Copper plating device for PCB (Printed Circuit Board)

Abstract

The utility model relates to the technical field of circuit board processing, in particular to a PCB (printed circuit board) copper plating device which comprises an electroplating tank, a sliding plate is slidably connected to the top of the electroplating tank, a supporting frame is fixed to the end face of the sliding plate, and an avoiding groove is formed in the end face of the sliding plate. An electroplating frame is slidably connected to the portion, located in the receding groove, in the supporting frame, and a driving piece used for driving the electroplating frame to move is arranged at the top of the supporting frame. Wherein the top of the electroplating tank is provided with a reciprocating mechanism, the reciprocating mechanism is used for driving the electroplating frame to move back and forth, the electroplating frame is internally provided with a clamping piece used for fixing the circuit boards, the clamping piece can clamp and fix the multiple circuit boards, and the situation that the circuit boards are disengaged and slide off in the moving process can be prevented in cooperation with a bearing part; the device can adapt to circuit boards of different sizes and is high in practicability, the circuit board can move in the electroplating liquid through the reciprocating mechanism, and it is ensured that each position of the circuit board can make full contact with the electroplating liquid to promote the electroplating reaction.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a PCB circuit board copper plating device. Background Art

[0002] A PCB circuit board is a substrate used to connect and support electronic components. It is usually made of insulating materials (such as resin and fiber) with conductive lines printed on the surface to achieve electrical connection between electronic components.

[0003] In order to improve the conductivity and corrosion resistance of PCB circuit boards, copper plating is required during production. Therefore, a PCB circuit board copper plating device is required to speed up production efficiency. For example, the prior art Chinese patent announcement number "CN215481392U" discloses a copper-plated target in a circuit board hole, which relates to the technical field of electroplating equipment, and includes a conduction component, an auxiliary conduction component and a clamping component; the conduction component includes a first conduction component installed on one side of the electroplating tank and a second conduction component installed on the other side of the electroplating tank, the first conduction component and the second conduction component are symmetrically arranged, a conduction member is connected between the first conduction component and the second conduction component, and the first conduction component, the second conduction component and the conduction member form a conduction path; the auxiliary conduction component is used to increase the conductive path of the conduction component; the clamping component includes a plurality of fastening clamps, and the fastening clamps are used to clamp the circuit board. This application has the effect of reducing the scrap rate of product electroplating.

[0004] However, in actual operation, the copper plating process is performed by placing the circuit board in the electroplating solution. However, because the circuit board cannot move, it cannot be ensured that every position of the circuit board can be completely in contact with the electroplating solution, which affects the processing quality. In addition, because the circuit board is clamped by a fastening clamp, the circuit board may slip due to lack of measures to support the circuit board. Utility Model Content

[0005] The utility model aims to solve the above-mentioned shortcomings of the prior art that affect the processing quality and the circuit board may be separated from the fastening clamp during the processing, and proposes a PCB circuit board copper plating device.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A PCB copper plating device is designed, comprising an electroplating pool, a slide plate is slidably connected to the top of the electroplating pool, a support frame is fixed to the end surface of the slide plate and an avoidance groove is provided, an electroplating rack is slidably connected to the support frame and located in the avoidance groove, and a driving member for driving the electroplating rack to move is provided on the top of the support frame;

[0008] Wherein, a reciprocating mechanism is provided on the top of the electroplating pool, and the reciprocating mechanism is used to drive the electroplating rack to move back and forth. A clamping piece for fixing the circuit board is provided inside the electroplating rack.

[0009] Furthermore, the driving member is a cylinder fixed on the top of the support frame, and a receiving plate is slidably connected to the support frame via a guide rod. The top of the receiving plate is fixedly connected to the axial end of the cylinder, and the electroplating rack is hung on its bottom.

[0010] Furthermore, the reciprocating mechanism includes a motor, and an extension portion is extended on one side of the top of the electroplating pool. The motor is fixedly installed on the bottom of the extension portion, and the shaft end of the motor is fixedly connected to a first connecting rod. The end surface of the slide plate is rotatably connected to a second connecting rod, and the first connecting rod and the second connecting rod are rotatably connected.

[0011] Furthermore, a hook is connected to the top of the electroplating rack, and a plurality of support rods are provided inside the electroplating rack. Both ends of the support rods are slidably connected to the electroplating rack. A limit block is provided at one end of the support rod, and a locking nut is threadedly connected to the other end. The limit block and the locking nut both resist the electroplating rack.

[0012] Furthermore, the clamping member includes a spring clip and a receiving portion, a plurality of the spring clips are passed through the periphery of the support rod, the receiving portion is arranged below the spring clip, and a plurality of slots for plugging in circuit boards are equidistantly opened on the top thereof, and the receiving portion is slidably connected to the electroplating rack through a positioning member.

