Analog-to-digital conversion circuit, chip and electronic equipment
By multiplexing the analog-to-digital conversion module and the communication module in the analog-to-digital conversion chip, the problem of clock source occupancy area and power consumption in traditional chips is solved, and a more efficient and reliable analog-to-digital conversion circuit is achieved.
Patent Information
- Application Number
- CN202421629198.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-10
AI Technical Summary
In traditional analog-to-digital conversion chips, the analog-to-digital conversion module and the communication module provide operating clocks by different clock sources, which causes the clock source to occupy the chip area and power consumption and affect the reliability and efficiency of the chip.
By multiplexing the analog-to-digital conversion module and the communication module, the setting of an additional clock source for the analog-to-digital conversion module is avoided, the area and power consumption of the chip are reduced, and the analog-to-digital conversion module and the communication module are in the same clock domain, reducing the need for clock domain synchronization.
While reducing chip area and power consumption, the working efficiency and reliability of the analog-to-digital conversion circuit are improved, and the additional overhead caused by clock domain synchronization is avoided.
Smart Images
Figure CN222916028U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit technologies, and particularly to an analog-to-digital conversion circuit, a chip, and an electronic device. Background Art
[0002] In circuit design, an analog-to-digital conversion (ADC) chip or a chip provided with an analog-to-digital conversion function module requires at least two parts: an analog-to-digital conversion module and a communication module. The analog-to-digital conversion module is used to convert an analog signal quantity into a digital signal quantity, and the communication module is used to output the converted digital signal quantity and provide it to a host or an MCU for data storage and processing.
[0003] However, for traditional analog-to-digital conversion chips or chips with analog-to-digital conversion functions, the analog-to-digital conversion module and the communication module are respectively provided with working clocks by different clock sources, and the clock source of the analog-to-digital conversion module must be set inside the chip. The chip performance is largely limited by the clock source of the analog-to-digital conversion module. And the clock source of the analog-to-digital conversion module will occupy the area of the chip and generate relatively large power consumption. Also, the reliability of the internal clock source of the chip is an important part of evaluating the reliability of the chip. If there is a problem with the internal clock of the chip, it will also cause the analog-to-digital conversion function of the entire chip to fail. Summary of the Utility Model
[0004] In view of the above problems, embodiments of this application provide an analog-to-digital conversion circuit, a chip, and an electronic device to solve the above technical problems.
[0005] In a first aspect, an embodiment of this application provides an analog-to-digital conversion circuit applied to a chip, including: an analog-to-digital conversion module and a communication module;
[0006] The analog-to-digital conversion module is respectively connected to a clock source and the communication module, so that the clock source respectively provides working clocks for the analog-to-digital conversion module and the communication module.
[0007] In a second aspect, an embodiment of this application further provides a chip including the analog-to-digital conversion circuit in the first aspect above.
[0008] In a third aspect, an embodiment of this application further provides an electronic device including the chip in the second aspect above.
[0009] The analog-to-digital conversion circuit, chip, and electronic device provided by the embodiments of the present application are applied to a chip and include: an analog-to-digital conversion module and a communication module; the analog-to-digital conversion module is respectively connected to a clock source and the communication module, so that the clock source provides working clocks for the analog-to-digital conversion module and the communication module respectively. In the analog-to-digital conversion circuit provided by the present application, the analog-to-digital conversion module and the communication module share the clock source. Therefore, there is no need to set an additional clock source for the analog-to-digital conversion module, avoiding the increase in area and power consumption caused by setting the clock source of the analog-to-digital conversion module. Moreover, the sharing of the clock by the analog-to-digital conversion module and the communication module also makes the analog-to-digital conversion module and the communication module in the same clock domain. When signals are transmitted, there is no need to synchronize the clock domains of the analog-to-digital conversion module and the communication module, further avoiding the increase in chip area and power consumption caused by clock domain synchronization, and also improving the working efficiency of the analog-to-digital conversion circuit.
[0010] These aspects or other aspects of the present application will be more clearly understood in the following description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0012] Figure 1 Shows a schematic diagram of a traditional analog-to-digital conversion chip.
[0013] Figure 2 Shows an application scenario diagram of the analog-to-digital conversion circuit provided by the embodiments of the present application.
