Semiconductor grinding fluid conveying device and semiconductor polishing equipment
By adopting a double-cantilever structure abrasive liquid conveying device in semiconductor chemical mechanical grinding technology, the problem of poor uniformity of the grinding liquid distribution is solved, a wider range of abrasive liquid distribution and higher process safety are achieved, and the quality and production efficiency of semiconductor devices are improved.
Patent Information
- Application Number
- CN202421879293.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-05
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-08-05
AI Technical Summary
In the existing semiconductor chemical mechanical grinding technology, the distribution uniformity of the abrasive liquid is poor, which makes it difficult to achieve flatness of the wafer surface during the polishing process, which in turn affects the accuracy of subsequent lithography processes and the quality of semiconductor devices.
A semiconductor abrasive liquid conveying device is designed, adopting a double cantilever structure, and the abrasive liquid drop position of the first abrasive liquid nozzle and the second abrasive liquid nozzle are adjusted respectively through the first cantilever and the second cantilever to achieve refined control of the abrasive liquid and a wider distribution range.
It improves the distribution uniformity of semiconductor abrasive liquid, reduces the waste of abrasive liquid, enhances process safety, reduces the difficulty of process adjustment, and improves the flatness of wafer surface, thereby improving the quality and production efficiency of semiconductor devices.
Smart Images
Figure CN222932468U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of chemical mechanical polishing, and particularly to a semiconductor polishing liquid delivery device and a semiconductor polishing equipment. Background Art
[0002] Chemical Mechanical Polishing (CMP) is a commonly used method to achieve global surface planarization, which is a semiconductor processing technology that combines chemical corrosion and physical mechanical actions. In semiconductor chemical mechanical polishing, multiple consumables are involved. Among them, the polishing liquid, as the main component affecting chemical mechanical polishing, its distribution on the polishing pad will greatly affect the uniformity of the entire polishing process. The flatness and defects of the film layer on the wafer surface will directly affect the subsequent lithography process performance, which will cause the irregular distribution of the photoresist on the wafer surface, and then reduce the accuracy of subsequent focusing and exposure line width, resulting in the failure of semiconductor devices.
[0003] The prior art uses a single-drop polishing liquid cantilever, and the polishing liquid will be concentrated in a small range where the polishing head swings. As a result, most of the polishing liquid is thrown away from the polishing pad during the first collision with the polishing head, and only a small part is effectively utilized. Therefore, in the process adjustment of the wafer surface topography, it is difficult to meet the flatness requirements of the wafer by changing the pressure distribution of the polishing head. Moreover, if polishing is performed at a position where the polishing liquid distribution is insufficient, it is very easy to form defects, seriously affecting production costs and production efficiency. Summary of the Utility Model
[0004] Embodiments of the present disclosure provide a semiconductor polishing liquid delivery device and a semiconductor polishing equipment, which can improve the distribution uniformity of the semiconductor polishing liquid.
[0005] According to a first aspect of the present disclosure, there is provided a semiconductor polishing liquid delivery device, including:
[0006] A rotating shaft, whose central axis extends along the height direction;
[0007] A first cantilever, extending along the radial direction of the rotating shaft, the first cantilever is rotatably connected to the rotating shaft around the central axis, and a first polishing liquid nozzle is provided at a first end of the first cantilever far from the rotating shaft; and
[0008] A second cantilever, extending along the radial direction of the rotating shaft, rotatably connected to the rotating shaft around the central axis, a second polishing liquid nozzle is provided at a second end of the second cantilever far from the rotating shaft, the second cantilever is located above the first cantilever, and the first cantilever and the second cantilever are independently arranged.
[0009] In some embodiments, along the height direction, the outlets of the first polishing liquid nozzle and the second polishing liquid nozzle are flush.
[0010] In some embodiments, the length of the second cantilever is greater than that of the first cantilever. A protruding portion is provided at the second end of the second cantilever. The protruding portion is flush with the bottom surface of the first cantilever in the height direction. The first abrasive liquid nozzle is provided at the bottom of the first end of the first cantilever, and the second abrasive liquid nozzle is located at the bottom of the protruding portion. The distribution locus of all the second abrasive liquid nozzles is entirely located outside the distribution locus of all the first abrasive liquid nozzles.
