Flexible circuit board capable of preventing layering and cracking
By setting connection strips, concave surfaces and convex surfaces between the upper and lower layers of the flexible circuit board, and combining the design of gold fingers, exhaust holes, coatings, positioning strips and positioning holes, the problem of flexible circuit boards being easily cracked in layers during use is solved, achieving a tighter fit and better protection effect.
Patent Information
- Application Number
- CN202421621866.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-10
AI Technical Summary
Existing flexible circuit boards are prone to delamination and cracking due to bending or folding when used, especially when the fitting is not thorough or positioned inaccurately during pressing.
By setting connection strips, concave surfaces and convex surfaces between the upper circuit board and the lower circuit board, it is ensured to fit tightly during pressing, and the fitting rate and protection effect are improved through the arrangement of gold fingers, exhaust holes, coatings, positioning strips and positioning holes.
Effectively prevent layered cracking of flexible circuit boards, improve fit rate and protection effect, and ensure more stable and reliable during use.
Smart Images

Figure CN222884846U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of flexible circuit boards, in particular to a flexible circuit board capable of preventing delamination and cracking. Background Art
[0002] Flexible circuit board is referred to as "soft board", commonly known as FPC in the industry. It is a printed circuit board made of flexible insulating substrate (mainly polyimide or polyester film), which has many advantages that rigid printed circuit boards do not have. For example, it can be bent, wound and folded freely. The use of FPC can greatly reduce the size of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, digital cameras and other fields or products. FPC also has the advantages of good heat dissipation and solderability, easy installation and low comprehensive cost. Flexible printed circuit boards are divided into single-sided, double-sided and multi-layer boards. The substrate used is mainly polyimide copper clad laminate. This material has high heat resistance and good dimensional stability, and is pressed with a covering film that has both mechanical protection and good electrical insulation properties to form the final product.
[0003] The existing flexible circuit board for preventing delamination and cracking is subjected to bending and folding during use. If the lamination is not complete or the positioning is inaccurate and offset occurs during lamination, the flexible circuit board will delaminate and crack.
[0004] Therefore, in view of this, the existing structural deficiencies are studied and improved, and a flexible circuit board that prevents delamination and cracking is proposed. Utility Model Content
[0005] The utility model aims to provide a flexible circuit board which can prevent delamination and cracking, so as to solve the problems mentioned in the above background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a flexible circuit board for preventing delamination and cracking, comprising an upper circuit board, a lower circuit board is arranged at the lower end of the upper circuit board, and the conductive material of the upper circuit board is pure copper or aluminum, and a connecting strip is arranged at the connection between the lower circuit board and the upper circuit board, concave surfaces are arranged on both sides of the upper end surface of the lower circuit board, and convex surfaces are arranged on both sides of the lower end surface of the upper circuit board, and the upper circuit board and the lower circuit board are bonded and connected through the concave surface and the convex surface.
[0007] Preferably, a vent hole is provided on the surface of the upper circuit board, and the vent hole is a through hole.
[0008] Preferably, gold fingers are provided at both ends of the upper circuit board, and a coating is provided on the upper end surface of the upper circuit board.
[0009] Preferably, positioning bars are provided at four corners of the upper end surface of the upper circuit board, and the positioning bars are arranged in an L shape.
[0010] Preferably, a positioning hole is provided on the surface of the positioning strip, and the positioning hole is a through hole.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] 1. The utility model is provided with an upper circuit board, a lower circuit board, a concave surface, a connecting strip, a convex surface, a gold finger and an exhaust hole. The setting of the connecting strip can make the upper circuit board and the lower circuit board fit more tightly and not easy to delaminate and crack during use. The setting of the concave surface and the convex surface can help the upper circuit board and the lower circuit board to be positioned when they are pressed together, thereby improving the fitting rate of the flexible circuit board;
[0013] 2. The utility model provides the covering film, the positioning strips and the positioning holes. The positioning holes can help with positioning when installing the covering film, thereby preventing the covering film from being offset and affecting the protective effect of the covering film. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;
[0015] Figure 2 This is a schematic diagram of the decomposed structure of the flexible circuit board of the utility model;
[0016] Figure 3 This is a schematic diagram of the three-dimensional structure of the upper circuit board of the utility model;
[0017] Figure 4 For this utility model Figure 1 Enlarged structural diagram at A in the middle.
