Die cutting circuit layer deburring device and circuit board production system

Abstract

The utility model relates to a die cutting circuit layer deburring device and a circuit board production system, and the die cutting circuit layer deburring device comprises a rack (1); the laser device (2) is movably connected to the rack (1), the laser device (2) is used for increasing the temperature of the circuit layer (101) so as to remove burrs, and the light spot width of the laser device (2) is larger than or equal to the width of the circuit layer (101); and the driving assembly (3) is configured to drive the laser (2) to move. According to the invention, burrs on the edge of the die-cutting circuit layer can be removed.

Description

Technical Field

[0001] The present disclosure relates to the technical field of printed circuit board production, and particularly to a deburring device for a die-cut circuit layer and a printed circuit board production system. Background Art

[0002] During the production of a printed circuit board, the copper foil is cut into a required circuit layer by the principle of circular knife roll cutting, and then the circuit layer is bonded to a protective film. However, during the roll cutting process, the edges of the circuit layer formed by roll cutting the copper foil will have cutting burrs, and there is a risk of short circuit where the burrs on the edges of the circuit layer are connected to adjacent circuits, seriously affecting the insulation electrical performance. Summary of the Utility Model

[0003] Embodiments of the present disclosure provide a deburring device for a die-cut circuit layer and a printed circuit board production system, which can remove the burrs on the edges of the die-cut circuit layer.

[0004] According to a first aspect of the present disclosure, a deburring device for a die-cut circuit layer is proposed, including: a frame; a laser, movably connected to the frame, the laser is used to increase the temperature of the circuit layer to remove burrs, and the spot width of the laser is greater than or equal to the width of the circuit layer; and a driving component configured to drive the laser to move.

[0005] The deburring device for a die-cut circuit layer in this embodiment has a simple and reliable structure. The driving component drives the laser to move, and the laser shrinks the burrs on the edges of the circuit layer through local high temperature, which can remove the burrs on the edges of the die-cut circuit layer, prevent circuit short circuits, and improve the insulation electrical performance of the circuit board; in this embodiment, since the spot width of the laser is greater than or equal to the width of the circuit layer, that is, the spot width covers the width of the circuit layer, heating of both sides of the circuit layer along the second direction can be achieved simultaneously, improving the deburring efficiency and deburring effect.

[0006] In some embodiments, the frame includes a first bracket and a second bracket, the first bracket and the second bracket are opposite and spaced apart along a first direction, and the deburring device for a die-cut circuit layer further includes: a first lead screw and a second lead screw, both extending along the first direction and both connected between the first bracket and the second bracket, the first lead screw and the second lead screw are spaced apart along a second direction, and the second direction is perpendicular to the first direction; and a third lead screw, extending along the second direction, the third lead screw is connected between the first lead screw and the second lead screw, the third lead screw is movable along the first direction, and the laser is connected to the third lead screw.

[0007] In this embodiment, the laser can move along the first direction through the third lead screw, which can broaden the moving coverage range of the laser and adjust the relative moving speed between the laser and the circuit layer.

[0008] In some embodiments, the laser is movably connected to the third lead screw along the second direction.

[0009] The laser of this embodiment is movably connected to the third lead screw along the second direction, enabling the laser to achieve cross-shaped movement, further broadening the movement coverage range of the laser, and then accurately adjusting the center position of the light spot according to the working conditions.

[0010] In some embodiments, the driving assembly includes: a first driving member and a second driving member. The first driving member is connected between the first end of the third lead screw and the first lead screw, and the second driving member is connected between the second end of the third lead screw and the second lead screw. The first driving member and the second driving member cooperate to drive the third lead screw to move along the first direction.

[0011] In this embodiment, the first driving member and the second driving member cooperate to drive the third lead screw to move along the first direction, which can broaden the movement coverage range of the laser, realize the automatic control of the laser position, and improve the automation level of the deburring device for the die-cut circuit layer.

[0012] In some embodiments, the driving assembly further includes: a third driving member, connected between the laser and the third lead screw, and the third driving member is configured to drive the laser to move along the second direction.

