Phase shift test circuit board for duplex filter

Abstract

The utility model discloses a phase shift test circuit board for a duplex filter. The phase shift test circuit board comprises a circuit board body, a first port, a second port, a third port and a phase shifter which are arranged on the circuit board body, and a packaging tube shell, the first port is connected with the Tx filter, the second port is connected with the Rx filter, and the third port is a common antenna port; the phase shifter is located between the common antenna port and the Tx filter port, and the phase shifter is used for realizing a phase shifting function; the packaging tube shell is an SMD tube shell.

Description

Technical Field

[0001] This application relates to the technical field of phase shift testing, and particularly to a phase shift testing circuit board for a duplex filter. Background Art

[0002] In modern communication devices, a duplex filter is a commonly used component that allows the device to transmit and receive signals simultaneously without interference. To ensure the performance of the duplex filter, precise testing is required. When testing a duplex filter, the use of a phase shifter is crucial for improving testing accuracy and efficiency.

[0003] Traditionally, the testing of duplex filters usually relies on low-temperature co-fired ceramic (LTCC) technology. LTCC technology is widely used in the packaging of high-performance duplex filters due to its superior frequency characteristics and integration. However, this technology has some significant drawbacks. First, the cost of LTCC packages is relatively high, which is particularly prominent in large-scale production. Second, products using LTCC packages usually face the problem of low yield, including poor pad consistency and low wire bonding yield, which increases the complexity and cost of production. In addition, the LTCC package welded by a gold-tin cap through reflow soldering has poor airtightness, which may affect the reliability and stability of the final product. Summary of the Utility Model

[0004] Therefore, this application provides a phase shift testing circuit board for a duplex filter to solve the problems in the prior art that the testing device for duplex filters is complex in production, high in cost, and poor in reliability and stability.

[0005] To achieve the above object, this application provides the following technical solution: A phase shift testing circuit board for a duplex filter, characterized by comprising a circuit board body, a first port, a second port, a third port, and a phase shifter arranged on the circuit board body, and a packaging shell;

[0006] The first port is connected to a Tx filter, the second port is connected to an Rx filter, and the third port is a common antenna port;

[0007] The phase shifter is located between the common antenna port and the Tx filter port, and the phase shifter is used to implement the phase shift function;

[0008] The packaging shell is an SMD shell.

[0009] Optionally, the common antenna port includes a first pad and a second pad;

[0010] The first pad is connected to the antenna common end, and the second pad is connected to the antenna output end through an external inductor.

[0011] Optionally, the distance between the first port and the second port is greater than a preset distance.

[0012] Optionally, the phase shifter is an inductor.

[0013] Optionally, the inductor is mounted on the surface of the circuit board body, and the inductor is electrically connected to the corresponding pad through a solder joint.

[0014] Optionally, the circuit board body is an aluminum plate body, a ceramic plate body or a metal plate body.

[0015] Optionally, an electromagnetic shielding structure is further provided on the circuit board body.

[0016] Optionally, a wireless communication module is further provided on the circuit board body, and the wireless communication module communicates with a test device.

[0017] Compared with the prior art, the present application has at least the following beneficial effects:

[0018] 1. By using a common SMD package instead of the traditional LTCC package, the price of the common SMD package is much lower than that of the LTCC package, significantly reducing the material cost and greatly decreasing the overall production cost, which is particularly important for large-scale production.

[0019] 2. By simplifying the structure of the test circuit board and using an inductor to achieve the phase shift function, the complex steps in the production process are reduced. This simplification not only improves the production efficiency but also increases the yield of the final product. The increase in yield means fewer defective products and higher production efficiency, thus further reducing the production cost.

[0020] 3. By optimizing the packaging technology, the airtightness of the product is significantly improved. The excellent airtightness not only ensures the reliability of the product but also enhances its stability in various environments.

[0021] 4. Although the present application uses lower-cost materials and a simplified design, the new phase shift test circuit board can still maintain or even improve the test performance of the duplex filter. The introduction of the inductor as a phase shifter effectively achieves the correct phase shift of the test signal, ensuring the accuracy and reliability of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] To more intuitively illustrate the prior art and the present application, exemplary drawings are given below. It should be understood that the specific shapes and structures shown in the drawings generally should not be regarded as limiting conditions when implementing the present application; for example, those skilled in the art are capable of making routine adjustments or further optimizations to the addition / removal / attribution division of certain units (components), specific shapes, positional relationships, connection methods, dimensional proportional relationships, etc. based on the technical concept disclosed in the present application and the exemplary drawings.