[0011] In some embodiments,
[0012] The first end of the first cantilever sweeps across the first region during its own rotation, and the protruding portion sweeps across the second region during its own rotation. The first region and the second region are arranged at intervals in the radial direction of the rotation axis; and / or
[0013] In the radial direction of the rotation axis, the end face of the first end of the first cantilever is the first end face, and the maximum distance from the points on the first end face to the central axis is the first distance. The end face of the protruding portion close to the first end is the second end face, and the minimum distance from the points on the second end face to the central axis is the second distance. The first distance is not greater than the second distance.
[0014] In some embodiments, a plurality of cleaning liquid nozzles are provided at the bottom of the first cantilever. The cleaning nozzles are configured to spray cleaning liquid to clean debris, and the plurality of cleaning liquid nozzles are arranged at intervals along the extending direction of the first cantilever.
[0015] In some embodiments, a first cavity is provided inside the first cantilever. A cleaning liquid pipeline and a first abrasive liquid pipeline are arranged in the first cavity. The first abrasive liquid pipeline is communicated with the first abrasive liquid nozzle. A second cavity is provided inside the second cantilever. A second abrasive liquid pipeline is arranged in the second cavity. The second abrasive liquid pipeline is communicated with the second abrasive liquid nozzle. Both the first cavity and the second cavity extend in the radial direction of the rotation axis. In the height direction, the height of the first cavity is less than the height of the second cavity.
[0016] In some embodiments,
[0017] A first limit and reset mechanism is provided between the first cantilever and the rotation axis. The first limit and reset mechanism is configured to fix the first cantilever at a desired position and is configured to reset the first cantilever from the desired position to the initial position; and / or
[0018] A second limit and reset mechanism is provided between the second cantilever and the rotation axis. The second limit and reset mechanism is configured to fix the second cantilever at a desired position and is configured to reset the second cantilever from the desired position to the initial position.
[0019] In some embodiments, the semiconductor abrasive liquid delivery device further includes:
[0020] A first driving mechanism, disposed within the rotating shaft, configured to drive the first cantilever to rotate about the central axis; and / or
[0021] A second driving mechanism, disposed within the rotating shaft, configured to drive the second cantilever to rotate about the central axis.
[0022] In some embodiments, the first cantilever includes a side plate, and the semiconductor polishing slurry delivery device further includes:
[0023] A third polishing slurry nozzle, disposed on the side plate, and the third polishing slurry nozzle and the first polishing slurry nozzle are arranged at a radial interval along the rotating shaft.
[0024] According to a second aspect of the present disclosure, there is provided a semiconductor polishing apparatus, including:
[0025] A polishing pad;
[0026] A semiconductor carrier, configured to fix a semiconductor and apply pressure thereto to contact the polishing pad; and
[0027] The semiconductor polishing slurry delivery device of the above embodiment.
[0028] Based on the above technical solutions, the semiconductor polishing slurry delivery device of the embodiments of the present disclosure has a compact structure. By setting the first cantilever and the second cantilever to respectively adjust the polishing slurry landing positions of the first polishing slurry nozzle and the second polishing slurry nozzle, it is possible to achieve fine control of the polishing slurry landing point, expand the distribution range of the polishing slurry, improve the distribution uniformity of the semiconductor polishing slurry, and reduce the waste of the polishing slurry; it can avoid the movement range of the polishing head, improve the process safety, reduce the difficulty of process adjustment, and at the same time provide a more flexible process adjustment method for some process nodes with special requirements, and provide a larger process window for special process nodes; it can make semiconductors such as wafers meet the flatness requirements, avoid forming defects on the semiconductor surface, thereby reducing production costs and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The drawings described herein are used to provide a further understanding of the present disclosure, and constitute a part of this application. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation of the present disclosure. In the drawings:
[0030] Figure 1 It is a schematic structural diagram of some embodiments of the semiconductor polishing slurry delivery device of the present disclosure.
