Intelligent control type anti-sputtering tin conveying groove device for wave soldering

Abstract

The utility model relates to the technical field of wave soldering, in particular to an intelligent control type anti-sputtering tin conveying groove device for wave soldering, which comprises a cleaning mechanism, the cleaning mechanism comprises a tin guide groove, a fixing plate is mounted at the top of the tin guide groove, an adjusting component is mounted on the outer side of the fixing plate, and a sieve plate is mounted outside the adjusting component. The screen plate is adjusted up and down through an adjusting assembly, a tin spraying nozzle is installed in the fixing plate, and the screen plate filters tin liquid sprayed out of the tin spraying nozzle. According to the embodiment, impurities are mixed in tin liquid, when the tin spraying nozzle sprays out the tin liquid, the tin liquid can be sprayed unstably to form sputtering, the adjusting assembly is installed in the fixing plate on the outer side of the tin spraying nozzle, so that the sieve plate is installed on the outer side of the tin spraying nozzle through the adjusting assembly, the recycled tin liquid flowing out of the tin spraying nozzle is filtered, the impurities are screened out, and the recycling efficiency is improved. And the effect of screening and filtering impurities in the tin liquid is achieved, and sputtering caused by the impurities in the tin liquid is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wave soldering, and more specifically to an intelligent control type anti-sputtering tin delivery tank device for wave soldering. Background Art

[0002] At present, in the process of PCBA automation, for semi-finished PCB boards with plug-in materials, wave soldering machines can be used for further processing. After the plug-in materials are plugged into the PCB board one by one, the PCB board passes through the wave soldering machine under the drive of the conveyor mechanism. The solder tank in the wave soldering machine sprays out flowing solder to contact the material pins, and the material is welded on the PCB board. When wave soldering is used to solder the PCB board, a tin supply tank is required to provide solder.

[0003] For wave soldering tin tank, the existing technologies include:

[0004] Chinese patent publication number CN214921194U discloses a wave soldering tin tank and solder, which includes a tank body, a nozzle and a receiving tank, the nozzle and the receiving tank are arranged on the tank body, a plurality of tin spraying holes are opened on the bottom of the tank body corresponding to the nozzle, a locking part is arranged on one side of the tank body, the locking part includes a clamping part, the clamping part is distributed along the height direction of the tank body, and the clamping part is used to clamp with the soldering machine. The present application has the effect of improving the stability of the solder tank after installation, thereby maintaining the welding quality.

[0005] It can be seen that when soldering electrical components on PCB boards, a tin supply tank is needed to provide tin liquid to the tin spray nozzle. The tin liquid sprayed from the tin spray nozzle will flow back into the tin supply tank for reheating. However, the tin liquid sprayed from the tin spray nozzle comes into contact with oxygen in the air, which will form impurities. Impurities in the tin liquid will cause the tin liquid sprayed from the tin spray nozzle to be uneven and prone to sputtering. It is necessary to clean the impurities in the tin liquid to avoid sputtering when there are too many impurities in the tin liquid.

[0006] In view of this, the utility model provides an intelligent control type anti-sputtering tin delivery tank device for wave soldering. Utility Model Content

[0007] The utility model aims to solve the above-mentioned shortcomings and provide a tin delivery tank device for wave soldering which can filter impurities in molten tin to avoid the influence of impurities on sputtering.

[0008] The sieve plate is used to screen and filter the impurities in the tin liquid to avoid the impurities in the tin liquid from being unevenly sprayed and causing the tin liquid to splash. At the same time, the slider and the connecting plate are used to install and adjust the sieve plate up and down.

[0009] Therefore, the utility model provides an intelligent control type anti-sputtering tin delivery tank device for wave soldering, which comprises a tin delivery tank body, wherein a cleaning mechanism is arranged inside the tin delivery tank body;

[0010] The cleaning mechanism includes a tin guide groove, a fixed plate is installed on the top of the tin guide groove, an adjusting component is installed on the outside of the fixed plate, a sieve plate is installed on the outside of the adjusting component, the sieve plate is adjusted up and down by the adjusting component, a tin spray nozzle is installed inside the fixed plate, and the sieve plate filters the tin liquid sprayed from the tin spray nozzle.