[0014] Figure 3 Shows a schematic diagram of the mode conversion circuit provided by the embodiments of the present application.
[0015] Figure 4 Shows another schematic diagram of the mode conversion circuit provided by the embodiments of the present application.
[0016] Figure 5 Shows yet another schematic diagram of the mode conversion circuit provided by the embodiments of the present application.
[0017] Figure 6 Shows a schematic diagram of the chip provided by the embodiments of the present application.
[0018] Figure 7 Shows a schematic diagram of the electronic device provided by the embodiments of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary only for explaining the present application and should not be construed as limiting the present application.
[0020] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of protection of the present application.
[0021] In the embodiments of the present application, it should be noted that in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.
[0022] Moreover, the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.
[0023] In the description of the embodiments of the present application, words such as "example" or "for example" are used to indicate examples, explanations or descriptions. Any embodiment or design described as "for example" or "for instance" in the embodiments of the present application is not construed as being more preferred or having more advantages than another embodiment or design. The use of words such as "example" or "for example" is intended to present relative concepts in a clear manner.
[0024] In addition, "a plurality of" in the embodiments of the present application means two or more. In view of this, "a plurality of" in the embodiments of the present application can also be understood as "at least two". "At least one" can be understood as one or more, for example, understood as one, two or more. For example, including at least one means including one, two or more, and does not limit which ones are included. For example, including at least one of A, B and C, then what can be included are A, B, C, A and B, A and C, B and C, or A and B and C.
[0025] It should be noted that in the embodiments of the present application, "and / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / ", without special instructions, generally represents an "or" relationship between the front and back associated objects.
[0026] It should be pointed out that in the embodiments of the present application, "connection" can be understood as electrical connection, and the connection of two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be either a direct connection between A and B or an indirect connection between A and B through one or more other electrical components.
[0027] For a traditional chip with an analog-to-digital conversion module, an independent clock source needs to be set in the chip to provide a clock signal for the analog-to-digital conversion module. Taking the analog-to-digital conversion chip as an example, Figure 1 shows a schematic diagram of a traditional analog-to-digital conversion chip, as Figure 1 shown, the traditional analog-to-digital conversion chip 100 includes at least two parts: an analog-to-digital conversion module 110 and a communication module 120. The analog-to-digital conversion module 110 is used to convert an analog signal quantity into a digital signal quantity, and the communication module 120 is used to output the digital signal quantity and provide it to the host or MCU for data storage and processing. And the communication module 120 is also used to configure the performance of the analog-to-digital conversion module, such as resolution, sampling rate, accuracy, etc., according to the input signal of external devices such as the host or MCU.
[0028] As Figure 1 shown, for the traditional analog-to-digital conversion chip 100, the analog-to-digital conversion module 110 and the communication module 120 are respectively provided with working clocks by a clock source 210 and a clock source 220. Among them, the clock source 210 of the analog-to-digital conversion module 110 must be set inside the analog-to-digital conversion chip 100, and the performance of the analog-to-digital conversion chip 100 is largely limited by the clock source 210 of the analog-to-digital conversion module 110. At the same time, the clock source 210 of the analog-to-digital conversion module 110 will occupy the area of the analog-to-digital conversion chip 100 and generate relatively large power consumption. And the reliability of the internal clock source of the chip is also an important part of evaluating the reliability of the chip. If there is a problem with the internal clock of the chip, it will also cause the entire analog-to-digital conversion chip 100 to fail. In addition, in the traditional analog-to-digital conversion chip 100, when the analog-to-digital conversion module 110 and the communication module 120 perform data transmission, before the data is transmitted to the communication module, it also needs to be clock-synchronized by a synchronization module 130 to synchronize the data from the clock domain of the analog-to-digital conversion module 110 to the clock domain of the communication module 120. This will undoubtedly reduce the data transmission rate, and the synchronization module 130 also needs to occupy chip area and power consumption.
[0029] In view of this problem, an embodiment of the present application provides an analog-to-digital conversion circuit. Figure 2 FIG. shows an application scenario diagram of the analog-to-digital conversion circuit provided by an embodiment of the present application. Figure 3 FIG. shows a schematic diagram of the analog-to-digital conversion circuit provided by an embodiment of the present application. As Figure 2 and Figure 3 shown, this analog-to-digital conversion circuit is applied to the chip 300, which may be an analog-to-digital conversion chip or a chip provided with an analog-to-digital conversion function module. The analog-to-digital conversion circuit includes: an analog-to-digital conversion module 310 and a communication module 320.