[0018] In the figure: 1, upper circuit board; 2, lower circuit board; 201, concave surface; 202, connecting strip; 203, convex surface; 3, gold finger; 301, exhaust hole; 4, lamination; 401, positioning strip; 402, positioning hole. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] like Figure 1-Figure 2As shown, a flexible circuit board for preventing delamination and cracking includes an upper circuit board 1, a lower circuit board 2 is arranged at the lower end of the upper circuit board 1, and the conductive material of the upper circuit board 1 is pure copper or aluminum, and a connecting strip 202 is arranged at the connection between the lower circuit board 2 and the upper circuit board 1. The advantage of this arrangement is that through the arrangement of the connecting strip 202, the upper circuit board 1 and the lower circuit board 2 can be more closely attached during use and are not prone to delamination and cracking.
[0021] Furthermore, concave surfaces 201 are provided on both sides of the upper end surface of the lower circuit board 2, and convex surfaces 203 are provided on both sides of the lower end surface of the upper circuit board 1, and the upper circuit board 1 and the lower circuit board 2 are bonded and connected through the concave surfaces 201 and the convex surfaces 203. The advantage of this arrangement is that the arrangement of the concave surfaces 201 and the convex surfaces 203 can help position the upper circuit board 1 and the lower circuit board 2 when they are pressed together, thereby improving the bonding rate of the flexible circuit board.
[0022] like Figure 3-Figure 4 As shown, the surface of the upper circuit board 1 is provided with an exhaust hole 301, and the exhaust hole 301 is a through hole. The advantage of this arrangement is that the exhaust hole 301 can help the flexible circuit board to dissipate heat while also discharging the air in the gap when the flexible circuit board is bonded.
[0023] Furthermore, gold fingers 3 are provided at both ends of the upper circuit board 1 , and a coating 4 is provided on the upper surface of the upper circuit board 1 . The advantage of this arrangement is that the flexible circuit board can be protected by the coating 4 .
[0024] Furthermore, positioning strips 401 are provided at the four corners of the upper surface of the upper circuit board 1, and the positioning strips 401 are arranged in an L shape. Positioning holes 402 are provided on the surface of the positioning strips 401, and the positioning holes 402 are through holes. The advantage of this arrangement is that the positioning holes 402 can help with positioning when installing the coating 4, thereby preventing the coating 4 from being offset and affecting the protective effect of the coating 4.
[0025] Working principle: When using the flexible circuit board that prevents delamination and cracking, first, when attaching the upper circuit board 1 and the lower circuit board 2, set the connecting strip 202 at the attaching position of the upper circuit board 1 and the lower circuit board 2, attach the convex surface 203 to the concave surface 201 and squeeze to complete the attaching, when the coating 4 is needed, the coating 4 can be attached to the surface of the upper circuit board 1 through the positioning strip 401 to help the upper circuit board 1 to attach, and then fixed by the positioning hole 402. This is the working principle of the flexible circuit board that prevents delamination and cracking.
Claims
1. A flexible circuit board for preventing delamination and cracking, comprising an upper circuit board (1), characterized in that: A lower circuit board (2) is arranged at the lower end of the upper circuit board (1), and the conductive material of the upper circuit board (1) is pure copper or aluminum, and a connecting strip (202) is arranged at the connection between the lower circuit board (2) and the upper circuit board (1), concave surfaces (201) are arranged on both sides of the upper end surface of the lower circuit board (2), and convex surfaces (203) are arranged on both sides of the lower end surface of the upper circuit board (1), and the upper circuit board (1) and the lower circuit board (2) are connected by bonding via the concave surfaces (201) and the convex surfaces (203).
2. A flexible circuit board for preventing delamination and cracking according to claim 1, characterized in that: An exhaust hole (301) is provided on the surface of the upper circuit board (1), and the exhaust hole (301) is a through hole.
3. A flexible circuit board for preventing delamination and cracking according to claim 1, characterized in that: Gold fingers (3) are provided at both ends of the upper circuit board (1), and a coating (4) is provided on the upper end surface of the upper circuit board (1).
4. A flexible circuit board for preventing delamination and cracking according to claim 1, characterized in that: Positioning bars (401) are arranged at four corners of the upper end surface of the upper circuit board (1), and the positioning bars (401) are arranged in an L shape.
5. A flexible circuit board for preventing delamination and cracking according to claim 4, characterized in that: A positioning hole (402) is provided on the surface of the positioning strip (401), and the positioning hole (402) is a through hole.