Control panel assembly and electric tool
By setting power control components in two columns in the power tool control board assembly, and combining the clamped radiator and extended heat dissipation cover, the problem of poor heat dissipation in the prior art is solved, significantly improving the heat dissipation effect and ensuring the reliable operation of the components.
Patent Information
- Application Number
- CN202421761402.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-03-29
- Filing Date
- 2024-07-24
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-24
AI Technical Summary
The heat dissipation effect of existing power tool control board components is poor, which causes severe heat to power control components such as IGBTs, which may cause failure to work properly or even damage.
A control board assembly is designed in which the power control components are arranged in two columns, the main body of the radiator is sandwiched between the two columns of components, and a heat dissipation cover arranged on the top of the main body extends at least partially to the top of the component to cover the two columns of components.
By increasing the exposed heat dissipation area of components and effectively using the heat dissipation cover to expand the heat dissipation area, the heat dissipation effect of the main heating components of the control panel assembly is significantly improved, ensuring the reliable operation of the components.
Smart Images
Figure CN222914785U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of power tools, and particularly relates to a control board assembly and a power tool. Background Art
[0002] Power tools such as slotting machines and angle grinders have relatively high power, and the components on the control board generate serious heat. In particular, the power control components used to control power, such as IGBT (Insulated Gate Bipolar Transistor), which is called insulated gate bipolar transistor in Chinese, generate particularly serious heat. If the heat dissipation is poor, it will lead to abnormal operation or even damage.
[0003] Existing power control components are usually flat-mounted on the substrate, with only one side surface exposed, resulting in poor heat dissipation.
[0004] Therefore, it is necessary to improve the existing technology to overcome the defects in the existing technology. Summary of the Utility Model
[0005] Therefore, what the utility model mainly solves is the technical problem of poor heat dissipation of the control board assembly in the existing technology.
[0006] To solve the above technical problem, the utility model provides a control board assembly, including:
[0007] A substrate;
[0008] A power control component, arranged on the first board surface of the substrate, located in the first area of the first board surface. The extension surface of the power control component is vertically arranged relative to the first board surface, and includes a first column of components and a second column of components arranged at intervals. The extension surfaces of the first column of components are substantially coplanar, and the extension surfaces of the second column of components are substantially coplanar;
[0009] A radiator, including a main body and a heat dissipation cover arranged on the top of the main body. The main body is clamped between the first column of components and the second column of components. The two side surfaces of the main body are respectively in contact with the two inner surfaces opposite to the first column of components and the second column of components. At least part of the heat dissipation cover extends to the top of the first column of components and the second column of components to cover the first column of components and the second column of components.
[0010] In one embodiment, the substrate includes a second area adjacent to the first area. The heat dissipation cover extends towards the second area side and exceeds the power control component to extend above the second area and is arranged at a relative interval with the second area.
[0011] In one embodiment, the height of the components in the second area is lower than the height of the power control component.
[0012] In one embodiment, the heat dissipation cover includes a plurality of spaced first heat dissipation plates, a heat dissipation gap is formed between adjacent first heat dissipation plates, and the extension surface of the first heat dissipation plate is parallel to the extension surface of the power control component.
[0013] In one embodiment, the heat dissipation cover further includes at least two second heat dissipation plates, the second heat dissipation plates are arranged perpendicular to the first heat dissipation plates, the second heat dissipation plates extend above the first column of components, and a plurality of the first heat dissipation plates extend above and outside the second column of components.
[0014] In one embodiment, the bottom surface of the main body is arranged at a gap with the first plate surface of the substrate, and the heat dissipation cover is located above the power control component and is arranged at a gap with the power control component.
[0015] In one embodiment, it further includes a capacitor arranged on the substrate, the capacitor is a thin film capacitor, and the thin film capacitors are arranged adjacent to the end sides of the first column of components and the second column of components.
[0016] In one embodiment, it further includes an installation box with one side open, the substrate is arranged in the installation box, the first plate surface faces the open side, the side wall of the installation box surrounds the substrate, and the radiator is higher than the side wall of the installation box.
[0017] In one embodiment, a heat conductive adhesive is filled between the substrate and the installation box.
[0018] In addition, the present utility model further provides an electric tool, including the control board assembly described in any one of the above embodiments.
