Controller circuit module patch welding structure

Abstract

The utility model discloses a controller circuit module patch welding structure. The structure comprises a power supply circuit, a single-chip microcomputer, a three-phase bridge type drive circuit, a signal indication circuit, a feedback circuit and a signal acquisition circuit. The power supply circuit, the single-chip microcomputer, the three-phase bridge type drive circuit, the signal indication circuit, the feedback circuit and the signal acquisition circuit are all arranged on a PCB, and the PCB is welded on an aluminum substrate. By means of the mode, PCB welding of the brushless motor can be rapidly carried out, welding is carried out after the control circuit is integrated on the PCB, batch production of the control circuit board of the brushless motor can be carried out in a modular mode, and the manufacturing efficiency of the control module of the brushless motor is improved.

Description

Technical Field

[0001] This application relates to the technical field of controllers, and more particularly, to a surface mount welding structure for a controller circuit module. Background Art

[0002] Currently, there are many requirements for the size of controllers in the market. The controllers of brushless motors are usually composed of an aluminum substrate and a common FR-4 control board, and generally, terminal blocks are used for connection. For such circuit boards, single-row terminal blocks are used. First of all, these materials are in bulk, and the devices cannot be surface-mounted by machines but can only be placed manually, resulting in time-consuming and laborious processing. Moreover, the bottom surfaces of the devices are not flat, and there will be a certain gap between the devices and the circuit board when they are placed on the board. After passing through the reflow soldering, there is a high probability of solder joint voids, and manual tin addition is required for correction later, resulting in inconvenient processing and solder joint void connection problems.

[0003] There are many control circuits in the controller of a brushless motor, including several electronic components. If each control circuit is welded to the PCB board one by one, it will undoubtedly take a lot of time. Summary of the Utility Model

[0004] The main purpose of this application is to provide a surface mount welding structure for a controller circuit module to solve the problems of inconvenient processing and welding reliability in the welding process of connecting the control circuit and the aluminum-based power circuit using terminal blocks at present.

[0005] To achieve the above object, this application provides the following technology: A surface mount welding structure for a controller circuit module, the structure includes:

[0006] The PCB board 101 where the control circuit of the brushless motor is located;

[0007] An aluminum substrate;

[0008] The PCB board 101 is welded to the aluminum substrate by surface mount soldering;

[0009] The PCB board integrates a brushless motor control circuit module, and this module includes a power supply circuit, a single-chip microcomputer, a three-phase bridge drive circuit, a signal indication circuit, a feedback circuit, and a signal acquisition circuit;

[0010] The power supply circuit is connected to the single-chip microcomputer and is used to supply power to the single-chip microcomputer; the three-phase bridge drive circuit is connected to the single-chip microcomputer and is used to convert the PWM signal sent by the single-chip microcomputer into a drive signal for controlling the brushless motor; the feedback circuit is connected to the single-chip microcomputer and is used to collect the back electromotive force voltage signal of the brushless motor and send the back electromotive force voltage signal to the single-chip microcomputer; the signal acquisition circuit is connected to the single-chip microcomputer and is used to collect the current signal, voltage signal and temperature signal of the brushless motor and send the current signal, voltage signal and temperature signal to the single-chip microcomputer; the signal indication circuit is connected to the single-chip microcomputer and is used to send fault information;

[0011] The power supply circuit, three-phase bridge drive circuit, signal indication circuit, feedback circuit and signal acquisition circuit are respectively electrically connected to the single-chip microcomputer.

[0012] As an optional embodiment of the present invention, optionally, connection holes 102 with half-hole plating are provided around the PCB board, and the PCB board is welded to the aluminum substrate by means of reflow soldering.

[0013] As an optional embodiment of the present invention, optionally, corresponding wiring ports 104 are provided on the aluminum substrate.

[0014] As an optional embodiment of the present invention, optionally, positioning posts 103 corresponding to the connection holes 102 are set on the aluminum substrate. The positioning posts 103 are made of solder and are arranged on the aluminum substrate in advance corresponding to the connection holes.

[0015] As an optional embodiment of the present invention, optionally, the positioning post 103 is a stepped shaft structure. After the PCB board is placed on the positioning post 103, the PCB board is clamped at the shaft shoulder of its stepped shaft, and a gap of 0.5-1 mm is kept between the PCB board and the aluminum substrate.

[0016] Compared with the prior art, the present application can bring the following technical effects: By making the control part circuit of the brushless motor controller into a modular circuit and welding the PCB board and the circuit board of the power part of the aluminum substrate by reflow soldering, the present invention solves the problems of inconvenient processing and welding reliability in the welding process of connecting the control circuit and the aluminum-based power circuit using a terminal block.

