alloy rapid cooling equipment, characterized by: The invention comprises a water cooling pool (1) and a heat exchanger (13), wherein guide rails (2) are symmetrically arranged on the left and right sides of the water cooling pool (1), and a cooling mechanism (7) is arranged inside the water cooling pool (1). The cooling mechanism (7) absorbs heat from the silicon manganese alloy through circulating cooling and the heat exchanger (13) arranged below, thereby saving the time and energy required for the silicon manganese alloy to cool down. A cooling mechanism (11) is arranged on one side of the water cooling pool (1), and the cooling mechanism (11) circulates the liquid inside, filters impurities in the liquid, and cools the liquid at the same time.

2. The silicon-manganese alloy rapid cooling device according to claim 1, characterized in that: The cooling mechanism (7) comprises a guide rail (2), a suspension frame (3), an electric cylinder (4), an electromagnetic suction cup (5), and a material box (6); two sides of the suspension frame (3) are arranged directly above the guide rail (2); an electric cylinder (4) is arranged directly above the guide rail (2); an output end of the electric cylinder (4) is connected to the electromagnetic suction cup (5); the outer side of the electromagnetic suction cup (5) is adsorbed and connected to the material box (6); and the material box (6) is arranged directly above the water cooling pool (1).

3. The silicon-manganese alloy rapid cooling device according to claim 2, characterized in that: The guide rail (2) is connected to the top of the material box (6) via suspension frames (3) arranged on both sides.

4. The silicon-manganese alloy rapid cooling device according to claim 1, characterized in that: The cooling mechanism (11) comprises a cooling box (12), an extraction pipe (8), a purification net box (9), a liquid filter element (14), a semiconductor refrigeration component (15) and a water pump (16); the cooling box (12) is installed on one side of the water cooling pool (1); the semiconductor refrigeration component (15) is symmetrically arranged at the bottom end of the cooling box (12); a water pump (16) is arranged inside the cooling box (12); an input end of the water pump (16) is connected to the extraction pipe (8); one end of the extraction pipe (8) is connected to the purification net box (9); and liquid filter elements (14) are arranged at equal intervals inside the purification net box (9).

5. The silicon-manganese alloy rapid cooling device according to claim 4, characterized in that: The cooling box (12) is connected to one side of the water cooling pool (1) via a reflux valve (10) arranged at the bottom.

6. The silicon-manganese alloy rapid cooling equipment according to claim 1, characterized in that: A heat exchanger (13) is provided at the inner bottom end of the water cooling pool (1).

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