[0019] The technical solution provided by the present utility model has the following advantages:
[0020] For the control board assembly and the electric tool provided by the present utility model, the power control components are arranged in two columns, namely the first column of components and the second column of components, and the extension surfaces of the power control components are all perpendicular to the first plate surface of the substrate. The exposed heat dissipation area on multiple side surfaces of the power control components is larger; the main body of the radiator is clamped between the first and second columns of components, and the two side surfaces of the main body are respectively abutted against the two inner side surfaces opposite to the first and second columns of components, so that the heat of the first and second columns of components can be conducted to the main body; the radiator further includes a heat dissipation cover arranged on the top of the main body, and the heat dissipation cover at least partially extends to the top of the first and second columns of components to cover the two columns of components, so that more heat can be dissipated through the heat dissipation cover. Therefore, the heat dissipation effect of the main heat generating components of the control board assembly can be improved, and the reliable operation of the control board assembly can be ensured. Description of the Drawings
[0021] To more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0022] Figure 1 Schematic perspective view of the control board assembly provided by the embodiment of the present utility model;
[0023] Figure 2 For Figure 1 Partial exploded view of the control board assembly shown;
[0024] Figure 3 Partial perspective view of the control board assembly provided by the embodiment of the present utility model;
[0025] Figure 4 Schematic perspective view of the power tool provided by an embodiment of the present utility model;
[0026] Figure 5 Schematic perspective view of the main body of the power tool provided by an embodiment of the present utility model. Detailed implementation manners
[0027] The following will clearly and completely describe the technical solutions of the present utility model in conjunction with the drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. The present utility model will be described in detail below with reference to the drawings and in conjunction with the embodiments. It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other.
[0028] It should be noted that the terms "first", "second", etc. in the description and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence.
[0029] In the present utility model, unless otherwise stated, the orientation terms such as "upper", "lower", "top", "bottom" are usually in the direction shown in the drawings, or in the vertical, perpendicular or gravitational direction of the component itself; similarly, for the convenience of understanding and description, "inner" and "outer" refer to the inner and outer of the contour of each component itself, but the above orientation terms do not limit the present utility model.
[0030] Embodiment 1
[0031] This embodiment provides a control board assembly, which is applied to a power tool. Figure 1Schematic perspective view of the control board assembly provided by the embodiment of the present utility model, Figure 2 is Figure 1 partial exploded structural view of the control board assembly shown. Please refer to Figure 1 and Figure 2 , the control board assembly includes a substrate 10, power control components 20 and a radiator 50.
[0032] The substrate 10 is in a plate shape and has a first plate surface and a second plate surface facing away from each other. The power control components 20 are arranged on the first plate surface and located in the first area 11 of the first plate surface. Specifically, the number of the power control components 20 is multiple, and each power control component 20 includes a body and pins. The body is in a plate shape, the pins are arranged on the lower side of the body, close to the substrate 10, and the body is electrically connected to the substrate 10 through the pins.
[0033] Define the extension surface of the body of the power control component as the extension surface corresponding to the power control component 20. In this embodiment, the extension surface of the power control component 20 is vertically arranged relative to the first plate surface. The power control component 20 includes a first column of components 21 and a second column of components 23 arranged at intervals relative to each other. The extension surfaces of the first column of components 21 are substantially coplanar, and the extension surfaces of the second column of components 23 are substantially coplanar. That is to say, the bodies of the first column of components 21 are arranged coplanarly, and the bodies of the second column of components 23 are also arranged coplanarly. An installation space is formed between the first column of components 21 and the second column of components 23.
[0034] Specifically, the power control component 20 is an IGBT (Insulate-Gate Bipolar Transistor), and its Chinese name is insulated gate bipolar transistor. The IGBT is a MOS structure bipolar device and belongs to a power device with the high-speed performance of a power MOSFET and the low-resistance performance of a bipolar device. However, this component has a large power and is one of the main heat-generating components of the control board assembly.
[0035] Part of the radiator 50 is arranged in the above installation space. Specifically, the radiator 50 includes a main body 51 and a heat dissipation cover 52 arranged on the top of the main body 51. The main body 51 is clamped between the first column of components 21 and the second column of components 23 and is located in the above installation space. The two side surfaces of the main body 51 are respectively in contact with the two inner surfaces opposite to the first column of components 21 and the second column of components 23, so as to facilitate the heat conduction between the main body 51 and the first column of components 21 and the second column of components 23. Specifically, the main body 51 includes a first side surface and a second side surface facing away from each other. The first side surface is in contact with the first column of components 21, and the second side surface is in contact with the second column of components 23, and heat exchange can be carried out with the first and second columns of components respectively. It should be noted that the above "contact" includes fitting contact and can also be set with a micro gap, such as a gap of 1-2 mm.