[0017] By the above method, the PCB board of the brushless motor can be quickly welded. After integrating the control circuit on the PCB board and then welding, the control circuit board of the brushless motor can be mass-produced in a modular manner, improving the manufacturing efficiency of the control module of the brushless motor.

[0018] The reflow soldering process of the surface mount type has the following advantages:

[0019] 1. It is not necessary to immerse the electronic components of the brushless motor in molten solder, so the components are less affected by thermal shock.

[0020] 2. Reflow soldering only applies solder to the required parts and can control the application amount.

[0021] 3. When there is a certain deviation in the placement position of the components, due to the surface tension of the molten solder, as long as the solder application position is correct, reflow soldering can automatically correct this small deviation during soldering and fix the components in the correct position - the automatic positioning effect.

[0022] 4. The components in the solder will not be mixed with impurities, ensuring the composition of the solder.

[0023] 5. On the same substrate, wave soldering and reflow soldering can be used in combination.

[0024] 6. The process is simple and the soldering quality is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings forming a part of this application are used to provide a further understanding of this application, making other features, objectives, and advantages of this application more obvious. The schematic embodiments and descriptions of the drawings of this application are used to explain this application and do not constitute an improper limitation of this application. In the drawings:

[0026] Figure 1 is a schematic structural diagram of a PCB board of the present utility model;

[0027] Figure 2 is a schematic structural diagram of an aluminum substrate of the present utility model;

[0028] Figure 3 is a schematic structural diagram of a patch solder of the present utility model;

[0029] Figure 4 is a schematic diagram of the circuit composition of a brushless motor control circuit module of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] In order to enable those skilled in the art to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0031] It should be noted that in the description, claims and the above-mentioned drawings of the present application, the terms "first", "second", etc. are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so as to implement the embodiments of the present application described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units does not necessarily limit to those clearly listed steps or units, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0032] In the present application, the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0033] Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present application can be understood according to specific circumstances.

[0034] In addition, the meaning of the term "plural" should be two or more.

[0035] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0036] As Figure 3 shown, a surface-mounted welding structure of a controller circuit module, the structure includes:

[0037] The PCB board 101 where the control circuit of the brushless motor is located;

[0038] The aluminum substrate;

[0039] The PCB board 101 is welded on the aluminum substrate by surface mounting welding;

[0040] As Figure 4 shown, the PCB board integrates a brushless motor control circuit module, and the module includes a power circuit, a single-chip microcomputer, a three-phase bridge drive circuit, a signal indication circuit, a feedback circuit and a signal acquisition circuit;

[0041] The power supply circuit is connected to the single-chip microcomputer and is used to supply power to the single-chip microcomputer; the three-phase bridge drive circuit is connected to the single-chip microcomputer and is used to convert the PWM signal sent by the single-chip microcomputer into a drive signal for controlling the brushless motor; the feedback circuit is connected to the single-chip microcomputer and is used to collect the back electromotive force voltage signal of the brushless motor and send the back electromotive force voltage signal to the single-chip microcomputer; the signal acquisition circuit is connected to the single-chip microcomputer and is used to collect the current signal, voltage signal and temperature signal of the brushless motor and send the current signal, voltage signal and temperature signal to the single-chip microcomputer; the signal indication circuit is connected to the single-chip microcomputer and is used to send fault information;

[0042] The power supply circuit, three-phase bridge drive circuit, signal indication circuit, feedback circuit and signal acquisition circuit are respectively electrically connected to the single-chip microcomputer.

[0043] Each circuit can be understood in combination with the control circuit of the existing brushless motor. The specific circuit structure of each working circuit in the controller of the brushless motor is not limited in this embodiment.

[0044] As Figure 3 shown, in the present utility model, the control part circuit of the brushless motor controller is made into a modular circuit (pre-integrated on a PCB board), and the PCB board and the circuit board of the aluminum substrate power part are welded together by reflow soldering. It solves the problems of inconvenient processing and welding reliability in the welding process of connecting the control circuit and the aluminum-based power circuit using a terminal block.

[0045] As Figure 1 shown, as an optional embodiment of the present utility model, optionally, connection holes 102 with half-hole plating are provided around the PCB board, and the PCB board is welded to the aluminum substrate by reflow soldering.

[0046] The power supply circuit, single-chip microcomputer, three-phase bridge drive circuit, signal indication circuit, feedback circuit and signal acquisition circuit are all placed on the same PCB board, and the PCB board is made into a weldable module. Half-hole plating connection holes are made at the edge part of the PCB board, and this module is welded to the aluminum substrate by reflow soldering. The specific welding position is at the half-hole plating position.

