Electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to electronic equipment, and aims to improve the heat dissipation efficiency of the electronic equipment. The electronic equipment comprises a circuit board, a chip, an optical module and a heat dissipation air channel, and the circuit board comprises a first surface and a second surface which are oppositely arranged in the first direction; the optical module is located on the side, away from the second surface, of the circuit board, the chip is arranged on the first surface and / or the second surface, and orthographic projections of the chip and the optical module on the circuit board are not overlapped; the heat dissipation air channel is in the first direction. The arrangement direction of the chip and the optical module is taken as a second direction, the circuit board is divided into a first area and a second area along the second direction, the chip is arranged in the first area, and at least one of two end parts of the first area is provided with a first hollow area along a third direction; the orthographic projection of the optical module on the circuit board is located in a second area, the second area is provided with a second hollowed-out area, and the first hollowed-out area and the second hollowed-out area are both communicated with the heat dissipation air channel; and the first direction, the second direction and the third direction are vertical pairwise.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] Chips, optical modules and printed circuit boards (PCBs) are the basic components of many electronic devices, such as switches, routers, servers, etc. The optical module is responsible for sending and receiving optical signals, and the PCB provides circuit connection and support for the optical module and other electronic components. However, with the increase in the functions of electronic devices, the improvement of processor performance, or the increase in data transmission rate, the power consumption of electronic devices has gradually increased, and the heat dissipation bottleneck of the heat dissipation device of the relevant electronic devices has gradually emerged, which cannot meet the heat dissipation requirements of the upgraded electronic devices.

[0003] Among them, taking the switch as an example, in the relevant switch, the arrangement direction of the switching chip and the optical module is the same as the air duct direction B of the fan, and the optical module and the switching chip are arranged on the surface of the PCB along the air duct direction, that is, the optical module and the switching chip are serially arranged along the air duct direction, and the structural parts located in the front (optical module or switching chip) will block the structural parts at the rear, resulting in low heat dissipation efficiency of the relevant switch. Utility Model Content

[0004] The present application discloses an electronic device to solve the problem of low heat dissipation efficiency of related electronic devices.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] In a first aspect, the present application provides an electronic device, which includes a circuit board, a chip, an optical module and a heat dissipation duct, wherein the circuit board includes a first surface and a second surface arranged opposite to each other along a first direction; the optical module is located on a side of the circuit board away from the second surface, the chip is arranged on the first surface and / or the second surface, and the orthographic projections of the chip and the optical module on the circuit board do not overlap; the heat dissipation duct is along the first direction; taking the arrangement direction of the chip and the optical module as the second direction, along the second direction, the circuit board is divided into a first area and a second area, the chip is arranged in the first area, and along the third direction, at least one of the two ends of the first area is provided with a first hollow area; the orthographic projection of the optical module on the circuit board is located in the second area, the second area is provided with a second hollow area, and the first hollow area and the second hollow area are both connected to the heat dissipation duct; the first direction, the second direction and the third direction are perpendicular to each other.

[0007] Furthermore, the electronic device also includes a support plate and a fan, the fan is located on the heat dissipation channel, the support plate is used to carry a circuit board, a chip, an optical module and / or the fan, and the circuit board is perpendicular to the support plate; along the third direction, a first hollow area is provided at the end of the first area away from the support plate, and / or a first hollow area is provided at the end of the first area close to the support plate.

[0008] Furthermore, the first hollow area is a strip-shaped opening extending along the second direction.

[0009] Furthermore, the chip is located on the first surface, and the electronic device also includes an annular windshield provided on the side of the chip away from the circuit board, and the orthographic projection of the annular windshield on the circuit board is located in the first area and surrounds the orthographic projection of the chip on the circuit board.

[0010] Furthermore, the first area is provided with two or more chips arranged along the third direction.

[0011] Furthermore, the electronic device also includes a heat dissipation device, which is located on a side of the circuit board away from the first surface, and includes a plurality of heat dissipation fins extending along a first direction.

[0012] Furthermore, the central axis of the heat dissipation device coincides with the central axis of the chip.

[0013] Furthermore, the heat dissipation device further includes an evaporator, the evaporator is directly connected to the heat dissipation fins, and the heat dissipation fins extend in a direction away from the evaporator.