[0036] The heat dissipation cover 52 at least partially extends to the tops of the first column of components 21 and the second column of components 23 to cover the first column of components 21 and the second column of components 23. Specifically, the heat dissipation cover 52 extends toward the side of the first column of components 21 and the side of the second column of components 23 respectively. Looking at the first board surface from a direction perpendicular to the first board surface, the heat dissipation cover 52 covers at least part of the first column of components 21 and at least part of the second column of components 23. In other words, the projection of the heat dissipation cover 52 on the first board surface covers at least part of the first column of components 21 and at least part of the second column of components 23. In this way, the heat dissipation cover 52 can achieve heat exchange on the top sides of the first column of components 21 and the second column of components 23, expand the heat dissipation amount, and improve the heat dissipation effect.
[0037] For the control board assembly provided in this embodiment, the power control components are arranged in two columns, namely the first column of components and the second column of components, and the extended surfaces of the power control components are all perpendicular to the first board surface of the substrate. The exposed heat dissipation area of the multi-side surfaces of the power control components is larger; the main body of the radiator is clamped between the first and second columns of components, and the two side surfaces of the main body are respectively in contact with the two inner surfaces opposite to the first and second columns of components, and the heat of the first and second columns of components can be conducted to the main body; the radiator further includes a heat dissipation cover arranged on the top of the main body, and the heat dissipation cover at least partially extends to the tops of the first and second columns of components to cover the two columns of components, and more heat can be dissipated through the heat dissipation cover. Thus, the heat dissipation effect of the main heat-generating components of the control board assembly can be improved, and the reliable operation of the control board assembly can be ensured.
[0038] In order to improve the heat dissipation effect of the control board assembly, in one embodiment, please refer to Figure 2 As shown, the substrate 10 includes a second area 12 adjacent to the first area 11, and partial components are arranged in the second area 12. The heat dissipation cover 52 extends toward the second area 12 side and extends beyond the power control component 20 to be spaced apart from the second area 12 above. Extending the heat dissipation cover 12 to the top of the second area 12 can not only increase the area of the heat dissipation cover 52 so as to improve the heat dissipation effect on the components in the first area 11; but also improve the heat dissipation effect on the components arranged in the second area 12, thereby improving the overall heat dissipation effect of the entire control board assembly.
[0039] Specifically, the height of the components in the second region 12 is lower than that of the power control components 20. In this embodiment, the second region 12 is located outside the components 23 in the second column. The second region 12 is arranged side by side with the first region 11. The height of the components arranged in the second region 12 is lower than that of the components 23 in the second column. The heat dissipation cover 52 extends from the top of the components 23 in the second column to the top of the second region 12. The interval between the heat dissipation cover 52 and the components in the second region 12 is greater than the interval between it and the components 23 in the second column. By arranging components with a lower height in the second region, a heat dissipation space can be formed outside the power control components, reducing the influence of the height of the components in the second region on the heat dissipation effect of the power control components. Moreover, arranging components with a lower height in the second region can reduce the heat dissipation burden of the components in the second region on the radiator, ensuring the heat dissipation effect of the heat dissipation cover on the power control components.
[0040] To improve the heat dissipation efficiency of the radiator, in one embodiment, please refer to Figure 2 , the heat dissipation cover 52 includes a plurality of spaced first heat dissipation plates 521. A heat dissipation gap is formed between adjacent first heat dissipation plates 521. The extension plane of the first heat dissipation plate 521 is parallel to the extension plane of the power control component 20. By making the extension plane of the first heat dissipation plate parallel to the extension plane of the power control component and arranging a plurality of first heat dissipation plates side by side, the surface area of the heat dissipation cover is increased, and thus the heat dissipation area is increased, thereby improving the heat dissipation effect.
[0041] Specifically, the first heat dissipation plate 521 extends above and outside the components 23 in the second column. The heat dissipation cover 52 further includes at least two second heat dissipation plates 523. The second heat dissipation plates 523 are perpendicularly arranged with respect to the first heat dissipation plates 521, and the second heat dissipation plates 523 extend above the components 21 in the first column.
[0042] In a specific embodiment, a gap is provided between the bottom surface of the main body 51 and the first plate surface of the substrate 10. The heat dissipation cover 52 is located above the power control component 20 and is spaced from the power control component 20. Specifically, screw holes are provided on the body of the power control component 20, and the main body 51 is fixed to the power control component 20 by screws passing through the screw holes, thereby realizing the fixation of the main body 51 and the power control component 20. A gap is provided between the main body 51 and the first plate surface of the substrate 10, facilitating the flow of air. Thermal conductive glue can also be filled in the gap to achieve waterproofing and accelerate heat conduction. A gap is provided between the heat dissipation cover and the top of the power control component, which can ensure the heat dissipation surface area of the heat dissipation cover and improve the heat dissipation effect.