[0047] As Figure 2 shown, corresponding wiring ports 104 are provided on the aluminum substrate.

[0048] In order to quickly locate for patch welding, a positioning structure is preset on the aluminum substrate, that is, positioning piles 103 corresponding to the connection holes 102 are pre-constructed by solder. The positioning piles 103 are made of solder and are arranged on the aluminum substrate in advance corresponding to the connection holes.

[0049] The positioning post 103 can be a fixed (pre-fixed on the surface of the aluminum substrate by spot welding) stepped shaft structure. After the PCB board is placed on the positioning post 103, the PCB board can be clamped at the shoulder of its stepped shaft, avoiding surface contact between the PCB board and the aluminum substrate, and leaving a gap of 0.5 - 1 mm for heat dissipation.

[0050] As Figure 3 shown, when soldering the PCB board by reflow soldering, align the connection holes 101 of the PCB patches with the positioning posts 103 for initial positioning. After placement, through reflow soldering, the positioning post 103 part in the connection hole 102 is fusion welded, fixing the PCB board on the positioning post 103, thus realizing the patch soldering process.

[0051] By the above method, the soldering of the PCB board of the brushless motor can be carried out quickly. After integrating the control circuit on the PCB board and then soldering, the batch production of the control circuit board of the brushless motor can be carried out modularly, improving the manufacturing efficiency of the control module of the brushless motor.

[0052] The reflow soldering process of the patch type has the following advantages:

[0053] 1. It is not necessary to immerse the electronic components of the brushless motor in the molten solder, so the components are less affected by thermal shock.

[0054] 2. Reflow soldering only applies solder to the required parts and can control the application amount.

[0055] 3. When the placement position of the components has a certain deviation, due to the surface tension of the molten solder, as long as the solder application position is correct, reflow soldering can automatically correct this small deviation during soldering, fixing the components in the correct position - the automatic positioning effect.

[0056] 4. The components in the solder will not be mixed with impurities, ensuring the composition of the solder.

[0057] 5. On the same substrate, wave soldering and reflow soldering can be used in combination.

[0058] 6. The process is simple and the soldering quality is high.

[0059] Advantages of reflow soldering:

[0060] 1. The solder paste can be quantitatively dispensed with high precision. The solder is heated fewer times and is not easily mixed with impurities.

[0061] 2. It is suitable for soldering various high-precision and high-requirement components.

[0062] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various modifications and changes can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A controller circuit module patch welding structure, characterized in that: The structure comprises: A PCB board (101) where the control circuit of the brushless motor is located; Aluminum substrate; The PCB board (101) is welded on the aluminum substrate by means of surface mount welding; The PCB board is integrated with a brushless motor control circuit module, which includes a power supply circuit, a single-chip microcomputer, a three-phase bridge drive circuit, a signal indication circuit, a feedback circuit and a signal acquisition circuit; The power supply circuit is connected to the single-chip microcomputer and is used to supply power to the single-chip microcomputer; the three-phase bridge drive circuit is connected to the single-chip microcomputer and is used to convert the PWM signal sent by the single-chip microcomputer into a drive signal for controlling the brushless motor; the feedback circuit is connected to the single-chip microcomputer and is used to collect the back-EMF voltage signal of the brushless motor and send the back-EMF voltage signal to the single-chip microcomputer; the signal acquisition circuit is connected to the single-chip microcomputer and is used to collect the current signal, voltage signal and temperature signal of the brushless motor and send the current signal, voltage signal and temperature signal to the single-chip microcomputer; the signal indication circuit is connected to the single-chip microcomputer and is used to send fault information; The power supply circuit, three-phase bridge drive circuit, signal indication circuit, feedback circuit and signal acquisition circuit are electrically connected to the single chip microcomputer respectively.

2. A controller circuit module patch welding structure as claimed in claim 1, characterized in that: Semi-perforated connection holes (102) are arranged around the PCB board, and the PCB board is welded on the aluminum substrate by reflow soldering.

3. A controller circuit module patch welding structure as claimed in claim 1, characterized in that: A corresponding connection port (104) is provided on the aluminum substrate.

4. A controller circuit module patch welding structure as claimed in claim 1, characterized in that: A positioning pile (103) corresponding to the connection hole (102) is set on the aluminum substrate. The positioning pile (103) is made of solder and is arranged on the aluminum substrate in advance corresponding to the connection hole.

5. A controller circuit module patch welding structure as claimed in claim 1, characterized in that: The positioning pile (103) is a stepped shaft structure. After the PCB board is placed on the positioning pile (103), the PCB board is clamped at the shoulder of the stepped shaft, and a gap of 0.5 to 1 mm is maintained between the PCB board and the aluminum substrate.

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