Semiconductor chip cutting waste collecting device

Abstract

The utility model discloses a semiconductor chip cutting waste collecting device, which belongs to the field of semiconductor chip auxiliary equipment and comprises a box body, a swing assembly, a water spray pipe and a conveying assembly are arranged in the box body from top to bottom, the swing assembly rotates in a reciprocating manner to drive the water spray pipe to swing in a reciprocating manner, and then a semiconductor chip on the conveying assembly is washed. Compared with a fixed water spraying pipe for cleaning, the water spraying pipe swings in a reciprocating manner, so that the contact area with the surface of the semiconductor chip is increased, the cleaning effect of the device is improved, the cleaning efficiency is high, and the waste of water resources can be reduced.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip auxiliary equipment, in particular to a semiconductor chip cutting waste collection device. Background Art

[0002] Semiconductor chips are semiconductor devices that can realize certain electronic functions by etching and wiring on semiconductor sheets. In order to meet the needs of mass production, the electrical properties of semiconductors must be predictable and stable, so the purity of dopants and the quality of semiconductor lattice structures must be strictly required. Common quality problems include lattice dislocation, twin planes or stacking faults, which will affect the characteristics of semiconductor materials. For a semiconductor device, defects in the material lattice are usually the main factor affecting the performance of the component.

[0003] A utility model patent with a search announcement number (CN213766123U) discloses a semiconductor chip cutting waste collection device. The waste collection device uses a dust hood to suck the waste generated during the cutting process into a first chip collection box through the chip leakage holes on the surface of the conveyor belt, so that the surface of the conveyor belt remains clean. During the waste collection process, the mist nozzle is used to keep the box moist, which can play a dust reduction role, prevent debris from flying, improve waste collection efficiency, reduce environmental pollution, and facilitate the next cutting. The cleaning structure can clean the waste on the surface of the cut semiconductor chip to improve the quality of the semiconductor chip.

[0004] The above device flushes the surface of the chip through the water spray component while keeping the box body moist, which can play a role in dust reduction and prevent debris from flying. However, the water spray component of the above device is fixed in position and can only flush a single point of the chip, resulting in low flushing efficiency. Utility Model Content

[0005] The utility model aims to overcome the problems of the prior art and provides a semiconductor chip cutting waste collection device.

[0006] The purpose of the utility model is achieved through the following technical solutions: a semiconductor chip cutting waste collection device, the device includes a box body, the box body is provided with a swing component, a water spray pipe, and a transmission component from top to bottom, the reciprocating rotation of the swing component drives the water spray pipe to swing back and forth, and then the semiconductor chip on the transmission component is cleaned.

[0007] In one example, the swing assembly includes a first drive device, a drive gear, a transmission groove, a transmission gear and a drive block; the first drive device is fixedly connected to the housing, the output end of the first drive device is connected to the drive block, the drive block is slidably connected to the transmission groove, the transmission groove is rotatably connected to the housing and fixedly connected to the drive gear, the drive gear is meshed with the transmission gear, the transmission gear is rotatably connected to the housing, and the transmission gear is fixedly connected to the water spray pipe.

[0008] In one example, the swing assembly further includes a swing block, which is fixedly connected to the transmission gear and the water spray pipe.

[0009] In one example, a mounting frame is provided on the box body, and the swing block is rotatably connected to the mounting frame.

[0010] In one example, the conveying assembly includes a second driving device, an annular conveyor belt and a support shaft. The second driving device is arranged on a box body, the support shaft is rotatably connected to the box body, the output shaft of the second driving device is transmission-connected to the conveyor belt, and the support shaft is used to support the conveyor belt.

[0011] In one example, a collecting bin is provided below the conveying component, and a through hole is opened on the conveying belt, wherein the aperture of the through hole is smaller than the aperture of the semiconductor chip and larger than the particle size of the impurity debris.

[0012] In one example, a collection box is provided at the end of the conveying assembly.

[0013] In one example, a heating wire is provided in the collection box.

[0014] In one example, a flipping mechanism for flipping the semiconductor chip is disposed in the box, and the flipping mechanism is located above the conveying component.

[0015] In one example, a fan is disposed in the box.

[0016] It should be further explained that the technical features corresponding to the above examples can be combined or replaced with each other to form a new technical solution.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] 1. In one example, the reciprocating rotation of the swing component drives the water spray pipe to swing back and forth, thereby flushing the semiconductor chip on the conveying component. Compared with the cleaning method of a fixed water spray pipe, the reciprocating swing of the water spray pipe of the utility model increases the contact area with the surface of the semiconductor chip, improves the cleaning effect of the device, has high cleaning efficiency, and can also reduce the waste of water resources.

