Auxiliary sintering device for nano-silver paste

Abstract

The utility model discloses an auxiliary sintering device for nano-silver paste, and relates to the technical field of auxiliary sintering of the nano-silver paste. The auxiliary sintering device for the nano-silver paste comprises a bearing table, a heating bin is arranged at the top of the bearing table, a conveying mechanism is arranged in the heating bin, and a sintering mechanism is arranged in the heating bin. According to the auxiliary sintering device for the nano-silver paste, by arranging the sintering plate, when the nano-silver paste needs to be pre-sintered, a substrate, a chip and a nano-silver paste main body are firstly placed at the top of the sintering plate through external equipment, and then a polytetrafluoroethylene high-temperature-resistant film is fixed at the top of the sintering plate through an iron sheet under the magnetic force of a magnet; a sintering plate is placed on a heat transfer plate in a heating bin through a handle, vacuumizing is conducted through a vacuumizing pipe, nitrogen is conveyed through a nitrogen conveying pipe, finally, the interior of the sintering plate is heated through the heat transfer plate, and the device facilitates presintering of nano-silver paste.

Description

Technical Field

[0001] The utility model belongs to the technical field of nano silver paste assisted sintering, and particularly relates to a nano silver paste assisted sintering device. Background Technique

[0002] The nano silver sintering technology is a high-temperature resistant encapsulation connection technology that uses nano silver paste to achieve under low temperature with or without pressure. The sintering temperature is much lower than the melting point of bulk silver. The organic components in the nano silver paste decompose and volatilize during the sintering process, and finally form a silver connection layer. The nano silver paste is widely used in the connection of electrical components.

[0003] When the above device is in use, it does not have a structure for pre-sintering nano silver paste. When the existing nano silver paste is in use, it is mostly directly sintered and connected to the circuit board, which is not conducive to forming a sintering neck with surrounding nano silver particles at high temperature to form a sintering body with the properties of bulk metal. Based on the existing technical deficiencies, the utility model designs a nano silver paste assisted sintering device. Summary of the Utility Model

[0004] In order to solve the above problems existing in the prior art, the utility model provides a nano silver paste assisted sintering device, which has the characteristics of pre-sintering nano silver paste.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: A nano silver paste assisted sintering device includes a bearing table, a heating chamber is arranged at the top of the bearing table, a transmission mechanism is arranged inside the heating chamber, and a sintering mechanism is arranged inside the heating chamber;

[0006] Sintering mechanism, the sintering mechanism includes a sintering plate, a magnet, an iron sheet, a polytetrafluoroethylene high-temperature resistant film, a substrate, a nano silver paste main body and a chip. The sintering plate is arranged inside the heating chamber, a magnet is arranged inside the sintering plate, an iron sheet is arranged on the top of the sintering plate, a polytetrafluoroethylene high-temperature resistant film is arranged on the top of the iron sheet, a substrate is arranged inside the sintering plate, a nano silver paste main body is arranged on the top of the substrate, and a chip is arranged on the top of the nano silver paste main body.

[0007] As a preferred technical scheme of the nano silver paste assisted sintering device of the utility model, a workbench is arranged at the top of the bearing table, a connection groove is opened on the top of the workbench, a support rod is fixedly connected to the bottom of the bearing table, and a base is fixedly connected to the bottom of the support rod.

[0008] As a preferred technical solution of the nano-silver paste assisted sintering device of the present utility model, a connecting block one is arranged on one side of the heating chamber, a heat transfer plate is arranged inside the heating chamber, an arc-shaped groove is opened on one side of the heating chamber, a top cover is rotatably connected to the top of the heating chamber, a connecting block two is arranged on one side of the top cover, a rotating shaft is fixedly connected to one side of the top cover, and a telescopic rod is arranged on one side of the rotating shaft.

[0009] As a preferred technical solution of the nano-silver paste assisted sintering device of the present utility model, the transmission mechanism includes a vacuum pumping tube, a nitrogen input tube, a handle, an air extraction groove, an air input groove and air holes. The vacuum pumping tube is arranged on the top of the bearing platform, a nitrogen input tube is arranged on one side of the vacuum pumping tube, a handle is fixedly connected to one side of the vacuum pumping tube, an air extraction groove is opened inside the sintering plate, an air input groove is opened inside the sintering plate, and air holes are opened on one side of the air input groove.

[0010] As a preferred technical solution of the nano-silver paste assisted sintering device of the present utility model, the sintering plate is arranged inside the heat transfer plate, and the iron sheet is arranged on the top of the magnet.