[0030] The analog-to-digital conversion module 310 is respectively connected to the clock source 400 and the communication module 320, so that the clock source 400 provides working clocks for the analog-to-digital conversion module 310 and the communication module 320 respectively.
[0031] As an implementation manner, the clock source 400 provides working clocks for the analog-to-digital conversion module 310 and the communication module 320 respectively. The analog-to-digital conversion module 310 converts the collected analog signal quantity into a digital signal quantity based on this working clock, and the communication module 320 outputs the digital signal quantity based on this working clock. Optionally, in this analog-to-digital conversion circuit, since both the analog-to-digital conversion module 310 and the communication module 320 work in the clock domain provided by the clock source 400, the digital signal quantity output by the analog-to-digital conversion module 310 will be directly output to the communication module 320 without the need for clock domain synchronization work. Similarly, the signal output by the communication module 320 to the analog-to-digital conversion module 310 will also be directly output to the analog-to-digital conversion module 310 without the need for clock domain synchronization work.
[0032] In some embodiments, the clock source 400 originally belongs to the clock source of the communication module 320 and is only responsible for providing the working clock for the communication module 320. An embodiment of the present application enables the clock source 400 to provide the working clock for the analog-to-digital conversion module 310 in addition to providing the working clock for the communication module 320.
[0033] The analog-to-digital conversion circuit provided by an embodiment of the present application is applied to an analog-to-digital conversion chip and a chip provided with an analog-to-digital conversion function module. The analog-to-digital conversion module and the communication module share the clock source. Therefore, there is no need to set an additional clock source for the analog-to-digital conversion module, avoiding the increase in area and power consumption caused by setting the clock source of the analog-to-digital conversion module. Moreover, the sharing of the clock by the analog-to-digital conversion module and the communication module also enables the analog-to-digital conversion module and the communication module to be in the same clock domain. When transmitting signals, there is no need to synchronize the clock domains of the analog-to-digital conversion module and the communication module, further avoiding the increase in chip area and power consumption caused by clock domain synchronization, and also improving the working efficiency of the analog-to-digital conversion circuit.
[0034] In some embodiments, in the analog-to-digital conversion circuit provided by an embodiment of the present application, asFigure 3 As shown, the clock source 400 is provided by an external module connected to the chip 300, and the external module includes at least a clock source. Optionally, the external module can be a processing chip such as an MCU, FPGA, CPLD, etc. that includes a clock source for data interaction with the analog-to-digital conversion circuit, or it can be a clock source only used to provide a working clock for the communication module 320 and the analog-to-digital conversion module 310.
[0035] As an implementation manner, Figure 4 Another schematic diagram of the mode conversion circuit provided by the embodiment of the present application is shown. As Figure 4 shown, the chip 300 is also connected to the MCU. The digital signal quantity output by the analog-to-digital conversion module 310 is output to the MCU through the communication module 320, and the MCU saves and processes the digital signal quantity. The configuration signal output by the MCU to the analog-to-digital conversion module 310 is also output to the analog-to-digital conversion module 310 through the communication module 320 to configure the performance of the analog-to-digital conversion module 310, such as parameters such as the resolution, sampling rate, and accuracy of the analog-to-digital conversion module. Among them, when the analog-to-digital conversion module 310 and the communication module 320 perform data transmission, the working clock is provided by the clock source of the MCU. Similarly, the chip 300 can also be connected to chips such as FPGA, CPLD, and single-chip microcomputer that include a clock source.
[0036] As an implementation manner, the chip 300 is connected to the clock source 400, and the clock source 400 is a clock chip that only has the function of providing a clock signal. The clock chip is used to provide a working clock for the analog-to-digital conversion module 310 and the communication module 320.
[0037] The analog-to-digital conversion circuit provided by the embodiment of the present application is applied to an analog-to-digital conversion chip and a chip provided with an analog-to-digital conversion function module. A clock source located outside the chip is used to provide a working clock for the analog-to-digital conversion module and the communication module. In this way, when adjusting the working clocks of the analog-to-digital conversion module and the communication module, only the clock source set outside the chip needs to be operated, and there is no need to operate the inside of the analog-to-digital conversion chip, which improves the robustness of the chip.