[0031] Figure 2 It is a schematic structural diagram of some embodiments of the first cantilever of the semiconductor polishing slurry delivery device of the present disclosure.
[0032] Figure 3 It is a schematic structural diagram of some embodiments of the second cantilever of the semiconductor polishing slurry delivery device of the present disclosure.
[0033] Figure 4 These are the structural schematic diagram and the grinding fluid flow field schematic diagram of some embodiments of the semiconductor grinding equipment disclosed in the present disclosure.
[0034] Figure 5 These are the structural schematic diagram and the grinding fluid flow field schematic diagram of the semiconductor grinding equipment in the prior art.
[0035] Description of the reference numerals
[0036] 1. Rotating shaft; 10. First cantilever; 11. First grinding fluid nozzle; 12. Cleaning fluid nozzle; 13. Side plate; 20. Second cantilever; 21. Protrusion; 22. Second grinding fluid nozzle; 33. Third grinding fluid nozzle; 100. First end face; 200. Second end face; 101. Grinding pad; 102. Semiconductor carrier; z. Height direction. Detailed implementation manners
[0037] The present disclosure is described in detail below. In the following paragraphs, different aspects of the embodiments are defined in more detail. Each aspect so defined can be combined with any other one or more aspects, unless clearly stated that they cannot be combined. In particular, any feature considered to be preferred or advantageous can be combined with one or more other features considered to be preferred or advantageous.
[0038] The terms "first", "second", etc. used in the present disclosure are only for convenience of description to distinguish different components with the same name, and do not indicate a sequence or primary-secondary relationship.
[0039] In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by the terms "inner", "outer", "upper", "lower", "front", "rear", etc. is defined based on the rotating shaft, the first cantilever or the second cantilever, etc., and is only for the convenience of describing the present disclosure, rather than indicating or implying that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the protection scope of the present disclosure.
[0040] The inventor found during the research process that the cantilever of the single-cantilever mechanical grinding equipment in the related art is used to provide a pipeline for transporting the grinding fluid to the nozzle, and relies on the rotation of the large disk to disperse the grinding fluid onto the disk surface. However, the grinding fluid flow field provided by it in chemical mechanical grinding is extremely narrow, and the flow field distribution is affected by factors such as the rotation speed of the large disk, the landing position of the grinding fluid, and the flow rate of the grinding fluid. It is difficult to completely cover the swing interval of the polishing head, and the distribution uniformity of the semiconductor grinding fluid is poor.
[0041] To solve the above problems, first, the present disclosure provides a semiconductor grinding fluid delivery device, as Figures 1 to 4 shown, including:
[0042] A rotating shaft 1, whose central axis extends along the height direction z;
[0043] A first cantilever 10, extending radially along the rotating shaft 1, the first cantilever 10 is rotatably connected to the rotating shaft 1 about the central axis, and a first abrasive liquid nozzle 11 is provided at the first end of the first cantilever 10 away from the rotating shaft 1; and
[0044] A second cantilever 20, extending radially along the rotating shaft 1, rotatably connected to the rotating shaft 1 about the central axis, a second abrasive liquid nozzle 22 is provided at the second end of the second cantilever 20 away from the rotating shaft 1, the second cantilever 20 is located above the first cantilever 10, and the first cantilever 10 and the second cantilever 20 are independently arranged.
[0045] Specifically, both the first cantilever 10 and the second cantilever 20 of the present disclosure can rotate about the central axis, which is convenient for equipment engineers to use a jig to adjust the landing position of the abrasive liquid. Specifically, compared with Figure 5 the traditional single-cantilever structure shown, by changing the rotation angles of the double cantilevers, the present disclosure can control the landing positions of the abrasive liquid of the first abrasive liquid nozzle 11 and the second abrasive liquid nozzle 22, expand the distribution range of the abrasive liquid, and improve the distribution uniformity of the semiconductor abrasive liquid.
