Plasma enhanced vapor deposition device

Abstract

The utility model discloses a plasma enhanced vapor deposition device, which comprises a plasma generating system, a spray header, a process cavity and a lifting device, the plasma generating system comprises a first electrode bar, a first electrode branch and a second electrode tube, a first electrode plate is arranged in the spray header, and a second electrode plate is arranged in the process cavity. The first electrode branch is electrically connected with the first electrode plate, the second electrode tube is connected with a spray header protection cover, the second electrode tube and the spray header protection cover form a conductive path, a conductive ring is mounted at the bottom of the spray header protection cover, a cavity connecting part is arranged on the process cavity, and the spray header protection cover is connected with the cavity connecting part of the process cavity through the conductive ring. The cavity body connecting part is provided with a conductive groove tightly connected with the conductive ring, and the cavity body outer wall heating plate, the base material heater, the spray head cooling flow channel and the spray head cover plate cooling flow channel are combined to control the temperature of the spray head, so that the reactant state is controlled, the plasma uniformity is enhanced, and the coating quality is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment manufacturing, in particular to a plasma enhanced chemical vapor deposition device. Background Art

[0002] When manufacturing devices such as semiconductor devices, flat panel displays, and solar cells, it is necessary to deposit various materials on a substrate and pattern the obtained substrate. Plasma enhanced chemical vapor deposition equipment is widely used in various coating processes due to its low coating temperature and excellent coating performance.

[0003] [Patent US201917050779A] discloses a substrate processing device in which a main plasma space is formed between a first electrode and a second electrode on which a substrate is mounted. A second nozzle injects a second gas into an auxiliary plasma space to form an auxiliary plasma. The first nozzle supplies a first gas to the main plasma space, and the second nozzle supplies a second gas to the auxiliary plasma space. The generation efficiency of local plasma can be controlled using a gas injection part to improve substrate processing characteristics.

[0004] [Patent KR20140174725A] discloses a substrate processing device in which the distance between the outer surface of an electrode rod and the outer surface of a second electrode through hole surrounding the electrode rod is 1.5 mm to 20 mm. This can improve the gas decomposition rate, increase the deposition rate of the film deposited on the substrate, and thus improve the quality of the film deposited on the substrate.

[0005] Existing patents do not mention the temperature control of the cavity and the shower head, and the control of particle generation and film deposition uniformity is still slightly insufficient. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a plasma enhanced chemical vapor deposition device. By combining a heating plate on the outer wall of the cavity, a substrate heater, a shower head cooling channel, and a shower head cover cooling channel, the temperature of the shower head is controlled, thereby controlling the state of reactants, enhancing plasma uniformity, and improving coating quality.

[0007] The above technical purpose of the utility model is achieved through the following technical solutions:

[0008] A plasma enhanced chemical vapor deposition device includes a plasma generation system, a showerhead, a process chamber, and a lifting device. The plasma generation system includes a first electrode rod, a first electrode branch, and a second electrode tube. A first electrode plate is installed inside the showerhead. The first electrode branch is electrically connected to the first electrode plate. The second electrode tube is connected to a showerhead protection cover, and the second electrode tube and the showerhead protection cover form an electrically conductive path. A conductive ring is installed at the bottom of the showerhead protection cover. A cavity connection part is provided on the process chamber, and the showerhead protection cover is connected to the cavity connection part of the process chamber through the conductive ring. The cavity connection part is provided with a conductive groove that is tightly connected to the conductive ring. A showerhead cover plate, a cooling water channel cover plate, a second gas equalizing plate, a first gas equalizing plate, and a second electrode post are also installed inside the showerhead. A main cavity is also provided on the process chamber. An external heating plate is provided on the outer wall of the main cavity, and an internal heating plate is provided inside the main cavity. The lifting mechanism is a heating plate lifting mechanism. A bracket is installed at the bottom of the main cavity, and the heating plate lifting mechanism is fixedly connected to the main cavity through the bracket.