[0038] In some embodiments, in the analog-to-digital conversion circuit provided by the embodiment of the present application, the working clock of the analog-to-digital conversion module 310 is the same as the working clock of the communication module 320, that is, the clock parameters such as the clock frequency and accuracy of the working clock of the analog-to-digital conversion module 310 are the same as those of the working clock of the communication module 320, so that the analog-to-digital conversion module 310 and the communication module 320 share the same clock source.
[0039] In some embodiments, in the analog-to-digital conversion circuit provided by the embodiment of the present application, the analog-to-digital conversion module 310 includes an analog-to-digital converter.
[0040] In some embodiments, in the analog-to-digital conversion circuit provided by the embodiments of the present application, the communication module 320 includes an interface of the analog-to-digital converter. Optionally, in practical applications, the communication module 320 is embodied in the form of an interface, such as an SPI communication interface, an I2C communication interface, an HDQ communication interface, etc.
[0041] In some embodiments, Figure 5 Another schematic diagram of the mode conversion circuit provided by the embodiments of the present application is shown, such as Figure 5 As shown, the analog-to-digital conversion circuit provided by the embodiments of the present application further includes:
[0042] A frequency division module 330, the input end of the frequency division module 330 is connected to the clock source 400 of the communication module, and the output ends are respectively connected to the analog-to-digital conversion module 310 and the communication module 320. The frequency division module 330 is used to divide the clock output by the clock source 400 and output it to the analog-to-digital conversion module 310 and the communication module 320. Optionally, the frequency division module 330 divides the clock output by the clock source 400 so that the divided clock meets the clock requirements of the communication module 320 and the analog-to-digital conversion module 310.
[0043] In some embodiments, in the analog-to-digital conversion circuit provided by the embodiments of the present application, the frequency division module 330 includes a frequency divider.
[0044] It can be understood that in the embodiments of the present application, the analog-to-digital converter (analog-to-digital conversion module 310), the interface of the analog-to-digital converter (communication module 320), and the frequency divider (frequency division module 330) essentially refer to an integrated circuit formed by integrating multiple electronic components, which has functions of analog-to-digital conversion, communication, and frequency division, so as to be integrated with each other to form a chip, rather than a finished device packaged in a housing on the market.
[0045] The analog-to-digital conversion circuit provided by the embodiments of the present application is applied to an analog-to-digital conversion chip and a chip provided with an analog-to-digital conversion function module, enabling the analog-to-digital conversion module and the communication module on the chip to reuse the external clock source of the chip. Therefore, there is no need to set an additional clock source for the analog-to-digital conversion module, avoiding the increase in area and power consumption caused by setting the clock source of the analog-to-digital conversion module. Moreover, the analog-to-digital conversion module and the communication module sharing the clock also make the analog-to-digital conversion module and the communication module in the same clock domain. When signal transmission occurs, there is no need to synchronize the clock domains of the analog-to-digital conversion module and the communication module, further avoiding the increase in chip area and power consumption caused by clock domain synchronization, and also improving the working efficiency of the analog-to-digital conversion circuit.
[0046] The embodiments of the present application further provide a chip, Figure 6 A schematic diagram of the chip provided by the embodiments of the present application is shown, such as Figure 6As shown, the chip 600 includes the above-mentioned analog-to-digital conversion circuit. A chip (Integrated Circuit, IC) is also called a chip, and this chip can be, but is not limited to, a SOC (System on Chip) chip, a SIP (system in package) chip.
[0047] For the chip provided by the embodiment of the present application, the analog-to-digital conversion circuit uses an external clock source, eliminating the need to set an additional clock source for the analog-to-digital conversion module, thus avoiding the increase in area and power consumption caused by setting the clock source of the analog-to-digital conversion module. Moreover, the reuse of the clock by the analog-to-digital conversion module and the communication module places the analog-to-digital conversion module and the communication module in the same clock domain, eliminating the need to synchronize the clock domains of the analog-to-digital conversion module and the communication module during signal transmission, further avoiding the increase in chip area and power consumption caused by clock domain synchronization, and also improving the working efficiency of the analog-to-digital conversion circuit.