[0011] As a further improvement of the technical solution, the tin guide groove is installed inside the tin delivery groove body, and the tin guide groove transports the tin liquid inside the tin delivery groove body to the tin spray nozzle.

[0012] As a further improvement of the technical solution, the adjustment component includes a slide groove, a slider is slidably installed inside the slide groove, a connecting plate is fixedly installed on the outer wall of the slider, and the connecting plate is connected and installed to the sieve plate.

[0013] As a further improvement of the technical solution, two sieve plates are provided, and the two sieve plates are symmetrically distributed on both sides of the tin spray nozzle.

[0014] As a further improvement of the technical solution, a baffle plate is installed on the top of the sieve plate, and the baffle plate can collect impurities filtered by the sieve plate.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] 1. In the intelligent controlled anti-sputtering tin delivery tank device for wave soldering, the tin liquid in the tin delivery tank body is transported to the tin guide tank, and the tin liquid is provided to the tin spray nozzle installed in the fixed plate at the top of the tin guide tank, and the PCB board is soldered. The tin liquid sprayed from the tin spray nozzle will flow back to the tin delivery tank body from both sides of the tin spray nozzle. Since the tin liquid sprayed from the tin spray nozzle absorbs oxygen and forms impurities inside, the impurities are mixed in the tin liquid. When the tin liquid is sprayed from the tin spray nozzle, the tin liquid spraying is unstable and sputtering is formed. An adjusting component is installed inside the fixed plate outside the tin spray nozzle, so that the sieve plate is installed on the outside of the tin spray nozzle with the help of the adjusting component, and the recovered tin liquid flowing out of the tin spray nozzle is filtered to screen out the impurities, so as to achieve the effect of screening and filtering the impurities in the tin liquid, and avoid sputtering caused by impurities in the tin liquid.

[0017] 2. In the intelligent controlled anti-sputtering tin transfer trough device for wave soldering, two slide grooves are opened on the fixed plate, so that the two sliders can slide in the slide grooves, and one side of the connecting plate is installed and connected to the outer wall of the slider, and the other side is installed and connected to the sieve plate, so that the sieve plate can be adjusted up and down in the slide groove. When the sieve plate screens and filters out impurities from the outflowing tin liquid, the blocking plate installed on the top of the sieve plate can block the screened impurities and collect them on the sieve plate. The staff can adjust the height of the sieve plate by pulling the sieve plate to process the impurities in the sieve plate, thereby achieving the effect of adjusting the height of the sieve plate and facilitating the cleaning and collection of impurities. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is described in more detail below by way of example with reference to the accompanying drawings, in which:

[0019] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0020] Figure 2 It is a top plan view of the cleaning mechanism of the utility model;

[0021] Figure 3 It is a cross-sectional schematic diagram of the adjustment component of the utility model.

[0022] The meaning of each number in the figure is:

[0023] 1. Tin delivery tank body; 2. Cleaning mechanism; 201. Tin delivery tank; 202. Fixed plate; 203. Adjustment assembly; 2031. Slider; 2032. Connecting plate; 204. Screen plate; 205. Tin spray nozzle; 3. Blocking plate. DETAILED DESCRIPTION

[0024] When soldering electrical components on a PCB board, a tin supply tank is needed to provide tin liquid to the tin spray nozzle. The tin liquid sprayed from the tin spray nozzle will flow back into the tin supply tank for reheating. However, the tin liquid sprayed from the tin spray nozzle will come into contact with oxygen in the air and form impurities. Impurities in the tin liquid will cause the tin liquid sprayed from the tin spray nozzle to be uneven and prone to sputtering. Therefore, the impurities in the tin liquid need to be cleaned to avoid sputtering when there are too many impurities in the tin liquid.

[0025] like Figure 1-2 As shown, the device comprises a tin delivery tank body 1, and a cleaning mechanism 2 is arranged inside the tin delivery tank body 1. The cleaning mechanism 2 cleans the impurities inside the tin liquid sprayed out of the tin spray nozzle 205, so as to facilitate the recovery of the tin liquid.