[0009] Preferably, an L-shaped insulating ring and an insulating plate are provided on the upper part of the first electrode plate. The first electrode plate and other parts of the showerhead are insulated through the L-shaped insulating ring and the insulating plate. An electrode plate cooling water flow channel is provided at the upper end of the first electrode plate.

[0010] Preferably, the showerhead cover plate is installed at the bottom of the showerhead protection cover. A cooling water flow channel is provided on the upper surface of the showerhead cover plate. The cooling water flow channel can be any one of a ring shape, a return shape, or a bow shape. The cross-sectional shape and area of the cooling water flow channel can be different according to different heat exchange amounts and can be any one of a rectangle, a trapezoid, or a semi-circle. The cooling water channel cover plate is provided above the showerhead cover plate, and the cooling water channel cover plate is fixedly welded to the showerhead cover plate. A cooling water inlet and outlet for connecting a cooling water channel inlet and outlet joint and an interface for connecting each gas joint are provided on the cooling water channel cover plate.

[0011] Preferably, the spray head is provided with a first gas guiding passage and a second gas guiding passage. The first gas guiding passage starts from the first gas injection port. The second gas equalizing plate is installed at the bottom of the spray head cover plate. The first gas equalizing plate is installed at the bottom of the second gas equalizing plate. A second gas distribution space corresponding to the second gas equalizing plate is provided at the bottom of the spray head cover plate. A first gas distribution space and first gas guiding holes are provided on the first gas equalizing plate. The first injection port passes through the spray head cover plate, the second gas distribution space and the second gas equalizing plate. The first gas distribution space corresponds to the second gas equalizing plate. Gas guiding holes are provided on the insulating plate, and the gas guiding holes correspond to the first gas guiding holes. An annular ionization region is further provided between the first electrode plate and the second electrode column. Electrode gas guiding holes are also provided on the second electrode column;

[0012] The second gas guiding passage starts from the second gas injection port. Gas guiding holes corresponding to the second gas injection port are provided on the spray head cover plate. Second gas distribution holes are provided on the second gas equalizing plate. Second gas guiding holes corresponding to the second gas distribution holes are further provided on the first gas equalizing plate. The second electrode column is installed at the lower ends of the second gas guiding holes.

[0013] Preferably, the heating plate lifting mechanism includes a lifting platform and a leveling screw. The lifting platform is installed at the moving part of the heating plate lifting mechanism. A horizontal adjustment platform is connected to the upper part of the lifting platform through an adjustment screw. Support rods are installed at the lower part of the inner heating plate. The horizontal adjustment platform is connected to the inner heating plate through the support rods. A vacuum bellows is connected between the horizontal adjustment platform and the main cavity. The support rods pass through the vacuum bellows to connect with the horizontal adjustment platform. Guide rods are also installed on the bracket. The upper end of the guide rod is fixed to the bottom of the main cavity. The middle part of the guide rod is connected to the horizontal adjustment platform through a linear bearing. The lower end of the guide rod is fixed to the lower part of the bracket.

[0014] Preferably, a jacking rod is further installed at the bottom of the inner heating plate. The upper end of the jacking rod is provided with a cone head larger than the diameter of the straight rod. The top end of the cone head is arc-shaped. A jacking rod hole is provided at the bottom of the inner heating plate. A conical groove for placing the cone head is provided at the upper part of the jacking rod hole.

[0015] Preferably, the lower end of the jacking rod is provided with a thread. A retaining piece is further installed at the lower end of the jacking rod. The retaining piece is stopped at the lower end of the jacking rod by a nut.

[0016] Preferably, a cylinder support is further installed at the bottom of the main cavity. A jacking cylinder is installed on the cylinder support. The cylinder body of the jacking cylinder is connected to the main cavity through the cylinder support. A cylinder ejector rod is installed on the piston rod of the jacking cylinder. A rod jacking plate is installed at the top of the cylinder ejector rod. The rod jacking plate is installed at the bottom of the jacking rod.