[0013] Furthermore, the positioning member includes positioning glass beads, and the positioning glass beads are fixedly installed on both sides of the top of the receiving part. The side of the plating rack is slidably connected to the receiving part through a guide groove, and its side is engaged with the positioning glass beads through a positioning hole.

[0014] The utility model provides a PCB copper plating device, which has the following beneficial effects: the utility model can clamp and fix multiple circuit boards through spring clips, and can prevent the circuit boards from slipping off during movement by cooperating with the receiving part, and can adjust the position of the receiving part through the positioning piece to effectively speed up the copper plating efficiency of the circuit board, and can also adapt to circuit boards of different sizes, which is highly practical, and can move the circuit board in the electroplating solution through the reciprocating mechanism, ensuring that each position of the circuit board can fully contact with the electroplating solution to promote the electroplating reaction;

[0015] The utility model copper-plates the circuit board by copper electroplating. For example, the application of cyanide-free electroplating technology can effectively reduce the pollution to the environment and take environmental protection into consideration without affecting the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model;

[0017] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of area A;

[0018] Figure 3 This is a schematic diagram of the structure of the electroplating rack of the utility model;

[0019] Figure 4 for Figure 3 Schematic diagram of the enlarged structure of area B;

[0020] Figure 5 This is an enlarged structural diagram of the positioning member of the utility model.

[0021] In the figure: 1. electroplating tank; 11. extension part; 2. slide plate; 3. support frame; 31. guide rod; 32. receiving plate; 4. electroplating frame; 41. hook; 42. support rod; 43. limit block; 44. locking nut; 5. driving member; 51. cylinder; 6. reciprocating mechanism; 61. motor; 62. first connecting rod; 63. second connecting rod; 7. clamping member; 71. spring clip; 72. receiving part; 8. positioning member; 81. positioning glass bead; 82. guide groove; 83. positioning hole. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] Reference Figure 1-5 A PCB copper plating device comprises an electroplating pool 1, a slide plate 2 is slidably connected to the top of the electroplating pool 1, a support frame 3 is fixed to the end surface of the slide plate 2 and an avoidance groove is provided, an electroplating rack 4 is slidably connected to the support frame 3 and located in the avoidance groove, and a driving member 5 for driving the electroplating rack 4 to move is provided on the top of the support frame 3;

[0024] A reciprocating mechanism 6 is provided on the top of the electroplating pool 1 , and the reciprocating mechanism 6 is used to drive the electroplating rack 4 to move back and forth. A clamping member 7 for fixing a circuit board is provided inside the electroplating rack 4 .

[0025] It should be added that the copper plate in the electroplating tank is used as an anode, the circuit board is used as a cathode, the anode copper plate is connected to the positive electrode of the power supply, the circuit board is connected to the negative electrode of the power supply, and the electroplating solution is placed in the electroplating tank 1, and the copper plating process is performed after the power supply is connected;

[0026] Among them, a slide rail is arranged between the two inner sides of the top of the electroplating pool 1, and the two sides of the slide plate 2 are rotatably connected with pulleys in the slide rail, and cooperate with the reciprocating mechanism 6 to drive the electroplating rack 4 to move back and forth, ensuring that the circuit board can fully contact with the electroplating liquid. In addition, a drain pipe is connected to the bottom of the electroplating pool 1, and an electric valve is arranged in the drain pipe.

[0027] Furthermore, the driving member 5 is a cylinder 51 fixed on the top of the support frame 3, and a receiving plate 32 is slidably connected to the support frame 3 through a guide rod 31. The top of the receiving plate 32 is fixedly connected to the axial end of the cylinder 51, and the electroplating rack 4 is hung on its bottom.

[0028] Furthermore, the reciprocating mechanism 6 includes a motor 61, and an extension portion 11 is extended on one side of the top of the electroplating pool 1. The motor 61 is fixedly installed on the bottom of the extension portion 11, and the shaft end of the motor 61 is fixedly connected to a first connecting rod 62. The end surface of the slide plate 2 is rotatably connected to a second connecting rod 63, and the first connecting rod 62 and the second connecting rod 63 are rotatably connected.

[0029] In a specific operation, the circuit board is fixed in the electroplating rack 4, and the cylinder 51 is used to drive the electroplating rack 4 to move downward, so that the circuit board is immersed in the electroplating solution;

[0030] Afterwards, the motor 61 drives the first connecting rod 62 to drive the second connecting rod 63 to rotate, thereby driving the slide plate 2 to move back and forth.

[0031] In more detail, a hook 41 is connected to the top of the plating rack 4, and a plurality of support rods 42 are provided inside the plating rack 4. Both ends of the support rod 42 are slidably connected to the plating rack 4. A limit block 43 is provided at one end of the support rod 42, and a locking nut 44 is threadedly connected to the other end. The limit block 43 and the locking nut 44 both abut against the plating rack 4.

