Coil board PCB resistant to voltage of 20KV

Abstract

The utility model discloses a coil board PCB resistant to voltage of 20KV, and belongs to the technical field of PCBs. The feeding mechanism comprises a first core plate, PP, a coil plate, PP and a second core plate which are sequentially stacked from top to bottom, the coil plate comprises a first circuit layer, PP, a third core plate, PP and a second circuit layer which are sequentially stacked from top to bottom, and the thickness of the first core plate and the thickness of the second core plate are both larger than 1.1 mm. The beneficial effects are that the dielectric thickness of the top layer and the bottom layer of the coil plate is designed to be larger than 1.1 mm, so that the requirement of withstand voltage of 20KV can be met; high-glue 1080 and 106PP is used, and PP glass fibers are very thin, so that the wick effect of the glass fibers can be reduced, and the problem of breakdown is reduced; the copper thickness of hole copper is controlled to be 50 microns, so that the safety of current passing through the hole is ensured; and a low-temperature-rise parameter is selected as a lamination parameter when the core plate and the PP are laminated, so that sufficient glue filling and lamination uniformity in lamination are ensured.

Description

Technical Field

[0001] This application belongs to the technical field of PCBs, and specifically relates to a coil board PCB with a withstand voltage of 20 KV. Background Art

[0002] Due to the continuous high voltage load on the flat power coil board, the circuit board is prone to being broken down by high voltage and failing at weak or defective points, resulting in product scrapping. Therefore, very precise parameter control is required in the design of such products, and the production process is equally important. The existing coil boards have the following problems: (1) During the design process, the coil board is composed of multiple layers laminated together. During the lamination process, using PP sheets, 7628PP sheets with low resin content and thick fiberglass cloth, the wicking effect after drilling or routing will become a weak point and is easily broken down by electricity, so multiple high-resin PP sheets of 1080 and below should be used during design; (2) The distance between the conductor and the formed edge also needs to be large enough to avoid the risk of the side wall of the board being broken down; (3) The surface of the coil conductor is also equally important. Instead of using traditional solder mask coverage, a relatively thick insulating layer needs to be pressed with epoxy resin PP; (4) Controlling the post-lamination dielectric uniformity, electroplated copper thickness, etc. of production parameters is also equally important.

[0003] In view of the above problem analysis, to solve the problem of withstanding a high voltage of 20 KV in a specific environment, passing the 1 mA leakage current test without withstand voltage failure or explosion, and meeting the requirements of controlling the dielectric thickness and board thickness uniformity, the key technical problems to be solved are: 1) The design problem of the dielectric thickness between layers of the high-voltage-resistant coil PCB; 2) The design problem of the distance between the inner conductor and the outer shape edge of the high-voltage-resistant coil PCB; 3) The layout problem of each layer of the high-voltage-resistant coil PCB; 4) The process flow problem of the high-voltage-resistant coil PCB itself. The post-lamination dielectric uniformity, drilling / routing parameters, electroplated copper thickness production control, etc. during the production process. Summary of the Utility Model

[0004] The purpose of the embodiments of this application is to provide a coil board PCB with a withstand voltage of 20 KV, which can solve at least one of the technical problems involved in the background art.

[0005] To solve the above technical problems, this application is implemented as follows:

[0006] The embodiments of this application provide a coil board PCB with a withstand voltage of 20 KV, including a first core board, PP, a coil board, PP, and a second core board stacked in sequence from top to bottom. The coil board includes a first circuit layer, PP, a third core board, PP, and a second circuit layer stacked in sequence from top to bottom. The thicknesses of the first core board and the second core board are both greater than 1.1 mm.

[0007] Optionally, the PP is 1080PP.

[0008] Optionally, the PP is 106PP.

[0009] Optionally, both the first circuit layer and the second circuit layer are copper foil layers with a thickness of 2OZ.

[0010] Optionally, the coil board PCB is further provided with holes for conducting the inner layer circuits, and the hole walls of the holes are plated with hole copper with a thickness of 50um.

[0011] Optionally, the core board and the PP are press-fitted and fixed by a traditional press with low temperature rise parameters.

[0012] The present application has the following beneficial effects compared with the prior art:

[0013] 1. The designed dielectric thickness of the top and bottom layers of the coil board is greater than 1.1mm, which can meet the requirement of withstanding a voltage of 20KV;

[0014] 2. Using high-glue 1080 and 106PP, the PP glass fiber is very fine, which can reduce the glass fiber wick effect, thereby reducing the problem of breakdown;

[0015] 3. The copper thickness of the hole copper is controlled at 50um to ensure the safety of current passing through the holes;

[0016] 4. When the core board and the PP are press-fitted, low temperature rise parameters are selected for the press-fitting parameters to ensure sufficient filling of glue and uniformity of press-fitting. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where:

[0018] Figure 1 It is a schematic structural diagram of the coil board PCB with a withstand voltage of 20KV provided by the present invention. Detailed Embodiments

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0020] The terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of this application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same category, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0021] Please refer to Figure 1 As shown, the embodiment of this application provides a coil board PCB with a withstand voltage of 20 KV, which includes a first core board 1, PP2, a coil board 3, PP2, and a second core board 4 stacked in sequence from top to bottom. The coil board 3 includes a first circuit layer 31, PP2, a third core board 32, PP2, and a second circuit layer 33 stacked in sequence from top to bottom.

[0022] The thicknesses of both the first core board 1 and the second core board 3 are greater than 1.1 mm, which can meet the requirement of a withstand voltage of 20 KV.

[0023] The PP2 is high-glue 1080PP or 106PP. The PP glass fiber is very fine, which can reduce the glass fiber wick effect, thereby reducing the problem of breakdown.

[0024] Both the first circuit layer 31 and the second circuit layer 33 are copper foil layers, and the thickness is 2 OZ.

[0025] The coil board PCB is also provided with holes (not shown) for conducting the inner layer circuit. The hole walls of the holes are plated with 50 um thick hole copper to ensure the safety of current passing through the holes.

[0026] The core board and the PP2 are fixed by pressing with a traditional press using low-temperature rise parameters to ensure sufficient filling of glue and uniformity of pressing.

[0027] It should be noted that in this article, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including that element.

[0028] In addition, it should be noted that the scope of the methods and systems in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, the features described with reference to certain examples may be combined in other examples.

[0029] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.

Claims

1. A coil board PCB with a withstand voltage of 20KV, characterized in that: It includes a first core plate, PP, a coil plate, PP and a second core plate stacked in sequence from top to bottom. The coil plate includes a first circuit layer, PP, a third core plate, PP and a second circuit layer stacked in sequence from top to bottom. The thickness of the first core plate and the second core plate are both greater than 1.1 mm.

2. The coil board PCB with a withstand voltage of 20KV according to claim 1, characterized in that: The PP is 1080PP.

3. The coil board PCB with a withstand voltage of 20KV according to claim 1, characterized in that: The PP is 106PP.

4. The coil board PCB with a withstand voltage of 20KV according to claim 1, characterized in that: The first circuit layer and the second circuit layer are both copper foil layers, and the thickness is 2OZ.

5. The coil board PCB with a withstand voltage of 20KV according to claim 1 or 4, characterized in that: The coil board PCB is also provided with holes for conducting the inner layer circuits, and the hole walls of the holes are plated with 50um thick copper.

6. The coil board PCB with a withstand voltage of 20KV according to claim 1, characterized in that: The core plate and PP are pressed and fixed by a traditional press using low temperature rise parameters.

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