Auxiliary jig for anodic oxidation of semiconductor etching cavity Liner

Abstract

The utility model discloses an auxiliary jig for anodic oxidation of a semiconductor etching cavity Liner, which belongs to the technical field of semiconductors, and comprises an object to be plated and a first support assembly for supporting the object to be plated, and further comprises an auxiliary assembly for improving the electron transfer rate; the second supporting assembly is used for supporting the auxiliary assembly; the pipeline is used for stirring the solution in the to-be-plated object; the auxiliary assembly comprises a first barrel, a cross-shaped supporting frame, a rod body and a through hole, the cross-shaped supporting frame is fixedly connected to the upper end of the first barrel, the rod body is installed on the first barrel, the rod body is installed on the second supporting assembly, the first barrel is located in an object to be plated, and the second barrel is located in the second supporting assembly. A through hole for enabling the first barrel to be communicated with an object to be plated is formed in the first barrel; according to the utility model, under the action of air stirring and the auxiliary cathode, electrons can be promoted to rapidly transfer and fully react, so that the film thickness and the film quality are the same as those of the outer surface of the cavity.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to an auxiliary jig for anodic oxidation of a semiconductor etching cavity Liner. Background Art

[0002] The usage area of semiconductor cavity parts is generally the inner cavity of the cavity parts. However, there are difficulties in the film quality of the inner cavity, such as low film thickness and inconvenient measurement. Only measuring the film quality of the surface oxide film and using it to judge the film quality in the cavity is overgeneralization and is incorrect and inaccurate. Therefore, according to the actual production needs, our company has made corresponding optimizations for the anodic oxidation of the inner cavity of the cavity parts and proposed relevant improvement solutions:

[0003] The principle of anodic oxidation of aluminum is essentially the principle of electrolysis of water. When an electric current passes through, the following reactions will occur:

[0004] At the cathode, H2 is released according to the following reaction: 2H++2e-→H2

[0005] At the anode, 4OH--4e-→2H2O+O2. The transfer of electrons occurs in the solution. During the oxidation process, with the action of air agitation on the product surface, electrons are fully exchanged. However, due to the blockage of the inner cavity wall and the insufficient chemical reaction in the inner cavity of the product, the thickness of the oxide film is uneven, the overall film thickness difference is large, and the film quality and film weight are both lower than the normal values, which will not only reduce the product quality but also affect the normal use of the client. Content of the Utility Model

[0006] Aiming at the deficiencies of the prior art, the utility model provides an auxiliary jig for anodic oxidation of a semiconductor etching cavity Liner, which solves the above problems.

[0007] To achieve the above purposes, the utility model is realized through the following technical solutions: An auxiliary jig for anodic oxidation of a semiconductor etching cavity Liner includes an object to be plated and a first support assembly for supporting the object to be plated, and further includes:

[0008] An auxiliary assembly, which is installed on the first support assembly through a second support assembly and is used to improve the electron transfer rate;

[0009] A second support assembly, which is installed on the first support assembly and is used to support the auxiliary assembly;

[0010] A pipeline, which is detachably installed on the auxiliary assembly and its end extends into the auxiliary assembly and is used to stir the solution in the object to be plated;

[0011] Among them, the auxiliary component includes a first cylinder body, a cross support frame, a rod body, a through hole, and, the cross support frame is fixedly connected to the upper end of the first cylinder body, the rod body is installed on the first cylinder body, the rod body is installed on the second support component, the first cylinder body is located inside the object to be plated, and a through hole for enabling the first cylinder body to communicate with the object to be plated is provided on the first cylinder body.

[0012] On the basis of the above technical solution, the present utility model further provides the following alternative technical solutions:

[0013] Further technical solution: A plurality of the through holes are provided and are uniformly arranged in a ring on the first cylinder body for enabling the first cylinder body to communicate with the object to be plated.

[0014] Further technical solution: The pipeline is installed on the rod body by winding with tape.

[0015] Further technical solution: The upper end of the pipeline is installed at the output end of an external air pump.

[0016] Further technical solution: The first support component includes a base, a bottom plate, and nuts. A bottom plate is installed on both sides of the base through nuts, the bottom plates are symmetrically arranged on both sides of the first cylinder body, and a placement slot for placing the object to be plated is provided on the base.

[0017] Further technical solution: The second support component includes a cross plate, sliders, vertical plates, and bolt assemblies. The two sliders are symmetrically and fixedly connected to the ends of the cross plate. The sliders are slidably matched with the limit sliding grooves provided on the vertical plates. The baffle plates are fixedly connected to the sliders. A plurality of limit holes for cooperating with the baffle plates are linearly provided on the vertical plates. The baffle plates are detachably connected to the vertical plates through bolt assemblies. The cross plate is detachably connected to the rod body through bolt assemblies. Second limit holes for cooperating with the bolt assemblies are provided on the rod body.

[0018] Further technical solution: A plurality of the second limit holes are provided and are linearly and uniformly arranged on the rod body.

[0019] Further technical solution: The bolt assembly is made of plastic.