[0032] In general, the clamping member 7 includes a spring clip 71 and a receiving portion 72. A plurality of the spring clips 71 are passed through the periphery of the support rod 42. The receiving portion 72 is disposed below the spring clip 71 and a plurality of slots for plugging in circuit boards are equidistantly provided on the top thereof. The receiving portion 72 is slidably connected to the electroplating rack 4 via a positioning member 8.

[0033] It is worth mentioning that the support rod 42 can be unlocked by rotating the locking nut 44, and the spring clip 71 can be replaced by sliding the support rod 42. Specifically, the bottom of the spring clip 71 is a clamping part, and the top is a pressing part. The pressing part has a hollow elliptical structure. The advantage is that it provides the spring clip 71 with a certain amount of movement to avoid the spring clip 71 being stuck with the support rod 42 when opening and closing.

[0034] Among them, the spring clip 71 uses the power of the spring to provide a clamping force to clamp and fix the circuit board. Specifically, the receiving portion 72 cooperates with the spring clip 71 to receive and fix the circuit board. Moreover, the positioning member 8 can be used to adjust the height of the receiving portion 72 to facilitate adaptation to circuit boards of different sizes.

[0035] Finally, the positioning member 8 includes a positioning glass bead 81, and the positioning glass bead 81 is fixedly installed on both sides of the top of the receiving part 72. The side of the plating rack 4 is slidably connected to the receiving part 72 through a guide groove 82, and its side is engaged with the positioning glass bead 81 through a positioning hole 83.

[0036] It should be supplemented that a plurality of positioning holes 83 are arranged at equal intervals, and the side of the receiving portion 72 is in a V-shaped structure.

[0037] Working method: When working, the spring clip 71 is sequentially inserted into the periphery of the support rod 42, and the support rod 42 is fixed in the electroplating rack 4 by means of straightening and sliding, and is fixed by the locking nut 44;

[0038] Then, the height of the receiving portion 72 is adjusted by positioning the glass beads 81 according to the size of the circuit board, the top of the circuit board is clamped and fixed by the spring clip 71, and the bottom of the circuit board is received by the receiving portion 72, and then the cylinder 51 drives the electroplating rack 4 to be immersed in the electroplating bath 1;

[0039] Finally, the motor 61 drives the first connecting rod 62 to drive the second connecting rod 63 to rotate, thereby driving the slide plate 2 to move back and forth.

[0040] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A PCB copper plating device, comprising a plating pool (1), characterized in that: The top of the electroplating pool (1) is slidably connected to a slide plate (2), the end surface of the slide plate (2) is fixed with a support frame (3) and is provided with an escape groove, the support frame (3) is slidably connected to an electroplating rack (4) located in the escape groove, and a driving member (5) for driving the electroplating rack (4) to move is provided on the top of the support frame (3); Wherein, a reciprocating mechanism (6) is provided on the top of the electroplating pool (1), and the reciprocating mechanism (6) is used to drive the electroplating rack (4) to move back and forth, and a clamping member (7) for fixing a circuit board is provided inside the electroplating rack (4); The driving member (5) is a cylinder (51) fixed on the top of the support frame (3); a receiving plate (32) is slidably connected to the support frame (3) via a guide rod (31); the top of the receiving plate (32) is fixedly connected to the axial end of the cylinder (51), and the electroplating frame (4) is hung on the bottom of the receiving plate; The reciprocating mechanism (6) comprises a motor (61), one side of the top of the electroplating tank (1) is extended to form an extension portion (11), the motor (61) is fixedly installed at the bottom of the extension portion (11), the shaft end of the motor (61) is fixedly connected to a first connecting rod (62), the end surface of the slide plate (2) is rotatably connected to a second connecting rod (63), and the first connecting rod (62) and the second connecting rod (63) are rotatably connected; The top of the electroplating rack (4) is connected with a hook (41), and a plurality of support rods (42) are arranged inside the hook, and both ends of the support rods (42) are slidably connected to the electroplating rack (4), one end of the support rod (42) is provided with a limit block (43), and the other end is threadedly connected with a locking nut (44), and the limit block (43) and the locking nut (44) both abut against the electroplating rack (4); The clamping member (7) comprises a spring clip (71) and a receiving portion (72); a plurality of the spring clips (71) are passed through the periphery of the support rod (42); the receiving portion (72) is arranged below the spring clip (71) and has a plurality of slots for plugging in circuit boards equidistantly formed on its top; the receiving portion (72) is slidably connected to the electroplating rack (4) via a positioning member (8); The positioning member (8) comprises positioning glass beads (81), and the positioning glass beads (81) are fixedly mounted on both sides of the top of the receiving portion (72); the side of the electroplating rack (4) is slidably connected to the receiving portion (72) via a guide groove (82), and its side is engaged with the positioning glass beads (81) via a positioning hole (83).

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