[0046] Specifically, the first cantilever 10 and the second cantilever 20 can be staggeredly arranged, and the degree of freedom of choice for the landing point of the abrasive liquid is higher. After determining one landing point, the other landing point will not be restricted by the angle. Specifically, by providing the first cantilever 10 and the second cantilever 20, when equipment engineers change the relative positions of the landing points of the abrasive liquid, they can directly adjust the first cantilever 10 and the second cantilever 20 and fix them at the required positions without additional operations such as adjusting the abrasive liquid pipeline.
[0047] Specifically, at the same flow rate, the double abrasive liquid cantilevers can make the concentrated abrasive liquid more dispersed, reducing the loss when the abrasive liquid first collides with the polishing head; at the same time, it is equivalent to providing two landing positions for the abrasive liquid. Compared with a single landing point, at the same large disk rotation speed, it can cover a larger swing range of the polishing head; and for special types of abrasive liquid that are mixed and used on the large disk, it can provide a more flexible liquid mixing method.
[0048] Optionally, the distance between the first abrasive liquid nozzle 11 and the central axis can be greater than the distance between the second abrasive liquid nozzle 22 and the central axis, or can be less than the distance between the second abrasive liquid nozzle 22 and the central axis, and can be set according to the actual needs of the polishing head. Optionally, one or more first abrasive liquid nozzles 11 and second abrasive liquid nozzles 22 can be provided, for example, three are provided, and the three nozzles are communicated with three abrasive liquid pipelines in the cantilever.
[0049] Optionally, the rotation of the first cantilever 10 and the second cantilever 20 can be manually controlled by the equipment engineer or controlled by a driving component. Specifically, when the rotation of the first cantilever 10 and the second cantilever 20 is manually controlled by the equipment engineer, there is no need to add an additional waterproof device for driving components such as motors, which can save space; it is possible to avoid adding additional regulation for controlling driving components such as motors, avoid program errors, and reduce the load on the machine platform processor; the cantilever at the fixed point has limited movement space on the large disk, and even when there are problems with the polishing conditions, it is possible to avoid collisions with the polishing head or the diamond anvil; when set reasonably, it will not affect the movement range of the polishing head and the diamond anvil, and can reduce the difficulty of process adjustment.
[0050] The grinding fluid delivery device of this embodiment has a compact structure. By setting the first cantilever 10 and the second cantilever 20 to adjust the landing positions of the grinding fluid of the first grinding fluid nozzle 11 and the second grinding fluid nozzle 22 respectively, it is possible to achieve precise control of the grinding fluid landing point, expand the distribution range of the grinding fluid, improve the distribution uniformity of the semiconductor grinding fluid, and reduce the waste of the grinding fluid; it can avoid the movement range of the polishing head, improve process safety, reduce the difficulty of process adjustment, and at the same time provide a more flexible process adjustment method for some process nodes with special requirements, and provide a larger process window for special process nodes; it can make semiconductors such as wafers meet the flatness requirements, avoid forming defects on the semiconductor surface, thereby reducing production costs and improving production efficiency.
[0051] In some embodiments, as Figure 1 shown, along the height direction z, the outlets of the first grinding fluid nozzle 11 and the second grinding fluid nozzle 22 are flush.
[0052] By making the outlets of the first grinding fluid nozzle 11 and the second grinding fluid nozzle 22 flush in this embodiment, the grinding fluid nozzles of the upper cantilever and the lower cantilever can be at the same horizontal height, avoiding the grinding fluid from splashing due to the excessive distance between the landing point of the grinding fluid and the large disk, thereby improving process stability.
[0053] In some embodiments, as Figures 1 to 3 shown, the length of the second cantilever 20 is greater than the length of the first cantilever 10. A protruding portion 21 is provided at the second end of the second cantilever 20. The protruding portion 21 is flush with the bottom surface of the first cantilever 10 along the height direction z. The first grinding fluid nozzle 11 is provided at the bottom of the first end of the first cantilever 10, and the second grinding fluid nozzle 22 is located at the bottom of the protruding portion 21. The distribution trajectories of all the second grinding fluid nozzles 22 are entirely located outside the distribution trajectories of all the first grinding fluid nozzles 11.