[0013] In this embodiment, the third driving member drives the laser to move along the second direction, which can accurately align the center of the light spot with the center of the circuit layer, realize the automatic control of the laser position, and improve the automation level of the deburring device for the die-cut circuit layer.

[0014] In some embodiments, the laser is located above the circuit layer along the third direction, and the third direction is perpendicular to the first direction and the second direction.

[0015] In this embodiment, by setting the laser to be located above the circuit layer along the third direction, there is no need to additionally adjust the height position of the laser, which can reduce the control difficulty and improve the reliability of the deburring device for the die-cut circuit layer.

[0016] In some embodiments, the laser is installed above the circuit layer through a connecting rod. The connecting rod extends along the third direction, and the laser is movable relative to the connecting rod along the third direction.

[0017] In this embodiment, since the laser is movable relative to the connecting rod along the third direction, the distance between the laser and the circuit layer can be adjusted along the third direction, thereby adjusting the laser energy and optimizing the deburring effect.

[0018] In some embodiments, the deburring device for the die-cut circuit layer further includes: a vision recognition component, which is used to recognize the marks on the circuit layer to determine the startup timing of the laser.

[0019] In this embodiment, a vision recognition component is provided to recognize marks to determine the startup timing of the laser, which can specifically remove burrs to reduce energy consumption. Meanwhile, it can also achieve automatic control of the startup timing of the laser, improving the automation level of the deburring device for the die-cut circuit layer.

[0020] In some embodiments, the marks on the circuit layer include a startup mark and a stop mark. The startup mark and the stop mark are arranged at intervals along the length direction of the circuit layer. In the area between the startup mark and the stop mark, the distance between adjacent circuits of the circuit layer is not greater than a preset distance.

[0021] In this embodiment, the area with a short-circuit risk of the circuit layer is set by the startup mark and the stop mark, which can shorten the opening time of the laser to reduce energy consumption; it can achieve automatic control of the startup and stop timing of the laser, improving the control accuracy and automation level.

[0022] In some embodiments, the power range of the laser is from 100W to 300W; and / or the laser beam of the laser is blue light or purple light.

[0023] In this embodiment, by setting the power range of the laser and the wavelength range of the laser beam, it can improve the deburring efficiency while avoiding damaging the circuit layer.

[0024] According to the second aspect of the present disclosure, a circuit board production system is proposed, including: a conveying device configured to convey the circuit layer placed on the bottom film; and the deburring device for the die-cut circuit layer of the above embodiment.

[0025] In the circuit board production system of this embodiment, the laser of the deburring device for the die-cut circuit layer shrinks the burrs at the edge of the circuit layer through local high temperature, which can remove the burrs at the edge of the die-cut circuit layer, prevent circuit short circuits, and the circuit board has high insulation electrical performance.

[0026] In some embodiments, the circuit board production system further includes: a cutting device arranged upstream of the deburring device for the die-cut circuit layer and configured to cut the copper foil into circuit layers; and a film laminating device arranged downstream of the deburring device for the die-cut circuit layer and configured to laminate protective films on the upper surface and the lower surface of the circuit layer respectively.

[0027] In the circuit board production system of this embodiment, protective films are laminated on the upper surface and the lower surface of the circuit layer without edge burrs respectively, which can produce circuit boards with stable performance and improve the yield of the circuit board production line. Description of the Drawings

[0028] The drawings described herein are used to provide a further understanding of the present disclosure and constitute a part of this application. The schematic embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation to the present disclosure.

[0029] Figure 1 Schematic diagram of the structure of some embodiments of the deburring device for the die-cut circuit layer of the present disclosure.

[0030] Figure 2 Schematic diagram of the structure of some embodiments of the circuit board production system of the present disclosure.

[0031] Figure 3 Front view of some embodiments of the circuit board production system of the present disclosure.

[0032] Figure 4 Schematic diagram of the structure of some embodiments of the circuit layer of the present disclosure. Detailed implementation manners

[0033] Now, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and in no way limits the present disclosure and its application or use. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: Unless otherwise specifically stated, the relative arrangements of components and steps, the components of materials, numerical expressions and values set forth in these embodiments should be construed as merely exemplary and not as limitations.