[0014] Further, the orthographic projection of the evaporator on the circuit board is located in the first area.

[0015] Furthermore, a dimension of the heat dissipation fin along the second direction is less than or equal to 180 mm.

[0016] In the electronic device provided by the present application, the heat dissipation duct is along the first direction, that is, the heat dissipation duct is perpendicular to the circuit board, the chip is arranged in the first area, the orthographic projection of the optical module on the circuit board is located in the second area, the first area is provided with a first hollow area, the second area is provided with a second hollow area, and the first hollow area and the second hollow area are both connected to the heat dissipation duct, wherein, taking the chip arranged on the first surface as an example for explanation, the air in the environment can flow to the chip, and then flow to the heat dissipation duct after passing through the first hollow area of ​​the circuit board; at the same time, the air in the environment can flow to the optical module, and then flow to the heat dissipation duct after passing through the second hollow area of ​​the circuit board. Therefore, the electronic device in the present application can dissipate heat for the chip and the optical module relatively independently to avoid mutual influence between the chip and the optical module, and the heated air can be discharged to the outside of the device through the heat dissipation duct, which effectively improves the heat dissipation efficiency of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1is a schematic diagram of the structure of related electronic equipment;

[0018] Figure 2 A schematic diagram of the structure of an electronic device according to an embodiment of the present application;

[0019] Figure 3 A schematic diagram of the structure of a circuit board according to an embodiment of the present application;

[0020] Figure 4 A schematic diagram of the structure of a circuit board according to another embodiment of the present application;

[0021] Figure 5 This is a schematic diagram of the structure of a circuit board in another embodiment of the present application;

[0022] Figure 6 A schematic diagram of fluid flow direction of an electronic device according to an embodiment of the present application;

[0023] Figure 7 A schematic diagram of fluid flow in an electronic device according to another embodiment of the present application;

[0024] Figure 8 A schematic diagram of the structure of an electronic device according to an embodiment of the present application;

[0025] Fig. 9 A schematic diagram of the structure of an electronic device according to an embodiment of the present application;

[0026] Fig.10 A top view of an electronic device according to another embodiment of the present application;

[0027] Fig.11 A side view of an electronic device according to another embodiment of the present application;

[0028] Fig.12 A top view of an electronic device according to another embodiment of the present application;

[0029] Fig.13 A simulated cloud diagram of the temperature difference between two chips of an electronic device according to an embodiment of the present application.

[0030] Reference numerals: 10, 100-chip; 20, 200-optical module; 30-fan; 300-blower; 310-heat dissipation duct; 40-PCB; 400-circuit board; 410-first area; 420-second area; 500-housing; 510-support plate; 520-side plate; 530-top plate; 540-annular windshield plate; 60, 600-heat dissipation device; 61, 610-heat dissipation fin; 620-evaporator; 70, 700-thermal conductive material;

[0031] 01-first surface; 02-second surface; 03-first hollow area; 04-second hollow area; 05-air outlet. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] Figure 1 For a schematic diagram of the structure of the relevant electronic equipment, refer to Figure 1 In the related electronic device (such as a switch), the arrangement direction of the switching chip 10 and the optical module 20 is the same as the air duct direction B of the fan 30, and the optical module 20 and the switching chip 10 are arranged on the surface of the PCB 40 along the air duct direction, that is, the optical module 20 and the switching chip 10 are arranged in series along the air duct direction. Along the fluid flow direction, the structural parts located in the front (optical module 20 or switching chip 10) will block the structural parts at the rear, resulting in low heat dissipation efficiency of the related switch.

[0034] In view of this, an electronic device is provided in an embodiment of the present application. Figure 2 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present application. Figure 3 This is a schematic diagram of the structure of a circuit board according to an embodiment of the present application. Figure 4 This is a schematic diagram of the structure of a circuit board in another embodiment of the present application. Figure 5 This is a schematic diagram of the structure of a circuit board in another embodiment of the present application. Please refer to Figures 2 to 5 The electronic device includes a circuit board 400, a chip 100, an optical module 200 and a heat dissipation duct 310, wherein the circuit board 400 includes a first surface 01 and a second surface 02 arranged opposite to each other along a first direction D1. The heat dissipation duct 310 is along the first direction D1, and the wind direction of the heat dissipation duct 310 can be the direction indicated by the arrow in the figure, or can be opposite to the direction indicated by the arrow.