[0054] Specifically, by making the protrusion 21 flush with the bottom surface of the first cantilever 10 in the height direction z and positioning the second abrasive liquid nozzle 22 at the bottom of the protrusion 21, an installation position can be provided for the second abrasive liquid nozzle 22, thereby making the first abrasive liquid nozzle 11 and the second abrasive liquid nozzle 22 flush with each other.
[0055] Specifically, the distribution trajectories of all the second abrasive liquid nozzles 22 are entirely located outside the distribution trajectories of all the first abrasive liquid nozzles 11, such that the double-layer cantilever does not additionally occupy the planar area on the polishing pad 101. Specifically, the length of the first cantilever 10 is less than the length of the second cantilever 20, enabling the double-layer cantilever arrangement without occupying additional length space and avoiding affecting the movement of the polishing head. Specifically, the first cantilever 10 itself comes in different lengths, and slightly reducing the cantilever length will not affect the cleaning effect of cleaning liquids such as high-pressure water on the platen.
[0056] The protrusion 21 of this embodiment can provide an installation position for the second abrasive liquid nozzle 22, facilitating the alignment of the first abrasive liquid nozzle 11 and the second abrasive liquid nozzle 22 and improving process stability; the distribution trajectories of all the second abrasive liquid nozzles 22 are entirely located outside the distribution trajectories of all the first abrasive liquid nozzles 11, such that the double-layer cantilever does not additionally occupy the planar area, reducing the impact on the process adjustment window and ensuring that the newly added upper-layer cantilever does not affect the swing range of the polishing head.
[0057] In some embodiments,
[0058] The first end of the first cantilever 10 sweeps across a first region during its own rotation, and the protrusion 21 sweeps across a second region during its own rotation. The first region and the second region are arranged at intervals along the radial direction of the rotation axis 1; and / or
[0059] Along the radial direction of the rotation axis, the end face of the first end of the first cantilever 10 is the first end face 100, the maximum distance from the points on the first end face 100 to the central axis is the first distance, the end face of the protrusion 21 near the first end is the second end face 200, the minimum distance from the points on the second end face 200 to the central axis is the second distance, and the first distance is not greater than the second distance.
[0060] Optionally, the first end face 100 and the second end face 200 can be adapted smooth structures, such as arc-shaped end faces.
[0061] The first region and the second region of this embodiment are arranged at intervals along the radial direction of the rotation axis 1, and / or the first distance is not greater than the second distance, facilitating the cross movement of the first cantilever 10 and the second cantilever 20 and enhancing the flexibility of the cantilever position.
[0062] In some embodiments, such as Figure 1 and Figure 2As shown, a plurality of cleaning liquid nozzles 12 are provided at the bottom of the first cantilever 10. The cleaning nozzles are configured to eject cleaning liquid to clean debris, and the plurality of cleaning liquid nozzles 12 are arranged at intervals along the extending direction of the first cantilever 10.
[0063] Specifically, the debris includes polishing by-products generated during the polishing process and residual grinding liquid, etc. Specifically, the extending direction of the first cantilever 10 is the radial direction of the rotating shaft 1.
[0064] Optionally, the plurality of cleaning liquid nozzles 12 are arranged at intervals along the extending direction of the first cantilever 10. Optionally, the cleaning liquid can be high-pressure water or deionized water, etc.
[0065] In this embodiment, by providing the cleaning liquid nozzles 12 at the bottom of the first cantilever 10, it is possible to remove the polishing by-products generated during the polishing process and the residual grinding liquid, ensure the cleanliness of the polishing pad, and improve the uniformity and stability of the ground products.
[0066] In some embodiments, a first cavity is provided inside the first cantilever 10. A cleaning liquid pipeline and a first grinding liquid pipeline are arranged in the first cavity. The first grinding liquid pipeline is connected to the first grinding liquid nozzle 11. A second cavity is provided inside the second cantilever 20. A second grinding liquid pipeline is arranged in the second cavity. The second grinding liquid pipeline is connected to the second grinding liquid nozzle 22. Both the first cavity and the second cavity extend along the radial direction of the rotating shaft 1. Along the height direction z, the height of the first cavity is less than the height of the second cavity.
