Sealing ring for semiconductor

Abstract

The utility model belongs to the field of sealing rings, and particularly relates to a sealing ring for a semiconductor, which comprises an outer ring, an inner ring, a thread structure, a metal longitudinal supporting bone, a metal transverse supporting bone, an anti-collision rubber head and a buffer gap, the metal transverse supporting bones and the metal longitudinal supporting bones are arranged between the outer ring and the inner ring in a crossed mode, and the anti-collision rubber heads are arranged at the two ends of the metal transverse supporting bones. Due to the fact that the threaded structure is arranged between the outer ring and the inner ring of the sealing ring and the metal longitudinal supporting bones and the metal transverse supporting bones are arranged in the crossed mode, the structural strength and stability of the sealing ring are greatly enhanced, the sealing ring can bear large pressure and deformation, the reliability of the sealing ring is improved, and the service life of the sealing ring is prolonged. The thread structure is designed in an Arabic number 8 shape, larger contact area and higher gripping force are provided, the sealing performance of the sealing ring is further improved, and the leakage problem is effectively prevented.

Description

Technical Field

[0001] The utility model relates to the field of sealing rings, in particular to a sealing ring for semiconductors. Background Art

[0002] With the continuous development of electronic technology, semiconductor devices have been widely used in modern electronic equipment. Semiconductor devices have very strict requirements for the working environment and need to prevent pollutants such as dust and water vapor in the external environment from entering the device interior, otherwise it will cause a decline in device performance or even failure. Therefore, in the process of packaging and application of semiconductor devices, sealing technology plays a crucial role.

[0003] At present, the common sealing methods for semiconductor devices include glue sealing, welding sealing, and mechanical sealing, etc. Among them, mechanical sealing has been widely used in semiconductor device packaging due to its advantages such as convenient assembly, reliable sealing, and low cost.

[0004] Existing sealing rings have the problem that semiconductor devices will inevitably be affected by vibration and impact from the external environment during operation. Traditional seals lack effective buffer and anti-seismic designs and are prone to displacement or deformation during vibration, which may lead to seal failure.

[0005] Therefore, a sealing ring for semiconductors is proposed to solve the above problems. Content of the Utility Model

[0006] In order to make up for the deficiencies of the prior art, the problem that semiconductor devices will inevitably be affected by vibration and impact from the external environment during operation, traditional seals lack effective buffer and anti-seismic designs, are prone to displacement or deformation during vibration, and may lead to seal failure is solved.

[0007] The technical solution adopted by the utility model to solve its technical problems is: A sealing ring for semiconductors described in the utility model includes an outer ring, an inner ring, a threaded structure, metal longitudinal support bones, metal transverse support bones, anti-collision rubber heads, and buffer gaps. The threaded structure is arranged between the outer ring and the inner ring, and the metal transverse support bones and metal longitudinal support bones are arranged crosswise between the outer ring and the inner ring. This design enhances the structural strength and stability of the sealing ring through the threaded structure and crosswise arranged metal support bones, and at the same time provides good sealing performance.

[0008] Preferably, the anti-collision rubber heads are arranged at both ends of the metal transverse support bones. This design can effectively buffer the impact and vibration received by the sealing ring during use by arranging anti-collision rubber heads at both ends of the metal transverse support bones, protect the sealing ring from damage, and extend its service life.

[0009] Preferably, the thread structure is in the shape of the Arabic numeral "8". This design enables the thread structure to have a larger contact area and stronger gripping force, improving the sealing performance and stability of the sealing ring.

[0010] Preferably, the metal longitudinal support ribs and metal transverse support ribs divide the space between the outer ring and the inner ring into several buffer gaps. By dividing the internal space of the sealing ring into multiple buffer gaps, this design can effectively absorb and buffer external impacts and vibrations, protecting the sealing ring and semiconductor device from damage.

[0011] Preferably, both the outer ring and the inner ring are circular ring structures. This design makes the sealing ring have a simple and symmetric structure, which is easy to process, manufacture, install and use. At the same time, it also improves the sealing performance of the sealing ring.

[0012] Preferably, the anti-collision rubber head is in a semi-circular structure. This design enables the anti-collision rubber head to have good buffering and shock absorption effects. At the same time, the semi-circular structure is also convenient for processing, manufacturing and installation, improving the practicability and reliability of the sealing ring.

[0013] The advantages of the present utility model are as follows:

[0014] 1. It enhances the structural strength and stability of the sealing ring, enabling it to withstand greater pressure and deformation, and improving the reliability and service life of the sealing ring;

[0015] 2. It provides a larger contact area and stronger gripping force, further improving the sealing performance of the sealing ring, effectively preventing leakage problems, can effectively absorb and buffer external impacts and vibrations, can effectively reduce the wear and impact on the sealing ring during use, extend its service life, the sealing ring has high manufacturing and installation convenience, and also helps to improve the sealing performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the overall front view of the present utility model;

[0018] Figure 2 It is a three-dimensional structural schematic diagram of the overall bottom view of the present utility model;

[0019] Figure 3 It is a three-dimensional structural schematic diagram of the overall top view of the present utility model;

[0020] Figure 4 This is a three-dimensional structural schematic diagram of the front view of part A of the present utility model.