[0035] The optical module 200 is located on the side of the circuit board 400 away from the second surface 02, that is, the optical module 200 is opposite to the first surface 01. Specifically, the optical module 200 can be directly arranged on the first surface 01, or it may not be directly in contact with the circuit board 400, as long as the optical module 200 is connected to the circuit board 400 signal. The optical module 200 is used to convert electrical signals into optical signals for transmission, and it is usually connected to external devices by plugging and unplugging. Among them, the chip 100 can be arranged on the first surface 01 and / or the second surface 02, and it is specifically set according to actual needs, but it is necessary to ensure that the orthographic projections of the chip 100 and the optical module 200 on the circuit board 400 do not overlap.

[0036] Please refer to Figures 2 to 5 , the arrangement direction of the chip 100 and the optical module 200 is the second direction D2, along the second direction D2, such as Figures 2 to 5 As shown, the circuit board 400 is divided into a first area 410 and a second area 420 (area selected by a dotted box), the chip 100 is arranged in the first area 410, and along the third direction D3, at least one of the two ends of the first area 410 is provided with a first hollow area 03. The optical module 200 is arranged in the second area 420, and the second area 420 is provided with a second hollow area 04. The first hollow area 03 and the second hollow area 04 are both connected to the heat dissipation duct 310 to realize the circulation of air, so that the chip 100 and the optical module 200 can be cooled respectively. Among them, the first direction D1, the second direction D2 and the third direction D3 are perpendicular to each other. It is worth mentioning that due to the limitation of process conditions or other factors, there may be some deviations or errors in the actual process, resulting in that the "vertical" described above may not be completely accurate. For example, the "vertical" described above may be a vertical structure allowed within the allowable error range. Of course, "vertical" can also be understood as "substantially vertical" or "completely vertical", so the "vertical" described above only needs to roughly meet the above conditions and is within the scope of protection of this application.

[0037] Wherein, the circuit board 400 may be a PCB. Optionally, as Figure 2 As shown, the electronic device further includes a housing 500, which may specifically include a support plate 510, a side plate 520 and a top plate 530. The support plate 510, the side plate 520 and the top plate 530 are arranged to form a receiving cavity, the circuit board 400, the chip 100 and the optical module 200 are arranged in the receiving cavity, and the support plate 510 is used to carry the circuit board 400, the chip 100 and the optical module 200. The circuit board 400 is perpendicular to the support plate 510, and the heat dissipation duct 310 is located in the receiving cavity, so that air can pass through the heat dissipation duct 310 to dissipate heat for the chip 100 and the optical module 200. Along the third direction, the end of the circuit board 400 away from the support plate 510 is the top end, and the end of the circuit board 400 connected to the support plate 510 is the bottom end.

[0038] In an optional embodiment of the present application, the chip 100 is disposed on the first surface 01 of the circuit board 400, and the air in the environment can flow to the chip 100, and then flow to the heat dissipation channel 310 after passing through the first hollow area 03 of the circuit board 400. In other possible embodiments of the present application, the chip 100 is disposed on the second surface 02 of the circuit board 400, and the air in the environment can flow to the first area 410 of the circuit board 400. Under the obstruction of the circuit board 400, the air passes through the first hollow area 03 of the circuit board 400, passes through the chip 100, and then flows into the heat dissipation channel 310.

[0039] Continue to refer to Figure 2The electronic device in the present application further includes a fan 300 disposed in the accommodating cavity, and the fan 300 is located on the heat dissipation duct 310. Optionally, the fan 300 can extract air, and the wind direction of the fan 300 is Figure 2 Alternatively, the fan 300 can also blow air, and the wind direction of the fan 300 is Figure 2 The direction shown by D1 is opposite.