[0067] Optionally, multiple first grinding liquid pipelines and second grinding liquid pipelines can be provided, for example, three. Optionally, the cover plate on the rotating shaft of the lower cantilever can be made into the base of the rotating shaft of the upper cantilever. The height of the first cantilever 10 can leave sufficient space for the relatively thick high-pressure water pipeline and the elastic reset / station locking structure of the base part of the rotating shaft of the upper cantilever. Optionally, reducing the height of the second cantilever can make full use of the chamber space of the polishing equipment and will not interfere with the stations of the upper pneumatic components (Up Pneumatic Assembly).
[0068] In this embodiment, no cleaning liquid pipeline is provided in the second cavity, which can reduce the pipeline distribution in the cavity, reduce the height of the second cavity, and further make the second cantilever 20 thinner and lighter, which can fully adapt to the limited space in the machine chamber and avoid interference between the second cantilever 20 and other components.
[0069] In some embodiments,
[0070] A first limit and reset mechanism is provided between the first cantilever 10 and the rotating shaft 1. The first limit and reset mechanism is configured to fix the first cantilever 10 at the required position and is configured to reset the first cantilever 10 from the required position to the initial position; and / or
[0071] A second limiting and resetting mechanism is provided between the second cantilever 20 and the rotating shaft 1. The second limiting and resetting mechanism is configured to fix the second cantilever 20 at a desired position and to reset the second cantilever 20 from the desired position to the initial position.
[0072] Specifically, in the initial state, the positions of the first cantilever 10 and the second cantilever 20 are the initial position or the reset position. Specifically, the equipment engineer can manually fix the first cantilever 10 and the second cantilever 20 at the desired positions respectively as needed to provide two circumferentially spaced positions for the grinding fluid to fall. Specifically, the first limiting and resetting mechanism and the second limiting and resetting mechanism ensure that the grinding fluid only falls at the designated positions by fixing the positions of the first cantilever 10 and the second cantilever 20 respectively.
[0073] Optionally, the reset position can be used as a safe position when the cantilever is not in the working state, reducing the risk of accidental collision, and also facilitating maintenance and inspection. Optionally, the first limiting and resetting mechanism and / or the second limiting and resetting mechanism can be implemented by using springs, screws, electromagnets, pneumatic or hydraulic components, etc. to achieve position holding and resetting.
[0074] By providing the first limiting and resetting mechanism and the second limiting and resetting mechanism, this embodiment can improve the usability of the grinding fluid delivery device and improve the user experience of the equipment engineer.
[0075] In some embodiments, the semiconductor grinding fluid delivery device further includes:
[0076] A first driving mechanism, provided inside the rotating shaft 1, configured to drive the first cantilever 10 to rotate around the central axis; and / or
[0077] A second driving mechanism, provided inside the rotating shaft 1, configured to drive the second cantilever 20 to rotate around the central axis.
[0078] Optionally, the driving mechanism can be a motor, etc. For example, by adding a motor to the rotating shaft 1 and adding the system control of the main machine, the first cantilever 10 and the second cantilever 20 can move freely in an arc on the large plate, ensuring that the grinding fluid is distributed on all parts of the polishing pad 101 during the polishing process.
[0079] By providing the driving mechanism, this embodiment can improve the uniformity of the grinding fluid distribution. By adjusting the position of the grinding fluid cantilever through the driving mechanism, the interference of human factors can be reduced, and it is more convenient for the equipment engineer to check or verify the machine table by driving the grinding fluid cantilever.
[0080] Optionally, when only the first cantilever 10 is provided without the second cantilever 20, the uniformity of the grinding fluid distribution can also be improved by providing the driving mechanism.
[0081] In some embodiments, such as Figure 1 shown, the first cantilever 10 includes a side plate 13, and the semiconductor polishing slurry delivery device further includes:
[0082] A third polishing slurry nozzle 33, disposed on the side plate 13, and the third polishing slurry nozzle 33 and the first polishing slurry nozzle 11 are arranged at a radial interval along the rotation axis 1.