[0011] As a preferred technical solution of the nano-silver paste assisted sintering device of the present utility model, the polytetrafluoroethylene high-temperature resistant film is arranged on the top of the sintering plate, and the chip is arranged on the top of the substrate.

[0012] As a preferred technical solution of the nano-silver paste assisted sintering device of the present utility model, the vacuum pumping tube is fixedly connected to one side of the sintering plate, and the nitrogen input tube is fixedly connected to one side of the sintering plate.

[0013] As a preferred technical solution of the nano-silver paste assisted sintering device of the present utility model, the air extraction groove is opened on one side of the vacuum pumping tube, the air input groove is opened on one side of the nitrogen input tube, and the air holes are opened on one side of the air extraction groove.

[0014] Compared with the prior art, the beneficial effects of the present utility model are:

[0015] 1. When the present utility model is in use, by setting a sintering plate, when pre-sintering the nano silver paste is required, first place the substrate inside the sintering plate through an external device, place the chip on the top of the substrate, place the nano silver paste body between the substrate and the chip, then place the polytetrafluoroethylene high-temperature resistant film on the top of the sintering plate, use the magnetic force of the magnet to make the iron sheet fix the polytetrafluoroethylene high-temperature resistant film on the top of the sintering plate, then place the sintering plate on the heat transfer plate inside the heating chamber through the handle, finally evacuate the inside of the sintering plate through the evacuation tube, the evacuation groove and the air holes provided on one side of the evacuation groove, then input nitrogen gas into the inside of the sintering plate through the nitrogen input tube, the gas input groove and the air holes provided on one side of the gas input groove, and finally heat the inside of the sintering plate through the heating structure and the heat transfer plate, which is convenient to weld the chip on the top of the substrate through the nano silver paste body, and this device is convenient for pre-sintering the nano silver paste. Description of the Drawings

[0016] The drawings are used to provide a further understanding of the present utility model, and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model, and do not constitute a limitation to the present utility model. In the drawings:

[0017] Figure 1 It is a schematic structural diagram of the carrier table of the present utility model;

[0018] Figure 2 It is a schematic structural diagram of the workbench of the present utility model;

[0019] Figure 3 It is a schematic structural diagram of the heating chamber of the present utility model;

[0020] Figure 4 It is a schematic structural diagram of the sintering mechanism of the present utility model;

[0021] Figure 5 It is a schematic structural diagram of the transmission mechanism of the present utility model.

[0022] In the figure: 1. Carrier table; 101. Workbench; 103. Connection groove; 104. Support rod; 105. Base; 2. Heating chamber; 202. First connection block; 203. Heat transfer plate; 204. Arc groove; 205. Top cover; 206. Second connection block; 207. Rotating shaft; 208. Telescopic rod; 3. Transmission mechanism; 301. Evacuation tube; 302. Nitrogen input tube; 303. Handle; 304. Evacuation groove; 305. Gas input groove; 306. Air hole; 4. Sintering mechanism; 401. Sintering plate; 402. Magnet; 403. Iron sheet; 404. Polytetrafluoroethylene high-temperature resistant film; 405. Substrate; 407. Nano silver paste body; 408. Chip. Detailed Embodiments

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0024] Please refer to Figures 1-5 , the present invention provides the following technical solutions: A nano-silver paste assisted sintering device includes a carrier table 1. A heating chamber 2 is arranged on the top of the carrier table 1. A transmission mechanism 3 is arranged inside the heating chamber 2, and a sintering mechanism 4 is arranged inside the heating chamber 2;

[0025] A workbench 101 is arranged on the top of the carrier table 1. A connection groove 103 is opened on the top of the workbench 101. A support rod 104 is fixedly connected to the bottom of the carrier table 1, and a base 105 is fixedly connected to the bottom of the support rod 104.

[0026] A connection block one 202 is arranged on one side of the heating chamber 2. A heat transfer plate 203 is arranged inside the heating chamber 2. An arc-shaped groove 204 is opened on one side of the heating chamber 2. A top cover 205 is rotatably connected to the top of the heating chamber 2. A connection block two 206 is arranged on one side of the top cover 205. A rotating shaft 207 is fixedly connected to one side of the top cover 205, and a telescopic rod 208 is arranged on one side of the rotating shaft 207.