[0040] In a possible implementation, Figure 3 As shown, the first area 410 includes a first hollow area 03, and the first hollow area 03 is arranged at the top of the first area 410. The specific description of the direction of the fluid is as follows: Figure 6 This is a schematic diagram of the fluid flow direction of an electronic device according to an embodiment of the present application, referring to Figure 6 The chip 100 is located on the first surface 01 of the circuit board 400, and the fan 300 is arranged on the heat dissipation duct 310. The air circulation path is described by taking the fan 300 as an extraction fan as an example. When the first hollow area 03 is located at the top of the first area 410, under the suction action of the fan 300, the air in the environment can flow to the chip 100, and then enter the heat dissipation duct 310 after passing through the first hollow area 03 at the top of the first area 410, and finally flow to the fan 300 and be discharged to the outside of the accommodating cavity under the action of the fan 300.

[0041] like Figure 4 As shown, the first area 410 includes a first hollow area 03, and the first hollow area 03 is arranged at the bottom of the first area 410, wherein the air circulation path is illustrated by taking the chip 100 located on the first surface 01 of the circuit board 400 as an example, under the suction action of the fan 300, the air in the environment can flow to the chip 100, and then enter the heat dissipation duct 310 after passing through the first hollow area 03 at the bottom of the first area 410, and finally flow to the fan 300, and finally, under the action of the fan 300, it is discharged to the outside of the accommodating cavity.

[0042] In another possible implementation, Figure 5 As shown, the first area 410 includes two first hollow areas 03. The top and bottom of the first area 410 are both provided with first hollow areas 03. The specific description of the direction of the fluid is as follows: Figure 7 This is a schematic diagram of fluid flow of an electronic device according to another embodiment of the present application, referring to Figure 7, taking the chip 100 located on the first surface 01 of the circuit board 400 and the fan 300 as an extraction fan as an example, the air circulation path is explained. Under the suction action of the fan 300, the air in the environment can flow to the chip 100, and then pass through the first hollow area 03 at the top and the first hollow area 03 at the bottom of the first area 410 respectively, and then enter the heat dissipation duct 310, and flow to the fan 300, and finally, under the action of the fan 300, it is discharged to the outside of the accommodating cavity.

[0043] Optionally, the first region 410 includes a first circuit layer (not shown in the figure), the first circuit layer is used to be electrically connected to the chip 100, and the first circuit layer is not connected to the first hollow area 03, so as to prevent the first hollow area 03 from affecting the routing of the first circuit layer. The specific shape of the first hollow area 03 is not limited in this application, as long as the first hollow area 03 does not affect the electrical connection between the circuit board 400 and the chip 100.

[0044] Optional, such as Figures 2 to 5 As shown, the first hollow area 03 is a strip-shaped opening extending along the second direction and arranged in the first region 410. Under the premise of not affecting the connection between the chip 100 and the circuit board 400, the area of ​​the first hollow area 03 is increased as much as possible to increase the flow rate of the fluid passing therethrough.

[0045] Optionally, the second region 420 includes a second circuit layer (not shown in the figure), which is used to be electrically connected to the optical module 200. The second circuit layer is not connected to the second hollow area 04 to prevent the second hollow area 04 from affecting the routing of the second circuit layer.

[0046] Optional, such as Figures 2 to 5 As shown, the second hollow area 04 can be a heat dissipation hole arranged in the second area 420, and the number of the heat dissipation holes is multiple, and the shape of the heat dissipation holes can be strip, circle or triangle, etc., and can be set according to actual conditions without affecting the connection between the optical module 200 and the circuit board 400.

[0047] Figure 8 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present application. Figure 8 The chip 100 is located on the surface of the circuit board 400 facing away from the fan 300. The electronic device also includes an annular wind shield 540 arranged on the side of the chip 100 facing away from the circuit board 400. The orthographic projection of the annular wind shield 540 on the circuit board 400 is located in the first area 410 and surrounds the orthographic projection of the chip 100 on the circuit board 400. The annular wind shield 540 can make the air in the environment blow toward the chip 100, thereby improving the heat dissipation efficiency of the chip 100.

[0048] Fig. 9 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present application. Figure 8 and Fig. 9 The first area 410 is provided with one, two or more chips 100. When the first area 410 is provided with two or more chips 100, optionally, the two or more chips 100 are arranged along a third direction D3. Compared with the arrangement of two or more chips 100 along the second direction D2, the signal loss of the chips 100 arranged along the third direction D3 is smaller.