[0023] Figure 1 This is a schematic diagram of the structure of a phase shift test circuit board for a duplex filter provided by an embodiment of the present application;

[0024] Figure 2 This is an equivalent circuit diagram of a phase shift test circuit board for a duplex filter provided by an embodiment of the present application;

[0025] Figure 3 This is a pin definition diagram of an LTCC phase shifter package in the prior art provided by an embodiment of the present application;

[0026] Figure 4 This is a pin definition diagram of an SMD package provided by an embodiment of the present application;

[0027] Figure 5 This is a test frequency response diagram of an LTCC and a test circuit board in the prior art provided by an embodiment of the present application;

[0028] Figure 6 This is a test frequency response diagram of a phase shift test circuit board for a duplex filter provided by an embodiment of the present application. Detailed implementation manners

[0029] The present application will be further described in detail below with reference to the accompanying drawings and through specific embodiments.

[0030] In the description of the present application: Unless otherwise specified, "a plurality of" means two or more. Terms such as "first", "second", "third", etc. in the present application are intended to distinguish the objects being referred to, and do not have a special meaning in terms of technical connotations (for example, they should not be understood as emphasizing the degree of importance or order, etc.). Expressions such as "including", "comprising", "having", etc. also mean "not limited to" (certain units, components, materials, steps, etc.).

[0031] Terms such as "upper", "lower", "left", "right", "middle", etc. cited in the present application are usually indications of the general relative position relationship for the convenience of intuitively understanding with reference to the accompanying drawings, and are not absolute limitations on the position relationship in the actual product.

[0032] As Figures 1 to 6 shown, a phase shift test circuit board for a duplex filter includes a circuit board body, a first port, a second port, a third port, and a phase shifter provided on the circuit board body, and a package housing;

[0033] The first port is connected to a Tx filter, the second port is connected to an Rx filter, and the third port is a common antenna port;

[0034] The phase shifter is located between the common antenna port and the Tx filter port, and the phase shifter is used to implement the phase shifting function;

[0035] The encapsulation housing is an SMD housing.

[0036] It should be noted that a phase shift test circuit board for a duplex filter provided in this application can test the duplex filter through three ports. Compared with traditional test boards, this test board can achieve the phase shifting function through the test circuit board, so that a common SMD housing with a relatively low cost can be selected for the housing, greatly reducing the cost, improving the production yield, and improving the airtightness of the product.

[0037] It should be noted that this test circuit board needs to be made relatively flat and uniform to ensure good contact between the pads and the test circuit board during testing.

[0038] In this embodiment, by using a common SMD housing to replace the traditional LTCC housing, the price of the common SMD housing is much lower than that of the LTCC housing, significantly reducing the material cost and greatly reducing the overall production cost, which is particularly important for large-scale production.

[0039] In this embodiment, by simplifying the structure of the test circuit board and using an inductor to implement the phase shifting function, the complex steps in the production process are reduced. This simplification not only improves the production efficiency but also improves the yield of the final product. The improvement in yield means fewer defective products and higher production efficiency, thus further reducing the production cost.

[0040] In this embodiment, by optimizing the encapsulation technology, the airtightness of the product is significantly improved. The excellent airtightness not only ensures the reliability of the product but also improves its stability in various environments.

[0041] In this embodiment, although lower-cost materials and a simplified design are adopted, the new phase shift test circuit board can still maintain or even improve the test performance of the duplex filter. The introduction of the inductor as the phase shifter effectively realizes the correct phase shift of the test signal, ensuring the accuracy and reliability of the test.

[0042] As Figure 2 shown, a phase shift test circuit board for a duplex filter provided in this application is used to test the duplex filter. By designing to use the same port as the common antenna terminal on the test circuit board and using an inductor as the phase shifter between the antenna terminals of the Tx filter and the Rx filter, it is characterized in that: by adopting this method, the original LTCC ceramic housing can be replaced, the cost of the housing can be reduced, the production yield can be improved, and the airtightness of the product can be improved.

[0043] It should be noted that in the package test of the duplexer with an SMD3.8*3.8 package, the shell used in the market originally was a Korean LTCC shell with a phase shifter, and the gold-tin cap was welded by reflow soldering. This shell integrates the phase shifter in the housing, which brings great convenience to the integrated design of the Tx filter and the Rx filter. However, this type of shell has a low yield, high cost, poor pad consistency, low wire bonding yield, and poor airtightness of the gold-tin cap. This test board introduces an inductor at the Tx and Rx ports through a design to play a role in phase shift. Without obvious deterioration of performance, the duplexer can be packaged in a common SMD3.8*3.8 shell, greatly reducing the cost, improving the production yield, and improving the airtightness of the product.