[0026] First, the specific structure of the cleaning mechanism 2 is disclosed. The cleaning mechanism 2 includes a tin guide groove 201. A fixed plate 202 is installed on the top of the tin guide groove 201. An adjustment component 203 is installed on the outside of the fixed plate 202. A sieve plate 204 is installed on the outside of the adjustment component 203. The sieve plate 204 is adjusted up and down by the adjustment component 203. A tin spray nozzle 205 is installed inside the fixed plate 202. The sieve plate 204 filters the tin liquid sprayed from the tin spray nozzle 205. The tin guide groove 201 is installed inside the tin delivery groove body 1. The tin guide groove 201 transports the tin liquid inside the tin delivery groove body 1 to the tin spray nozzle 205.

[0027] Tin metal can be heated into tin liquid inside the tin delivery tank body 1. The tin guide tank 201 is installed inside the tin delivery tank body 1. The fan blades can be connected to the output shaft of the motor to rotate inside the tin guide tank 201, and the tin liquid in the tin delivery tank body 1 is transported to the tin guide tank 201, and the tin liquid is provided to the tin spray nozzle 205 installed in the top fixing plate 202 of the tin guide tank 201 to solder the PCB board. The tin liquid sprayed by the tin spray nozzle 205 will flow back to the tin delivery tank body 1 from both sides of the tin spray nozzle 205. The sprayed tin liquid absorbs oxygen and forms impurities. The impurities are mixed in the tin liquid. When the tin liquid is sprayed out from the tin spray nozzle 205, the spraying of the tin liquid will be unstable and sputtering will occur. An adjusting component 203 is installed inside the fixed plate 202 outside the tin spray nozzle 205, so that the sieve plate 204 is installed on the outside of the tin spray nozzle 205 with the help of the adjusting component 203, and the recovered tin liquid flowing out of the tin spray nozzle 205 is filtered to screen out the impurities, thereby achieving the effect of screening and filtering the impurities in the tin liquid and avoiding sputtering caused by impurities in the tin liquid.

[0028] The improvement of this embodiment is that the sieve plate 204 structure is used to achieve the effect of screening and filtering impurities in the tin liquid, thereby solving the problem in the prior art that impurities in the tin liquid will cause uneven spraying of the tin liquid and cause tin liquid sputtering.

[0029] Since the sieve plate 204 in the prior art cannot be adjusted up and down in height, it is inconvenient to clean impurities. Figure 3 A second embodiment of the present utility model is shown.

[0030] The specific structure of the adjustment component 203 is disclosed again. The adjustment component 203 includes a slide groove, a slider 2031 is slidably installed inside the slide groove, and a connecting plate 2032 is fixedly installed on the outer wall of the slider 2031. The connecting plate 2032 is connected and installed to the sieve plate 204. Two sieve plates 204 are provided, and the two sieve plates 204 are symmetrically distributed on both sides of the tin spray nozzle 205. A blocking plate 3 is installed on the top of the sieve plate 204, and the blocking plate 3 can collect impurities filtered by the sieve plate 204.

[0031] By opening two slide grooves on the fixed plate 202, the two sliders 2031 can slide in the slide grooves, so that one side of the connecting plate 2032 is installed and connected to the outer wall of the slider 2031, and the other side is installed and connected to the sieve plate 204, so that the height of the sieve plate 204 can be adjusted up and down in the slide groove. When the sieve plate 204 screens and filters out impurities from the outflowing tin liquid, the blocking plate 3 installed on the top of the sieve plate 204 can block the screened impurities and collect them on the sieve plate 204. The staff can adjust the height of the sieve plate 204 by pulling the sieve plate 204, and process the impurities in the sieve plate 204, so as to achieve the effect of adjusting the height of the sieve plate 204 and facilitating the cleaning and collection of impurities.

[0032] The improvement of this embodiment is that: through the structure of the slider 2031 and the connecting plate 2032, the effect of adjusting the sieve plate 204 up and down during installation is achieved, which solves the problem of inconvenient cleaning of impurities in the prior art.