[0017] Beneficial effects: In this application, a plasma generation system, a spray head, a process cavity, and a lifting device are provided; the spray head has two independent gas passages; there is an insulating material between the first electrode plate and the second electrode plate of the spray head; the spray head has an independent cooling flow channel; the outer wall of the process cavity has a heating device; the substrate lifting device has a heating function, which solves the problem that the temperature of the cavity and the spray head could not be controlled in the past. By combining the heating plate on the outer wall of the cavity, the substrate heater, the cooling flow channel of the spray head, and the cooling flow channel of the spray head cover plate, the temperature of the spray head is controlled, thereby controlling the state of the reactants, enhancing the plasma uniformity, and improving the coating quality. Description of the Drawings

[0018] Figure 1 It is the oblique side view of the overall structure schematic diagram of the embodiment;

[0019] Figure 2 It is the front sectional view of the embodiment except for the plasma power supply;

[0020] Figure 3 It is the front partial sectional view of the spray head of the embodiment;

[0021] Figure 4 It is the top view of the spray head cover plate of the embodiment;

[0022] Figure 5 It is the side view of the overall structure of the embodiment;

[0023] Figure 6 It is the sectional view of the substrate jacking structure in the cavity of the embodiment;

[0024] Figure 7 It is the sectional view of the jacking rod in the cavity of the embodiment.

[0025] Reference Numerals: 1, plasma generation system; 102, first electrode rod; 103, first electrode branch; 104, second electrode tube; 2, spray head; 211, spray head protective cover; 214, conductive ring; 215, first gas injection port; 216, second gas injection port; 222, first electrode plate; 222a, electrode plate cooling water channel; 223, L-shaped insulating ring; 224, second electrode column; 224a, electrode air guide hole; 225, insulating plate; 225a, air guide hole; 226, first gas equalizing plate; 226a, first gas distribution space; 226b, first gas guide hole; 226c, second gas guide hole; 227, second gas equalizing plate; 227a, second gas distribution hole; 228, spray head cover plate; 228a, second gas distribution space; 228b, cooling water channel; 229, cooling water channel cover plate; 3, process chamber; 301, external heating plate; 302, main chamber; 303, internal heating plate; 303a, conical groove; 304, lifting rod; 304a, conical head; 305, chamber connection part; 306, special-shaped insulating ring; 307, lifting plate for the lifting rod; 308, retaining piece; 4, lifting device; 411, heating plate lifting mechanism; 412, bracket; 413, guide rod; 414, lifting platform; 415, horizontal adjustment platform; 416, leveling screw; 417, large vacuum bellows; 421, lifting cylinder; 422, cylinder bracket; 423, cylinder lifting rod; 424, vacuum bellows. Detailed Embodiment

[0026] Figures 1-7 A preferred embodiment is a plasma enhanced chemical vapor deposition apparatus, which includes a plasma generation system 100, a spray head 200, a process chamber 300, and a lifting device 400.

[0027] In addition to the power supply, the plasma generation system 100 further includes a first electrode rod 102, a first electrode branch 103, and a second electrode tube 104. A first electrode plate 222 is installed inside the spray head 200. The first electrode branch 103 is made of a material with excellent conductivity and is connected to the first electrode plate 222 of the spray head 200. According to the shape and size of the chamber, the first electrode branch 103 can have different numbers of branches, but the lengths of each branch are preferably the same to ensure that the voltages reaching the first electrode plate 222 of each branch are the same.

[0028] The second electrode tube 104 is connected to a showerhead protective cover 211. The second electrode tube 104 and the showerhead protective cover 211 are connected to form an electrically conductive path. A conductive ring 214 is installed at the bottom of the showerhead protective cover 211. A cavity connection part 305 is provided on the process chamber 300. When the showerhead 200 is combined with the process chamber 300, the showerhead protective cover 211 is connected to the cavity connection part 305 of the process chamber 300 through the highly conductive conductive ring 214. The cavity connection part 305 has a conductive groove that is tightly connected to the conductive ring 214 to ensure good electrical conductivity between the process chamber 300 and the second electrode tube 104.