[0083] Specifically, by adding a polishing slurry landing point on the side plate 13 of the first cantilever 10, the polishing slurry can have more landing point options, which can ensure that the polishing slurry is distributed on each part of the polishing pad 101 during the polishing process, and improve the uniformity of the polishing slurry distribution.
[0084] Optionally, along the height direction z, the outlets of the first polishing slurry nozzle 11 and the third polishing slurry nozzle 33 are flush.
[0085] In this embodiment, the third polishing slurry nozzle 33 is disposed on the side plate 13 of the first cantilever 10, with a simple structure and easy to implement, which can enable the polishing slurry to have more landing point options and improve the uniformity of the polishing slurry distribution.
[0086] Optionally, in the case where only the first cantilever 10 is provided without the second cantilever 20, the uniformity of the polishing slurry distribution can also be improved by disposing the third polishing slurry nozzle 33 on the side plate 13 of the first cantilever 10.
[0087] Specifically, as the main component affecting chemical mechanical polishing, the distribution of the polishing slurry on the polishing pad 101 will greatly affect the uniformity of the entire polishing process, and the flatness and defects of the film layer on the wafer surface will directly affect the process performance of subsequent lithography. It will cause the irregular distribution of the photoresist on the wafer surface, thereby reducing the accuracy of subsequent focusing and exposure line width, and resulting in the failure of semiconductor devices.
[0088] To solve the above problems, the present disclosure also provides a semiconductor polishing apparatus, including:
[0089] A polishing pad 101;
[0090] A semiconductor carrier 102, configured to fix the semiconductor and apply pressure thereto to contact the polishing pad 101; and
[0091] The semiconductor polishing slurry delivery device of the above embodiment.
[0092] Specifically, the semiconductor polishing slurry delivery device is used to deliver the polishing slurry to the polishing pad 101. The semiconductor carrier 102 includes a polishing head. The polishing pad 101 rotates during the polishing process, and the polishing head swings during the polishing process. Optionally, the polishing pad 101 can be referred to as a large disk, and the semiconductor can include wafers and the like.
[0093] The semiconductor polishing equipment of this embodiment has a compact abrasive slurry delivery device. By separately adjusting the landing positions of the abrasive slurry of the first abrasive slurry nozzle 11 and the second abrasive slurry nozzle 22, the distribution uniformity of the semiconductor abrasive slurry is high; the process safety is high, the difficulty of process adjustment is low, and a larger process window can be provided for special process nodes; it can make semiconductors such as wafers meet the flatness requirements and avoid forming defects on the semiconductor surface; it can improve the accuracy of subsequent focusing and exposure line width, thereby improving the quality of semiconductor devices.
[0094] The above has introduced in detail a semiconductor abrasive slurry delivery device and semiconductor polishing equipment provided by the present disclosure. Specific embodiments are used herein to elaborate on the principles and implementation manners of the present disclosure. The description of the above embodiments is only used to help understand the method and its core idea of the present disclosure. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present disclosure, several improvements and modifications can be made to the present disclosure, and these improvements and modifications also fall within the protection scope of the claims of the present disclosure.
Claims
1. A semiconductor polishing liquid delivery device, characterized in that: include: A rotation axis (1) having a central axis extending in a height direction (z); a first cantilever (10) extending in a radial direction of the rotating shaft (1); the first cantilever (10) being rotatably connected to the rotating shaft (1) around the central axis; a first polishing liquid nozzle (11) being provided at a first end of the first cantilever (10) away from the rotating shaft (1); and The second cantilever (20) extends radially along the rotating shaft (1) and is rotatably connected to the rotating shaft (1) around the central axis. A second grinding liquid nozzle (22) is provided at a second end of the second cantilever (20) away from the rotating shaft (1). The second cantilever (20) is located above the first cantilever (10). The first cantilever (10) and the second cantilever (20) are independently arranged.