[0033] In summary, the working principle of this solution is as follows:

[0034] Tin metal can be heated into tin liquid inside the tin delivery tank body 1. The tin guide tank 201 is installed inside the tin delivery tank body 1. The fan blades can be connected to the output shaft of the motor to rotate inside the tin guide tank 201, and the tin liquid in the tin delivery tank body 1 is transported to the tin guide tank 201, and the tin liquid is provided to the tin spray nozzle 205 installed in the top fixing plate 202 of the tin guide tank 201 to solder the PCB board. The tin liquid sprayed by the tin spray nozzle 205 will flow back to the tin delivery tank body 1 from both sides of the tin spray nozzle 205. The sprayed tin liquid absorbs oxygen and forms impurities. The impurities are mixed in the tin liquid. When the tin liquid is sprayed out from the tin spray nozzle 205, the spraying of the tin liquid will be unstable and form sputtering. The adjusting component 203 is installed inside the fixed plate 202 outside the tin spray nozzle 205, so that the sieve plate 204 is installed on the outside of the tin spray nozzle 205 with the help of the adjusting component 203, and the recovered tin liquid flowing out of the tin spray nozzle 205 is filtered to screen out the impurities, so as to achieve the effect of screening and filtering the impurities in the tin liquid, and avoid the impurities in the tin liquid from causing sputtering;

[0035] By opening two slide grooves on the fixed plate 202, the two sliders 2031 can slide in the slide grooves, so that one side of the connecting plate 2032 is installed and connected to the outer wall of the slider 2031, and the other side is installed and connected to the sieve plate 204, so that the height of the sieve plate 204 can be adjusted up and down in the slide groove. When the sieve plate 204 screens and filters out impurities from the outflowing tin liquid, the blocking plate 3 installed on the top of the sieve plate 204 can block the screened impurities and collect them on the sieve plate 204. The staff can adjust the height of the sieve plate 204 by pulling the sieve plate 204, and process the impurities in the sieve plate 204, so as to achieve the effect of adjusting the height of the sieve plate 204 and facilitating the cleaning and collection of impurities.

[0036] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. An intelligent controlled anti-sputtering tin delivery tank device for wave soldering, characterized in that: It at least comprises a tin delivery trough body (1), wherein a cleaning mechanism (2) is arranged inside the tin delivery trough body (1); The cleaning mechanism (2) comprises a tin guide groove (201), a fixed plate (202) is installed on the top of the tin guide groove (201), an adjusting component (203) is installed on the outside of the fixing plate (202), a sieve plate (204) is installed on the outside of the adjusting component (203), the sieve plate (204) is adjusted up and down by the adjusting component (203), a tin spray nozzle (205) is installed inside the fixing plate (202), and the sieve plate (204) filters the tin liquid sprayed from the tin spray nozzle (205).

2. The intelligent controlled anti-sputtering tin delivery bath device for wave soldering as claimed in claim 1, characterized in that: The tin guide groove (201) is installed inside the tin delivery groove body (1), and the tin guide groove (201) transports the tin liquid inside the tin delivery groove body (1) to the tin spray nozzle (205).

3. The intelligent controlled anti-sputtering tin delivery bath device for wave soldering as claimed in claim 1, characterized in that: The adjustment component (203) comprises a slide groove, a slider (2031) is slidably mounted inside the slide groove, a connecting plate (2032) is fixedly mounted on the outer wall of the slider (2031), and the connecting plate (2032) is connected and mounted to the sieve plate (204).

4. The intelligent controlled anti-sputtering tin delivery bath device for wave soldering as claimed in claim 1, characterized in that: Two sieve plates (204) are provided, and the two sieve plates (204) are symmetrically distributed on both sides of the tin spray nozzle (205).

5. The intelligent controlled anti-sputtering tin delivery bath device for wave soldering according to claim 1, characterized in that: A blocking plate (3) is installed on the top of the sieve plate (204), and the blocking plate (3) can collect impurities filtered by the sieve plate (204).

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