Manual sheet guiding device
By designing a manual guide for silicon wafer transfer, using the combination of fixed structure and M5 screw holes, the problem of easy damage to the silicon wafer during traditional transfer is solved, stable gliding and efficient transfer of silicon wafers are achieved, and product performance and production efficiency are improved.
Patent Information
- Application Number
- CN202421922097.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-09
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-08-09
AI Technical Summary
During the traditional silicon wafer transfer process, the silicon wafers are prone to friction or collision, resulting in tiny scratches or defects on the surface of the silicon wafer, affecting the performance and yield of the final product.
A manual guide is designed, including a base plate, a baffle and two press plates. The baffle and press plate are fixed through the combination of M5 screw holes and bolts to ensure that the silicon wafer slides stably during the guide plate and reduce collision with the sheet box.
By reducing the collision between the silicon wafer and the box, the manual chip guide effectively avoids scratches and damage to the silicon wafer, improves the performance and yield of the product, simplifies the operation process, and speeds up production speed.
Smart Images
Figure CN222914764U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of silicon wafer production, and particularly relates to a manual wafer guide. Background Art
[0002] A semiconductor wafer refers to a silicon wafer with large-scale integrated circuits and is the most important part of an electronic device, undertaking the functions of processing and storing. The first process in semiconductor wafer manufacturing is to obtain a thin silicon wafer. Generally, for batch processing of silicon wafers, the process conversion is to transport the cut silicon wafers in batches to the next process for processing. The transportation is carried out by inserting the silicon wafers into a cassette. During the conversion between different processes, it is necessary to transfer the silicon wafers from one cassette to another. However, in the traditional silicon wafer transfer process, there are often mutual frictions or collisions between the silicon wafers, which may cause micro-scratches or defects on the surface of the silicon wafers, thereby affecting the performance and yield of the final product. For this reason, a manual wafer guide is proposed. Summary of the Utility Model
[0003] The purpose of the utility model is to provide a manual wafer guide, aiming to solve the problems raised in the above background art.
[0004] An embodiment of the utility model is implemented as follows. A manual wafer guide includes a bottom plate, a baffle, and two pressing plates.
[0005] The bottom plate serves as the main structure for supporting the cassette and allowing it to slide back and forth on the surface. There are M5 screw holes on both sides of the top of the bottom plate for installing the pressing plates; there are two M5 through holes in the middle of the bottom plate, and the through holes are provided with R10 concave holes for installing the baffle.
[0006] The baffle is installed on the bottom plate. The bottom edge of the baffle is cut out to form an opening, and the opening is used to ensure that the cassette passes through the baffle and blocks the silicon wafers; there are two M5 mounting holes at the bottom of the baffle. The M5 bolts pass through the M5 mounting holes and the M5 through holes to fix the baffle on the bottom plate, and the M5 bolts are recessed into the R10 concave holes.
[0007] The two pressing plates are respectively arranged on both sides of the baffle for fixing the baffle. There is an M5 bolt hole in the middle of each pressing plate. The M5 bolts pass through the M5 bolt holes and the M5 screw holes to fix the pressing plates on the bottom plate.
[0008] Furthermore, the size of the bottom plate is 550 mm in length, 200 mm in width, and 20 mm in thickness.
[0009] Furthermore, the size of the baffle is 202 mm in length, 134.5 mm in width, and 20 mm in thickness. The bottom edge cut out at the lower end is 152 mm in length and 11.5 mm in width.
[0010] Furthermore, the size of the pressing plate is 65 mm in length, 50 mm in width, and 20 mm in thickness.
[0011] Furthermore, the base plate, the baffle plate, and the pressing plate are all made of PVC sheets.
[0012] Furthermore, the M5 mounting holes correspond to the M5 through holes; the M5 bolt holes correspond to the M5 screw holes.
[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0014] This manual wafer handler is made of PVC material and has a smooth surface, which can effectively avoid damaging the silicon wafer during operation. Its operation process is simple and safe, and it can realize the rapid inversion of the silicon wafer, thus accelerating the production speed. In addition, the design of this manual wafer handler is simple, the material is inexpensive and durable, and the use stability is strong, which is suitable for use in silicon wafer production. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is a perspective view of the three-dimensional structure of the manual wafer handler.
[0016] Figure 2 is a perspective view of the three-dimensional structure of the bottom view of the manual wafer handler.
[0017] Figure 3 is a perspective view of the three-dimensional structure of the top view of the manual wafer handler.
[0018] Figure 4 is a side perspective view of the manual wafer handler.
[0019] In the figure: base plate 11, M5 screw hole 12, M5 through hole 13, R10 concave hole 14, baffle plate 21, M5 mounting hole 22, pressing plate 31, M5 bolt hole 32. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] In order to make the objectives, technical solutions, and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.
[0021] The following describes in detail the specific implementation of the present utility model with reference to specific embodiments.