[0020] Further technical solution: The lower end of the rod body is fixedly connected to the cross support frame by welding.

[0021] Beneficial effects

[0022] The present utility model provides an auxiliary jig for anodic oxidation of a semiconductor etching cavity Liner, and has the following beneficial effects compared with the prior art:

[0023] 1. In the present utility model, the entire device is placed in an electroplating tank filled with electroplating solution. The two sides of the first cylinder are connected to an auxiliary cathode installed on the electroplating tank through wires. The object to be electroplated is connected to the anode through wires. At the same time, a pump is used to ventilate and stir the solution in the first cylinder through a pipeline, so as to promote the rapid transfer of electrons in the first cylinder and the object to be electroplated, so as to obtain a sufficient reaction, and the object to be electroplated is electroplated and processed, so that the film thickness and film quality inside the object to be electroplated are the same as those on the outer surface of the cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional structural schematic diagram of the present utility model.

[0025] Figure 2 It is a schematic diagram of the overall structure of the present utility model.

[0026] Figure 3 It is a partial structural schematic diagram of the second support assembly of the present utility model.

[0027] Annotation of reference numerals in the drawings: 1. Object to be electroplated; 2. Auxiliary assembly; 201. First cylinder; 202. Cross support frame; 203. Rod body; 204. Through hole; 3. First support assembly; 301. Base; 302. Bottom plate; 303. Nut; 4. Second support assembly; 401. Horizontal plate; 402. Slide block; 403. Vertical plate; 404. Bolt assembly; 405. Baffle plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model, and are not used to limit the present utility model.

[0029] The following describes the specific implementation of the present utility model in detail with reference to specific embodiments.

[0030] Please refer to Figures 1 to 3 , which is provided by an embodiment of the present utility model. An auxiliary jig for anodic oxidation of a semiconductor etching cavity Liner includes an object to be electroplated 1 and a first support assembly 3 for supporting the object to be electroplated 1, and further includes:

[0031] An auxiliary assembly 2, which is installed on the first support assembly 3 through a second support assembly 4 and is used to improve the electron transfer rate;

[0032] A second support assembly 4, which is installed on the first support assembly 3 and is used to support the auxiliary assembly 2;

[0033] A pipe, which is detachably installed on the auxiliary component 2 and its end extends into the auxiliary component 2, is used for stirring the solution located in the object to be plated 1;

[0034] Wherein, the auxiliary component 2 includes a first cylinder body 201, a cross support frame 202, a rod body 203, a through hole 204 and 205. The cross support frame 202 is fixedly connected to the upper end of the first cylinder body 201. The rod body 203 is installed on the first cylinder body 201. The rod body 203 is installed on the second support component 4. The first cylinder body 201 is located in the object to be plated 1. A through hole 204 for enabling the first cylinder body 201 to communicate with the object to be plated 1 is provided on the first cylinder body 201;

[0035] Preferably, the first cylinder body 201 does not contact the bottom of the object to be plated 1. The purpose of this setting is to prevent a short - circuit phenomenon between the object to be plated 1 and the first cylinder body 201 after being electrified;

[0036] Preferably, a plurality of through holes 204 are provided and are evenly arranged in a ring on the first cylinder body 201, for enabling the first cylinder body 201 to communicate with the object to be plated 1, facilitating the flow and transfer of electrons in the solution;

[0037] Preferably, the pipe is installed on the rod body 203 by tape winding. Those skilled in the relevant art should know that the purpose of this setting is to limit the pipe on the first cylinder body 201 to prevent the pipe from falling. Therefore, in some embodiments, the pipe can also be installed on the rod body 203 by a buckle. When the material of the pipe is metal, it can also be fixedly connected to the rod body 203 by welding;

[0038] Preferably, the upper end of the pipe is installed at the output end of an external air pump. The purpose of this setting is to supply air to the pipe by the air pump, so that the gas is introduced into the first cylinder body 201 through the pipe to stir the solution, facilitating the transfer of electrons;

[0039] Preferably, the first support component 3 includes a base 301, a bottom plate 302 and a nut 303. A bottom plate 302 is installed on both sides of the base 301 through nuts 303. The bottom plates 302 are symmetrically arranged on both sides of the first cylinder body 201. A placement slot (not marked in the figure) for placing the object to be plated 1 is provided on the base 301;

[0040] Preferably, the second support assembly 4 includes a cross plate 401, sliders 402, vertical plates 403, and bolt assemblies 404. The two sliders 402 are symmetrically and fixedly connected to the ends of the cross plate 401. The sliders 402 are slidably engaged with limiting chutes (not marked in the figure) formed on the vertical plates 403. A baffle 405 is fixedly connected to the sliders 402. A number of limiting holes (not marked in the figure) for cooperating with the baffle 405 are linearly formed on the vertical plates 403. The baffle 405 is detachably connected to the vertical plates 403 through bolt assemblies. The cross plate 401 is detachably connected to the rod body 203 through bolt assemblies 404. Second limiting holes (not marked in the figure) for cooperating with the bolt assemblies 404 are formed on the rod body 203. There are a number of the second limiting holes and they are linearly and evenly arranged on the rod body 203. The purpose of this setting is to support the first cylinder body 201 and be able to adjust the height of the first cylinder body 201 according to requirements;