[0034] The "first", "second" and similar terms used in the present disclosure do not denote any order, quantity or importance, but are only used to distinguish different parts. Words such as "including" or "comprising" mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements. "Upper", "lower", "left", "right", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0035] In the present disclosure, when it is described that a specific device is located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device. When it is described that a specific device is connected to other devices, the specific device may be directly connected to the other devices without an intermediate device, or may not be directly connected to the other devices and have an intermediate device.

[0036] All terms used in the present disclosure (including technical terms or scientific terms) have the same meaning as understood by those of ordinary skill in the art to which the present disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in a general dictionary such as should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense, unless specifically defined as such herein.

[0037] Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and devices should be considered as part of the specification.

[0038] Based on the above embodiments of the present disclosure, in the absence of an explicit negation or conflict, the technical features of one embodiment can be beneficially combined with one or more other embodiments.

[0039] First, the present disclosure provides a deburring device for a die-cut circuit layer. As Figures 1 to 3 shown, the deburring device for a die-cut circuit layer includes: a frame 1; a laser 2 movably connected to the frame 1, the laser 2 being configured to raise the temperature of the circuit layer 101 to remove burrs; and a driving assembly 3 configured to drive the laser 2 to move.

[0040] Specifically, after the copper foil is die-cut, the circuit layer 101 stored in the carrier film is conveyed through the deburring device for the die-cut circuit layer. The driving assembly 3 drives the laser 2 to move above the circuit layer 101. The laser 2 emits a laser beam to form a light spot 113. The light spot 113 generates local high temperature on the circuit layer 101, and the high-temperature burning operation causes the burrs at the edge of the circuit layer 101 to shrink to remove the burrs. After the circuit layer 101 is made into a circuit board, it can be applied to battery signal acquisition, etc. The circuit layer 101 is a long strip-shaped structure. For example, the circuit layer 101 can extend along the first direction x.

[0041] Optionally, the frame 1 can be an integral structure or a split structure. For example, the frame 1 can be two gantry frames, etc. Optionally, during the operation of the deburring device for the die-cut circuit layer, the laser 2 can be stationary relative to the frame 1 to simplify the control module, or it can move. For example, the moving direction can be the same as or opposite to the conveying direction of the circuit layer 101. When the moving direction is the same as the conveying direction of the circuit layer 101, the moving speed of the laser 2 should avoid the light spot 113 being stationary relative to the circuit layer 101.

[0042] Optionally, the laser 2 can also move to the side of the circuit layer 101 to raise the temperature of the circuit layer 101. Optionally, the relative moving speed between the laser 2 and the circuit layer 101 can be adjusted according to requirements. For example, when there are more burrs, the relative moving speed between the laser 2 and the circuit layer 101 can be reduced, and when it is necessary to improve the deburring efficiency, the relative moving speed between the laser 2 and the circuit layer 101 can be increased.

[0043] Optionally, the laser 2 can be turned on for the entire time when the circuit layer 101 passes through to improve the coverage rate of burr removal, or it can be turned on only when passing through the area of the circuit layer 101 at risk of short circuit to reduce power consumption. Optionally, due to the different temperatures at the center and the edge of the light spot 113, according to the actual requirements of the burr position, the center of the light spot 113 can be aligned with the width center of the circuit layer 101 or deviate from the width center of the circuit layer 101, and the width of the light spot 113 can also be adjusted according to requirements.

[0044] The die-cut circuit layer deburring device of this embodiment has a simple and reliable structure. The driving component 3 drives the laser 2 to move. The laser 2 shrinks the burrs at the edge of the circuit layer 101 through local high temperature, can remove the burrs at the edge of the die-cut circuit layer, prevent circuit short circuits, and improve the insulation electrical performance of the circuit board.

[0045] In some embodiments, as Figures 1 to 3 shown, the frame 1 includes a first bracket 11 and a second bracket 12. The first bracket 11 and the second bracket 12 are opposite and spaced apart along the first direction x. The die-cut circuit layer deburring device further includes: a first lead screw 41 and a second lead screw 42, both extending along the first direction x and both connected between the first bracket 11 and the second bracket 12. The first lead screw 41 and the second lead screw 42 are spaced apart along the second direction y, and the second direction y is perpendicular to the first direction x; and a third lead screw 43, extending along the second direction y. The third lead screw 43 is connected between the first lead screw 41 and the second lead screw 42, and the third lead screw 43 is movable along the first direction x. The laser 2 is connected to the third lead screw 43.