[0049] You can continue to refer to Figure 8 The fan 300 may include a plurality of air outlets 05 arranged along the second direction D2 to improve the efficiency of sucking or blowing the hot air in the accommodating cavity.

[0050] You can continue to refer to Figure 1 In the related electronic devices, the heat sink 60 is usually arranged on the side of the chip 10 away from the PCB 40, and a thermal conductive material 70 is arranged between the heat sink 60 and the chip 10. The extension direction of the heat sink fins 61 of the heat sink 60 is perpendicular to the air duct direction B. The heat sink fins 61 often exceed the air duct of the fan 30, which is not conducive to heat dissipation of the heat sink fins 61.

[0051] In view of this, the electronic device in the embodiment of the present application further includes a heat dissipation device. Fig.10 This is a top view of an electronic device according to another embodiment of the present application. Fig.11 This is a side view of an electronic device according to another embodiment of the present application, see also Fig.10 and Fig.11 The heat sink 600 is located on the side of the circuit board 400 away from the first surface 01. The heat sink 600 includes a plurality of heat sink fins 610. The heat sink fins 610 extend along the first direction. The specific extension size of the heat sink fins 610 is set according to the distance between the chip 100 and the fan 300. The heat sink fins 610 extend along the first direction and are parallel to the wind direction of the fan 300, which helps the fan 300 to dissipate heat from the heat sink fins 610. Moreover, the air duct design of the electronic device in the present application can significantly reduce the temperature difference of the heat sink fins 610, improve the temperature uniformity of the heat sink 600, and dissipate heat more efficiently.

[0052] Optionally, the central axis Z of the heat sink 600 coincides with the central axis of the chip 100. It should be noted that the number of chips 100 here can be one, two, or more. When the number of chips 100 is more than two, the central axes of two or more chips 100 coincide with the central axis of the heat sink 600. The above-mentioned setting method can make the heat sink 600 a symmetrical structure relative to the chip 100, and prevent the heat sink 600 from crushing the chip 100 in the case of vibration and falling.

[0053] Continue to refer to Fig.10The electronic device also includes a thermally conductive material 700 disposed between the heat sink 600 and the chip 100. The thermally conductive material 700 helps to improve the heat conduction efficiency between the chip 100 and the heat sink 600. The thermally conductive material 700 has a lower thermal resistance, which can help heat pass through the contact surface faster and reduce heat loss during the conduction process. Moreover, the thermally conductive material 700 can increase the thermal contact area between the heat sink 600 and the chip 100, so that heat can be more effectively transferred from the high-temperature chip 100 to the heat sink 600.

[0054] Fig.12 This is a top view of an electronic device according to another embodiment of the present application, wherein the heat dissipation device 600 further includes an evaporator 620, which is directly connected to the heat dissipation fins 610, and the heat dissipation fins 610 extend in a direction away from the evaporator 620. When the chip 100 is disposed on the surface of the circuit board 400 facing the fan 300, the evaporator 620 may be in direct contact with the chip 100, or a heat conductive material may be disposed between the two. When the chip 100 is disposed on the surface of the circuit board 400 facing away from the fan 300, the evaporator 620 may be in direct contact with the circuit board 400, or a heat conductive material may be disposed between the two.

[0055] It is understandable that, compared with the related heat sink, the evaporator 620 and the heat sink fin 610 are connected by a heat pipe. In the heat sink 600 in the embodiment of the present application, the evaporator 620 and the heat sink fin 610 are directly connected, which can reduce the number of parts, simplify the structure of the heat sink 600, and make it easier to disassemble and assemble. At the same time, because there is no need to set up a heat pipe, it can be avoided that the heat sink 600 fails due to the failure of the heat pipe. As long as the reliability of the evaporator 620 is guaranteed, the reliability can be improved by more than 50%, and the temperature difference between the chip 100 and the heat sink fin 610 is reduced by 5-10°C.