[0041] Preferably, the bolt assemblies 404 are made of plastic. Those skilled in the relevant art should know that the purpose of this setting is to prevent the cross plate 401 connected to the rod body 203 from conducting electricity. Therefore, in some embodiments, the bolt assemblies 404 can also be made of other non-conductive materials;

[0042] Preferably, the lower end of the rod body 203 is fixedly connected to the cross support frame 202 by welding. Those skilled in the relevant art should know that the purpose of this setting is to limit the rod body 203 on the cross support frame 202. Therefore, in some embodiments, the rod body 203 can also be detachably connected to the cross support frame 202 by a clamping method, or detachably connected to the cross support frame 202 by a bolt connection method.

[0043] In the embodiment of the present utility model, the entire device is placed in an electroplating tank (not marked in the figure) filled with electroplating solution. The two sides of the first cylinder body 201 are connected to an auxiliary cathode installed on the electroplating tank through wires. The object to be electroplated 1 is connected to the anode through a wire. At the same time, a pump body is used to ventilate and stir the solution in the first cylinder body 201 through a pipeline, so as to promote the rapid transfer of electrons in the first cylinder body 201 and the object to be electroplated 1, so as to obtain a full reaction, perform electroplating treatment on the object to be electroplated, and make the film thickness and film quality inside the object to be electroplated be the same as those on the outer surface of the cavity.

[0044] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusively, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0045] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An auxiliary jig for semiconductor etching chamber Liner anodization, comprising an object to be plated (1) and a first support component (3) for supporting the object to be plated (1), characterized in that: Also includes: An auxiliary component (2) is mounted on the first support component (3) via a second support component (4) and is used to increase the electron transfer rate; A second supporting assembly (4) is mounted on the first supporting assembly (3) and is used to support the auxiliary assembly (2); a pipe, which is detachably mounted on the auxiliary component (2) and has an end portion extending into the auxiliary component (2), and is used to stir the solution in the object to be plated (1); The auxiliary component (2) comprises a first cylinder (201), a cross support frame (202), a rod (203), a through hole (204) and (205); the cross support frame (202) is fixedly connected to the upper end of the first cylinder (201); the rod (203) is mounted on the first cylinder (201); the rod (203) is mounted on the second support component (4); the first cylinder (201) is located in the object to be plated (1); and the first cylinder (201) is provided with a through hole (204) for facilitating the communication between the first cylinder (201) and the object to be plated (1).

2. The auxiliary jig for semiconductor etching chamber Liner anodization according to claim 1, characterized in that: The through holes (204) are provided in a plurality and are evenly arranged in a ring shape on the first cylinder (201), and are used to facilitate the first cylinder (201) to communicate with the object (1) to be plated.

3. The auxiliary jig for semiconductor etching chamber Liner anodization according to claim 2, characterized in that: The pipe is installed on the rod body (203) by wrapping with adhesive tape.

4. The auxiliary jig for semiconductor etching chamber Liner anodization according to claim 3, characterized in that: The upper end of the pipeline is installed at the output end of the external air pump.

5. The auxiliary jig for semiconductor etching chamber Liner anodization according to claim 1, characterized in that: The first supporting assembly (3) comprises a base (301), a bottom plate (302) and a nut (303); a bottom plate (302) is mounted on both sides of the base (301) via a nut (303); the bottom plates (302) are symmetrically arranged on both sides of the first cylinder (201); and a placement slot for placing an object to be plated (1) is provided on the base (301).

6. The auxiliary jig for semiconductor etching chamber Liner anodization according to claim 5, characterized in that: The second support assembly (4) comprises a transverse plate (401), a slider (402), a vertical plate (403) and a bolt assembly (404); the two sliders (402) are symmetrically fixedly connected to the ends of the transverse plate (401); the sliders (402) are slidably matched with the limiting sliding grooves provided on the vertical plate (403); the baffle plate (405) is fixedly connected to the slider (402); a plurality of limiting holes for use with the baffle plate (405) are linearly provided on the vertical plate (403); the baffle plate (405) is detachably connected to the vertical plate (403) by the bolt assembly; the transverse plate (401) is detachably connected to the rod body (203) by the bolt assembly (404); and a second limiting hole for use with the bolt assembly (404) is provided on the rod body (203).

7. The auxiliary jig for semiconductor etching chamber Liner anodization according to claim 6, characterized in that: A plurality of the second limiting holes are provided and are linearly and evenly arranged on the rod body (203).

8. The auxiliary jig for semiconductor etching chamber Liner anodization according to claim 6, characterized in that: The bolt assembly (404) is made of plastic.

9. The auxiliary jig for semiconductor etching chamber Liner anodization according to claim 1 or 3, characterized in that: The lower end of the rod body (203) is fixedly connected to the cross support frame (202) by welding.

Images