[0046] Specifically, the third direction z is perpendicular to the first direction x and the second direction y. The third direction z can be the height direction. Both the first lead screw 41 and the second lead screw 42 are connected to the ends of the first bracket 11 and the second bracket 12 away from the ground. Optionally, the laser beam extends along the third direction z.

[0047] Optionally, the circuit layer 101 can be conveyed through the die-cut circuit layer deburring device in any direction. For example, it can be along the first direction x, or along the second direction y, or along other inclined directions, etc. The distance between the laser 2 and the circuit layer 101 along the third direction z is adjustable to adjust the heating amount of the light spot 113.

[0048] Optionally, the first bracket 11 and the second bracket 12 can be the same gantry. For example, both the first bracket 11 and the second bracket 12 include a first section, a second section, and a third section. The first section and the second section extend along the third direction z, and the third section extends along the second direction y. The third end is connected to the ends of the first section and the second section away from the ground.

[0049] The laser 2 of this embodiment is movable along the first direction x by the third lead screw 43, which can broaden the moving coverage range of the laser 2 and adjust the relative moving speed between the laser 2 and the circuit layer 101.

[0050] In some embodiments, the laser 2 is movably connected to the third lead screw 43 along the second direction y.

[0051] The laser 2 of this embodiment is movably connected to the third lead screw 43 along the second direction y, which can enable the laser 2 to perform cross-shaped movement, further broaden the moving coverage range of the laser 2, and then accurately adjust the center position of the light spot 113 according to the working conditions.

[0052] In some embodiments, the circuit layer 101 is conveyed along the first direction x, and the laser 2 can perform three-degree-of-freedom movement along the first direction x, the second direction y, and the third direction z.

[0053] Specifically, the conveying speed of the circuit layer 101 may be constant in a fixed device. The laser 2 moves in the opposite direction to the conveying direction of the circuit layer 101 along the first direction x, which can improve the deburring efficiency; if burrs that are not removed cleanly are captured, the laser 2 can move repeatedly along the first direction x to improve the deburring effect.

[0054] Specifically, the center of the circuit layer 101 along the second direction y may not be located at the center of the light spot 113. The laser 2 moves along the second direction y to adjust the position of the laser 2, which can make the center of the circuit layer 101 along the second direction y coincide with the center of the light spot 113; although the light spot 113 may cover the entire width of the circuit layer 101, the central region of the light spot 113 has higher energy. By moving the laser 2 along the second direction y to make the center of the light spot 113 face the burr position, a better deburring effect can be obtained.

[0055] Optionally, the laser 2 can be installed on a screw rod with adjustable up-and-down distance. By adjusting the focal length between the laser 2 and the circuit layer 101 along the third direction z, the laser energy can be adjusted.

[0056] In some embodiments, as Figure 1 and Figure 2 shown, the driving assembly 3 includes: a first driving member 31 and a second driving member 32. The first driving member 31 is connected between the first end of the third lead screw 43 and the first lead screw 41, and the second driving member 32 is connected between the second end of the third lead screw 43 and the second lead screw 42. The first driving member 31 and the second driving member 32 cooperate to drive the third lead screw 43 to move along the first direction x.

[0057] Specifically, the first driving component 31 and the second driving component 32 synchronously drive the third lead screw 43 to move. Optionally, the first driving component 31, the second driving component 32, and the third driving component 33 can be any driving components such as motors, or can be the nut seats of ball screws.

[0058] In this embodiment, the first driving component 31 and the second driving component 32 cooperate to drive the third lead screw 43 to move along the first direction x, which can broaden the moving coverage range of the laser 2, realize the automatic control of the position of the laser 2, and improve the automation level of the deburring device for the die-cut circuit layer.

[0059] In some embodiments, as Figure 1 and Figure 2 shown, the driving assembly 3 further includes: a third driving component 33, connected between the laser 2 and the third lead screw 43, and the third driving component 33 is configured to drive the laser 2 to move along the second direction y.