[0029] An L-shaped insulating ring 223 and an insulating plate 225a are provided on the upper part of the first electrode plate 222 to insulate the first electrode plate 222 from other parts of the showerhead 200. A special-shaped insulating ring 306 is provided on the upper part of the process chamber 300 to insulate the first electrode plate 222 from the process chamber 300 when the showerhead 200 is combined with the process chamber 300.

[0030] A showerhead cover plate 228, a cooling water channel cover plate 229, a second gas equalizing plate 227, a first gas equalizing plate 226, and a second electrode post 224 are also installed inside the showerhead 200. The showerhead cover plate 228, the cooling water channel cover plate 229, the second gas equalizing plate 227, the first gas equalizing plate 226, and the second electrode post 224 are electrically connected to each other and are in communication with the second electrode tube 104.

[0031] As Figure 5 shown, a cooling water flow channel 228b is provided on the upper surface of the showerhead cover plate 228. According to the shape and size of the showerhead, the cooling water flow channel 228b can be in shapes and lengths such as annular, meandering, and bow-shaped that are conducive to sufficient heat exchange of the cooling water; the cross-sectional shape and area of the cooling water flow channel 228b can be different according to the heat exchange amount and can be rectangular, trapezoidal, semi-circular, etc. A cooling water channel cover plate 229 is also provided on the showerhead cover plate 228 and is fixedly welded to the showerhead cover plate 228. The cooling water channel cover plate 229 is provided with cooling water inlets and outlets for connecting the cooling water channel inlet and outlet joints and interfaces for connecting each gas joint.

[0032] An electrode plate cooling water flow channel 222a is provided at the upper end of the first electrode plate 222 to control the temperature of the first electrode plate 222.

[0033] The spray head 200 is provided with a first gas guiding passage and a second gas guiding passage. The first gas guiding passage starts from the first gas injection port 215; the second gas equalizing plate 227 is installed at the bottom of the spray head cover plate 228, the first gas equalizing plate 226 is installed at the bottom of the second gas equalizing plate 227, and a second gas distribution space 228a corresponding to the second gas equalizing plate 227 is formed at the bottom of the spray head cover plate 228. A first gas distribution space 226a and a first gas guiding hole 226b are formed on the first gas equalizing plate 226, a guiding hole 225a is formed on the insulating plate 225, an annular ionization region is further provided between the first electrode plate 222 and the second electrode column 224, and an electrode guiding hole 224a is further formed on the second electrode column 224. The first gas injection port 215 passes through the spray head cover plate 228, the second gas distribution space 228a, and the second gas equalizing plate 227 to deliver the first gas to the first gas distribution space 226a; the first gas passes through the first gas guiding hole 226b from the first gas distribution space 226a to reach the guiding hole 225a of the insulating plate 225, and further diffuses to the annular ionization region 222b between the first electrode plate 222 and the second electrode column 224; after the first gas is ionized into plasma gas through the annular ionization region 222b, it diffuses into the cavity and reacts with the second gas ejected from the electrode guiding hole 224a of the second electrode column 224 and is deposited on the substrate surface to form a coating film.