[0019] 2. In one example, through holes are opened on the conveyor belt, and the washed debris and impurities enter the collecting bin through the through holes, so that the debris and impurities are separated from the semiconductor chips to ensure the cleanliness of the semiconductor chips.

[0020] 3. In one example, a collection box is set up to collect the cleaned semiconductor chips, and the semiconductor chips are further heated by a heating wire to dry out the moisture on the surface of the semiconductor chips to prevent static electricity or corrosion or electrochemical problems caused by moisture in subsequent processes.

[0021] 4. In one example, the semiconductor chip is flipped over by a flipping mechanism, which can further improve the cleaning effect of the semiconductor chip.

[0022] 5. In one example, a fan is used to drive the air flow in the box to prevent dust generated by the washing of semiconductor chips from accumulating in the box. At the same time, a water spray pipe wets and presses down the raised dust, reducing suspended particles in the air and reducing the risk of contamination to semiconductor chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The specific implementation methods of the present invention are further described in detail below in conjunction with the accompanying drawings. The accompanying drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The same reference numerals are used in these drawings to represent the same or similar parts. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0024] Figure 1 A schematic diagram of the internal structure of a device provided as an example of the utility model;

[0025] Figure 2 A schematic diagram of the structure of a swing assembly provided as an example of the utility model;

[0026] Figure 3 A schematic diagram of a partial structure of a swing assembly provided as an example of the utility model;

[0027] Figure 4 A schematic diagram of the structure of a transmission component provided as an example of the utility model;

[0028] Figure 5 The present invention is a schematic diagram of a device structure provided as an example.

[0029] In the figure: 1-box; 11-collection drawer; 2-collection box; 3-transmission assembly; 31-drive motor; 32-conveyor belt; 321-through hole; 33-support shaft; 4-swing assembly; 40-servo motor; 41-drive gear; 42-transmission slot; 43-transmission gear; 44-swing block; 45-drive block; 47-mounting frame; 5-fan; 6-water spray pipe; 7-flip mechanism. DETAILED DESCRIPTION

[0030] The technical solution of the utility model is described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] In the description of the present invention, it should be noted that the directions or positional relationships indicated by "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the directions or positional relationships described in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the use of ordinal numbers (for example, "first and second", "first to fourth", etc.) is to distinguish objects, and is not limited to this order, and cannot be understood as indicating or implying relative importance.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0034] In one example, a semiconductor chip cutting waste collection device, such as Figure 1 As shown, the device includes a box body 1, in which a swinging component 4, a water spray pipe 6, and a conveying component 3 are arranged. Preferably, a plurality of swinging components 4 can be arranged, and the number of swinging components 4 corresponds to the number of water spray pipes 6. Among them, the swinging component 4 is used to generate reciprocating rotation to drive the water spray pipe to swing back and forth; the water spray pipe 6 includes a water pipe and one or more nozzles arranged on the water pipe, which can be a mist nozzle or a nozzle that directly sprays water, and the water output of the nozzle can be adjusted, and the surface of the semiconductor chip is cleaned by spraying water through the water spray pipe 6; the conveying component 3 is used to convey the semiconductor chip. Therefore, in order to achieve the purpose of cleaning the semiconductor chip, the water spray pipe 6 is arranged above the conveying component 3, and the swinging component 4 is arranged above the water spray pipe 6. At this time, the reciprocating rotation of the swinging component 4 drives the water spray pipe 6 to swing back and forth, thereby washing the semiconductor chip on the conveying component 3. Compared with the method of cleaning with a fixed water spray pipe, the reciprocating swing of the water spray pipe of the utility model increases the contact area with the surface of the semiconductor chip, improves the cleaning effect of the device, has high cleaning efficiency, and can also reduce the waste of water resources.

[0035] In one example, if Figure 2-Figure 3As shown, the swing assembly 4 includes a servo motor 40 (first drive device), a driving gear 41, a transmission slot 42, a transmission gear 43 and a driving block 45. Preferably, the swing assembly also includes a connecting rod, and the transmission slot 42 is provided on a square column. The servo motor 40 is fixedly connected to the housing 1, the output shaft of the servo motor 40 is fixedly connected to one end of the driving block 45, the other end of the driving block 45 is connected to the connecting rod, the connecting rod is slidably connected to the transmission slot 42, and the connecting rod is tightly fitted to the inner wall of the transmission slot 42, so that the connecting rod will not deviate and shake when sliding in the transmission slot 42; the transmission slot 42 is rotatably connected to the housing 1 and is fixedly connected to the driving gear 41; the driving gear 41 is meshed with the transmission gear 43, the transmission gear 43 is rotatably connected to the housing 1, and the water spray pipe 6 is fixedly connected to the transmission gear 43. At this time, the working principle of the driving component is: the servo motor 4 drives the driving block 45 to rotate through the output shaft, and the driving block 45 slides in the transmission groove 42 through the connecting rod while pushing the transmission groove 42 to swing, and the swing of the transmission groove 42 drives the driving gear 41 to follow the swing, and the transmission gear 43 reciprocates under the swing of the driving gear 41 through meshing, and the reciprocating rotation of the transmission gear 43 drives the water spray pipe 6 to swing back and forth, and the water spray pipe 6 flushes the surface of the semiconductor chip while swinging back and forth. The water spray pipe 6 swings and flushes, and the contact area with the surface of the semiconductor chip is increased by the swinging and flushing of the water spray pipe 6, thereby improving the cleaning effect of the device and reducing the waste of water resources.