[0027] It needs to be further explained that: A workbench 101 is arranged on the top of the carrier table 1. A heating chamber 2 is arranged on the top of the workbench 101. A heating structure is arranged at the heating chamber 2 on the workbench 101, which is convenient for heating the sintering plate 401 placed inside the heating chamber 2. A transmission mechanism 3 and a sintering mechanism 4 are arranged inside the heating chamber 2. By setting the transmission mechanism 3 and the sintering mechanism 4, it is convenient to pre-sinter the nano-silver paste.

[0028] Please refer to Figures 4-5 , the present invention provides the following technical solutions:

[0029] The sintering mechanism 4 includes a sintering plate 401, a magnet 402, an iron sheet 403, a polytetrafluoroethylene high-temperature resistant film 404, a substrate 405, a nano-silver paste main body 407, and a chip 408. The sintering plate 401 is arranged inside the heating chamber 2. A magnet 402 is arranged inside the sintering plate 401. An iron sheet 403 is arranged on the top of the sintering plate 401. A polytetrafluoroethylene high-temperature resistant film 404 is arranged on the top of the iron sheet 403. A substrate 405 is arranged inside the sintering plate 401. A nano-silver paste main body 407 is arranged on the top of the substrate 405. A chip 408 is arranged on the top of the nano-silver paste main body 407.

[0030] The transmission mechanism 3 includes a vacuum pumping tube 301, a nitrogen delivery tube 302, a handle 303, an air extraction groove 304, an air delivery groove 305, and air holes 306. The vacuum pumping tube 301 is arranged on the top of the bearing table 1. A nitrogen delivery tube 302 is arranged on one side of the vacuum pumping tube 301. A handle 303 is fixedly connected to one side of the vacuum pumping tube 301. An air extraction groove 304 is formed inside the sintering plate 401. An air delivery groove 305 is formed inside the sintering plate 401. An air hole 306 is formed on one side of the air delivery groove 305.

[0031] The sintering plate 401 is arranged inside the heat transfer plate 203. The iron sheet 403 is arranged on the top of the magnet 402.

[0032] The polytetrafluoroethylene high-temperature resistant film 404 is arranged on the top of the sintering plate 401. The chip 408 is arranged on the top of the substrate 405.

[0033] The vacuum pumping tube 301 is fixedly connected to one side of the sintering plate 401. The nitrogen delivery tube 302 is fixedly connected to one side of the sintering plate 401.

[0034] The air extraction groove 304 is formed on one side of the vacuum pumping tube 301. The air delivery groove 305 is formed on one side of the nitrogen delivery tube 302. The air hole 306 is formed on one side of the air extraction groove 304.

[0035] It should be further explained that: the substrate 405 is placed inside the sintering plate 401 through an external device, and the chip 408 is placed on the top of the substrate 405. The nano-silver paste main body 407 is placed between the substrate 405 and the chip 408. Then the polytetrafluoroethylene high-temperature resistant film 404 is placed on the top of the sintering plate 401. The magnetic force of the magnet 402 makes the iron sheet 403 fix the polytetrafluoroethylene high-temperature resistant film 404 on the top of the sintering plate 401. Then the sintering plate 401 is placed at the heat transfer plate 203 inside the heating chamber 2 through the handle 303. Finally, the inside of the sintering plate 401 is evacuated through the vacuum pumping tube 301, the air extraction groove 304, and the air holes 306 arranged on one side of the air extraction groove 304. Then nitrogen is delivered into the inside of the sintering plate 401 through the nitrogen delivery tube 302, the air delivery groove 305, and the air holes 306 arranged on one side of the air delivery groove 305. Finally, the inside of the sintering plate 401 is heated through the heating structure and the heat transfer plate 203, which is convenient for welding the chip 408 on the top of the substrate 405 through the nano-silver paste main body 407.

[0036] Working principle: When a nano-silver paste assisted sintering device is in use, first, a workbench 101 is provided on the top of the carrier table 1, a heating chamber 2 is provided on the top of the workbench 101, and a heating structure is provided at the heating chamber 2 on the workbench 101, which is convenient for heating the sintering plate 401 placed inside the heating chamber 2. A transmission mechanism 3 and a sintering mechanism 4 are provided inside the heating chamber 2. By setting the transmission mechanism 3 and the sintering mechanism 4, it is convenient to pre-sinter the nano-silver paste.