[0034] The second gas guiding passage starts from the second gas injection port 216; the number of the second gas injection ports 216 is determined according to the size of the cavity and the gas flow condition; a guiding hole 225a corresponding to the second gas injection port is formed on the spray head cover plate 228, a second gas distributing hole 227a is formed on the second gas equalizing plate 227, a second gas guiding hole 226c corresponding to the second gas distributing hole 227a is further formed on the first gas equalizing plate 226, the second electrode column 224 is installed at the lower end of each second gas guiding hole 226c, and a guiding hole corresponding to the second gas injection port 216 is formed on the spray head cover plate 228. The second gas passes through the guiding hole and enters the second gas distribution space 228a, and is evenly distributed and diffused in the second gas distribution space 228a; the second gas equalizing plate 227 is provided with relatively dense second gas distributing holes 227a, the first gas equalizing plate 226 is provided with second gas guiding holes 226c corresponding to the second gas distributing holes 227a, and each guiding hole is connected with a second electrode column 224 at the lower end, and an electrode guiding hole 224a is formed in the center of the second electrode column. After the second gas is evenly distributed and diffused in the distribution space 228a, it can continuously pass through the second gas distributing hole 227a, the second gas guiding hole 226c, and the electrode guiding hole 224a to reach the inside of the cavity.

[0035] An external heating plate 301 is provided on the outer wall of the main cavity 302, and an internal heating plate 303 is provided inside the main cavity 302. The cavity is heated through the external heating plate 301, and the substrate is heated through the internal heating plate 303. The upper surface of the internal heating plate 303 has grooves adapted to the shape of the substrate, which can stably place the substrate and heat the substrate. When the spray head 200 is combined with the process cavity 300, the heat of the internal heating plate 303 can not only heat the substrate, but also heat the spray head 200.

[0036] The lifting device 4 is a heating plate lifting mechanism 411. A bracket 412 is installed at the bottom of the main cavity 302. The heating plate lifting mechanism 411 includes a lifting platform 414 and a leveling screw 416. The lifting platform 414 is installed at the moving part of the heating plate lifting mechanism 411. The upper part of the lifting platform 414 is connected with a horizontal adjustment platform 415 through an adjustment screw. The horizontal adjustment platform 415 can be leveled by adjusting the leveling screw between the lifting platform 414 and the horizontal adjustment platform 415. A support rod is installed at the lower part of the internal heating plate 303. The horizontal adjustment platform 415 and the internal heating plate 303 are connected through the support rod at the lower part of the internal heating plate 303. A vacuum bellows is connected between the horizontal adjustment platform 415 and the main cavity 302, and both ends of the vacuum bellows are sealed and connected with O-rings to realize the sealing of the internal heating plate 303 in the cavity. A guide rod 413 is also installed on the bracket 412. The upper end of the guide rod 413 is fixed to the lower part of the main cavity, the lower end is fixed to the lower part of the bracket 412, and the middle part is connected with the horizontal adjustment platform 415 through a linear bearing, playing a guiding role when the horizontal adjustment platform 415 moves up and down. When performing the coating process, the distance between the upper surface of the substrate and the lower surface of the spray head 200 is 20 - 50 mm, and the height can be adjusted according to the process.

[0037] A jacking rod 304 is also installed at the bottom of the internal heating plate 303. The upper end of the jacking rod 304 is provided with a cone head 304a larger than the diameter of the rod, and the top of the cone head is an arc surface. A rod hole is opened at the bottom of the internal heating plate 303, and a conical groove 303a for placing the cone head 304a is provided at the upper part of the rod hole. When the jacking rod 304 is placed in the rod hole of the internal heating plate 303 and the internal heating plate 303 is lifted to a certain height, the cone head 304a can be completely immersed in the conical groove 303a to ensure that the jacking rod 304 does not generate a jacking force on the substrate at this time.

[0038] The lower end of the jacking rod 304 is provided with a thread, and a retaining piece 308 is also installed at the lower end of the jacking rod 304. The retaining piece 308 is stopped by a nut at the lower end of the jacking rod 304 to prevent the jacking rod 304 from disengaging from the upper part of the internal heating plate 303.