[0022] As Figures 1-4 shown, a manual wafer handler provided by an embodiment of the present utility model includes a base plate 11, a baffle plate 21, and two pressing plates 31;
[0023] The bottom plate 11 has dimensions of 550 mm in length, 200 mm in width, and 20 mm in thickness. As the main structure, the bottom plate 11 is used to support the cassette and allow it to slide back and forth on the surface. There are M5 screw holes 12 on both sides of its top for passing through M5 bolts to fix the upper pressure plate 31. There are two M5 through holes 13 in the middle, and R10 concave holes 14 are provided on the through holes to facilitate the passing of bolts and hide them, keeping the bottom surface flat and not affecting the operation of the overall device.
[0024] The baffle 21 is installed on the bottom plate 11. The baffle 21 has dimensions of 202 mm in length, 134.5 mm in width, and 20 mm in thickness. The bottom end is cut out with a bottom edge of 152 mm in length and 11.5 mm in width to form an opening, which is used to ensure that the cassette can pass through the baffle 21 safely while blocking the silicon wafers, so as to ensure the safe movement of the silicon wafers from one cassette to another. There are two M5 mounting holes 22 at the bottom of the baffle 21. The M5 mounting holes 22 correspond to the M5 through holes 13. M5 bolts pass through the M5 mounting holes 22 and the M5 through holes 13 to fix the baffle 21 on the bottom plate 11, and the M5 bolts sink into the R10 concave holes 14 without affecting the flatness of the bottom surface of the wafer guide.
[0025] Two pressure plates 31 are respectively arranged on both sides of the baffle 21. The pressure plates 31 have dimensions of 65 mm in length, 50 mm in width, and 20 mm in thickness. There are M5 bolt holes 32 in the middle of each pressure plate 31. The M5 bolt holes 32 correspond to the M5 screw holes 12. M5 bolts pass through the M5 bolt holes 32 and the M5 screw holes 12 to fix the pressure plates 31 on the bottom plate 11. The main function of the pressure plate 31 is to fix the baffle 21 to prevent the baffle 21 from shifting left and right during use, thereby protecting the silicon wafers from being scratched or damaged in other ways.
[0026] In the embodiment of the present utility model, during wafer guiding, the back surface of the silicon wafer contacts the cassette, and the front surface is completely separated from the cassette, ensuring that the silicon wafer will not be scratched during the conduction process. During the wafer guiding process, the silicon wafer slides stably, reducing the collision with the cassette and lowering the bumping of the silicon wafer. The design of this manual wafer guide is simple, the material is inexpensive and durable, and the use stability is strong, which is suitable for use in silicon wafer production.
[0027] As Figure 1 shown, as a preferred embodiment of the present utility model, the bottom plate 11, the baffle 21, and the pressure plate 31 are all made of PVC plates.
[0028] In the embodiment of the present utility model, this manual wafer guide is made of PVC material and has a smooth surface, which can effectively avoid damaging the silicon wafers during the operation process.
[0029] The above are only the preferred embodiments of the present utility model. It should be noted that for those skilled in the art, without departing from the concept of the present utility model, several modifications and improvements can be made, which should also be regarded as the protection scope of the present utility model, and these will not affect the implementation effect of the present utility model and the practicability of the patent.
Claims
1. A manual film guide, characterized in that: It includes a bottom plate, a baffle and two pressure plates; The bottom plate is used as the main structure to support the film box and allow it to slide back and forth on the surface. M5 screw holes are provided on both sides of the top of the bottom plate for installing the pressure plate; two M5 through holes are provided in the middle of the bottom plate, and the through holes are provided with R10 concave holes for installing the baffle; The baffle is mounted on the bottom plate, and the bottom edge of the baffle is cut out to form an opening, which is used to ensure that the wafer box passes through the baffle and blocks the silicon wafer; two M5 mounting holes are provided at the bottom of the baffle, and the M5 bolts pass through the M5 mounting holes and the M5 through holes to fix the baffle on the bottom plate, and the M5 bolts are sunk into the R10 recessed holes; The two pressing plates are respectively arranged on both sides of the baffle plate for fixing the baffle plate. An M5 bolt hole is arranged in the middle of each pressing plate. The M5 bolt passes through the M5 bolt hole and the M5 screw hole to fix the pressing plate on the bottom plate.
2. The manual film guide according to claim 1, characterized in that: The dimensions of the base plate are 550 mm in length, 200 mm in width and 20 mm in thickness.
3. The manual film guide according to claim 1, characterized in that: The size of the baffle is 202 mm in length, 134.5 mm in width, and 20 mm in thickness, and a bottom edge of 152 mm in length and 11.5 mm in width is cut out at the lower end.
4. The manual film guide according to claim 1, characterized in that: The dimensions of the pressing plate are 65 mm in length, 50 mm in width and 20 mm in thickness.
5. The manual film guide according to claim 1, characterized in that: The bottom plate, baffle plate and pressure plate are all made of PVC sheets.
6. The manual film guide according to claim 1, characterized in that: The M5 mounting hole corresponds to the M5 through hole; the M5 bolt hole corresponds to the M5 screw hole.