[0043] In a specific embodiment, the circuit board assembly further includes a capacitor 25 disposed on the substrate 10. Preferably, the capacitor 25 is a thin-film capacitor, which has the advantages of small volume, convenient installation, strong voltage resistance, and insensitivity to temperature. The thin-film capacitor is disposed adjacent to the end sides of the first column of components 21 and the second column of components 23 and is close to the radiator 50, so that the radiator can be used to dissipate heat from the thin-film capacitor, and the heat dissipation effect is better.
[0044] For the convenience of waterproofing and installation of the control board assembly, in a specific embodiment, please refer to Figure 2 and Figure 3 As shown, the control board assembly further includes an installation box 40 for accommodating the substrate 10. One side of the installation box 40 is open. The substrate 10 is disposed in the installation box 40, with the first board surface facing the open side. The side walls of the installation box 40 surround the substrate 10, and the radiator 50 is higher than the side walls of the installation box. The substrate 10 is fixed in the housing of the power tool 100 through the installation box 40, making the fixation of the substrate 10 more convenient. Moreover, the installation box 40 has side walls on the bottom side and circumferentially, which can form an isolation barrier on multiple sides of the substrate 10, thereby reducing the risk of the components on the substrate being wetted by water. Moreover, the radiator is higher than the side walls of the installation box, which can reduce the influence of the installation box on the heat dissipation efficiency of the radiator and ensure the heat dissipation effect of the radiator.
[0045] Specifically, support ribs are provided circumferentially on the bottom wall of the installation box 40, and the substrate 10 is supported and positioned on the support ribs. In this way, a gap is formed between the second board surface of the substrate 10 and the bottom wall of the installation box 40, which can improve the heat dissipation effect of the substrate.
[0046] To ensure the heat dissipation effect and waterproofing, further, a thermal conductive adhesive is filled between the substrate 10 and the installation box 40. The thermal conductive adhesive can be disposed between the first board surface of the substrate 10 and the side wall of the installation box 40, or can be further disposed between the second board surface of the substrate 10 and the side wall and bottom wall of the installation box 40. The thermal conductive adhesive can achieve waterproof sealing of the solder joints of the components on the substrate, fix the substrate to the installation box, and can also improve the thermal conductivity efficiency and ensure the heat dissipation effect.
[0047] Embodiment 2
[0048] The present utility model further provides a power tool, please refer to Figure 4 As shown. The power tool 100 includes a grip assembly, a main body portion 110, an output end 180, a motor, and a control board assembly. Among them, the motor is disposed in the main body portion 110, and part of the control board assembly is disposed in the grip assembly. The control board assembly can be referred to the detailed description in Embodiment 1, and the same components are denoted by the same reference numerals and will not be described herein again.
[0049] Specifically, the holding assembly includes a base 150, a first hand-held portion 120, a second hand-held portion 130, and a column 160. The base 150 is disposed at an end of the main body 10 away from the power output of the motor 20. The base 150, the first hand-held portion 120, the second hand-held portion 130, the column 160, and the base 150 are sequentially connected to form a closed ring, and the surrounding space of the ring forms a holding space. The operator's hand can reach into the holding space to grip the first hand-held portion 120 and / or the second hand-held portion 130, thereby operating the power tool 100.
[0050] Part of the control board assembly is disposed on the base 150 and part is disposed in the main body 110. The control board assembly is slidably inserted into the main body 110. Please refer to Figure 3 , 4 and Figure 5 , a guiding rib 431 is provided on the outer side surface of the mounting box 40, and a guiding groove 432 is provided on the bottom surface of the mounting box 40. Among them, the guiding ribs 431 are respectively provided on the outer surfaces of the opposite side walls of the mounting box 40. Preferably, one guiding rib 431 is provided on the outer surface of each of the two side walls, and the two guiding ribs 431 are parallel to each other. Two convex ribs 433 are provided on the outer surface of the bottom wall of the mounting box 40, and the two convex ribs 433 are parallel to each other and spaced apart, and the above-mentioned guiding groove 432 is formed therebetween.