2. The semiconductor polishing liquid delivery device according to claim 1, characterized in that: Along the height direction (z), the outlet of the first grinding liquid nozzle (11) and the outlet of the second grinding liquid nozzle (22) are flush.
3. The semiconductor polishing liquid delivery device according to claim 2, characterized in that: The length of the second cantilever (20) is greater than that of the first cantilever (10); a protrusion (21) is provided at the second end of the second cantilever (20); the protrusion (21) is flush with the bottom surface of the first cantilever (10) along the height direction (z); the first grinding liquid nozzle (11) is provided at the bottom of the first end of the first cantilever (10); the second grinding liquid nozzle (22) is located at the bottom of the protrusion (21); and the distribution tracks of all the second grinding liquid nozzles (22) are located outside the distribution tracks of all the first grinding liquid nozzles (11).
4. The semiconductor polishing liquid delivery device according to claim 3, characterized in that: The first end of the first cantilever (10) sweeps over a first area during its own rotation, and the protrusion (21) sweeps over a second area during its own rotation, and the first area and the second area are arranged at intervals along the radial direction of the rotation axis (1); and / or Along the radial direction of the rotation axis (1), the first end face of the first cantilever (10) is a first end face (100), the maximum distance between a point on the first end face (100) and the central axis is a first distance, the end face of the protrusion (21) close to the first end is a second end face (200), the minimum distance between a point on the second end face (200) and the central axis is a second distance, and the first distance is not greater than the second distance.
5. The semiconductor polishing liquid delivery device according to claim 1, characterized in that: A plurality of cleaning liquid nozzles (12) are provided at the bottom of the first cantilever (10), the cleaning liquid nozzles (12) being configured to spray cleaning liquid to clean debris, and the plurality of cleaning liquid nozzles (12) are arranged at intervals along the extension direction of the first cantilever (10).
6. The semiconductor polishing liquid delivery device according to claim 5, characterized in that: A first cavity is provided in the first cantilever (10), a cleaning liquid pipeline and a first grinding liquid pipeline are arranged in the first cavity, the first grinding liquid pipeline is connected to the first grinding liquid nozzle (11), a second cavity is provided in the second cantilever (20), a second grinding liquid pipeline is arranged in the second cavity, the second grinding liquid pipeline is connected to the second grinding liquid nozzle (22), the first cavity and the second cavity both extend radially along the rotation axis (1), and along the height direction (z), the height of the first cavity is smaller than the height of the second cavity.
7. The semiconductor polishing liquid delivery device according to claim 1, characterized in that: A first position limiting and resetting mechanism is provided between the first cantilever (10) and the rotating shaft (1), the first position limiting and resetting mechanism being configured to fix the first cantilever (10) at a desired position and to reset the first cantilever (10) from the desired position to an initial position; and / or A second position limiting and resetting mechanism is provided between the second cantilever (20) and the rotating shaft (1), and the second position limiting and resetting mechanism is configured to fix the second cantilever (20) at a desired position, and is configured to reset the second cantilever (20) from the desired position to an initial position.
8. The semiconductor polishing liquid delivery device according to any one of claims 1 to 7, characterized in that: Also includes: a first driving mechanism, disposed in the rotating shaft (1), configured to drive the first cantilever (10) to rotate around the central axis; and / or The second driving mechanism is arranged in the rotating shaft (1) and is configured to drive the second cantilever (20) to rotate around the central axis.
9. The semiconductor polishing liquid delivery device according to any one of claims 1 to 7, characterized in that: The first cantilever (10) comprises a side plate (13), and the semiconductor polishing liquid delivery device further comprises: The third grinding liquid nozzle (33) is arranged on the side plate (13), and the third grinding liquid nozzle (33) and the first grinding liquid nozzle (11) are arranged at intervals along the radial direction of the rotating shaft (1).
10. A semiconductor polishing device, characterized in that: include: Abrasive pad (101); a semiconductor carrier (102) configured to fix the semiconductor and press it to contact the polishing pad (101); and A semiconductor polishing liquid delivery device as described in any one of claims 1 to 9.