[0036] Preferably, the driving gear 41 is sector-shaped as a whole, and the driving gear 41 reciprocates by engaging the transmission gear 43 through sector-shaped swinging, thereby driving the swing block 44 to follow the reciprocating swing.

[0037] In one example, if Figure 2 As shown, the swing assembly also includes a swing block 44, one end of which is fixedly connected to the transmission gear 43, and the swing block 44 is fixedly connected to the water spray pipe 6. The reciprocating rotation of the transmission gear 43 drives the swing block 44 to swing back and forth, and the swing block 44 drives the water spray pipe 6 to swing back and forth.

[0038] In one example, if Figure 1 As shown, a mounting frame 47 is provided in the box body 1 , the mounting frame 47 is fixedly connected to the box body 1 , and the other end of the swing block 44 is rotatably connected to the mounting frame 47 , and the swing block 44 is limitedly installed by the mounting frame 47 .

[0039] In one example, if Figure 4-5 As shown, the conveying assembly 3 includes a second driving device, an annular conveyor belt 32 and a plurality of supporting shafts 33, and the second driving device is a driving motor 31. A driving motor 31 is provided on one side of the box body 1, and the conveyor belt 32 is drivingly connected to the output shaft of the driving motor 31. The internal transmission of the conveyor belt 32 is connected to a plurality of supporting shafts 33, and the supporting shafts 33 are rotatably connected to the box body 1. The driving motor 31 drives the conveyor belt 32 to rotate to deliver the semiconductor chip into the box body 1.

[0040] In one example, a collecting drawer 11 is provided below the conveying assembly 3, and the collecting drawer 11 is fixedly connected to the box body 1. A plurality of through holes 32 are provided on the conveyor belt 32, and the aperture of the through hole 32 is smaller than the aperture of the semiconductor chip and larger than the particle size of the impurity debris. When the semiconductor chip on the conveyor belt 32 is washed by the water spray pipe 6, the washed debris impurities enter the collecting drawer 11 through the through hole 32, so that the debris impurities are separated from the semiconductor chip to ensure the cleanliness of the semiconductor chip.

[0041] In one example, a collection box 2 is provided at the end of the conveying component 3 (the discharge end of the conveyor belt) for collecting the washed semiconductor chips. Preferably, a buffer layer is provided at the bottom of the collection box 2 to provide a buffer force for the semiconductor chips to prevent chip damage. Preferably, a heating wire is provided in the collection box 2, and the heating wire is fixedly connected to the collection box 2. Preferably, the heating wire is arranged in the interlayer of the collection box 1, and the semiconductor chip does not directly contact the heating wire. The cleaned semiconductor chips enter the collection box 2 through the conveyor belt 32 for collection, and the semiconductor chips are heated by the heating wire in the collection box 2 to dry the moisture on the surface of the semiconductor chips to prevent static electricity or corrosion or electrochemical problems caused by moisture in subsequent processes.

[0042] In one example, a flipping mechanism 7 is provided in the box, and the flipping mechanism is located above the conveying assembly 7, and is used to flip the semiconductor chip. Specifically, the flipping mechanism 7 includes a motor, pneumatic fingers, and a clamping plate, and the pneumatic fingers and the clamping plate are driven by the motor to clamp and flip the semiconductor chip; the specific structure of the flipping mechanism 7 is a well-known technology in the art, such as the flipping mechanism formed by the motor, pneumatic fingers, and clamping plates that cooperate with each other, which is disclosed in the utility model patent with the announcement number CN219650014U and the name of the semiconductor chip cutting waste collection device, and will not be repeated here.

[0043] In one example, a fan is provided in the box body, and the fan 5 is fixedly connected to the box body 1 . Preferably, the fan 5 is provided above the conveying component 3 and between the two swinging components 4 .