[0039] The number of the lifting rods 304 is set according to the size and weight of the substrate, generally ranging from 3 to 6, and it is required to be able to lift the substrate smoothly away from the inner heating plate 303 by a certain distance. A cylinder support 422 is also installed at the bottom of the main cavity 302. A lifting cylinder 421 is installed on the cylinder support 422. The cylinder body of the lifting cylinder 421 is connected to the main cavity 302 through the cylinder support 422. A cylinder push rod 423 is installed on the piston rod of the lifting cylinder 421. A push rod lifting plate 307 is installed at the top of the cylinder push rod 423. The push rod lifting plate 307 is installed at the bottom of the lifting rod 304. When multiple lifting rods 304 are set, in order to reduce the number of lifting cylinders 421, a push rod lifting plate 307 is arranged at the lower part of the lifting rod 304. One push rod lifting plate 307 can be connected to one or more push rod lifting cylinders 421, and multiple lifting rods 304 can be arranged thereon. There is no fixed connection between the lifting rod 304 and the push rod lifting plate 307, and they can be separated. The lower part of the push rod lifting plate 307 is connected to the piston rod of the lifting cylinder 421 through the cylinder push rod 423, and the cylinder body of the lifting cylinder 421 is connected to the main cavity 302 through the cylinder support 422. A vacuum bellows 424 is arranged outside the cylinder push rod 423. Both ends of the vacuum bellows 424 are sealed with the main cavity 302 and the cylinder push rod 423 respectively through O-rings to ensure the airtight environment inside the cavity.

Claims

1. A plasma enhanced vapor deposition device, comprising a plasma generating system (100), a shower head (200), a process chamber (300) and a lifting device (400), characterized in that: The plasma generating system (100) comprises a first electrode rod (102), a first electrode branch (103) and a second electrode tube (104); a first electrode plate (222) is installed inside the shower head (200); the first electrode branch (103) is electrically connected to the first electrode plate (222); the second electrode tube (104) is connected to a shower head protection cover (211); the second electrode tube (104) and the shower head protection cover (211) form a conductive path; a conductive ring (214) is installed at the bottom of the shower head protection cover (211); a cavity connecting portion (305) is provided on the process chamber (300); the shower head protection cover (211) is connected to the cavity connecting portion (305) of the process chamber (300) through the conductive ring (214); The cavity connection part (305) is provided with a conductive groove tightly connected to the conductive ring (214); the shower head (200) is also installed with a shower head cover plate (228), a cooling water channel cover plate (229), a second gas uniformizing plate (227), a first gas uniformizing plate (226), and a second electrode column (224); the process cavity (300) is also provided with a main cavity (302); the outer wall of the main cavity (302) is provided with an external heating plate (301); the main cavity (302) is provided with an internal heating plate (303); the lifting device (400) is a heating plate lifting mechanism (411); the bottom of the main cavity (302) is installed with a bracket (412); the heating plate lifting mechanism (411) is fixedly connected to the main cavity (302) through the bracket (412).

2. The plasma enhanced vapor deposition device according to claim 1, characterized in that: An L-shaped insulating ring (223) and an insulating plate (225) are arranged on the upper part of the first electrode plate (222); the first electrode plate (222) and other parts of the shower head (200) are insulated by the L-shaped insulating ring (223) and the insulating plate (225); and an electrode plate cooling water channel (222a) is arranged on the upper end of the first electrode plate (222).

3. The plasma enhanced vapor deposition device according to claim 1, characterized in that: The spray head cover plate (228) is installed at the bottom of the spray head protection cover (211). The upper surface of the spray head cover plate (228) is provided with a cooling water channel (228b). The cooling water channel (228b) can be any one of annular, circular or arched. The cross-sectional shape and area of ​​the cooling water channel (228b) can be different according to the heat exchange amount, and can be any one of rectangular, trapezoidal and semicircular. The cooling water channel cover plate (229) is arranged above the spray head cover plate (228). The cooling water channel cover plate (229) is welded and fixed to the spray head cover plate (228). The cooling water channel cover plate (229) is provided with a cooling water inlet and outlet connected to the cooling water channel inlet and outlet joints and an interface connected to each gas joint.