[0037] When pre-sintering the nano-silver paste is required, first place the substrate 405 into the sintering plate 401 through an external device, place the chip 408 on the top of the substrate 405, place the nano-silver paste body 407 between the substrate 405 and the chip 408, then place the polytetrafluoroethylene high-temperature resistant film 404 on the top of the sintering plate 401, and use the magnetic force of the magnet 402 to make the iron sheet 403 fix the polytetrafluoroethylene high-temperature resistant film 404 on the top of the sintering plate 401. Then place the sintering plate 401 on the heat transfer plate 203 inside the heating chamber 2 through the handle 303. Finally, evacuate the inside of the sintering plate 401 through the evacuation tube 301, the evacuation groove 304 and the air holes 306 provided on one side of the evacuation groove 304, and then fill the inside of the sintering plate 401 with nitrogen gas through the nitrogen input pipe 302, the gas input groove 305 and the air holes 306 provided on one side of the gas input groove 305. Finally, heat the inside of the sintering plate 401 through the heating structure and the heat transfer plate 203, which is convenient for soldering the chip 408 to the top of the substrate 405 through the nano-silver paste body 407. This device is convenient for pre-sintering the nano-silver paste.

[0038] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A nano silver paste auxiliary sintering device, comprising a carrier platform (1), characterized in that: A heating chamber (2) is arranged on the top of the carrier platform (1), a transmission mechanism (3) is arranged inside the heating chamber (2), and a sintering mechanism (4) is arranged inside the heating chamber (2); A sintering mechanism (4), the sintering mechanism (4) comprising a sintering plate (401), a magnet (402), an iron sheet (403), a polytetrafluoroethylene high temperature resistant film (404), a substrate (405), a nano silver paste body (407) and a chip (408), the sintering plate (401) being arranged inside a heating chamber (2), the sintering plate (401) being provided with a magnet (402) inside, the top of the sintering plate (401) being provided with an iron sheet (403), the top of the iron sheet (403) being provided with a polytetrafluoroethylene high temperature resistant film (404), the inside of the sintering plate (401) being provided with a substrate (405), the top of the substrate (405) being provided with a nano silver paste body (407), and the top of the nano silver paste body (407) being provided with a chip (408).

2. The nano silver paste auxiliary sintering device according to claim 1, characterized in that: A workbench (101) is arranged on the top of the bearing platform (1), a connecting groove (103) is provided on the top of the workbench (101), a supporting rod (104) is fixedly connected to the bottom of the bearing platform (1), and a base (105) is fixedly connected to the bottom of the supporting rod (104).

3. The nano silver paste auxiliary sintering device according to claim 1, characterized in that: A connecting block 1 (202) is provided on one side of the heating bin (2), a heat transfer plate (203) is provided inside the heating bin (2), an arc-shaped groove (204) is provided on one side of the heating bin (2), a top cover (205) is rotatably connected to the top of the heating bin (2), a connecting block 2 (206) is provided on one side of the top cover (205), a rotating shaft (207) is fixedly connected to one side of the top cover (205), and a telescopic rod (208) is provided on one side of the rotating shaft (207).

4. The nano silver paste auxiliary sintering device according to claim 1, characterized in that: The transmission mechanism (3) comprises a vacuum tube (301), a nitrogen gas delivery tube (302), a handle (303), a vacuum groove (304), a gas delivery groove (305) and an air hole (306); the vacuum tube (301) is arranged on the top of the support platform (1); a nitrogen gas delivery tube (302) is arranged on one side of the vacuum tube (301); a handle (303) is fixedly connected to one side of the vacuum tube (301); a vacuum groove (304) is provided inside the sintering plate (401); a gas delivery groove (305) is provided inside the sintering plate (401); and an air hole (306) is provided on one side of the gas delivery groove (305).

5. The nano silver paste auxiliary sintering device according to claim 1, characterized in that: The sintering plate (401) is arranged inside the heat transfer plate (203), and the iron sheet (403) is arranged on top of the magnet (402).

6. The nano silver paste auxiliary sintering device according to claim 1, characterized in that: The polytetrafluoroethylene high temperature resistant film (404) is arranged on the top of the sintering plate (401), and the chip (408) is arranged on the top of the substrate (405).

7. The nano silver paste auxiliary sintering device according to claim 4, characterized in that: The vacuum pumping pipe (301) is fixedly connected to one side of the sintering plate (401), and the nitrogen supply pipe (302) is fixedly connected to one side of the sintering plate (401).

8. The nano silver paste auxiliary sintering device according to claim 4, characterized in that: The air extraction groove (304) is provided on one side of the vacuum extraction pipe (301), the gas delivery groove (305) is provided on one side of the nitrogen delivery pipe (302), and the air hole (306) is provided on one side of the air extraction groove (304).

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