[0060] In this embodiment, the third driving component 33 drives the laser 2 to move along the second direction y, which can accurately align the center of the light spot 113 with the center of the circuit layer 101, realize the automatic control of the position of the laser 2, and improve the automation level of the deburring device for the die-cut circuit layer.

[0061] In some embodiments, as Figure 2 and Figure 3 shown, the laser 2 is located above the circuit layer 101 along the third direction z, and the third direction z is perpendicular to the first direction x and the second direction y.

[0062] Specifically, the laser 2 is located on the side of the circuit layer 101 away from the bottom film. Optionally, the laser 2 can be located directly above the circuit layer 101, or can be located above the side of the circuit layer 101.

[0063] In this embodiment, by setting the laser 2 to be located above the circuit layer 101 along the third direction z, without the need to additionally adjust the height position of the laser 2, the control difficulty can be reduced, and the reliability of the deburring device for the die-cut circuit layer can be improved.

[0064] In some embodiments, as Figure 2 and Figure 3 shown, the laser 2 is installed above the circuit layer 101 through a connecting rod 44. The connecting rod 44 extends along the third direction z, and the laser 2 is movable relative to the connecting rod 44 along the third direction z.

[0065] Specifically, the relative position between the laser 2 and the connecting rod 44 can be adjusted by threads to realize continuous adjustment of the height position of the laser 2 along the third direction z.

[0066] In this embodiment, the laser 2 is movable relative to the connecting rod 44 along the third direction z, so that the distance between the laser 2 and the circuit layer 101 can be adjusted along the third direction z, thereby adjusting the laser energy and optimizing the deburring effect.

[0067] In some embodiments, as Figures 1 to 3 shown, the die-cut circuit layer deburring device further includes: a vision recognition component 5 for recognizing the marks on the circuit layer 101 to determine the starting timing of the laser 2.

[0068] Optionally, the vision recognition component 5 can be an imaging device adopting a flying shooting mode, etc. Optionally, along the first direction x, the vision recognition component 5 and the laser 2 are respectively located on both sides of the third driving component 33. Optionally, the marks on the circuit layer 101 can be any shape such as square, circular, triangular, cross-shaped or crosshatch-shaped, etc.

[0069] In this embodiment, by setting the vision recognition component 5 to recognize the marks to determine the starting timing of the laser 2, the burrs can be removed in a targeted manner to reduce energy consumption. At the same time, the automatic control of the starting timing of the laser 2 can be realized, and the automation level of the die-cut circuit layer deburring device can be improved.

[0070] In some embodiments, as Figure 4 shown, the marks on the circuit layer 101 include a starting mark 111 and a stopping mark 112. The starting mark 111 and the stopping mark 112 are arranged at intervals along the length direction of the circuit layer 101. In the area between the starting mark 111 and the stopping mark 112, the distance between adjacent circuits of the circuit layer 101 is not greater than a preset distance.

[0071] Specifically, there are multiple circuits on the circuit layer 101, and the distances between the circuits are different. The area between the starting mark 111 and the stopping mark 112 is the area of the circuit layer 101 with a short-circuit risk. The circuit layer 101 is very long. For example, the length of the flexible circuit board applied to battery signal acquisition can reach 1 to 2 meters. Burning the area with a short-circuit risk can shorten the opening time of the laser 2 and save energy.

[0072] Optionally, the distance between adjacent circuits can be the distance along the second direction y, and the preset distance can be 0.5 mm, that is, the area with a short-circuit risk can be the area where the distance between adjacent circuits ≤ 0.5 mm. The distance between adjacent circuits is also called the line pitch.

[0073] In this embodiment, the area of the circuit layer 101 with a short-circuit risk is set by the starting mark and the stopping mark, which can shorten the opening time of the laser 2 to reduce energy consumption; the automatic control of the starting and stopping timing of the laser 2 can be realized, and the control accuracy and automation level can be improved.

[0074] In some embodiments, as Figure 4As shown, the width of the light spot 113 of the laser 2 is greater than or equal to the width of the circuit layer 101.