4. The plasma enhanced vapor deposition device according to claim 2, characterized in that: The shower head (200) is provided with a first gas guide passage and a second gas guide passage, wherein the first gas guide passage starts from a first gas injection port (215), the second gas uniform plate (227) is installed at the bottom of the shower head cover plate (228), the first gas uniform plate (226) is installed at the bottom of the second gas uniform plate (227), a second gas uniform distribution space (228a) corresponding to the second gas uniform plate (227) is provided at the bottom of the shower head cover plate (228), and the first gas uniform distribution space (226a) and the first gas guide hole (226) are provided on the first gas uniform plate (226). 6b), the first injection port passes through the shower head cover plate (228), the second gas uniform distribution space (228a) and the second gas uniform distribution plate (227), the first gas uniform distribution space (226a) corresponds to the second gas uniform distribution plate (227), the insulating plate (225) is provided with a gas guide hole (225a), the gas guide hole (225a) corresponds to the first gas guide hole (226b), an annular ionization zone is further provided between the first electrode plate (222) and the second electrode column (224), and the second electrode column (224) is further provided with an electrode gas guide hole (224a); The second gas guide passage starts from the second gas injection port (216); a gas guide hole (225a) corresponding to the second gas injection port is provided on the shower head cover plate (228); second gas distribution holes (227a) are provided on the second gas equalizing plate (227); second gas guide holes (226c) corresponding to the second gas distribution holes (227a) are also provided on the first gas equalizing plate (226); and the second electrode column (224) is installed at the lower end of each of the second gas guide holes (226c).

5. The plasma enhanced vapor deposition device according to claim 1, characterized in that: The heating plate lifting mechanism (411) comprises a lifting platform (414) and a leveling screw (416); the lifting platform (414) is installed at the moving part of the heating plate lifting mechanism (411); the upper part of the lifting platform (414) is connected to a horizontal adjustment platform (415) via a leveling screw (416); a support rod is installed at the lower part of the inner heating plate (303); the horizontal adjustment platform (415) is connected to the inner heating plate (303) via the support rod; the horizontal adjustment platform (415) is connected to the main A large vacuum bellows (417) is connected between the cavities (302), the support rod passes through the vacuum bellows (417) to be connected to the horizontal adjustment platform (415), and a guide rod (413) is also installed on the bracket (412), the upper end of the guide rod (413) is fixed to the bottom of the main cavity (302), the middle part of the guide rod (413) is connected to the horizontal adjustment platform (415) through a linear bearing, and the lower end of the guide rod (413) is fixed to the lower part of the bracket (412).

6. The plasma enhanced vapor deposition device according to claim 5, characterized in that: A lifting rod (304) is also installed at the bottom of the inner heating plate (303), and a cone head (304a) larger than the diameter of the straight rod is arranged at the upper end of the lifting rod (304), and the top of the cone head (304a) is in the form of an arc surface. A lifting rod hole is arranged at the bottom of the inner heating plate (303), and a conical groove (303a) for placing the cone head (304a) is arranged at the upper part of the lifting rod hole.

7. The plasma enhanced vapor deposition device according to claim 6, characterized in that: The lower end of the lifting rod (304) is provided with a thread, and the lower end of the lifting rod (304) is also installed with a blocking piece (308), and the blocking piece (308) is stopped at the lower end of the lifting rod (304) through a nut.

8. The plasma enhanced vapor deposition device according to claim 7, characterized in that: A cylinder support (422) is also installed at the bottom of the main cavity (302), and a lifting cylinder (421) is installed on the cylinder support (422). The cylinder body of the lifting cylinder (421) is connected to the main cavity (302) through the cylinder support (422). A cylinder push rod (423) is installed on the piston rod of the lifting cylinder (421). A push rod lifting plate (307) is installed on the top of the cylinder push rod (423), and the push rod lifting plate (307) is installed at the bottom of the lifting rod (304).

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