[0044] Combining the above examples, we get a preferred example of the utility model. In this case, the device includes: a box body 1, in which two swing components 4, two water spray pipes 6 and a conveying component 3 are arranged from top to bottom. A collecting drawer 11 is arranged below the conveying component 3, and a through hole 321 is opened on the conveying belt 32; a collecting box 2 is arranged at the end of the conveying belt 32, and a heating wire is arranged in the collecting box 2; a turning mechanism 7 is arranged in the box body 1, which is located above the conveying component 3; and a fan 5 is also arranged between the two swing components 4. At this time, the working principle of the device is as follows:

[0045] The semiconductor chip is delivered into the box body 1 by driving the conveyor belt 32 to rotate through the driving motor 31. At this time, the servo motor 40 drives the driving block 45 to rotate through the output shaft. The driving block 45 slides in the transmission groove 42 through the connecting rod at the other end and pushes the transmission groove 42 to swing. The swing of the transmission groove 42 drives the driving gear 41 to follow the swing. The driving gear 41 swings and meshes with the transmission gear 43. The transmission gear 43 reciprocates through the meshing. The reciprocating rotation of the transmission gear 43 drives the swing block 44 to swing back and forth. The swing block 44 drives the water spray pipe 6 to swing back and forth. The water spray pipe 6 swings back and forth to flush the surface of the semiconductor chip. The swing flushing of the water spray pipe 6 increases the contact with the surface of the semiconductor chip. The contact area improves the cleaning effect of the device and reduces the waste of water resources. At the same time, the washed debris and impurities enter the collecting bin 11 through the through hole 32, and the flipping mechanism 7 flips the semiconductor chip. At this time, the surface of the semiconductor chip is flushed through the water spray pipe 6 on the other side, so that both sides of the semiconductor chip are flushed. At the same time, the fan 5 drives the air flow in the box 1 to avoid the accumulation of dust generated by the flushing of the semiconductor chip in the box 1. At the same time, the water spray pipe 6 wets and presses the raised dust. The cleaned semiconductor chips enter the collecting box 2 through the conveyor belt 32 for collection, and the semiconductor chips are heated by the heating wire in the collecting box 2 to dry the moisture on the surface of the semiconductor chips.

[0046] The above specific implementation methods are detailed descriptions of the present utility model. It cannot be determined that the specific implementation methods of the present utility model are limited to these descriptions. For ordinary technicians in the technical field to which the present utility model belongs, they can make several simple deductions and substitutions without departing from the concept of the present utility model, which should be regarded as belonging to the protection scope of the present utility model.

Claims

1. A semiconductor chip cutting waste collection device, characterized in that: The invention comprises a box body, in which a swing component, a water spray pipe and a transmission component are arranged from top to bottom. The reciprocating rotation of the swing component drives the water spray pipe to swing reciprocally, thereby cleaning the semiconductor chip on the transmission component.

2. The semiconductor chip cutting waste collection device according to claim 1, characterized in that: The swing assembly includes a first drive device, a drive gear, a transmission groove, a transmission gear and a drive block; the first drive device is fixedly connected to the box, the output end of the first drive device is connected to the drive block, the drive block is slidably connected to the transmission groove, the transmission groove is rotatably connected to the box and fixedly connected to the drive gear, the drive gear is meshed with the transmission gear, the transmission gear is rotatably connected to the box, and the transmission gear is fixedly connected to the water spray pipe.

3. The semiconductor chip cutting waste collection device according to claim 1, characterized in that: The swing assembly also includes a swing block, which is fixedly connected to the transmission gear and the water spray pipe.

4. The semiconductor chip cutting waste collection device according to claim 3, characterized in that: A mounting frame is arranged on the box body, and the swing block is rotatably connected with the mounting frame.

5. The semiconductor chip cutting waste collection device according to claim 1, characterized in that: The conveying assembly includes a second driving device, an annular conveyor belt and a supporting shaft. The second driving device is arranged on a box body. The supporting shaft is rotatably connected to the box body. The output shaft of the second driving device is transmission-connected to the conveyor belt. The supporting shaft is used to support the conveyor belt.

6. The semiconductor chip cutting waste collection device according to claim 5, characterized in that: A collecting bin is arranged below the conveying component, and a through hole is opened on the conveying belt. The aperture of the through hole is smaller than the aperture of the semiconductor chip and larger than the particle size of the impurity debris.

7. The semiconductor chip cutting waste collection device according to claim 1, characterized in that: A collection box is provided at the end of the conveying assembly.

8. The semiconductor chip cutting waste collection device according to claim 7, characterized in that: A heating wire is arranged in the collecting box.

9. The semiconductor chip cutting waste collection device according to claim 1, characterized in that: The box body is provided with a turning mechanism, which is located above the conveying assembly.

10. The semiconductor chip cutting waste collection device according to claim 1, characterized in that: A fan is arranged in the box.

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