[0051] Correspondingly, please pay attention to Figure 5 , the groove on the corresponding position of the main body 110 that slidably cooperates with the guiding rib 431. Specifically, the main body 11 includes two ribs 111 protruding from the inner wall of the main body 11, and the two ribs 111 are parallel to each other and spaced apart, and the above-mentioned groove that slidably cooperates with the guiding rib 431 is formed therebetween. The main body 110 further includes a guide rail 112, and the guide rail 112 is adapted to be inserted into the guiding groove 432 and slidably cooperate with the guiding groove 432.
[0052] When the control board assembly needs to be installed, align the groove between the guiding rib 431 of the mounting box 40 and the rib 111, align the guiding groove 432 and the guide rail 112, apply a force along the axial direction to push the control board assembly, and push it into the main body 10 until the control board assembly is inserted into the main body 110 in place, and then fixedly connect the mounting box 40 and the main body 110 through fasteners.
[0053] In order to position the depth of insertion of the control board assembly into the main body 110, in a specific embodiment, a positioning structure is provided between the mounting box and the main body. Please refer to Figure 4As shown, the positioning structure includes positioning ribs 44 provided on the side wall of the mounting box 40 facing the main body portion 110. The positioning ribs 44 protrude from the side wall of the mounting box 40 and are used to abut against the internal structure of the main body portion 110 to limit the insertion stroke of the mounting box 40. Specifically, the number of the positioning ribs 44 is two, which are spaced apart on the side wall of the mounting box 40 facing the main body portion 110. After the positioning ribs 44 abut against the main body portion 110, a gap is formed between the mounting box 43 and the abutting structure of the main body portion 110, facilitating the flow of air around the mounting box 40 and ensuring the heat dissipation of the control board assembly.
[0054] The holding assembly further includes an auxiliary handle 140 provided on one side of the main body portion 110 for assisting in holding. Specifically, the extending direction of the auxiliary handle 140 is substantially perpendicular to the center line of the main body portion 110, and the auxiliary handle 140 is close to the output end 180, so as to facilitate the operation of the output end 180.
[0055] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, those of ordinary skill in the art can make other different forms of changes or modifications without creative efforts, and all of them should fall within the protection scope of the present invention.
Claims
1. A control panel assembly, characterized in that: include: substrate; A power control component is arranged on the first board surface of the substrate and is located in the first area of the first board surface. The extended surface of the power control component is arranged vertically relative to the first board surface, and includes a first column of components and a second column of components arranged relatively spaced apart. The extended surfaces of the first column of components are substantially coplanar, and the extended surfaces of the second column of components are substantially coplanar. The heat sink comprises a main body and a heat dissipation cover arranged on the top of the main body, the main body is sandwiched between the first column components and the second column components, the two side surfaces of the main body are respectively abutted against the two inner side surfaces opposite to the first column components and the second column components, and the heat dissipation cover at least partially extends to the top of the first column components and the second column components to cover the first column components and the second column components.
2. The control panel assembly according to claim 1, characterized in that: The substrate includes a second area adjacent to the first area, the heat dissipation cover extends toward the second area and extends beyond the power control component to the top of the second area and is disposed opposite to the second area and spaced apart from the second area.
3. The control panel assembly according to claim 2, characterized in that: The height of the components in the second area is lower than the height of the power control components.
4. The control panel assembly according to claim 1, characterized in that: The heat dissipation cover comprises a plurality of spaced first heat dissipation plates, heat dissipation gaps are formed between adjacent first heat dissipation plates, and the extension surfaces of the first heat dissipation plates are parallel to the extension surfaces of the power control components.
5. The control panel assembly according to claim 4, characterized in that: The heat dissipation cover also includes at least two second heat dissipation plates, which are arranged perpendicular to the first heat dissipation plates and extend above the first column of components. A plurality of the first heat dissipation plates extend above and outside the second column of components.
6. The control panel assembly according to claim 1, characterized in that: A gap is set between the bottom surface of the main body and the first plate surface of the substrate, and the heat dissipation cover is located above the power control component and is spaced apart from the power control component.
7. The control board assembly according to claim 1, characterized in that: It also includes a capacitor arranged on the substrate, wherein the capacitor is a thin film capacitor, and the thin film capacitor is adjacently arranged at the end sides of the first column of components and the second column of components.
8. The control panel assembly according to claim 1, characterized in that: It also includes an installation box with one side open, the substrate is arranged on the installation box, the first board surface faces the open side, the side wall of the installation box surrounds the substrate, and the heat sink is higher than the side wall of the installation box.
9. The control panel assembly according to claim 8, characterized in that: Thermal conductive glue is filled between the substrate and the installation box.
10. An electric tool, characterized in that: A control panel assembly comprising any one of claims 1 to 9.