[0075] Specifically, the width of the light spot 113 can be the distance of the light spot 113 along the second direction y. Optionally, the width of the light spot can be adjusted by the lens of the laser 2. By adjusting the width of the light spot 113 to be equal to the width of the circuit layer 101, the laser energy can be maximally used to heat both sides of the circuit layer 101 along the second direction y. Optionally, the length of the light spot 113 along the first direction x (feeding direction) can be 0.1 - 1 mm.

[0076] In this embodiment, since the width of the light spot 113 of the laser 2 is greater than or equal to the width of the circuit layer 101, that is, the width of the light spot 113 covers the width of the circuit layer 101, heating of both sides of the circuit layer 101 along the second direction y can be achieved simultaneously, improving the deburring efficiency and deburring effect.

[0077] In some embodiments, the power range of the laser 2 is 100W to 300W; and / or the laser beam of the laser 2 is blue light or violet light.

[0078] In this embodiment, by setting the power range of the laser 2 and the wavelength range of the laser beam, damage to the circuit layer 101 can be avoided while improving the deburring efficiency.

[0079] In some specific embodiments, the circuit layer 101 extends along the first direction x and is conveyed along the first direction x. The laser 2 is located above the circuit layer 101 along the third direction z. The visual recognition component 5 is an imaging device using the flying shot mode. When the visual recognition component 5 recognizes the start mark 111 during the flying shot process, the laser 2 is started. At the same time, the driving component 3 drives the laser 2 to move to a specified position. The laser 2 is stationary relative to the frame 1 at the specified position. The center of the light spot 113 coincides with the center of the circuit layer 101, and the width of the light spot 113 is equal to the width of the circuit layer 101. The laser 2 performs a burning operation on the conveyed circuit layer 101. When the visual recognition component 5 recognizes the stop mark 112 during the flying shot process, the laser 2 is turned off.

[0080] Specifically, starting the laser 2 first and then moving it can improve the deburring efficiency. The power of the laser makes the circuit layer 101 heat up, and at the same time, the burrs curl and shrink, but there is no negative impact on the deformation of the main body of the circuit layer 101.

[0081] Secondly, the present disclosure provides a circuit board production system, as Figure 2 and Figure 3 shown, the circuit board production system includes: a conveying device 110 configured to convey the circuit layer 101 placed on the bottom film; and the die-cut circuit layer deburring device of the above embodiment.

[0082] Specifically, the circuit board production system is used to produce consumer circuit boards, such as flexible circuit boards, which can be applied to power batteries, energy storage batteries, electronic appliances, mechanical devices, etc. Specifically, the circuit layer 101 is stored on the bottom film and fed to the deburring device for the die-cut circuit layer. During this process, the bottom film can also play an insulating and protective role.

[0083] In the circuit board production system of this embodiment, the laser 2 of the deburring device for the die-cut circuit layer shrinks the burrs at the edge of the circuit layer 101 through local high temperature, which can remove the burrs at the edge of the die-cut circuit layer, prevent circuit short-circuit, and the circuit board has high insulation electrical performance.

[0084] In some embodiments, the circuit board production system further includes: a cutting device, arranged upstream of the deburring device for the die-cut circuit layer, configured to cut the copper foil into the circuit layer 101; and a film laminating device, arranged downstream of the deburring device for the die-cut circuit layer, configured to laminate protective films on the upper and lower surfaces of the circuit layer 101 respectively.

[0085] Specifically, after the cutting device die-cuts the copper foil, the circuit layer 101 is stored on the bottom film and fed to the subsequent processes, and then laminated with the protective film through the film laminating device. The deburring device for the die-cut circuit layer is located after feeding and before protective film lamination. The upper and lower surfaces of the circuit layer 101 are respectively laminated with the upper film and the lower film with cut windows to form a stable circuit board.

[0086] In the circuit board production system of this embodiment, the upper and lower surfaces of the circuit layer 101 without edge burrs are respectively laminated with protective films, which can produce a circuit board with stable performance and improve the yield of the circuit board production line.