[0044] In a possible implementation manner, the common antenna port includes a first pad and a second pad;

[0045] The first pad is connected to the antenna common end, and the second pad is connected to the antenna output end through an external inductor.

[0046] As Figure 1 shown, on the left is the antenna common end of the Tx and Rx of the test circuit board. This common end has two pads. One pad is directly connected to the antenna common end, and the other pad is connected to the antenna common end through an external inductor. The two ports on the right are the input and output ends of the Tx and Rx respectively.

[0047] In a possible implementation manner, the distance between the first port and the second port is greater than a preset distance.

[0048] Among them, the preset distance can be set by the designer of the phase shift test circuit board, and this embodiment does not make specific limitations on this.

[0049] For example, the preset distance can be 2 cm.

[0050] In this embodiment, the distance between the first port and the second port is greater than the preset distance to optimize the signal distribution and reduce interference.

[0051] In a possible implementation manner, the phase shifter is an inductor.

[0052] In a possible implementation manner, the inductor is mounted on the surface of the circuit board body, and the inductor is electrically connected to the corresponding pad through a solder joint.

[0053] In a possible implementation manner, the circuit board body is an aluminum board body, a ceramic board body, or a metal board body.

[0054] Among them, the aluminum substrate is a kind of metal substrate material with excellent thermal conductivity and heat dissipation performance. It is composed of an aluminum substrate and an insulating layer, and is suitable for circuit designs that require high power density and high heat dissipation requirements.

[0055] Ceramic substrates are usually made of ceramic materials such as alumina or boron nitride, and have excellent insulation, heat conduction and high temperature resistance, and are suitable for high-frequency circuits and high-power applications.

[0056] Metal substrates are composite materials composed of a metal base material and an insulating layer, and have good heat conduction and mechanical strength. Common metal base materials include aluminum, copper, steel, etc., and are suitable for circuit designs that require high power density and heat dissipation requirements.

[0057] In this embodiment, the material of the circuit board body is selected as a composite material with high conductivity and good thermal stability to improve the performance and durability of the entire circuit board.

[0058] For example, the circuit board body can also be a glass fiber reinforced epoxy resin board body. The glass fiber reinforced epoxy resin board body is a common circuit board substrate material, and has good insulation, heat resistance and mechanical strength. It is composed of glass fiber cloth and epoxy resin, and has excellent conductivity and heat resistance, and is suitable for various circuit applications.

[0059] In a possible implementation manner, an electromagnetic shielding structure is further provided on the circuit board body.

[0060] In this embodiment, by providing an electromagnetic shielding structure on the circuit board body, the inductor is shielded to reduce electromagnetic interference.

[0061] In a possible implementation manner, a wireless communication module is further provided on the circuit board body, and the wireless communication module communicates with the test device.

[0062] In this embodiment, the test data is transmitted by communicating with the test device through the wireless communication module.

[0063] The technical features of the above embodiments can be combined arbitrarily as long as there is no contradiction in the combination of these technical features. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described; these embodiments that are not explicitly written out should also be considered to be within the scope recorded in this specification.

Claims

1. A phase shift test circuit board for a duplex filter, characterized in that: It comprises a circuit board body, a first port, a second port, a third port and a phase shifter arranged on the circuit board body, and a packaging tube shell; The first port is connected to the Tx filter, the second port is connected to the Rx filter, and the third port is a common antenna port; The phase shifter is located between the common antenna port and the Tx filter port, and the phase shifter is used to realize a phase shifting function; The packaging tube shell is an SMD tube shell.

2. The phase shift test circuit board according to claim 1, characterized in that: The common antenna port includes a first pad and a second pad; The first pad is connected to the common end of the antenna, and the second pad is connected to the output end of the antenna via an external inductor.

3. The phase shift test circuit board according to claim 1, characterized in that: The distance between the first port and the second port is greater than a preset distance.

4. The phase shift test circuit board according to claim 1, characterized in that: The phase shifter is an inductor.

5. The phase shift test circuit board according to claim 2, characterized in that: The inductor is mounted on the surface of the circuit board, and the inductor is electrically connected to the corresponding pad through a solder point.

6. The phase shift test circuit board according to claim 1, characterized in that: The circuit board body is an aluminum plate body, a ceramic plate body or a metal plate body.

7. The phase shift test circuit board according to claim 1, characterized in that: The circuit board body is also provided with an electromagnetic shielding structure.

8. The phase shift test circuit board according to claim 1, characterized in that: The circuit board body is also provided with a wireless communication module, and the wireless communication module communicates with the testing equipment.

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