[0056] In addition, because the heat dissipation efficiency of the electronic device in the present application is improved, the size of the heat dissipation device 600 is smaller. Specifically, the size of the heat dissipation fin 610 along the second direction is less than or equal to 180 mm. Compared with the size of the fin of the heat dissipation device 600 in the related electronic device along the second direction of about 400 mm, the size of the heat dissipation device 600 in the present application is smaller and the occupied space is reduced. At the same time, the weight of the heat dissipation device 600 is lighter, which can be reduced from more than 2 kg to about 1 kg, which can effectively protect the chip 100 from the problem that the heat dissipation device 600 is easily damaged in the vibration and falling scenario.

[0057] Optionally, the orthographic projection of the evaporator 620 on the circuit board 400 is located in the first area 410 to prevent the evaporator 620 from blocking the second hollow area 04 , thereby affecting the heat dissipation of the optical module 200 .

[0058] In summary, by optimizing the air duct design of the chip 100 and the optical module 200 in the electronic device in the present application, the heat dissipation efficiency of the electronic device can be significantly improved, and the setting position and structure of the heat dissipation device 600 can be optimized simultaneously, which can reduce the temperature difference of the heat dissipation fins 610, improve the temperature uniformity of the heat dissipation device 600, and dissipate heat more efficiently to meet the heat dissipation requirements of the chip 100 and the optical module 200.

[0059] Fig.13 This is a simulated cloud diagram of the temperature difference between two chips of an electronic device according to an embodiment of the present application, referring to Fig.13 When the first area of ​​the circuit board includes two first hollow areas, the maximum temperature difference between two chips arranged along the third direction D3 in the first area is only 2°, which effectively improves the temperature uniformity of the chips.

[0060] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. An electronic device, characterized in that: include: A circuit board, the circuit board comprising a first surface and a second surface arranged opposite to each other along a first direction; A chip and an optical module, wherein the optical module is located on a side of the circuit board away from the second surface, the chip is arranged on the first surface and / or the second surface, and the orthographic projections of the chip and the optical module on the circuit board do not overlap; A heat dissipation duct, wherein the heat dissipation duct is along the first direction; Among them, the arrangement direction of the chip and the optical module is the second direction, and along the second direction, the circuit board is divided into a first area and a second area, the chip is arranged in the first area, and along the third direction, at least one of the two ends of the first area is provided with a first hollow area; the orthographic projection of the optical module on the circuit board is located in the second area, and the second area is provided with a second hollow area, and the first hollow area and the second hollow area are both connected to the heat dissipation duct; the first direction, the second direction and the third direction are perpendicular to each other.

2. The electronic device according to claim 1, characterized in that: The electronic device further comprises a support plate and a fan, wherein the fan is located on the heat dissipation duct, the support plate is used to carry the circuit board, the chip, the optical module and / or the fan, and the circuit board is perpendicular to the support plate; Along the third direction, the first region is provided with the first hollow area at an end away from the support plate, and / or the first region is provided with the first hollow area at an end close to the support plate.

3. The electronic device according to claim 1, characterized in that: The first hollow area is a strip-shaped opening extending along the second direction.

4. The electronic device according to claim 1, characterized in that: The chip is located on the first surface, and the electronic device further comprises an annular windshield provided on the side of the chip away from the circuit board, the orthographic projection of the annular windshield on the circuit board is located in the first area and surrounds the orthographic projection of the chip on the circuit board.

5. The electronic device according to claim 1, characterized in that: The first area is provided with two or more chips arranged along the third direction.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further comprises a heat dissipation device, which is located on a side of the circuit board away from the first surface, and comprises a plurality of heat dissipation fins extending along the first direction.

7. The electronic device according to claim 6, characterized in that: The central axis of the heat dissipation device coincides with the central axis of the chip.

8. The electronic device according to claim 6, characterized in that: The heat dissipation device further comprises an evaporator, the evaporator is directly connected to the heat dissipation fins, and the heat dissipation fins extend in a direction away from the evaporator.

9. The electronic device according to claim 8, characterized in that: The evaporator is located in the first area in an orthographic projection on the circuit board.

10. The electronic device according to claim 6, characterized in that: The dimension of the heat dissipation fin along the second direction is less than or equal to 180 mm.

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