[0048] As an implementation, the chip provided by the embodiment of the present application is an analog-to-digital conversion (ADC) chip, which at least includes an analog-to-digital conversion module and a communication module, and the analog-to-digital conversion module and the communication module reuse the external clock source connected to the analog-to-digital conversion (ADC) chip.
[0049] As an implementation, the chip provided by the embodiment of the present application is a chip provided with an analog-to-digital conversion function module, which at least includes an analog-to-digital conversion module and a communication module, and the analog-to-digital conversion module and the communication module reuse the external clock source connected to the chip.
[0050] The embodiment of the present application also provides an electronic device. Figure 7 The following shows a schematic diagram of the electronic device provided by the embodiment of the present application, as Figure 7 shown, the electronic device includes a device body 70 and the above-mentioned chip 600 disposed within the device body 70. The electronic device can be, but is not limited to, a weighing scale, a body fat scale, a nutrition scale, an infrared electronic thermometer, a pulse oximeter, a body composition analyzer, a wireless charger, a fast charger, a vehicle charger, an adapter, a display, a USB (Universal Serial Bus) expansion dock, a stylus, a true wireless earphone, an automotive center console screen, an automobile, a smart wearable device, a mobile terminal, a smart home device. The smart wearable device includes, but is not limited to, a smart watch, a smart bracelet, and a cervical massager. The mobile terminal includes, but is not limited to, a smart phone, a laptop computer, a tablet computer, and a POS (point of sale terminal) machine. The smart home device includes, but is not limited to, a smart socket, a smart rice cooker, a smart floor sweeper, and a smart light.
[0051] The electronic device provided by the embodiment of the present application enables the analog-to-digital conversion circuit to use an external clock source, eliminating the need to set an additional clock source for the analog-to-digital conversion module. This avoids the increase in area and power consumption caused by setting the clock source of the analog-to-digital conversion module. Moreover, the reuse of the clock by the analog-to-digital conversion module and the communication module places the analog-to-digital conversion module and the communication module in the same clock domain. When signals are transmitted, there is no longer a need to synchronize the clock domains of the analog-to-digital conversion module and the communication module, further avoiding the increase in chip area and power consumption caused by clock domain synchronization and improving the working efficiency of the analog-to-digital conversion circuit.
[0052] The above are only the preferred embodiments of the present application and do not impose any formal limitations on the present application. Although the present application has been disclosed above with preferred embodiments, it is not intended to limit the present application. Any person skilled in the art can make some modifications or refinements to the equivalent embodiments with equivalent changes within the scope of the technical solution of the present application. However, as long as it does not depart from the content of the technical solution of the present application, any brief modifications, equivalent changes, and refinements made to the above embodiments based on the technical essence of the present application still fall within the scope of the technical solution of the present application.
Claims
1. An analog-to-digital conversion circuit, characterized in that: Applied to chips, including: analog-to-digital conversion module and communication module; The analog-to-digital conversion module is connected to a clock source and the communication module respectively, so that the clock source provides a working clock for the analog-to-digital conversion module and the communication module respectively.
2. The analog-to-digital conversion circuit according to claim 1, characterized in that: The clock source is provided by an external module connected to the chip, and the external module at least includes a clock source.
3. The analog-to-digital conversion circuit according to claim 1, characterized in that: The working clock of the analog-to-digital conversion module is the same as the working clock of the communication module.
4. The analog-to-digital conversion circuit according to claim 1, characterized in that: Also includes: A frequency division module, wherein the input end of the frequency division module is connected to the clock source, and the output end of the frequency division module is respectively connected to the analog-to-digital conversion module and the communication module, and the frequency division module is used to divide the clock output by the clock source and output it to the analog-to-digital conversion module and the communication module.
5. The analog-to-digital conversion circuit according to claim 4, characterized in that: The frequency division module includes a frequency divider.
6. The analog-to-digital conversion circuit according to claim 1, characterized in that: The analog-to-digital conversion module includes an analog-to-digital converter.
7. The analog-to-digital conversion circuit according to claim 6, characterized in that: The communication module includes an interface of the analog-to-digital converter.
8. A chip, characterized in that: The analog-to-digital conversion circuit comprises any one of claims 1 to 7.
9. An electronic device, characterized in that: The invention comprises a device body and the chip as claimed in claim 8 arranged in the device body.