[0021] In the figure: 1, outer ring; 2, inner ring; 3, thread structure; 4, metal longitudinal support bone; 5, metal transverse support bone; 6, anti-collision rubber head; 7, buffer gap. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Embodiment 1:

[0024] Please refer to Figures 1 to 4 As shown, a semiconductor sealing ring includes an outer ring 1, an inner ring 2, a thread structure 3, a metal longitudinal support bone 4, a metal transverse support bone 5, an anti-collision rubber head 6, and a buffer gap 7. The thread structure 3 is arranged between the outer ring 1 and the inner ring 2, and the metal transverse support bone 5 and the metal longitudinal support bone 4 are cross-arranged between the outer ring 1 and the inner ring 2. Specifically in implementation, the outer ring 1 and the inner ring 2 can be manufactured by injection molding or machining, and then the thread structure 3, the metal longitudinal support bone 4, and the metal transverse support bone 5 are assembled between the outer ring 1 and the inner ring 2 to form a complete sealing ring structure.

[0025] The anti-collision rubber heads 6 are arranged at both ends of the metal transverse support bone 5. Specifically in implementation, installation grooves can be reserved at both ends of the metal transverse support bone 5, and then the anti-collision rubber heads 6 are embedded into the installation grooves and fixed, or other connection methods such as bonding or buckling can be used to install the anti-collision rubber heads 6 on the metal transverse support bone 5.

[0026] The thread structure 3 is in the shape of an Arabic numeral "8". Specifically in implementation, corresponding thread grooves can be opened on the inner walls of the outer ring 1 and the inner ring 2, and then the thread structure 3 is embedded into the thread grooves to make it present the shape of an "8". The thread structure 3 can be made of elastic materials such as rubber or silica gel to provide good sealing performance.

[0027] The metal longitudinal support bones 4 and the metal transverse support bones 5 divide the space between the outer ring 1 and the inner ring 2 into several buffer gaps 7. During specific implementation, the metal transverse support bones 5 can be first assembled between the outer ring 1 and the inner ring 2, and then the metal longitudinal support bones 4 are cross-assembled to divide the internal space of the sealing ring into multiple independent buffer gaps 7. The metal support bones can be made of materials such as stainless steel and aluminum alloy to provide sufficient strength and support.

[0028] Both the outer ring 1 and the inner ring 2 are circular ring structures. During specific implementation, the circular ring-shaped outer ring 1 and inner ring 2 with corresponding specifications can be designed and manufactured according to the specific model and size requirements of the semiconductor device to ensure the normal installation and use of the sealing ring.

[0029] The anti-collision rubber head 6 is a semi-circular structure. During specific implementation, the semi-circular anti-collision rubber head 6 can be manufactured by injection molding or machining, and then installed at both ends of the metal transverse support bone 5. The anti-collision rubber head 6 can be made of wear-resistant and impact-resistant rubber materials to provide good buffering and protection.

[0030] Working principle: First, the sealing ring is installed in cooperation with the corresponding parts of the semiconductor device through the outer ring 1 and the inner ring 2. Using the circular ring structures of the outer ring 1 and the inner ring 2 and the sealing force provided by the thread structure 3, the effective sealing of the internal space of the semiconductor device is achieved, preventing pollutants, moisture, etc. in the external environment from entering the device interior and protecting the semiconductor devices and circuits from damage. During the operation of the sealing ring, the vibration and impact of the external environment are transmitted to the sealing ring through the device. The metal longitudinal support bones 4 and the metal transverse support bones 5 divide the internal space of the sealing ring into multiple buffer gaps 7. When the external vibration and impact act on the sealing ring, these buffer gaps 7 can effectively absorb and buffer the vibration energy, reduce the impact on the sealing ring body and the semiconductor device, and improve the seismic performance of the entire system. When the sealing ring is subjected to severe impact or extrusion, the anti-collision rubber heads 6 provided at both ends of the metal transverse support bone 5 can provide additional buffering and protection.

[0031] Secondly, when the sealing ring is impacted, the anti-collision rubber head 6 will first come into contact with the equipment housing and deform, absorbing part of the impact energy, reducing the direct impact on the metal support bone and the sealing ring body, thereby extending the service life of the sealing ring. The metal longitudinal support bone 4 and the metal transverse support bone 5 are cross-arranged between the outer ring 1 and the inner ring 2 to form a stable support structure. This structure can enhance the overall strength and rigidity of the sealing ring, prevent the sealing ring from deforming or being damaged excessively when under pressure, and ensure that the sealing ring can play a sealing and protective role stably for a long time. The thread structure 3 is designed in the shape of the Arabic numeral "8" and cooperates with the thread grooves of the outer ring 1 and the inner ring 2 to provide a larger contact area and stronger sealing force. When the sealing ring is installed in place, the thread structure 3 will tightly engage with the equipment housing to form a firm sealing connection, effectively preventing the occurrence of sealing failure and leakage problems.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A sealing ring for semiconductor, characterized in that: It comprises an outer ring (1), an inner ring (2), a threaded structure (3), a metal longitudinal support bone (4), a metal transverse support bone (5), an anti-collision rubber head (6) and a buffer gap (7); The threaded structure (3) is arranged between the outer ring (1) and the inner ring (2), and the metal transverse support bone (5) and the metal longitudinal support bone (4) are cross-arranged between the outer ring (1) and the inner ring (2).

2. A semiconductor sealing ring according to claim 1, characterized in that The anti-collision rubber heads (6) are arranged at both ends of the metal transverse support bones (5).

3. A semiconductor sealing ring according to claim 1, characterized in that The thread structure (3) is in the shape of an Arabic numeral "8".

4. A semiconductor sealing ring according to claim 1, characterized in that The metal longitudinal support bones (4) and the metal transverse support bones (5) divide the space between the outer ring (1) and the inner ring (2) into a plurality of buffer gaps (7).

5. A semiconductor sealing ring according to claim 1, characterized in that The outer ring (1) and the inner ring (2) are both annular structures.

6. A semiconductor sealing ring according to claim 2, characterized in that The anti-collision rubber head (6) is a semicircular structure.

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