[0087] The above has introduced in detail a deburring device for a die-cut circuit layer and a circuit board production system provided by the present disclosure. Specific embodiments are used herein to elaborate on the principles and implementation manners of the present disclosure. The description of the above embodiments is only used to help understand the method and its core idea of the present disclosure. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present disclosure, several improvements and modifications can be made to the present disclosure, and these improvements and modifications also fall within the protection scope of the claims of the present disclosure.

Claims

1. A die-cutting circuit layer deburring device, characterized in that: include: Rack(1); A laser (2) is movably connected to the frame (1), the laser (2) being used to increase the temperature of the circuit layer (101) to remove burrs, and the spot width of the laser (2) is greater than or equal to the width of the circuit layer (101); and The driving component (3) is configured to drive the laser (2) to move.

2. The die-cutting circuit layer deburring device according to claim 1, characterized in that: The frame (1) comprises a first bracket (11) and a second bracket (12), the first bracket (11) and the second bracket (12) being arranged opposite to each other and spaced apart along a first direction (x), and the die-cutting circuit layer deburring device further comprises: A first screw rod (41) and a second screw rod (42), both extending along the first direction (x) and both connected between the first bracket (11) and the second bracket (12), the first screw rod (41) and the second screw rod (42) being arranged at intervals along a second direction (y), the second direction (y) being perpendicular to the first direction (x); and A third screw rod (43) extends along the second direction (y), the third screw rod (43) is connected between the first screw rod (41) and the second screw rod (42), the third screw rod (43) is movable along the first direction (x), and the laser (2) is connected to the third screw rod (43).

3. The die-cutting circuit layer deburring device according to claim 2, characterized in that: The laser (2) is movably connected to the third lead screw (43) along the second direction (y).

4. The die-cutting circuit layer deburring device according to claim 2, characterized in that: The driving component (3) comprises: A first driving component (31) and a second driving component (32), wherein the first driving component (31) is connected between a first end of the third screw rod (43) and the first screw rod (41), and the second driving component (32) is connected between a second end of the third screw rod (43) and the second screw rod (42), and the first driving component (31) and the second driving component (32) cooperate to drive the third screw rod (43) to move along the first direction (x).

5. The die-cutting circuit layer deburring device according to claim 4, characterized in that: The driving component (3) further comprises: A third driving component (33) is connected between the laser (2) and the third lead screw (43), and the third driving component (33) is configured to drive the laser (2) to move along the second direction (y).

6. The die-cutting circuit layer deburring device according to claim 2, characterized in that: The laser (2) is located above the circuit layer (101) along a third direction (z), and the third direction (z) is perpendicular to the first direction (x) and the second direction (y).

7. The die-cutting circuit layer deburring device according to claim 6, characterized in that: The laser (2) is mounted above the circuit layer (101) via a connecting rod (44); the connecting rod (44) extends along the third direction (z), and the laser (2) is movable relative to the connecting rod (44) along the third direction (z).

8. The die-cutting circuit layer deburring device according to claim 1, characterized in that: Also includes: A visual recognition component (5) is used to recognize a mark on the circuit layer (101) to determine the start timing of the laser (2).

9. The die-cutting circuit layer deburring device according to claim 8, characterized in that: The marks on the circuit layer (101) include a start mark (111) and a stop mark (112), wherein the start mark (111) and the stop mark (112) are arranged at intervals along the length direction of the circuit layer (101), and in the area between the start mark (111) and the stop mark (112), the distance between adjacent circuits of the circuit layer (101) is not greater than a preset distance.

10. The die-cutting circuit layer deburring device according to any one of claims 1 to 9, characterized in that: The power of the laser (2) is in the range of 100 W to 300 W; and / or The laser beam of the laser (2) is blue light or violet light.

11. A circuit board production system, characterized in that: include: A conveying device (110) configured to convey the circuit layer (101) placed on the supporting film; and The die-cut circuit layer deburring device according to any one of claims 1 to 10.

12. The circuit board production system according to claim 11, characterized in that: Also includes: A cutting device, arranged upstream of the die-cutting circuit layer deburring device, configured to cut the copper foil into circuit layers (101); and The film laminating device is arranged downstream of the die-cut circuit layer deburring device and is configured to respectively laminate protective films on the upper surface and the lower surface of the circuit layer (101).

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